USD659657S1 - Light emitting diode (LED) package - Google Patents

Light emitting diode (LED) package Download PDF

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Publication number
USD659657S1
USD659657S1 US29/401,692 US201129401692F USD659657S US D659657 S1 USD659657 S1 US D659657S1 US 201129401692 F US201129401692 F US 201129401692F US D659657 S USD659657 S US D659657S
Authority
US
United States
Prior art keywords
led
package
light emitting
emitting diode
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/401,692
Inventor
Christopher P. Hussell
Shuying Huang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Creeled Inc
Original Assignee
Cree Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cree Inc filed Critical Cree Inc
Priority to US29/401,692 priority Critical patent/USD659657S1/en
Application granted granted Critical
Publication of USD659657S1 publication Critical patent/USD659657S1/en
Assigned to CREELED, INC. reassignment CREELED, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREE, INC.
Assigned to CITIZENS BANK, N.A. reassignment CITIZENS BANK, N.A. SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREELED, INC., SMART EMBEDDED COMPUTING, INC., SMART High Reliability Solutions, LLC, SMART MODULAR TECHNOLOGIES, INC.
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

Description

FIG. 1 is a top perspective view of an LED package showing our design;
FIG. 2 is a top view thereof;
FIG. 3 is a top end view thereof;
FIG. 4 is an opposing bottom end view thereof;
FIG. 5 is a bottom view thereof opposite the view of FIG. 2;
FIG. 6 is a side view thereof;
FIG. 7 is an opposing side view thereof; and,
FIG. 8 is a back perspective view thereof.
The broken lines are for illustrative purposes only and form no part of the claimed design.

Claims (1)

  1. The ornamental design for a light emitting diode (LED) package, as shown and described.
US29/401,692 2010-04-30 2011-09-14 Light emitting diode (LED) package Active USD659657S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/401,692 USD659657S1 (en) 2010-04-30 2011-09-14 Light emitting diode (LED) package

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/360,791 USD648686S1 (en) 2010-04-30 2010-04-30 Light emitting diode (LED) package
US29/401,692 USD659657S1 (en) 2010-04-30 2011-09-14 Light emitting diode (LED) package

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/360,791 Division USD648686S1 (en) 2009-01-12 2010-04-30 Light emitting diode (LED) package

Publications (1)

Publication Number Publication Date
USD659657S1 true USD659657S1 (en) 2012-05-15

Family

ID=44907302

Family Applications (2)

Application Number Title Priority Date Filing Date
US29/360,791 Active USD648686S1 (en) 2009-01-12 2010-04-30 Light emitting diode (LED) package
US29/401,692 Active USD659657S1 (en) 2010-04-30 2011-09-14 Light emitting diode (LED) package

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US29/360,791 Active USD648686S1 (en) 2009-01-12 2010-04-30 Light emitting diode (LED) package

Country Status (1)

Country Link
US (2) USD648686S1 (en)

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110031865A1 (en) * 2009-01-12 2011-02-10 Hussell Christopher P Light emitting device packages with improved heat transfer
US20110180827A1 (en) * 2009-06-05 2011-07-28 Hussell Christopher P Solid state lighting device
USD679842S1 (en) 2011-01-03 2013-04-09 Cree, Inc. High brightness LED package
US8610140B2 (en) 2010-12-15 2013-12-17 Cree, Inc. Light emitting diode (LED) packages, systems, devices and related methods
US8648359B2 (en) 2010-06-28 2014-02-11 Cree, Inc. Light emitting devices and methods
US8686445B1 (en) 2009-06-05 2014-04-01 Cree, Inc. Solid state lighting devices and methods
USD708156S1 (en) 2010-07-16 2014-07-01 Cree, Inc. Package for light emitting diode (LED) lighting
US8860043B2 (en) 2009-06-05 2014-10-14 Cree, Inc. Light emitting device packages, systems and methods
US8878217B2 (en) 2010-06-28 2014-11-04 Cree, Inc. LED package with efficient, isolated thermal path
US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
USD777694S1 (en) * 2015-05-15 2017-01-31 Citizen Electronics Co., Ltd. Light-emitting diode
USD782989S1 (en) * 2015-05-15 2017-04-04 Citizen Electronics Co., Ltd. Light-emitting diode
US9634209B2 (en) 2011-03-02 2017-04-25 Cree, Inc. Miniature surface mount device
US9685592B2 (en) 2009-01-14 2017-06-20 Cree Huizhou Solid State Lighting Company Limited Miniature surface mount device with large pin pads
US9859471B2 (en) 2011-01-31 2018-01-02 Cree, Inc. High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
TWD204009S (en) 2019-03-22 2020-04-11 晶元光電股份有限公司 Part of light-emitting device
TWD204008S (en) 2019-03-22 2020-04-11 晶元光電股份有限公司 Part of light-emitting device
US10683971B2 (en) 2015-04-30 2020-06-16 Cree, Inc. Solid state lighting components
US11101408B2 (en) 2011-02-07 2021-08-24 Creeled, Inc. Components and methods for light emitting diode (LED) lighting

Non-Patent Citations (44)

* Cited by examiner, † Cited by third party
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Certificate of Registration for Community Design Application Serial No. 001283600-0001-0003 dated Jan. 7, 2011.
Description Model No. NS6G083 issued by Nichia Corporation—at least as early as Aug. 31, 2007.
Description Model No. NS6x083x issued by Nichia Corporation—at least as early as Feb. 17, 2007.
International Preliminary Report on Patentability for PCT Application Serial No. PCT/US2010/035379 dated Dec. 8, 2011.
International Search Report and Written Opinion for PCT Serial No. PCT/US2011/043539 dated Oct. 28, 2011.
International Search Report and Written Opinion for PCT Serial No. PCT/US2011/41833 dated Oct. 24, 2011.
International Search Report/Written Opinion dated Jan. 5, 2011 for PCT/US2010/035379.
Japanese Office Action for JP2010-026185 dated Apr. 5, 2011.
Non-Final Office Action for Korean Application Serial No. KR 30-2010-0047048 dated Jan. 2, 2012.
Non-Final Office Action for Korean Application Serial No. KR 30-2010-0047049 dated Jan. 2, 2012.
Non-Final Office Action for U.S. Appl. No. 12/479,318, dated Jun. 2, 2010.
Non-final Office Action for U.S. Appl. No. 12/479,318, dated Nov. 10, 2010.
Non-Final Office Action for U.S. Appl. No. 12/853,812 dated Dec. 7, 2011.
Notice of Allowance dated Apr. 16, 2010 from U.S. Appl. No. 29/338,186.
Notice of Allowance for Chinese Application Serial No. CN 2011/30171313.0 dated Dec. 6, 2011.
Notice of Allowance for Japanese Application Serial No. JP-DES 2011/015199 dated Nov. 10, 2011.
Notice of Allowance for Japanese Application Serial No. JP-DES 2011/015200 dated Nov. 30, 2011.
Notice of Allowance for Japanese Application Serial No. JP-DES 2011/015201 dated Nov. 30, 2011.
Notice of Allowance for Japanese Design Appl. No. 2010-026186 dated Mar. 29, 2011.
Notice of Allowance for Taiwanese Application Serial No. TW 099305566 dated Dec. 5, 2011.
Notice of Allowance for U.S. Appl. No. 12/479,318, dated Feb. 17, 2011.
Notice of Allowance for U.S. Appl. No. 29/338,186, dated Mar. 10, 2011.
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Taiwanese Office Action for Appl. No. 099305566 dated Jul. 12, 2011.
U.S. Appl. No. 12/853,812, filed Aug. 10, 2010.
U.S. Appl. No. 13/011,609, filed Jan. 21, 2011.
U.S. Appl. No. 29/360,791, filed Apr. 30, 2010.
U.S. Appl. No. 61/404,985, filed Oct. 13, 2010.

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8598602B2 (en) 2009-01-12 2013-12-03 Cree, Inc. Light emitting device packages with improved heat transfer
US9123874B2 (en) 2009-01-12 2015-09-01 Cree, Inc. Light emitting device packages with improved heat transfer
US20110031865A1 (en) * 2009-01-12 2011-02-10 Hussell Christopher P Light emitting device packages with improved heat transfer
US9685592B2 (en) 2009-01-14 2017-06-20 Cree Huizhou Solid State Lighting Company Limited Miniature surface mount device with large pin pads
US8860043B2 (en) 2009-06-05 2014-10-14 Cree, Inc. Light emitting device packages, systems and methods
US20110180827A1 (en) * 2009-06-05 2011-07-28 Hussell Christopher P Solid state lighting device
US8497522B2 (en) 2009-06-05 2013-07-30 Cree, Inc. Solid state lighting device
US8686445B1 (en) 2009-06-05 2014-04-01 Cree, Inc. Solid state lighting devices and methods
US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
US8866166B2 (en) 2009-06-05 2014-10-21 Cree, Inc. Solid state lighting device
US8648359B2 (en) 2010-06-28 2014-02-11 Cree, Inc. Light emitting devices and methods
US8878217B2 (en) 2010-06-28 2014-11-04 Cree, Inc. LED package with efficient, isolated thermal path
USD708156S1 (en) 2010-07-16 2014-07-01 Cree, Inc. Package for light emitting diode (LED) lighting
US8610140B2 (en) 2010-12-15 2013-12-17 Cree, Inc. Light emitting diode (LED) packages, systems, devices and related methods
USD679842S1 (en) 2011-01-03 2013-04-09 Cree, Inc. High brightness LED package
USD704358S1 (en) 2011-01-03 2014-05-06 Cree, Inc. High brightness LED package
US9859471B2 (en) 2011-01-31 2018-01-02 Cree, Inc. High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
US11101408B2 (en) 2011-02-07 2021-08-24 Creeled, Inc. Components and methods for light emitting diode (LED) lighting
US9634209B2 (en) 2011-03-02 2017-04-25 Cree, Inc. Miniature surface mount device
US10683971B2 (en) 2015-04-30 2020-06-16 Cree, Inc. Solid state lighting components
US10962199B2 (en) 2015-04-30 2021-03-30 Cree, Inc. Solid state lighting components
USD782989S1 (en) * 2015-05-15 2017-04-04 Citizen Electronics Co., Ltd. Light-emitting diode
USD777694S1 (en) * 2015-05-15 2017-01-31 Citizen Electronics Co., Ltd. Light-emitting diode
TWD204009S (en) 2019-03-22 2020-04-11 晶元光電股份有限公司 Part of light-emitting device
TWD204008S (en) 2019-03-22 2020-04-11 晶元光電股份有限公司 Part of light-emitting device

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