USD709464S1 - Light emitting diode (LED) package - Google Patents

Light emitting diode (LED) package Download PDF

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Publication number
USD709464S1
USD709464S1 US29/423,422 US201229423422F USD709464S US D709464 S1 USD709464 S1 US D709464S1 US 201229423422 F US201229423422 F US 201229423422F US D709464 S USD709464 S US D709464S
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US
United States
Prior art keywords
view
led
package
light emitting
emitting diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/423,422
Inventor
Amber C. Abare
Jeffrey Carl Britt
Joseph G. Clark
Raymond Rosado
Harsh Sundani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Creeled Inc
Original Assignee
Cree Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cree Inc filed Critical Cree Inc
Priority to US29/423,422 priority Critical patent/USD709464S1/en
Priority to US13/554,776 priority patent/US10439112B2/en
Priority to US29/439,629 priority patent/USD749051S1/en
Priority to US13/713,410 priority patent/US9349929B2/en
Assigned to CREE, INC. reassignment CREE, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SUNDANI, Harsh, BRITT, JEFFREY C., ROSADO, RAYMOND, ABARE, AMBER C., CLARK, Joseph G.
Application granted granted Critical
Publication of USD709464S1 publication Critical patent/USD709464S1/en
Assigned to CREELED, INC. reassignment CREELED, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREE, INC.
Assigned to CITIZENS BANK, N.A. reassignment CITIZENS BANK, N.A. SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREELED, INC., SMART EMBEDDED COMPUTING, INC., SMART High Reliability Solutions, LLC, SMART MODULAR TECHNOLOGIES, INC.
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Description

FIG. 1 is a top perspective view of a LED package showing our design according to a first embodiment;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof, opposite the view of FIG. 2;
FIG. 4 is a first side view thereof;
FIG. 5 is a second side view thereof;
FIG. 6 is a third side view thereof, opposite the view of FIG. 4;
FIG. 7 is a fourth side view thereof, opposite the view of FIG. 5;
FIG. 8 is a top perspective view of a LED package showing our design according to a second embodiment;
FIG. 9 is a top plan view thereof;
FIG. 10 is a bottom plan view thereof, opposite the view of FIG. 9;
FIG. 11 is a first side view thereof;
FIG. 12 is a second side view thereof;
FIG. 13 is a third side view thereof, opposite the view of FIG. 11;
FIG. 14 is a fourth side view thereof, opposite the view of FIG. 12;
FIG. 15 is a top perspective view of a LED package showing our design according to a third embodiment;
FIG. 16 is a top plan view;
FIG. 17 is a bottom plan view;
FIG. 18 is first side view;
FIG. 19 is second side view;
FIG. 20 is third side view;
FIG. 21 is fourth side view;
FIG. 22 is a top perspective view of a LED package showing our design according to a fourth embodiment;
FIG. 23 is a top plan view;
FIG. 24 is a bottom plan view;
FIG. 25 is first side view;
FIG. 26 is second side view;
FIG. 27 is third side view; and,
FIG. 28 is fourth side view.
The broken lines are for illustrative purposes only and form no part of the claimed design. The stippled portion of the embodiment illustrated in FIGS. 8, 9, 11, and 13 represent that the stippled portion is a different material than other, adjacent portions. The more densely stippled portions illustrated in FIGS. 22, 23, and 25-28 represent a metallic surface.

Claims (1)

    CLAIM
  1. The ornamental design for a light emitting diode (LED) package, as shown and described.
US29/423,422 2012-05-31 2012-05-31 Light emitting diode (LED) package Active USD709464S1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US29/423,422 USD709464S1 (en) 2012-05-31 2012-05-31 Light emitting diode (LED) package
US13/554,776 US10439112B2 (en) 2012-05-31 2012-07-20 Light emitter packages, systems, and methods having improved performance
US29/439,629 USD749051S1 (en) 2012-05-31 2012-12-13 Light emitting diode (LED) package
US13/713,410 US9349929B2 (en) 2012-05-31 2012-12-13 Light emitter packages, systems, and methods

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/423,422 USD709464S1 (en) 2012-05-31 2012-05-31 Light emitting diode (LED) package

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US13/554,776 Continuation-In-Part US10439112B2 (en) 2012-05-31 2012-07-20 Light emitter packages, systems, and methods having improved performance

Related Child Applications (3)

Application Number Title Priority Date Filing Date
US13/554,776 Continuation US10439112B2 (en) 2012-05-31 2012-07-20 Light emitter packages, systems, and methods having improved performance
US13/713,410 Continuation-In-Part US9349929B2 (en) 2012-05-31 2012-12-13 Light emitter packages, systems, and methods
US29/439,629 Continuation-In-Part USD749051S1 (en) 2012-05-31 2012-12-13 Light emitting diode (LED) package

Publications (1)

Publication Number Publication Date
USD709464S1 true USD709464S1 (en) 2014-07-22

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US29/423,422 Active USD709464S1 (en) 2012-05-31 2012-05-31 Light emitting diode (LED) package

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US (1) USD709464S1 (en)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100237775A1 (en) * 2009-03-20 2010-09-23 Everlight Electronics Co., Ltd. Light emitting diode package structure and manufacturing method thereof
USD735683S1 (en) * 2013-05-03 2015-08-04 Cree, Inc. LED package
USD746240S1 (en) * 2013-12-30 2015-12-29 Cree, Inc. LED package
USD749051S1 (en) 2012-05-31 2016-02-09 Cree, Inc. Light emitting diode (LED) package
USD753612S1 (en) * 2012-09-07 2016-04-12 Cree, Inc. Light emitter device
US9349929B2 (en) 2012-05-31 2016-05-24 Cree, Inc. Light emitter packages, systems, and methods
USD758976S1 (en) * 2013-08-08 2016-06-14 Cree, Inc. LED package
US9397266B2 (en) 2007-11-14 2016-07-19 Cree, Inc. Lateral semiconductor light emitting diodes having large area contacts
US9484499B2 (en) 2007-04-20 2016-11-01 Cree, Inc. Transparent ohmic contacts on light emitting diodes with carrier substrates
USD790486S1 (en) * 2014-09-30 2017-06-27 Cree, Inc. LED package with truncated encapsulant
USD826871S1 (en) * 2014-12-11 2018-08-28 Cree, Inc. Light emitting diode device
USD844183S1 (en) 2016-08-19 2019-03-26 Citizen Electronics Co., Ltd. Light emitting diode
USD844576S1 (en) 2017-07-25 2019-04-02 Citizen Electronics Co., Ltd. Light emitting diode
US10439112B2 (en) 2012-05-31 2019-10-08 Cree, Inc. Light emitter packages, systems, and methods having improved performance
US10683971B2 (en) 2015-04-30 2020-06-16 Cree, Inc. Solid state lighting components
USD926714S1 (en) 2019-10-30 2021-08-03 Creeled, Inc. Light emitting diode package
USD1000400S1 (en) 2021-04-16 2023-10-03 Creeled, Inc. Light emitting diode package

Non-Patent Citations (11)

* Cited by examiner, † Cited by third party
Title
"High Flux Density and Efficacy," Luxeon M Datasheet DSI03, 2012, pp. 1-22, Philips Lumileds Company, United States.
Chinese Notice of Grant for Application No. 201230586339.6 dated Apr. 15, 2013.
Chinese Office Action for Application No. 201330248426.5 dated Aug. 19, 2013.
Chinese Office Action for Application No. 201330525231.0 dated Jan. 13, 2014.
International Search Report and Written Opinion for Application No. PCT/US2013/043618 dated Sep. 25, 2013.
International Search Report and Written Opinion for Application No. PCT/US2013/043619 dated Sep. 26, 2013.
Notice of Allowance for Design U.S. Appl. No. 29/439,629 dated Nov. 27, 2013.
Notice of Issurance for Application No. 201330248426.5 dated Nov. 19, 2013.
Restriction Requirement for Design U.S. Appl. No. 29/439,629 dated Sep. 30, 2013.
Restriction Requirement for U.S. Appl. No. 13/554,776 dated Jun. 14, 2013.
Shchekin, Oleg et al., "Evolutionary new chip design targets lighting systems," Compound Semiconductor, Mar. 2007, vol. 13 No. 2, Institute of Physics Publishing and IOP Publishing Ltd.

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9484499B2 (en) 2007-04-20 2016-11-01 Cree, Inc. Transparent ohmic contacts on light emitting diodes with carrier substrates
US9397266B2 (en) 2007-11-14 2016-07-19 Cree, Inc. Lateral semiconductor light emitting diodes having large area contacts
US20100237775A1 (en) * 2009-03-20 2010-09-23 Everlight Electronics Co., Ltd. Light emitting diode package structure and manufacturing method thereof
US10439112B2 (en) 2012-05-31 2019-10-08 Cree, Inc. Light emitter packages, systems, and methods having improved performance
USD749051S1 (en) 2012-05-31 2016-02-09 Cree, Inc. Light emitting diode (LED) package
US9349929B2 (en) 2012-05-31 2016-05-24 Cree, Inc. Light emitter packages, systems, and methods
USD753612S1 (en) * 2012-09-07 2016-04-12 Cree, Inc. Light emitter device
USD735683S1 (en) * 2013-05-03 2015-08-04 Cree, Inc. LED package
USD758976S1 (en) * 2013-08-08 2016-06-14 Cree, Inc. LED package
USD746240S1 (en) * 2013-12-30 2015-12-29 Cree, Inc. LED package
USD790486S1 (en) * 2014-09-30 2017-06-27 Cree, Inc. LED package with truncated encapsulant
USD826871S1 (en) * 2014-12-11 2018-08-28 Cree, Inc. Light emitting diode device
US10683971B2 (en) 2015-04-30 2020-06-16 Cree, Inc. Solid state lighting components
US10962199B2 (en) 2015-04-30 2021-03-30 Cree, Inc. Solid state lighting components
USD844183S1 (en) 2016-08-19 2019-03-26 Citizen Electronics Co., Ltd. Light emitting diode
USD844576S1 (en) 2017-07-25 2019-04-02 Citizen Electronics Co., Ltd. Light emitting diode
USD926714S1 (en) 2019-10-30 2021-08-03 Creeled, Inc. Light emitting diode package
USD1000400S1 (en) 2021-04-16 2023-10-03 Creeled, Inc. Light emitting diode package

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