| Número de publicación | USD627316 S1 |
| Tipo de publicación | Concesión |
| Número de solicitud | 29/330,441 |
| Fecha de publicación | 16 Nov 2010 |
| Fecha de presentación | 7 Ene 2009 |
| Fecha de prioridad | 7 Ene 2009 |
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Heater board enclosure
US D627316 S1
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The ornamental design for the heater board enclosure, as shown and described.
FIG. 1 is a front perspective view of the heater board enclosure;
FIG. 2 is a top plan view thereof;
FIG. 3 is a front elevation view thereof;
FIG. 4 is a right side elevation view thereof and a mirror image of the left side;
FIG. 5 is a rear elevation view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is a bottom perspective view thereof.
The broken lines showing portions of the heater board enclosure are shown for illustrative purpose only and forms no part of the claimed design.
| Referencia |
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| 1 | EFD ProcessMate 6500 Temperature Control Unit brochure. |
| Patente citante | Fecha de presentación | Fecha de publicación | Solicitante | Título |
|---|
| US20120106070 | 2 Nov 2010 | 3 May 2012 | Technology Advancement Group, Inc. | Field serviceable cpu module |
| US20120120594 | 12 Nov 2010 | 17 May 2012 | Huang Tien-Sheng | Heat dissipating casing structure for main board |