Búsqueda Imágenes Maps Play YouTube Noticias Gmail Drive Más »
Iniciar sesión
Usuarios de lectores de pantalla: deben hacer clic en este enlace para utilizar el modo de accesibilidad. Este modo tiene las mismas funciones esenciales pero funciona mejor con el lector.

Patentes

  1. Búsqueda avanzada de patentes
Número de publicaciónUSD758976 S1
Tipo de publicaciónConcesión
Número de solicitudUS 29/462,795
Fecha de publicación14 Jun 2016
Fecha de presentación8 Ago 2013
Fecha de prioridad8 Ago 2013
Número de publicación29462795, 462795, US D758976 S1, US D758976S1, US-S1-D758976, USD758976 S1, USD758976S1
InventoresJesse Reiherzer, Michael John Bergmann, Joseph Gates Clark
Cesionario originalCree, Inc.
Exportar citaBiBTeX, EndNote, RefMan
Enlaces externos: USPTO, Cesión de USPTO, Espacenet
LED package
US D758976 S1
Resumen  disponible en
Imágenes(7)
Previous page
Next page
Reclamaciones(1)
    CLAIM
  1. The ornamental design for an LED package, as shown and described herein.
Descripción

FIG. 1 is a top perspective view of an LED package according to one embodiment of the present invention.

FIG. 2 is a front elevation view of one side of the LED package shown in FIG. 1.

FIG. 3 is a back elevation view of the LED package as shown in FIG. 1.

FIG. 4 is an elevation view of one side of the LED package shown in FIG. 1, with the other side being substantially the same.

FIG. 5 is a top view of the LED package shown in FIG. 1.

FIG. 6 is a bottom view of the LED package shown in FIG. 1.

FIG. 7 is a top perspective view of an LED package according to another embodiment of the present invention.

FIG. 8 is a front elevation view of one side of the LED package shown in FIG. 7.

FIG. 9 is a back elevation view of the LED package as shown in FIG. 7.

FIG. 10 is an elevation view of one side of the LED package shown in FIG. 7, with the other side being substantially the same.

FIG. 11 is a top view of the LED package shown in FIG. 7.

FIG. 12 is a bottom view of the LED package shown in FIG. 7.

FIG. 13 is a top perspective view of an LED package according to another embodiment of the present invention.

FIG. 14 is a front elevation view of one side of the LED package shown in FIG. 13.

FIG. 15 is a back elevation view of the LED package as shown in FIG. 13.

FIG. 16 is an elevation view of one side of the LED package shown in FIG. 13, with the other side being substantially the same.

FIG. 17 is a top view of the LED package shown in FIG. 13; and,

FIG. 18 is a bottom view of the LED package shown in FIG. 13.

The regular broken lines shown in the above figures depict environmental subject matter only and form no part of the claimed design in those embodiments.

Citas de patentes
Patente citada Fecha de presentación Fecha de publicación Solicitante Título
US40139163 Oct 197522 Mar 1977Monsanto CompanySegmented light emitting diode deflector segment
US494654713 Oct 19897 Ago 1990Cree Research, Inc.Method of preparing silicon carbide surfaces for crystal growth
US504086831 May 199020 Ago 1991Siemens AktiengesellschaftSurface-mountable opto-component
US52000223 Oct 19906 Abr 1993Cree Research, Inc.Method of improving mechanically prepared substrate surfaces of alpha silicon carbide for deposition of beta silicon carbide thereon and resulting product
US595115011 Sep 199714 Sep 1999Eaton CorporationDisplay system
US606116030 May 19979 May 2000Dowa Mining Co., Ltd.Component device for optical communication
US635004129 Mar 200026 Feb 2002Cree Lighting CompanyHigh output radial dispersing lamp using a solid state light source
US637690231 Ene 200023 Abr 2002Osram Opto Semiconductors Gmbh & Co. OhgOptoelectronic structural element
US652191514 Mar 200118 Feb 2003Asahi Rubber Inc.Light-emitting diode device
US666745120 Mar 200323 Dic 2003Eaton CorporationPush button assembly
US668667630 Abr 20013 Feb 2004General Electric CompanyUV reflectors and UV-based light sources having reduced UV radiation leakage incorporating the same
US670706918 Jun 200216 Mar 2004Samsung Electro-Mechanics Co., LtdLight emission diode package
US67597334 Abr 20036 Jul 2004Osram Opto Semiconductors GmbhOptoelectric surface-mountable structural element
US690051127 Jun 200331 May 2005Osram Opto Semiconductors GmbhOptoelectronic component and method for producing it
US694070424 Ene 20016 Sep 2005Gelcore, LlcSemiconductor light emitting device
US700934311 Mar 20047 Mar 2006Kevin Len Li LimSystem and method for producing white light using LEDs
US70666268 Abr 200427 Jun 2006Citizen Electronics Co., Ltd.LED lamp
US71022151 Jul 20045 Sep 2006Osram GmbhSurface-mountable light-emitting diode structural element
US71836323 Abr 200627 Feb 2007Osram GmbhSurface-mountable light-emitting diode structural element
US72139404 Dic 20068 May 2007Led Lighting Fixtures, Inc.Lighting device and lighting method
US722400026 Abr 200429 May 2007Lumination, LlcLight emitting diode component
US72534486 Dic 20047 Ago 2007Gentex CorporationSemiconductor radiation emitter package
US727142527 Nov 200318 Sep 2007Osram Opto Semiconductors GmbhOptoelectronic component
US728278514 Sep 200416 Oct 2007Stanley Electric Co., Ltd.Surface mount type semiconductor device and lead frame structure thereof
US731718122 Ago 20058 Ene 2008Hitachi Cable, Ltd.Light-emitting unit and method for producing same as well as lead frame used for producing light-emitting unit
US761475921 Dic 200610 Nov 2009Cree Led Lighting Solutions, Inc.Lighting device
US77222203 May 200725 May 2010Cree Led Lighting Solutions, Inc.Lighting device
US776269214 Ene 200827 Jul 2010Foxsemicon Integrated Technology, Inc.Surface mount light emitting diode assembly and backlight module using the same
US779106130 Ene 20067 Sep 2010Cree, Inc.External extraction light emitting diode based upon crystallographic faceted surfaces
US805808815 Ene 200815 Nov 2011Cree, Inc.Phosphor coating systems and methods for light emitting structures and packaged light emitting diodes including phosphor coating
US845014714 Mar 201228 May 2013Philips Lumileds Lighting Company LlcLaminating encapsulant film containing phosphor over LEDs
US852338321 Feb 20113 Sep 2013Cooper Technologies CompanyRetrofitting recessed lighting fixtures
US8624289 *10 Sep 20087 Ene 2014Osram Opto Semiconductors GmbhOptoelectronic component
US2002012316323 Abr 20015 Sep 2002Takehiro FujiiEdge-emitting light-emitting semiconductor device and method of manufacture thereof
US200201630014 May 20017 Nov 2002Shaddock David MulfordSurface mount light emitting device package and fabrication method
US200300084311 Abr 20029 Ene 2003Sumitomo Electric Industries, Ltd.Light emitting device
US2004004122227 May 20034 Mar 2004Loh Ban P.Power surface mount light emitting die package
US2004007995722 Oct 200329 Abr 2004Andrews Peter ScottPower surface mount light emitting die package
US2004012691325 Nov 20031 Jul 2004Loh Ban P.Composite leadframe LED package and method of making the same
US200401308805 Jun 20038 Jul 2004Samsung Electronics Co., Ltd.Backlight unit
US2004021839022 Ene 20044 Nov 2004Digital Optics International CorporationHigh-density illumination system
US20040227149 *29 Abr 200418 Nov 2004Cree, Inc.High powered light emitter packages with compact optics
US200402389301 Jul 20042 Dic 2004Osram Opto Semiconductors GmbhSurface-mountable light-emitting diode structural element
US2005007324416 Sep 20047 Abr 2005Chou Der JeouMethods and apparatus for an LED light
US2005007384023 Ago 20047 Abr 2005Chou Der JeouMethods and apparatus for an LED light engine
US200501737084 Feb 200511 Ago 2005Toyoda Gosei Co., Ltd.Light emitting device and sealing material
US2006004947727 Nov 20039 Mar 2006Karlheinz ArndtOptoelectronic component
US2006006088221 Sep 200523 Mar 2006Sharp Kabushiki KaishaOptical semiconductor device, optical communication device, and electronic equipment
US2006010291710 Jun 200318 May 2006Toshihiko OyamaSemiconductor light emitting device, method for producing the same and reflector for semiconductor light emitting device
US2006018643117 Feb 200624 Ago 2006Nichia CorporationLight emitting device provided with lens for controlling light distribution characteristic
US200602788866 Jun 200614 Dic 2006Sony CorporationLight emitting diode, method of manufacturing light emitting diode, light emitting diode backlight, light emitting diode illuminating device, light emitting diode display, and electronic apparatus
US200700851077 Dic 200619 Abr 2007Kabushiki Kaisha ToshibaLight Emitting Device
US2007010846317 Nov 200517 May 2007Chua Janet B YLight-emitting diode with UV-blocking nano-particles
US2007015866821 Jun 200612 Jul 2007Cree, Inc.Close loop electrophoretic deposition of semiconductor devices
US2007025225026 Abr 20061 Nov 2007Cotco Holdings Limited, A Hong Kong CorporationApparatus and method for use in mounting electronic elements
US2007027893418 Abr 20076 Dic 2007Led Lighting Fixtures, Inc.Lighting device and lighting method
US2008013028530 Nov 20075 Jun 2008Led Lighting Fixtures, Inc.Lighting device and lighting method
US2008017388422 Ene 200724 Jul 2008Cree, Inc.Wafer level phosphor coating method and devices fabricated utilizing method
US2008025813023 Abr 200723 Oct 2008Bergmann Michael JBeveled LED Chip with Transparent Substrate
US200900576994 Sep 20075 Mar 2009Philips Lumileds Lighting Company, LlcLED with Particles in Encapsulant for Increased Light Extraction and Non-Yellow Off-State Color
US2009009104525 Abr 20079 Abr 2009Sekisui Chemical Co., LtdThemosetting Composition for Optical Semiconductor, Die Bond Material for Optical Semiconductor Device, Underfill Material for Optical Semiconductor Device, Sealing Agent for Optical Semiconductor Device, and Optical Semiconductor Device
US2009010828131 Oct 200730 Abr 2009Cree, Inc.Light emitting diode package and method for fabricating same
US2009027299527 Sep 20065 Nov 2009Nitto Denko CorporationResin composition for optical semiconductor element encapsulation, and optical semiconductor device produced by using the same
US2009028378116 May 200819 Nov 2009Cree Hong Kong LimitedMini V SMD
US2009029034520 May 200826 Nov 2009Apl Ip Holding LlcEnclosures for led circuit boards
US2009029638130 Oct 20083 Dic 2009Jack DubordAdjustable modular lighting system and method of using same
US2010007905925 Jun 20091 Abr 2010John RobertsSolid State Lighting Devices Including Light Mixtures
US2010014220520 Nov 200910 Jun 2010Avx CorporationTwo part surface mount led strip connector and led assembly
US201001557633 Mar 201024 Jun 2010Cree, Inc.Systems and methods for application of optical materials to optical elements
US2011003152730 Jul 201010 Feb 2011Hitachi Chemical Company, Ltd.Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
US2011012133123 Nov 200926 May 2011Koninklijke Philips Electronics N.V.Wavelength converted semiconductor light emitting device
US2011014028914 Dic 201016 Jun 2011Toshio ShiobaraResin composition for encapsulating optical semiconductor element and optical semiconductor device
US201101496043 Mar 201123 Jun 2011Cree, Inc.Encapsulant profile for light emitting diodes
US2011015606128 Jul 201030 Jun 2011Harvatek CorporationLight emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof
US2011016368322 Feb 20117 Jul 2011Quarkstar, LlcSolid State Lamp Using Light Emitting Strips
US201102213309 Mar 201015 Sep 2011Cree, Inc.High cri lighting device with added long-wavelength blue color
US2011031600623 Dic 201029 Dic 2011Tao XuSurface-Textured Encapsulations for use with Light Emitting Diodes
US20120032202 *17 Mar 20109 Feb 2012Sharp Kabushiki KaishaPlanar light source device and display device provided with the planar light source device
US201200617031 Jun 201115 Mar 2012Kabushiki Kaisha ToshibaLight emitting device and manufacturing method of light emitting device
US201200628219 Sep 201115 Mar 2012Toshiba Materials Co., Ltd.White led, backlight using same, and liquid crystal display device conforming to ebu standard
US2012012066611 Nov 201117 May 2012Hella Kgaa Hueck & Co.Street lighting device
US2012023519018 Mar 201120 Sep 2012Cree, Inc.Encapsulant with index matched thixotropic agent
US2013027197917 Abr 201217 Oct 2013Dennis PearsonScalable LED Sconce Light
US20130328073 *10 Oct 201212 Dic 2013Cree, Inc.Led package with multiple element light source and encapsulant having planar surfaces
US20130328074 *19 Feb 201312 Dic 2013Cree, Inc.Led package with multiple element light source and encapsulant having planar surfaces
USD49455026 Ago 200317 Ago 2004Nichia CorporationLight emitting diode
USD5113293 Feb 20058 Nov 2005Nichia CorporationLight emitting diode
USD5113303 Feb 20058 Nov 2005Nichia CorporationLight emitting diode
USD5170277 Jun 200514 Mar 2006Nichia CorporationLight emitting diode
USD57221030 Abr 20071 Jul 2008Lg Innotek Co., Ltd.Light-emitting diode (LED)
USD57657415 Ene 20089 Sep 2008Rohm Co., Ltd.Light emitting diode module
USD5916979 Ago 20065 May 2009Cree, Inc.Lamp package
USD615504 *31 Oct 200711 May 2010Cree, Inc.Emitter package
USD63102029 Abr 201018 Ene 2011Edison Opto CorporationLED package
USD63363114 Dic 20071 Mar 2011Cree Hong Kong LimitedLight source of light emitting diode
USD63486310 Ene 200822 Mar 2011Cree Hong Kong LimitedLight source of light emitting diode
USD645416 *16 Jun 201020 Sep 2011Panasonic CorporationLight-emitting diode
USD649943 *28 Dic 20106 Dic 2011Panasonic CorporationLight emitting diode
USD650343 *31 Ene 201113 Dic 2011Cree, Inc.Multiple configuration light emitting device package
USD6569068 Dic 20103 Abr 2012Cree Hong Kong LimitedLED package
USD660257 *31 Ene 201122 May 2012Cree, Inc.Emitter package
USD66290225 Oct 20103 Jul 2012Cree Hong Kong LimitedLED package
USD667802 *7 Sep 201125 Sep 2012Citizen Electronics Co., Ltd.Light-emitting diode
USD674758 *3 Ene 201222 Ene 2013Silitek Electronic (Guangzhou) Co., Ltd.Light emitting diode
USD675169 *13 Dic 201129 Ene 2013Lextar Electronics Corp.Multi-chip LED
USD691973 *8 Jul 201122 Oct 2013Cree, Inc.Lamp packages
USD698323 *14 Feb 201328 Ene 2014Nichia CorporationLight emitting diode
USD698741 *28 Nov 20124 Feb 2014Kabushiki Kaisha ToshibaLight-emitting diode
USD703348 *9 Jul 201222 Abr 2014Cree, Inc.Lamp package
USD704154 *5 Oct 20126 May 2014Cree, Inc.Light emitter package
USD709464 *31 May 201222 Jul 2014Cree, Inc.Light emitting diode (LED) package
USD711840 *11 Jun 201226 Ago 2014Cree, Inc.LED package
USD718725 *1 Ago 20132 Dic 2014Cree, Inc.LED package with encapsulant
USRE348619 Oct 199014 Feb 1995North Carolina State UniversitySublimation of silicon carbide to produce large, device quality single crystals of silicon carbide
CN1417868A29 Oct 200114 May 2003银河光电股份有限公司Multiple-chip package structure of LED chip
CN1977399A31 Mar 20066 Jun 2007松下电器产业株式会社LED component and method for manufacturing same
EP0441622A16 Feb 199114 Ago 1991Shin-Etsu Chemical Co., Ltd.Epoxy resin compositions containing highly transparent silica-titania glass beads
EP1187227A231 May 198913 Mar 2002Osram Opto Semiconductors GmbH & Co. oHGSurface-mountable optical element and method of fabrication
EP1529807A215 Oct 200411 May 2005Nitto Denko CorporationEpoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same
EP1953834A128 Dic 20056 Ago 2008Matsushita Electric Works, Ltd.Light-emitting device
EP2042528A125 Sep 20071 Abr 2009Sony Chemical & Information Device CorporationCurable resin composition
EP2149920A113 May 20083 Feb 2010Showa Denko K.K.Semiconductor light-emitting device
EP2196501A17 Dic 200916 Jun 2010Nichia CorporationThermoseting epoxy resin composition and semiconductor device
EP2336230A114 Dic 201022 Jun 2011Shin-Etsu Chemical Co., Ltd.Resin composition for encapsulating optical semiconductor element and optical semiconductor device
JP1171204A Título no disponible
JP1218688A Título no disponible
JP2000188358A Título no disponible
JP2000223752A Título no disponible
JP2003197974A Título no disponible
JP2006165029A Título no disponible
JP2007287981A Título no disponible
JP2007299905A Título no disponible
JPH0545812Y2 Título no disponible
WO2004053933A23 Dic 200324 Jun 2004Cree, Inc.Composite leadframe led package and method of making the same
WO2006060141A214 Nov 20058 Jun 2006Nanocrystal Lighting CorporationOptically reliable nanoparticle based nanocomposite hri encapsulant and photonic waveguiding material
WO2011061650A122 Oct 201026 May 2011Koninklijke Philips Electronics N.V.Wavelength converted semiconductor light emitting diode
WO2012128966A38 Mar 201210 Ene 2013Cree, Inc.Light emitting diode package comprising encapsulant with index matched thixotropic agent
Otras citas
Referencia
1Chinese Office Action for Patent Application No. 201210031021.0 dated Dec. 30, 2013.
2Citizen Micro HumanTech. "COB-High-wattage Series and Low-wattage Series." Short Form Lighting LED Catalog 2012. Citizen Electronics Co. Ltd. Japan. 12 pages.
3Cree family of LED chips. DA, EZ, GaN, MB, RT,TR, UT, and XT. Printout from cree.com. 2 pages.
4Cree XLampC family product info printout, from cree.com, 20 pages.
5Cree XLampXM product info printout, from cree.com, 13 pages.
6Cree® XLamp® MC-E LEDs Product Info Sheets, 14 pages.
7Decision of Registration from Japanese Design Patent Application No. 2013-004502, dated Jun. 24, 2014.
8Decision of Registration from Japanese Design Patent Application No. 2013-004502. dated Jun. 24, 2014.
9Decision of Registration from Japanese Design Patent Application No. 2013-025955, dated Jun. 24, 2014.
10Definition of 'composite', Oxford American English Dictionary, 2 pages, http://oxforddictionaries.com/us/definition/american-english/compsite?q=composite.
11Design of Registration Notice from Japanese Patent Appl. No. 2012-030304, dated Jan. 21, 2014.
12Examination and Search Report from Taiwanese Patent Appl. No. 103300731, dated Jul. 21, 2014.
13Examination and Search Report from Taiwanese Patent Appl. No. 103300731. dated Jul. 21, 2014.
14Examination Report from Taiwanese Patent Appl. No. 102301478, dated Sep. 6, 2013.
15Examination Report from Taiwanese Patent appl. No. 102308472, dated May 14, 2014.
16Final Office Action for U.S. Appl. No. 13/829,558 dated Mar. 9, 2015.
17Final Office Action for U.S. Appl. No. 13/842,150 dated Jan. 22, 2015.
18Final Office Action from U.S. Appl. No. 13/040,088 dated May 7, 2013.
19Final Office Action U.S. Appl. No. 13/051,894 dated Aug. 19, 2013.
20First Office Action from Chinese Design Patent appl. No. 201330524820.7, dated Feb. 20, 2014.
21First Office Action from Chinese Patent Appl. No. 201330052393.7, dated Jan. 9, 2014.
22International Report on Patentability and Written Opinion for Application No. Application No. PCT/US2012/028327 dated Sep. 24, 2013.
23International Search Report and Written Opinion from PCT/US2013/062640 dated May 22, 2014.
24International Search Report for Application No. PCT/US2014/045888 dated Sep. 11, 2014.
25International Search Report for PCT Patent Application No. PCT/US2012/028327 dated Nov. 23, 2012.
26Letter of Examination Report from Taiwanese Patent appl. No. 101307391, dated Jun. 5. 2013.
27Nichia Corporation LEDs, Models NSSM016G, NSSM227, NESM026X, NSSM026BB, NESM005A, 9 pages.
28Non-Final OA for U.S. Appl. No. 13/051,894 dated Jan. 14, 2013.
29Non-Final Office Action for U.S. Appl. No. 13/672,592 dated Jan. 7, 2015.
30Non-Final Office Action for U.S. Appl. No. 13/899,314 dated Jan. 15, 2015.
31Non-Final Office Action for U.S. Appl. No. 13/958,461 dated Mar. 10, 2015.
32Non-Final Office Action from U.S. Appl. No. 13/040,088 dated Sep. 13, 2013.
33Notice of Allowance and Search Report for Taiwanese Patent Appl. No. 101307391, dated Oct. 15, 2013.
34Notice of Allowance from Chinese Patent Appl. No. 201330524820.7. Dated Aug. 5, 2014.
35Notice of Allowance from Korean Patent Appl. No. 30-2013-0010610, dated Oct. 17, 2014.
36Notice of Allowance from Korean Patent Appl. No. 30-2014-0006603, dated Apr. 2, 2015.
37Notice of Allowance from Korean Patent Appl. No. 30-2014-0016126, dated Jun. 1, 2015.
38Notice of Allowance of Taiwanese Appl. No. 103300731, dated Jan. 21, 2015.
39Notice of Issuance of Chinese Patent Appl. No. 201430021459.0. dated May 21, 2014.
40Notice to Submit a Response from Korean Design Appl. No. 30-2012-0059744 dated Apr. 28, 2014.
41Notice to Submit a Response from Korean Design Appl. No. 30-2014-0016126, dated Nov. 7, 2014.
42Notice to Submit a Response from Korean Patent Appl. No. 30-2012-0059744, dated Nov. 26, 2013.
43Office Action from Japanese Patent appl. No. 2007-228699, dated May 22, 2015.
44Office Action from Korean Patent Appl. No. 30-2014-0006603, dated Nov. 12, 2014.
45Office Action from Korean Patent Appl. No. 30-2014-0016126, dated Feb. 23, 2015.
46Office Action from Korean Patent Design Appl. No. 30/2013-0010610, dated Jul. 8, 2014.
47Office Action from Korean Patent Design Appl. No. 30-2013-0010610. dated Jul. 8, 2014.
48Office Action from Taiwanese Patent appl. No. 099145035, dated Apr. 22, 2015.
49Office Action from U.S. Appl. No. 13/051,894 dated Jun. 18, 2014.
50Office Action from U.S. Appl. No. 13/649,052 dated Jul. 24, 2014.
51Office Action from U.S. Appl. No. 13/649,067 dated Jul. 7, 2014.
52Office Action from U.S. Appl. No. 29/424,353. dated Dec. 26, 2013.
53Patent Certificate from Chinese Design Patent Appl. No. ZL 2013 3 0524820.7, dated Nov. 4, 2013.
54Patent Issue Notice from Taiwanese Design Patent No. D-166931, dated Apr. 1, 2015.
55Reasons for Rejection from Japanese Design Patent Appl. No. 2013-004502, dated Aug. 6, 2013.
56Second Office Action from Chinese Patent Appl. No. 201210031021.0 dated Jun. 4, 2014.
57U.S. Appl. No. 11/473,089, filed Jun. 21, 2006, Tarsa et al.
58U.S. Appl. No. 11/656,759, filed Jan. 22, 2007, Chitnis et al.
59U.S. Appl. No. 11/818,818, filed Jun. 2007, Chakraborty et al.
60U.S. Appl. No. 11/895,573, filed Aug. 2007, Chakraborty et al.
61U.S. Appl. No. 11/899,790, filed Sep. 7, 2007, Chitnis et al.
62U.S. Appl. No. 12/002,429, filed Dec. 2007, Loh et al.
63U.S. Appl. No. 12/463,709, filed May 11, 2009, Donofrio.
64U.S. Appl. No. 12/475,261, filed May 2009, Nagley et al.
65U.S. Appl. No. 12/498,253, filed Jul. 2009, Le Toquin et al.
66U.S. Appl. No. 12/717,048, filed Jun. 24, 2010, Donofrio.
67U.S. Appl. No. 12/873,303, filed Aug. 31, 2010, Edmond et al.
68U.S. Appl. No. 13/028,946, filed Feb. 16, 2011, Le et al.
69U.S. Appl. No. 13/034,501, filed Feb. 24, 2011, Le et al.
70U.S. Appl. No. 13/219,486, filed Aug. 2011, Ibbetson et al.
71U.S. Appl. No. 13/306,589, filed Nov. 2011, Tarsa et al.
72U.S. Appl. No. 13/368,217, filed Feb. 7, 2012, Pickard et al.
73U.S. Appl. No. 13/544,662, filed Jul. 2012, Tarsa et al.
74U.S. Appl. No. 13/770,389, filed Feb. 2013, Lowes et al.
75U.S. Appl. No. 13/804,309, filed Mar. 2013, Castillo et al.
76U.S. Appl. No. 13/842,307, filed Mar. 2013, Ibbetson et al.
77U.S. Appl. No. 29/412,854, filed Feb. 8, 2012, Leung, et al.
78US-133452215, Jan. 2012, Lu et al.
Citada por
Patente citante Fecha de presentación Fecha de publicación Solicitante Título
USD778848 *7 Abr 201514 Feb 2017Cree, Inc.Solid state light emitter component
Clasificaciones
Clasificación de EE.UU.D13/180