USD752000S1 - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
- Publication number
- USD752000S1 USD752000S1 US29/509,740 US201429509740F USD752000S US D752000 S1 USD752000 S1 US D752000S1 US 201429509740 F US201429509740 F US 201429509740F US D752000 S USD752000 S US D752000S
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- US
- United States
- Prior art keywords
- semiconductor device
- view
- elevation view
- ornamental design
- side elevation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The broken lines shown in the drawings represent portions of the semiconductor device that form no part of the claimed design.
Claims (1)
- We claim the ornamental design for a semiconductor device, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/509,740 USD752000S1 (en) | 2013-03-07 | 2014-11-20 | Semiconductor device |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/789,065 US8975694B1 (en) | 2013-03-07 | 2013-03-07 | Low resistance power switching device |
US29/448,057 USD721047S1 (en) | 2013-03-07 | 2013-03-08 | Semiconductor device |
US29/509,740 USD752000S1 (en) | 2013-03-07 | 2014-11-20 | Semiconductor device |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/448,057 Division USD721047S1 (en) | 2013-03-07 | 2013-03-08 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
USD752000S1 true USD752000S1 (en) | 2016-03-22 |
Family
ID=52248043
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/448,057 Active USD721047S1 (en) | 2013-03-07 | 2013-03-08 | Semiconductor device |
US29/509,740 Active USD752000S1 (en) | 2013-03-07 | 2014-11-20 | Semiconductor device |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/448,057 Active USD721047S1 (en) | 2013-03-07 | 2013-03-08 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
US (2) | USD721047S1 (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD813182S1 (en) * | 2016-08-02 | 2018-03-20 | Panasonic Intellectual Property Management Co., Ltd. | Semiconductor device |
USD822627S1 (en) * | 2017-01-31 | 2018-07-10 | Rohm Co., Ltd. | Semiconductor device |
USD822628S1 (en) * | 2017-01-31 | 2018-07-10 | Rohm Co., Ltd. | Semiconductor device |
USD823270S1 (en) * | 2016-09-30 | 2018-07-17 | Rohm Co., Ltd. | Semiconductor device |
USD852765S1 (en) * | 2017-10-19 | 2019-07-02 | Rohm Co., Ltd. | Semiconductor device |
USD853343S1 (en) * | 2017-10-19 | 2019-07-09 | Rohm Co., Ltd. | Semiconductor device |
USD856947S1 (en) * | 2017-10-19 | 2019-08-20 | Rohm Co., Ltd. | Semiconductor device |
USD934821S1 (en) * | 2019-07-24 | 2021-11-02 | Nuvoton Technology Corporation Japan | Semiconductor device |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD769832S1 (en) | 2013-02-19 | 2016-10-25 | Sony Corporation | Semiconductor device |
USD721047S1 (en) * | 2013-03-07 | 2015-01-13 | Vlt, Inc. | Semiconductor device |
USD761745S1 (en) * | 2013-06-28 | 2016-07-19 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
USD756317S1 (en) * | 2014-08-26 | 2016-05-17 | Féinics Amatech Teoranta | Layout for contact pads and connection bridges of a transponder chip module |
USD868756S1 (en) * | 2016-11-10 | 2019-12-03 | GM Global Technology Operations LLC | Vehicle antenna |
JP1642346S (en) * | 2019-03-20 | 2019-09-30 | ||
USD934820S1 (en) * | 2019-10-24 | 2021-11-02 | Nuvoton Technology Corporation Japan | Semiconductor device |
Citations (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4152714A (en) | 1978-01-16 | 1979-05-01 | Honeywell Inc. | Semiconductor apparatus |
USD259559S (en) * | 1978-07-28 | 1981-06-16 | Hitachi, Ltd. | Semiconductor |
US4809135A (en) * | 1986-08-04 | 1989-02-28 | General Electric Company | Chip carrier and method of fabrication |
US4891686A (en) | 1988-04-08 | 1990-01-02 | Directed Energy, Inc. | Semiconductor packaging with ground plane conductor arrangement |
US4949158A (en) * | 1987-07-24 | 1990-08-14 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
US5105257A (en) * | 1990-08-08 | 1992-04-14 | Mitsubishi Denki Kabushiki Kaisha | Packaged semiconductor device and semiconductor device packaging element |
USD328599S (en) | 1990-04-10 | 1992-08-11 | Gemplus Card International | Connecting terminal for chip cards |
US5187552A (en) | 1979-03-28 | 1993-02-16 | Hendrickson Thomas E | Shielded field-effect transistor devices |
US5401910A (en) | 1992-12-03 | 1995-03-28 | Murata Manufacturing Co. Ltd. | Electronic component |
US5585670A (en) | 1995-09-05 | 1996-12-17 | Mitsubishi Electric Semiconductor Software Co. | Semiconductor device package |
USD396847S (en) | 1996-10-17 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
USD396846S (en) | 1997-04-16 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
US5844307A (en) | 1995-07-31 | 1998-12-01 | Nec Corporation | Plastic molded IC package with leads having small flatness fluctuation |
US6166430A (en) * | 1998-05-27 | 2000-12-26 | Matsushita Electronics Corporation | Lead frame, method for manufacturing the frame, resin-molded semiconductor device and method for manufacturing the device |
US6238953B1 (en) | 1999-01-12 | 2001-05-29 | Sony Corporation | Lead frame, resin-encapsulated semiconductor device and fabrication process for the device |
USD444132S1 (en) | 2000-08-23 | 2001-06-26 | Kabushiki Kaisha Toshiba | Semiconductor element |
US6353258B1 (en) | 1995-01-17 | 2002-03-05 | Hitachi, Ltd. | Semiconductor module |
USD456367S1 (en) | 2000-12-15 | 2002-04-30 | Protek Devices, Lp | Semiconductor chip |
USD466093S1 (en) | 2001-04-27 | 2002-11-26 | Taiyo Yuden Co., Ltd. | Hybird integrated circuit board |
USD473199S1 (en) | 2001-11-30 | 2003-04-15 | Kabushiki Kaisha Toshiba | Portion of semiconductor device |
USD476959S1 (en) | 2002-07-31 | 2003-07-08 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD476962S1 (en) | 2002-03-29 | 2003-07-08 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD480371S1 (en) | 2001-11-30 | 2003-10-07 | Kabushiki Kaisha Toshiba | Semiconductor device |
US20040004272A1 (en) | 2002-07-02 | 2004-01-08 | Leeshawn Luo | Integrated circuit package for semicoductor devices with improved electric resistance and inductance |
US6710441B2 (en) | 2000-07-13 | 2004-03-23 | Isothermal Research Systems, Inc. | Power semiconductor switching devices, power converters, integrated circuit assemblies, integrated circuitry, power current switching methods, methods of forming a power semiconductor switching device, power conversion methods, power semiconductor switching device packaging methods, and methods of forming a power transistor |
USD489338S1 (en) | 2003-07-28 | 2004-05-04 | Semiconductor Components Industries, L.L.C. | Packaged semiconductor device |
US6891223B2 (en) | 2002-03-19 | 2005-05-10 | Infineon Technologies Ag | Transistor configuration with a structure for making electrical contact with electrodes of a trench transistor cell |
USD504874S1 (en) | 2004-08-11 | 2005-05-10 | Semiconductor Components Industries, Llc | Semiconductor device package |
USD510728S1 (en) * | 2004-08-11 | 2005-10-18 | Semiconductor Components Industries Llc | Semiconductor device package |
US6969909B2 (en) | 2002-12-20 | 2005-11-29 | Vlt, Inc. | Flip chip FET device |
US7038917B2 (en) | 2002-12-27 | 2006-05-02 | Vlt, Inc. | Low loss, high density array interconnection |
US20100096756A1 (en) | 2007-01-10 | 2010-04-22 | Masayoshi Tagami | Semiconductor device and method of manufacturing the same |
US8021918B2 (en) | 2006-09-29 | 2011-09-20 | Megica Corporation | Integrated circuit chips with fine-line metal and over-passivation metal |
US20120299069A1 (en) | 2006-03-30 | 2012-11-29 | Intel Corporation | Copper-filled trench contact for transistor performance improvement |
USRE44372E1 (en) | 2008-04-15 | 2013-07-16 | Vlt, Inc. | System and apparatus for efficient heat removal from heat-generating electronic modules |
USD699201S1 (en) | 2012-10-01 | 2014-02-11 | Gemalto M2M Gmbh | Pad arrangement of a circuit module |
USD701843S1 (en) | 2010-12-28 | 2014-04-01 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
USD721047S1 (en) * | 2013-03-07 | 2015-01-13 | Vlt, Inc. | Semiconductor device |
USD732487S1 (en) * | 2013-08-06 | 2015-06-23 | Formosa Epitaxy Incorporation | Partial semiconductor light emitting component |
USD732488S1 (en) * | 2013-08-06 | 2015-06-23 | Formosa Epitaxy Incorporation | Partial semiconductor light emitting component |
-
2013
- 2013-03-08 US US29/448,057 patent/USD721047S1/en active Active
-
2014
- 2014-11-20 US US29/509,740 patent/USD752000S1/en active Active
Patent Citations (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4152714A (en) | 1978-01-16 | 1979-05-01 | Honeywell Inc. | Semiconductor apparatus |
USD259559S (en) * | 1978-07-28 | 1981-06-16 | Hitachi, Ltd. | Semiconductor |
US5187552A (en) | 1979-03-28 | 1993-02-16 | Hendrickson Thomas E | Shielded field-effect transistor devices |
US4809135A (en) * | 1986-08-04 | 1989-02-28 | General Electric Company | Chip carrier and method of fabrication |
US4949158A (en) * | 1987-07-24 | 1990-08-14 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
US4891686A (en) | 1988-04-08 | 1990-01-02 | Directed Energy, Inc. | Semiconductor packaging with ground plane conductor arrangement |
USD328599S (en) | 1990-04-10 | 1992-08-11 | Gemplus Card International | Connecting terminal for chip cards |
US5105257A (en) * | 1990-08-08 | 1992-04-14 | Mitsubishi Denki Kabushiki Kaisha | Packaged semiconductor device and semiconductor device packaging element |
US5401910A (en) | 1992-12-03 | 1995-03-28 | Murata Manufacturing Co. Ltd. | Electronic component |
US6353258B1 (en) | 1995-01-17 | 2002-03-05 | Hitachi, Ltd. | Semiconductor module |
US5844307A (en) | 1995-07-31 | 1998-12-01 | Nec Corporation | Plastic molded IC package with leads having small flatness fluctuation |
US5585670A (en) | 1995-09-05 | 1996-12-17 | Mitsubishi Electric Semiconductor Software Co. | Semiconductor device package |
USD396847S (en) | 1996-10-17 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
USD396846S (en) | 1997-04-16 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
US6166430A (en) * | 1998-05-27 | 2000-12-26 | Matsushita Electronics Corporation | Lead frame, method for manufacturing the frame, resin-molded semiconductor device and method for manufacturing the device |
US6238953B1 (en) | 1999-01-12 | 2001-05-29 | Sony Corporation | Lead frame, resin-encapsulated semiconductor device and fabrication process for the device |
US6710441B2 (en) | 2000-07-13 | 2004-03-23 | Isothermal Research Systems, Inc. | Power semiconductor switching devices, power converters, integrated circuit assemblies, integrated circuitry, power current switching methods, methods of forming a power semiconductor switching device, power conversion methods, power semiconductor switching device packaging methods, and methods of forming a power transistor |
USD444132S1 (en) | 2000-08-23 | 2001-06-26 | Kabushiki Kaisha Toshiba | Semiconductor element |
USD456367S1 (en) | 2000-12-15 | 2002-04-30 | Protek Devices, Lp | Semiconductor chip |
USD466093S1 (en) | 2001-04-27 | 2002-11-26 | Taiyo Yuden Co., Ltd. | Hybird integrated circuit board |
USD473199S1 (en) | 2001-11-30 | 2003-04-15 | Kabushiki Kaisha Toshiba | Portion of semiconductor device |
USD480371S1 (en) | 2001-11-30 | 2003-10-07 | Kabushiki Kaisha Toshiba | Semiconductor device |
US6891223B2 (en) | 2002-03-19 | 2005-05-10 | Infineon Technologies Ag | Transistor configuration with a structure for making electrical contact with electrodes of a trench transistor cell |
USD476962S1 (en) | 2002-03-29 | 2003-07-08 | Kabushiki Kaisha Toshiba | Semiconductor device |
US20040004272A1 (en) | 2002-07-02 | 2004-01-08 | Leeshawn Luo | Integrated circuit package for semicoductor devices with improved electric resistance and inductance |
USD476959S1 (en) | 2002-07-31 | 2003-07-08 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
US6969909B2 (en) | 2002-12-20 | 2005-11-29 | Vlt, Inc. | Flip chip FET device |
US7166898B2 (en) | 2002-12-20 | 2007-01-23 | Picor Corporation | Flip chip FET device |
US7038917B2 (en) | 2002-12-27 | 2006-05-02 | Vlt, Inc. | Low loss, high density array interconnection |
USD489338S1 (en) | 2003-07-28 | 2004-05-04 | Semiconductor Components Industries, L.L.C. | Packaged semiconductor device |
USD504874S1 (en) | 2004-08-11 | 2005-05-10 | Semiconductor Components Industries, Llc | Semiconductor device package |
USD510728S1 (en) * | 2004-08-11 | 2005-10-18 | Semiconductor Components Industries Llc | Semiconductor device package |
US20120299069A1 (en) | 2006-03-30 | 2012-11-29 | Intel Corporation | Copper-filled trench contact for transistor performance improvement |
US8021918B2 (en) | 2006-09-29 | 2011-09-20 | Megica Corporation | Integrated circuit chips with fine-line metal and over-passivation metal |
US20100096756A1 (en) | 2007-01-10 | 2010-04-22 | Masayoshi Tagami | Semiconductor device and method of manufacturing the same |
USRE44372E1 (en) | 2008-04-15 | 2013-07-16 | Vlt, Inc. | System and apparatus for efficient heat removal from heat-generating electronic modules |
USD701843S1 (en) | 2010-12-28 | 2014-04-01 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
USD699201S1 (en) | 2012-10-01 | 2014-02-11 | Gemalto M2M Gmbh | Pad arrangement of a circuit module |
USD721047S1 (en) * | 2013-03-07 | 2015-01-13 | Vlt, Inc. | Semiconductor device |
USD732487S1 (en) * | 2013-08-06 | 2015-06-23 | Formosa Epitaxy Incorporation | Partial semiconductor light emitting component |
USD732488S1 (en) * | 2013-08-06 | 2015-06-23 | Formosa Epitaxy Incorporation | Partial semiconductor light emitting component |
Non-Patent Citations (4)
Title |
---|
Efficient Power Conversion Corporation, "EPC1012-Enhancement Mode Power Transistor Datasheet". 2011, www.epc-co.com. |
Notice of Allowance mailed Aug. 28, 2014 in U.S. Appl. No. 29/448,057 (13 pgs.). |
Notice of Allowance mailed Oct. 31, 2014 in U.S. Appl. No. 13/789,065 (18 pgs.). |
Product Information, ST Dual N-Channel 30 V, Ω typ., 11 a STripFET™ V Power MOSFET in a PowerFLAT™ 5×6 double island, Doc ID 18416 Rev 3, Dec. 2012, www.st.com (14 pages). |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD813182S1 (en) * | 2016-08-02 | 2018-03-20 | Panasonic Intellectual Property Management Co., Ltd. | Semiconductor device |
USD823270S1 (en) * | 2016-09-30 | 2018-07-17 | Rohm Co., Ltd. | Semiconductor device |
USD822627S1 (en) * | 2017-01-31 | 2018-07-10 | Rohm Co., Ltd. | Semiconductor device |
USD822628S1 (en) * | 2017-01-31 | 2018-07-10 | Rohm Co., Ltd. | Semiconductor device |
USD852765S1 (en) * | 2017-10-19 | 2019-07-02 | Rohm Co., Ltd. | Semiconductor device |
USD853343S1 (en) * | 2017-10-19 | 2019-07-09 | Rohm Co., Ltd. | Semiconductor device |
USD856947S1 (en) * | 2017-10-19 | 2019-08-20 | Rohm Co., Ltd. | Semiconductor device |
USD934821S1 (en) * | 2019-07-24 | 2021-11-02 | Nuvoton Technology Corporation Japan | Semiconductor device |
Also Published As
Publication number | Publication date |
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USD721047S1 (en) | 2015-01-13 |
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