USD628541S1 - Light emitting diode - Google Patents

Light emitting diode Download PDF

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Publication number
USD628541S1
USD628541S1 US29/363,724 US36372410F USD628541S US D628541 S1 USD628541 S1 US D628541S1 US 36372410 F US36372410 F US 36372410F US D628541 S USD628541 S US D628541S
Authority
US
United States
Prior art keywords
light emitting
emitting diode
view
design
elevational view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/363,724
Inventor
Jung-Chiuan Lin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Everlight Electronics Co Ltd
Original Assignee
Everlight Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Everlight Electronics Co Ltd filed Critical Everlight Electronics Co Ltd
Priority to US29/363,724 priority Critical patent/USD628541S1/en
Assigned to EVERLIGHT ELECTRONICS CO., LTD. reassignment EVERLIGHT ELECTRONICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LIN, JUNG-CHIUAN
Application granted granted Critical
Publication of USD628541S1 publication Critical patent/USD628541S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Description

FIG. 1 is a perspective view of a light emitting diode showing the claimed design;
FIG. 2 is another perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a right side elevational view thereof;
FIG. 7 is a bottom plan view thereof, which is a mirror image of the top plan view; and,
FIG. 8 is a view showing the visible inner structure through the window portion. The window portion of the design is filled with light transmissible material. The broken lines are directed to environment and are for illustrative purpose only; the broken lines form no part of the claimed design.

Claims (1)

  1. The ornamental design for a light emitting diode, as shown and described.
US29/363,724 2010-06-14 2010-06-14 Light emitting diode Active USD628541S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/363,724 USD628541S1 (en) 2010-06-14 2010-06-14 Light emitting diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/363,724 USD628541S1 (en) 2010-06-14 2010-06-14 Light emitting diode

Publications (1)

Publication Number Publication Date
USD628541S1 true USD628541S1 (en) 2010-12-07

Family

ID=43244455

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/363,724 Active USD628541S1 (en) 2010-06-14 2010-06-14 Light emitting diode

Country Status (1)

Country Link
US (1) USD628541S1 (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110180827A1 (en) * 2009-06-05 2011-07-28 Hussell Christopher P Solid state lighting device
US20110186873A1 (en) * 2009-06-05 2011-08-04 Emerson David T Light emitting device packages, systems and methods
US8269244B2 (en) 2010-06-28 2012-09-18 Cree, Inc. LED package with efficient, isolated thermal path
USD667801S1 (en) 2010-07-16 2012-09-25 Cree, Inc. Package for light emitting diode (LED) lighting
USD668235S1 (en) * 2011-07-11 2012-10-02 Lextar Electronics Corp. Light emitting diode package
USD668624S1 (en) * 2011-07-25 2012-10-09 Lextar Electronics Corp. Light emitting diode package
USD679842S1 (en) 2011-01-03 2013-04-09 Cree, Inc. High brightness LED package
US8598602B2 (en) 2009-01-12 2013-12-03 Cree, Inc. Light emitting device packages with improved heat transfer
US8610140B2 (en) 2010-12-15 2013-12-17 Cree, Inc. Light emitting diode (LED) packages, systems, devices and related methods
US8648359B2 (en) 2010-06-28 2014-02-11 Cree, Inc. Light emitting devices and methods
US8686445B1 (en) 2009-06-05 2014-04-01 Cree, Inc. Solid state lighting devices and methods
US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
US9859471B2 (en) 2011-01-31 2018-01-02 Cree, Inc. High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
US11101408B2 (en) 2011-02-07 2021-08-24 Creeled, Inc. Components and methods for light emitting diode (LED) lighting

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9123874B2 (en) 2009-01-12 2015-09-01 Cree, Inc. Light emitting device packages with improved heat transfer
US8598602B2 (en) 2009-01-12 2013-12-03 Cree, Inc. Light emitting device packages with improved heat transfer
US20110180827A1 (en) * 2009-06-05 2011-07-28 Hussell Christopher P Solid state lighting device
US20110186873A1 (en) * 2009-06-05 2011-08-04 Emerson David T Light emitting device packages, systems and methods
US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
US8866166B2 (en) 2009-06-05 2014-10-21 Cree, Inc. Solid state lighting device
US8860043B2 (en) 2009-06-05 2014-10-14 Cree, Inc. Light emitting device packages, systems and methods
US8686445B1 (en) 2009-06-05 2014-04-01 Cree, Inc. Solid state lighting devices and methods
US8497522B2 (en) 2009-06-05 2013-07-30 Cree, Inc. Solid state lighting device
US8648359B2 (en) 2010-06-28 2014-02-11 Cree, Inc. Light emitting devices and methods
US8878217B2 (en) 2010-06-28 2014-11-04 Cree, Inc. LED package with efficient, isolated thermal path
US8269244B2 (en) 2010-06-28 2012-09-18 Cree, Inc. LED package with efficient, isolated thermal path
USD708156S1 (en) 2010-07-16 2014-07-01 Cree, Inc. Package for light emitting diode (LED) lighting
USD667801S1 (en) 2010-07-16 2012-09-25 Cree, Inc. Package for light emitting diode (LED) lighting
US8610140B2 (en) 2010-12-15 2013-12-17 Cree, Inc. Light emitting diode (LED) packages, systems, devices and related methods
USD679842S1 (en) 2011-01-03 2013-04-09 Cree, Inc. High brightness LED package
USD704358S1 (en) 2011-01-03 2014-05-06 Cree, Inc. High brightness LED package
US9859471B2 (en) 2011-01-31 2018-01-02 Cree, Inc. High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
US11101408B2 (en) 2011-02-07 2021-08-24 Creeled, Inc. Components and methods for light emitting diode (LED) lighting
USD668235S1 (en) * 2011-07-11 2012-10-02 Lextar Electronics Corp. Light emitting diode package
USD668624S1 (en) * 2011-07-25 2012-10-09 Lextar Electronics Corp. Light emitting diode package

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