USD658139S1 - High-density emitter package - Google Patents

High-density emitter package Download PDF

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Publication number
USD658139S1
USD658139S1 US29/384,360 US201129384360F USD658139S US D658139 S1 USD658139 S1 US D658139S1 US 201129384360 F US201129384360 F US 201129384360F US D658139 S USD658139 S US D658139S
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United States
Prior art keywords
emitter package
density emitter
view
density
design
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US29/384,360
Inventor
Peter Scott Andrews
Raymond Rosado
Michael P. Laughner
David T. Emerson
Amber C. Abare
Jeffrey C. Britt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CreeLED Inc
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Cree Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Cree Inc filed Critical Cree Inc
Priority to US29/384,360 priority Critical patent/USD658139S1/en
Assigned to CREE, INC. reassignment CREE, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: EMERSON, DAVID T., ABARE, AMBER C., ANDREWS, PETER S., BRITT, JEFFREY C., LAUGHNER, MICHAEL P., ROSADO, RAYMOND
Application granted granted Critical
Publication of USD658139S1 publication Critical patent/USD658139S1/en
Assigned to CREE LED, INC. reassignment CREE LED, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREE, INC.
Assigned to CITIZENS BANK, N.A. reassignment CITIZENS BANK, N.A. SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREELED, INC., SMART EMBEDDED COMPUTING, INC., SMART High Reliability Solutions, LLC, SMART MODULAR TECHNOLOGIES, INC.
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Description

FIG. 1 is a top perspective view showing an embodiment of our design for a high-density emitter package.
FIG. 2 is a top view of the embodiment of our design shown in FIG. 1.
FIG. 3 is a side view of the embodiment of our design shown in FIG. 1.
FIG. 4 is another side view of the embodiment of our design as shown in FIG. 1.
FIG. 5 is a bottom perspective view of the embodiment of our design shown in FIG. 1.
FIG. 6 is another side view of the embodiment of our design as shown in FIG. 1.
FIG. 7 is another side view of the embodiment of our design as shown in FIG. 1.
FIG. 8 is a bottom view of the embodiment of our design as shown in FIG. 1.
FIG. 9 is a top perspective view showing an alternate environment thereof;
FIG. 10 is a top view thereof;
FIG. 11 is a side view thereof;
FIG. 12 is another side view thereof;
FIG. 13 is a bottom perspective view thereof;
FIG. 14 is another side view thereof;
FIG. 15 is another side view thereof; and,
FIG. 16 is a bottom view thereof.
The broken lines in the drawing views is for the purpose of illustrating environmental structure and forms no part of the claimed design.

Claims (1)

  1. We claim the ornamental design for a high-density emitter package, as shown and described.
US29/384,360 2011-01-31 2011-01-31 High-density emitter package Active USD658139S1 (en)

Priority Applications (1)

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US29/384,360 USD658139S1 (en) 2011-01-31 2011-01-31 High-density emitter package

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US29/384,360 USD658139S1 (en) 2011-01-31 2011-01-31 High-density emitter package

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USD658139S1 true USD658139S1 (en) 2012-04-24

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Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9082921B2 (en) 2007-10-31 2015-07-14 Cree, Inc. Multi-die LED package
US9172012B2 (en) 2007-10-31 2015-10-27 Cree, Inc. Multi-chip light emitter packages and related methods
USD741821S1 (en) * 2014-04-10 2015-10-27 Kingbright Electronics Co., Ltd. LED component
USD749051S1 (en) * 2012-05-31 2016-02-09 Cree, Inc. Light emitting diode (LED) package
USD753612S1 (en) * 2012-09-07 2016-04-12 Cree, Inc. Light emitter device
US9349929B2 (en) 2012-05-31 2016-05-24 Cree, Inc. Light emitter packages, systems, and methods
US9397266B2 (en) 2007-11-14 2016-07-19 Cree, Inc. Lateral semiconductor light emitting diodes having large area contacts
US9484499B2 (en) 2007-04-20 2016-11-01 Cree, Inc. Transparent ohmic contacts on light emitting diodes with carrier substrates
USD772181S1 (en) * 2015-04-02 2016-11-22 Genesis Photonics Inc. Light emitting diode package substrate
US9515055B2 (en) 2012-05-14 2016-12-06 Cree, Inc. Light emitting devices including multiple anodes and cathodes
USD777122S1 (en) * 2015-02-27 2017-01-24 Cree, Inc. LED package
USD783547S1 (en) * 2015-06-04 2017-04-11 Cree, Inc. LED package
US9666762B2 (en) 2007-10-31 2017-05-30 Cree, Inc. Multi-chip light emitter packages and related methods
USD790486S1 (en) * 2014-09-30 2017-06-27 Cree, Inc. LED package with truncated encapsulant
US9923132B2 (en) 2013-05-24 2018-03-20 Cree, Inc. Solid state lighting component package with conformal reflective coating
USD826871S1 (en) * 2014-12-11 2018-08-28 Cree, Inc. Light emitting diode device
US10439112B2 (en) 2012-05-31 2019-10-08 Cree, Inc. Light emitter packages, systems, and methods having improved performance
USD926714S1 (en) * 2019-10-30 2021-08-03 Creeled, Inc. Light emitting diode package

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9484499B2 (en) 2007-04-20 2016-11-01 Cree, Inc. Transparent ohmic contacts on light emitting diodes with carrier substrates
US9666762B2 (en) 2007-10-31 2017-05-30 Cree, Inc. Multi-chip light emitter packages and related methods
US9172012B2 (en) 2007-10-31 2015-10-27 Cree, Inc. Multi-chip light emitter packages and related methods
US9082921B2 (en) 2007-10-31 2015-07-14 Cree, Inc. Multi-die LED package
US9397266B2 (en) 2007-11-14 2016-07-19 Cree, Inc. Lateral semiconductor light emitting diodes having large area contacts
US9515055B2 (en) 2012-05-14 2016-12-06 Cree, Inc. Light emitting devices including multiple anodes and cathodes
US10439112B2 (en) 2012-05-31 2019-10-08 Cree, Inc. Light emitter packages, systems, and methods having improved performance
USD749051S1 (en) * 2012-05-31 2016-02-09 Cree, Inc. Light emitting diode (LED) package
US9349929B2 (en) 2012-05-31 2016-05-24 Cree, Inc. Light emitter packages, systems, and methods
USD753612S1 (en) * 2012-09-07 2016-04-12 Cree, Inc. Light emitter device
US9923132B2 (en) 2013-05-24 2018-03-20 Cree, Inc. Solid state lighting component package with conformal reflective coating
US10944031B2 (en) 2013-05-24 2021-03-09 Cree, Inc. Solid state lighting component package with conformal reflective coating
USD741821S1 (en) * 2014-04-10 2015-10-27 Kingbright Electronics Co., Ltd. LED component
USD790486S1 (en) * 2014-09-30 2017-06-27 Cree, Inc. LED package with truncated encapsulant
USD826871S1 (en) * 2014-12-11 2018-08-28 Cree, Inc. Light emitting diode device
USD777122S1 (en) * 2015-02-27 2017-01-24 Cree, Inc. LED package
USD790487S1 (en) * 2015-04-02 2017-06-27 Genesis Photonics Inc. Light emitting diode package substrate
USD772181S1 (en) * 2015-04-02 2016-11-22 Genesis Photonics Inc. Light emitting diode package substrate
USD783547S1 (en) * 2015-06-04 2017-04-11 Cree, Inc. LED package
USD926714S1 (en) * 2019-10-30 2021-08-03 Creeled, Inc. Light emitting diode package

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