USD769834S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD769834S1
USD769834S1 US29/503,992 US201429503992F USD769834S US D769834 S1 USD769834 S1 US D769834S1 US 201429503992 F US201429503992 F US 201429503992F US D769834 S USD769834 S US D769834S
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US
United States
Prior art keywords
semiconductor device
view
elevational view
broken lines
side perspective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/503,992
Inventor
Tatsuya Kawase
Noboru Miyamoto
Mikio Ishihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to US29/503,992 priority Critical patent/USD769834S1/en
Application granted granted Critical
Publication of USD769834S1 publication Critical patent/USD769834S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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FIG. 1 is a front, top and right side perspective view of a semiconductor device showing our new design;
FIG. 2 is a rear, top, and left side perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a right side elevational view thereof;
FIG. 7 is a top plan view thereof;
FIG. 8 is a bottom plan view thereof;
FIG. 9 is a front, top and right side perspective view thereof, shown in a used condition attached to a mount shown in broken lines; and,
FIG. 10 is another front elevational view thereof, attached to a mount shown in broken lines.
The broken lines shown in the drawings represent portions of the semiconductor device that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor device, as shown and described.
US29/503,992 2013-05-08 2014-10-01 Semiconductor device Active USD769834S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/503,992 USD769834S1 (en) 2013-05-08 2014-10-01 Semiconductor device

Applications Claiming Priority (14)

Application Number Priority Date Filing Date Title
JP2013-010104 2013-01-23
JP2013-010102 2013-01-23
JP2013-010100 2013-05-08
JP2013010102 2013-05-08
JP2013010103 2013-05-08
JP2013010100 2013-05-08
JP2013-010099 2013-05-08
JP2013010104 2013-05-08
JP2013-010101 2013-05-08
JP2013-010103 2013-05-08
JP2013010101 2013-05-08
JP2013010099 2013-05-08
US29/464,434 USD719537S1 (en) 2013-05-08 2013-08-16 Semiconductor device
US29/503,992 USD769834S1 (en) 2013-05-08 2014-10-01 Semiconductor device

Related Parent Applications (1)

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US29/464,434 Division USD719537S1 (en) 2013-05-08 2013-08-16 Semiconductor device

Publications (1)

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USD769834S1 true USD769834S1 (en) 2016-10-25

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US29/464,434 Active USD719537S1 (en) 2013-05-08 2013-08-16 Semiconductor device
US29/503,992 Active USD769834S1 (en) 2013-05-08 2014-10-01 Semiconductor device

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US29/464,434 Active USD719537S1 (en) 2013-05-08 2013-08-16 Semiconductor device

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Cited By (12)

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Publication number Priority date Publication date Assignee Title
USD785577S1 (en) * 2013-08-21 2017-05-02 Mitsubishi Electric Corporation Semiconductor device
USD790491S1 (en) * 2015-09-30 2017-06-27 Mitsubishi Electric Corporation Power semiconductor device
USD798832S1 (en) * 2015-09-30 2017-10-03 Mitsubishi Electric Corporation Power semiconductor device
USD799439S1 (en) * 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module
USD805680S1 (en) * 2013-12-09 2017-12-19 Kenall Manufacturing Company Driver housing
USD864883S1 (en) * 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD864882S1 (en) * 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD865690S1 (en) * 2017-09-27 2019-11-05 Hamamatsu Photonics K.K. Part for semiconductor device
USD903613S1 (en) 2018-06-26 2020-12-01 Rohm Co., Ltd. Semiconductor module
USD903611S1 (en) * 2019-03-29 2020-12-01 Mitsubishi Electric Corporation Semiconductor device
USD913978S1 (en) * 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD923591S1 (en) * 2019-03-15 2021-06-29 Tamura Corporation Semiconductor driving circuit module

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USD874411S1 (en) * 2008-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD732092S1 (en) * 2014-03-19 2015-06-16 Veeco Ald Inc. Gas injection plate
USD732093S1 (en) * 2014-03-19 2015-06-16 Veeco Ald Inc. Gas tube assembly
USD772182S1 (en) * 2014-04-02 2016-11-22 Mitsubishi Electric Corporation Power semiconductor device
USD762597S1 (en) * 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
JP1536359S (en) * 2014-08-19 2015-10-26
JP1536191S (en) * 2014-08-19 2015-10-26
JP1536360S (en) * 2014-08-19 2015-10-26
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD742338S1 (en) * 2014-08-27 2015-11-03 Apple Inc. MLB module for electronic device
USD803663S1 (en) 2014-11-20 2017-11-28 Green Inova Lighting Technology Limited Bracket
JP1585831S (en) * 2017-01-05 2017-09-11
USD864132S1 (en) 2017-01-05 2019-10-22 Rohm Co., Ltd. Power semiconductor module
USD864884S1 (en) 2017-10-23 2019-10-29 Mitsubishi Electric Corporation Semiconductor device
USD906271S1 (en) 2018-04-13 2020-12-29 Rohm Co., Ltd. Semiconductor module
USD874412S1 (en) * 2018-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
USD873226S1 (en) * 2018-04-13 2020-01-21 Rohm Co., Ltd. Semiconductor module
USD942403S1 (en) 2019-10-24 2022-02-01 Wolfspeed, Inc. Power module having pin fins

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USD505400S1 (en) 2004-03-26 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD505399S1 (en) 2003-03-14 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD539761S1 (en) 2006-08-22 2007-04-03 Kabushiki Kaisha Toshiba Semiconductor
USD548203S1 (en) 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD548202S1 (en) 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD587662S1 (en) 2007-12-20 2009-03-03 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD589012S1 (en) 2008-03-17 2009-03-24 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD606951S1 (en) 2008-11-14 2009-12-29 Fuji Electric Device Technology Co, Ltd. Semiconductor device
US20100149774A1 (en) 2008-12-17 2010-06-17 Mitsubishi Electric Corporation Semiconductor device
US20110044012A1 (en) * 2006-12-15 2011-02-24 Mitsubishi Electric Corporation Semiconductor device
USD653634S1 (en) 2010-10-28 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD653633S1 (en) 2010-12-14 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD674760S1 (en) 2011-04-01 2013-01-22 Fuji Electric Co., Ltd. Semiconductor device
USD686174S1 (en) 2011-08-12 2013-07-16 Fuji Electric Co., Ltd Semiconductor device
USD704670S1 (en) 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD704671S1 (en) 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD705184S1 (en) 2013-07-11 2014-05-20 Fuji Electric Co., Ltd. Semiconductor module

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US3762039A (en) 1971-09-10 1973-10-02 Mos Technology Inc Plastic encapsulation of microcircuits
US3846734A (en) 1973-02-06 1974-11-05 Amp Inc Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates
US4422703A (en) * 1981-09-15 1983-12-27 Thomas & Betts Corporation Electrical connector for use with multi-pin arrays
US4737884A (en) * 1982-05-26 1988-04-12 Fujitsu Limited Semiconductor device module
US4866571A (en) * 1982-06-21 1989-09-12 Olin Corporation Semiconductor package
US4677526A (en) * 1984-03-01 1987-06-30 Augat Inc. Plastic pin grid array chip carrier
US4595794A (en) * 1984-03-19 1986-06-17 At&T Bell Laboratories Component mounting apparatus
USD288922S (en) 1984-04-19 1987-03-24 Thomson Components-Mostek Corporation Zero power random access memory package
US4663833A (en) 1984-05-14 1987-05-12 Oki Electric Industry Co. Ltd. Method for manufacturing IC plastic package with window
USD317592S (en) * 1987-01-19 1991-06-18 Canon Kabushiki Kaisha Semiconductor element
USD318271S (en) 1987-07-04 1991-07-16 Terutomi Hasegawa Substrate for mounting semiconductors
USD317300S (en) 1987-07-04 1991-06-04 Terutomi Hasegawa Semi-conductor mounting substrate
USD316848S (en) 1987-07-04 1991-05-14 Terutomi Hasegawa Mounting substrate for semiconductors
US4987474A (en) * 1987-09-18 1991-01-22 Hitachi, Ltd. Semiconductor device and method of manufacturing the same
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USD359028S (en) 1993-09-02 1995-06-06 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
USD360619S (en) 1993-09-16 1995-07-25 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD357462S (en) * 1993-09-16 1995-04-18 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD357672S (en) 1993-09-16 1995-04-25 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD357671S (en) 1993-09-16 1995-04-25 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
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USD389808S (en) 1996-01-09 1998-01-27 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
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USD505400S1 (en) 2004-03-26 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD548202S1 (en) 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD548203S1 (en) 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD539761S1 (en) 2006-08-22 2007-04-03 Kabushiki Kaisha Toshiba Semiconductor
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USD653634S1 (en) 2010-10-28 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
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Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD785577S1 (en) * 2013-08-21 2017-05-02 Mitsubishi Electric Corporation Semiconductor device
USD805485S1 (en) 2013-08-21 2017-12-19 Mitsubishi Electric Corporation Semiconductor device
USD844216S1 (en) * 2013-12-09 2019-03-26 Kenall Manufacturing Company Driver housing
USD805680S1 (en) * 2013-12-09 2017-12-19 Kenall Manufacturing Company Driver housing
USD790491S1 (en) * 2015-09-30 2017-06-27 Mitsubishi Electric Corporation Power semiconductor device
USD798832S1 (en) * 2015-09-30 2017-10-03 Mitsubishi Electric Corporation Power semiconductor device
USD799439S1 (en) * 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module
USD864883S1 (en) * 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD864882S1 (en) * 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD865690S1 (en) * 2017-09-27 2019-11-05 Hamamatsu Photonics K.K. Part for semiconductor device
USD903613S1 (en) 2018-06-26 2020-12-01 Rohm Co., Ltd. Semiconductor module
USD913978S1 (en) * 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD923591S1 (en) * 2019-03-15 2021-06-29 Tamura Corporation Semiconductor driving circuit module
USD903611S1 (en) * 2019-03-29 2020-12-01 Mitsubishi Electric Corporation Semiconductor device

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