Heater board enclosure
US D627316 S1
The ornamental design for the heater board enclosure, as shown and described.
FIG. 1 is a front perspective view of the heater board enclosure;
FIG. 2 is a top plan view thereof;
FIG. 3 is a front elevation view thereof;
FIG. 4 is a right side elevation view thereof and a mirror image of the left side;
FIG. 5 is a rear elevation view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is a bottom perspective view thereof.
The broken lines showing portions of the heater board enclosure are shown for illustrative purpose only and forms no part of the claimed design.
|1||EFD ProcessMate 6500 Temperature Control Unit brochure.|
| Patente citante|| Fecha de presentación|| Fecha de publicación|| Solicitante|| Título|
|US20120106070||2 Nov 2010||3 May 2012||Technology Advancement Group, Inc.||Field serviceable cpu module|
|US20120120594||12 Nov 2010||17 May 2012||Huang Tien-Sheng||Heat dissipating casing structure for main board|