USD643819S1 - Package for light emitting diode (LED) lighting - Google Patents

Package for light emitting diode (LED) lighting Download PDF

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Publication number
USD643819S1
USD643819S1 US29/365,939 US36593910F USD643819S US D643819 S1 USD643819 S1 US D643819S1 US 36593910 F US36593910 F US 36593910F US D643819 S USD643819 S US D643819S
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US
United States
Prior art keywords
package
led
lighting
light emitting
emitting diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/365,939
Inventor
Sung Chul Joo
Christopher P. Hussell
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Creeled Inc
Original Assignee
Cree Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cree Inc filed Critical Cree Inc
Priority to US29/365,939 priority Critical patent/USD643819S1/en
Assigned to CREE, INC. reassignment CREE, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HUSSELL, CHRISTOPHER P., JOO, SUNG CHUL
Priority to US29/397,017 priority patent/USD667801S1/en
Application granted granted Critical
Publication of USD643819S1 publication Critical patent/USD643819S1/en
Priority to US29/432,988 priority patent/USD708156S1/en
Assigned to CREELED, INC. reassignment CREELED, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREE, INC.
Assigned to CITIZENS BANK, N.A. reassignment CITIZENS BANK, N.A. SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREELED, INC., SMART EMBEDDED COMPUTING, INC., SMART High Reliability Solutions, LLC, SMART MODULAR TECHNOLOGIES, INC.
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Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

Description

FIG. 1 is a top perspective view of a package for light emitting diode (LED) lighting showing our design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a first side view thereof, the opposing side being a mirror image of that shown;
FIG. 4 is a second side view thereof, the opposing side being a mirror image of that shown;
FIG. 5 is a bottom plan view thereof opposite the view of FIG. 2;
FIG. 6 is a first side view thereof, the opposing side being a mirror image of that shown;
FIG. 7 is a second side view thereof, the opposing side being a mirror image of that shown; and,
FIG. 8 is a bottom perspective view thereof.
The broken lines are for illustrative purposes only and form no part of the claimed design.

Claims (1)

  1. The ornamental design for a package for light emitting diode (LED) lighting, as shown and described.
US29/365,939 2010-07-16 2010-07-16 Package for light emitting diode (LED) lighting Active USD643819S1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US29/365,939 USD643819S1 (en) 2010-07-16 2010-07-16 Package for light emitting diode (LED) lighting
US29/397,017 USD667801S1 (en) 2010-07-16 2011-07-11 Package for light emitting diode (LED) lighting
US29/432,988 USD708156S1 (en) 2010-07-16 2012-09-24 Package for light emitting diode (LED) lighting

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/365,939 USD643819S1 (en) 2010-07-16 2010-07-16 Package for light emitting diode (LED) lighting

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US29/397,017 Division USD667801S1 (en) 2010-07-16 2011-07-11 Package for light emitting diode (LED) lighting

Publications (1)

Publication Number Publication Date
USD643819S1 true USD643819S1 (en) 2011-08-23

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US29/365,939 Active USD643819S1 (en) 2010-07-16 2010-07-16 Package for light emitting diode (LED) lighting
US29/397,017 Active USD667801S1 (en) 2010-07-16 2011-07-11 Package for light emitting diode (LED) lighting
US29/432,988 Active USD708156S1 (en) 2010-07-16 2012-09-24 Package for light emitting diode (LED) lighting

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US29/397,017 Active USD667801S1 (en) 2010-07-16 2011-07-11 Package for light emitting diode (LED) lighting
US29/432,988 Active USD708156S1 (en) 2010-07-16 2012-09-24 Package for light emitting diode (LED) lighting

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US (3) USD643819S1 (en)

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US20110180827A1 (en) * 2009-06-05 2011-07-28 Hussell Christopher P Solid state lighting device
US8269244B2 (en) 2010-06-28 2012-09-18 Cree, Inc. LED package with efficient, isolated thermal path
USD667801S1 (en) * 2010-07-16 2012-09-25 Cree, Inc. Package for light emitting diode (LED) lighting
USD679842S1 (en) 2011-01-03 2013-04-09 Cree, Inc. High brightness LED package
US8610140B2 (en) 2010-12-15 2013-12-17 Cree, Inc. Light emitting diode (LED) packages, systems, devices and related methods
US8648359B2 (en) 2010-06-28 2014-02-11 Cree, Inc. Light emitting devices and methods
US8686445B1 (en) 2009-06-05 2014-04-01 Cree, Inc. Solid state lighting devices and methods
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USD731826S1 (en) * 2014-01-15 2015-06-16 Winston Products Llc Merchandising containers for vehicle lights
USD731825S1 (en) * 2014-01-15 2015-06-16 Winston Products Llc Merchandising containers for vehicle lights
US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
USD778848S1 (en) * 2015-04-07 2017-02-14 Cree, Inc. Solid state light emitter component
US9691949B2 (en) 2014-05-30 2017-06-27 Cree, Inc. Submount based light emitter components and methods
US9859471B2 (en) 2011-01-31 2018-01-02 Cree, Inc. High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
US10957736B2 (en) 2018-03-12 2021-03-23 Cree, Inc. Light emitting diode (LED) components and methods
US11101408B2 (en) 2011-02-07 2021-08-24 Creeled, Inc. Components and methods for light emitting diode (LED) lighting

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