USD771168S1 - Wire bonding ceramic capillary - Google Patents

Wire bonding ceramic capillary Download PDF

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Publication number
USD771168S1
USD771168S1 US29/507,914 US201429507914F USD771168S US D771168 S1 USD771168 S1 US D771168S1 US 201429507914 F US201429507914 F US 201429507914F US D771168 S USD771168 S US D771168S
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US
United States
Prior art keywords
wire bonding
ceramic capillary
bonding ceramic
capillary
depicts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/507,914
Inventor
Russell Bell
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Coorstek Inc
Original Assignee
Coorstek Inc
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Filing date
Publication date
Application filed by Coorstek Inc filed Critical Coorstek Inc
Priority to US29/507,914 priority Critical patent/USD771168S1/en
Assigned to COORSTEK, INC. reassignment COORSTEK, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BELL, RUSSELL
Priority to TW104302295F priority patent/TWD174022S/en
Priority to JPD2015-9731F priority patent/JP1551100S/ja
Application granted granted Critical
Publication of USD771168S1 publication Critical patent/USD771168S1/en
Assigned to WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT reassignment WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: COORSTEK, INC.
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Description

FIG. 1 depicts a first perspective view of a wire bonding ceramic capillary.
FIG. 2 depicts a second perspective view thereof;
FIG. 3 depicts a top plan view thereof;
FIG. 4 depicts a side elevation view thereof; and,
FIG. 5 depicts a bottom plan view thereof.
The broken lines in the drawings illustrate environmental structure on the article and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a wire bonding ceramic capillary, as shown and described.
US29/507,914 2014-10-31 2014-10-31 Wire bonding ceramic capillary Active USD771168S1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US29/507,914 USD771168S1 (en) 2014-10-31 2014-10-31 Wire bonding ceramic capillary
TW104302295F TWD174022S (en) 2014-10-31 2015-04-30 Portion of a wire bonding ceramic capillary
JPD2015-9731F JP1551100S (en) 2014-10-31 2015-04-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/507,914 USD771168S1 (en) 2014-10-31 2014-10-31 Wire bonding ceramic capillary

Publications (1)

Publication Number Publication Date
USD771168S1 true USD771168S1 (en) 2016-11-08

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Family Applications (1)

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US29/507,914 Active USD771168S1 (en) 2014-10-31 2014-10-31 Wire bonding ceramic capillary

Country Status (3)

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US (1) USD771168S1 (en)
JP (1) JP1551100S (en)
TW (1) TWD174022S (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD815168S1 (en) * 2017-05-23 2018-04-10 Rpm Wood Finishes Group, Inc. Cartridge for heat pump dispenser
USD868123S1 (en) 2016-12-20 2019-11-26 Coorstek, Inc. Wire bonding wedge tool
USD877219S1 (en) * 2017-04-27 2020-03-03 Hakko Corporation Soldering tip

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US3101634A (en) * 1960-09-12 1963-08-27 Gulton Ind Inc Sonic welder
US3690538A (en) 1970-02-25 1972-09-12 Gaiser Tool Co Bonding tool
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USD255318S (en) * 1977-11-22 1980-06-10 Bakkeren Hans A Ultrasonic welding head for polypropylene strapping
US4415115A (en) 1981-06-08 1983-11-15 Motorola, Inc. Bonding means and method
USD271741S (en) 1981-02-02 1983-12-13 Eldon Industries, Inc. Soldering iron tip
US4600138A (en) 1984-07-25 1986-07-15 Hughes Aircraft Company Bonding tool and clamp assembly and wire handling method
JPS62190343U (en) 1986-05-26 1987-12-03
JPS6380845U (en) 1986-11-14 1988-05-27
USD297704S (en) * 1985-03-11 1988-09-20 Carol Bulow Miniature welding torch with disposable tip
USD305720S (en) * 1987-02-09 1990-01-30 Olgesby & Butler Plc Soldering iron with removable cap
US5217154A (en) 1989-06-13 1993-06-08 Small Precision Tools, Inc. Semiconductor bonding tool
US5248076A (en) 1989-08-22 1993-09-28 Cooper Industries, Inc. Soldering tool
US5445306A (en) 1994-05-31 1995-08-29 Motorola, Inc. Wedge wire bonding tool tip
US5485949A (en) 1993-04-30 1996-01-23 Matsushita Electric Industrial Co., Ltd. Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary
US5683603A (en) 1995-04-19 1997-11-04 Fortune; William S. Electric soldering iron tip improvements
US5954260A (en) 1996-12-17 1999-09-21 Texas Instruments Incorporated Fine pitch bonding technique
JPH11354569A (en) 1998-06-05 1999-12-24 Hitachi Ltd Method and device for bonding wire and manufacture of semiconductor device
US6041995A (en) 1997-03-06 2000-03-28 Kabushiki Kaisha Shinkawa Wire bonding method
US6068174A (en) 1996-12-13 2000-05-30 Micro)N Technology, Inc. Device and method for clamping and wire-bonding the leads of a lead frame one set at a time
USD431434S (en) * 1998-01-08 2000-10-03 Hakko Corporation Soldering iron tip
US6158647A (en) 1998-09-29 2000-12-12 Micron Technology, Inc. Concave face wire bond capillary
USD444175S1 (en) * 2000-05-23 2001-06-26 Pentel Kabushiki Kaisha Correction pen
US6260753B1 (en) 1998-08-07 2001-07-17 Stmicroelectronics S.R.L. Gold bumps bonding on connection pads and subsequent coining of their vertex
US6352197B1 (en) 1999-01-29 2002-03-05 Rohm Co., Ltd. Method and apparatus for wire-bonding for electric components
JP2003068784A (en) 2001-08-28 2003-03-07 Kyocera Corp Capillary for wire bonding
US6564989B2 (en) 2000-08-22 2003-05-20 Mitsubishi Denki Kabushiki Kaisha Wire bonding method and wire bonding apparatus
US6646228B2 (en) 1999-08-18 2003-11-11 Hyperion Innovations, Inc. Cordless soldering iron
JP2004087822A (en) 2002-08-27 2004-03-18 Mitsubishi Materials Corp Wedge tool
US6729527B2 (en) * 2001-01-30 2004-05-04 Kulicke & Soffa Investments, Inc. Bonding tool with polymer coating
USD517384S1 (en) * 2004-01-22 2006-03-21 Pentel Kabushiki Kaisha Wire solder applicator
US7051915B2 (en) 2002-08-29 2006-05-30 Rohm Co., Ltd. Capillary for wire bonding and method of wire bonding using it
US7216794B2 (en) 2005-06-09 2007-05-15 Texas Instruments Incorporated Bond capillary design for ribbon wire bonding
US7247588B2 (en) 2002-11-22 2007-07-24 Saint-Gobain Ceramics & Plastics, Inc. Zirconia toughened alumina ESD safe ceramic composition, component, and methods for making same
US7249702B2 (en) 2003-12-04 2007-07-31 Kulicke And Soffa Industries, Inc. Multi-part capillary
USD549255S1 (en) 2004-11-08 2007-08-21 Dragos Axinte Soldering iron tip
US7407080B2 (en) 2004-04-02 2008-08-05 Chippac, Inc. Wire bond capillary tip
JP2009147103A (en) 2007-12-14 2009-07-02 Renesas Technology Corp Semiconductor device and manufacturing method of same
USD598721S1 (en) 2008-04-24 2009-08-25 Luis Meza Motorcycle maintenance tool
JP2009283814A (en) 2008-05-26 2009-12-03 Toshiba Lighting & Technology Corp Capillary for wire bonding and electronic component assembling apparatus
US7918378B1 (en) 2010-08-06 2011-04-05 National Semiconductor Corporation Wire bonding deflector for a wire bonder
US8056794B2 (en) 2006-10-09 2011-11-15 Kulicke And Soffa Industries, Inc. Combination wedge bonding and ball bonding transducer
USD667857S1 (en) * 2009-06-04 2012-09-25 Smk Co., Ltd. Electrode tip for resistive welders
US8292160B2 (en) 2009-02-23 2012-10-23 Shinkawa Ltd. Method of manufacturing semiconductor device, and bonding apparatus
JP2013135008A (en) 2011-12-26 2013-07-08 Fuji Electric Co Ltd Wedge tool for wire bonding, bonding device, wire bonding method, and method of manufacturing semiconductor device
USD697956S1 (en) * 2013-01-24 2014-01-21 Tesa Tape Inc. Ultrasonic welding sheath
TW201412448A (en) 2012-09-26 2014-04-01 Toto Ltd Soldering iron tip
TW201429601A (en) 2013-01-25 2014-08-01 Toto Ltd Bonding capillary
TW201429600A (en) 2013-01-25 2014-08-01 Toto Ltd Solder pin
JP2014222729A (en) 2013-05-14 2014-11-27 住友電気工業株式会社 Method and apparatus for manufacturing semiconductor device
USD720785S1 (en) * 2013-10-30 2015-01-06 Sei Optifrontier Co., Ltd. Electrode bar for optical fiber fusion splicer
USD741127S1 (en) * 2013-11-14 2015-10-20 Robert Bosch Gmbh Glue applicator
USD753739S1 (en) * 2015-04-17 2016-04-12 Coorstek, Inc. Wire bonding wedge tool

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3101634A (en) * 1960-09-12 1963-08-27 Gulton Ind Inc Sonic welder
US3690538A (en) 1970-02-25 1972-09-12 Gaiser Tool Co Bonding tool
US4030657A (en) 1972-12-26 1977-06-21 Rca Corporation Wire lead bonding tool
USD255318S (en) * 1977-11-22 1980-06-10 Bakkeren Hans A Ultrasonic welding head for polypropylene strapping
USD271741S (en) 1981-02-02 1983-12-13 Eldon Industries, Inc. Soldering iron tip
US4415115A (en) 1981-06-08 1983-11-15 Motorola, Inc. Bonding means and method
US4600138A (en) 1984-07-25 1986-07-15 Hughes Aircraft Company Bonding tool and clamp assembly and wire handling method
USD297704S (en) * 1985-03-11 1988-09-20 Carol Bulow Miniature welding torch with disposable tip
JPS62190343U (en) 1986-05-26 1987-12-03
JPS6380845U (en) 1986-11-14 1988-05-27
USD305720S (en) * 1987-02-09 1990-01-30 Olgesby & Butler Plc Soldering iron with removable cap
US5217154A (en) 1989-06-13 1993-06-08 Small Precision Tools, Inc. Semiconductor bonding tool
US5248076A (en) 1989-08-22 1993-09-28 Cooper Industries, Inc. Soldering tool
US5485949A (en) 1993-04-30 1996-01-23 Matsushita Electric Industrial Co., Ltd. Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary
US5445306A (en) 1994-05-31 1995-08-29 Motorola, Inc. Wedge wire bonding tool tip
US5683603A (en) 1995-04-19 1997-11-04 Fortune; William S. Electric soldering iron tip improvements
US6068174A (en) 1996-12-13 2000-05-30 Micro)N Technology, Inc. Device and method for clamping and wire-bonding the leads of a lead frame one set at a time
US5954260A (en) 1996-12-17 1999-09-21 Texas Instruments Incorporated Fine pitch bonding technique
US6041995A (en) 1997-03-06 2000-03-28 Kabushiki Kaisha Shinkawa Wire bonding method
USD431434S (en) * 1998-01-08 2000-10-03 Hakko Corporation Soldering iron tip
JPH11354569A (en) 1998-06-05 1999-12-24 Hitachi Ltd Method and device for bonding wire and manufacture of semiconductor device
US6260753B1 (en) 1998-08-07 2001-07-17 Stmicroelectronics S.R.L. Gold bumps bonding on connection pads and subsequent coining of their vertex
US6158647A (en) 1998-09-29 2000-12-12 Micron Technology, Inc. Concave face wire bond capillary
US6352197B1 (en) 1999-01-29 2002-03-05 Rohm Co., Ltd. Method and apparatus for wire-bonding for electric components
US6646228B2 (en) 1999-08-18 2003-11-11 Hyperion Innovations, Inc. Cordless soldering iron
USD444175S1 (en) * 2000-05-23 2001-06-26 Pentel Kabushiki Kaisha Correction pen
US6564989B2 (en) 2000-08-22 2003-05-20 Mitsubishi Denki Kabushiki Kaisha Wire bonding method and wire bonding apparatus
US6729527B2 (en) * 2001-01-30 2004-05-04 Kulicke & Soffa Investments, Inc. Bonding tool with polymer coating
JP2003068784A (en) 2001-08-28 2003-03-07 Kyocera Corp Capillary for wire bonding
JP2004087822A (en) 2002-08-27 2004-03-18 Mitsubishi Materials Corp Wedge tool
US7051915B2 (en) 2002-08-29 2006-05-30 Rohm Co., Ltd. Capillary for wire bonding and method of wire bonding using it
US7247588B2 (en) 2002-11-22 2007-07-24 Saint-Gobain Ceramics & Plastics, Inc. Zirconia toughened alumina ESD safe ceramic composition, component, and methods for making same
US7249702B2 (en) 2003-12-04 2007-07-31 Kulicke And Soffa Industries, Inc. Multi-part capillary
USD517384S1 (en) * 2004-01-22 2006-03-21 Pentel Kabushiki Kaisha Wire solder applicator
US7407080B2 (en) 2004-04-02 2008-08-05 Chippac, Inc. Wire bond capillary tip
USD549255S1 (en) 2004-11-08 2007-08-21 Dragos Axinte Soldering iron tip
US7216794B2 (en) 2005-06-09 2007-05-15 Texas Instruments Incorporated Bond capillary design for ribbon wire bonding
US8056794B2 (en) 2006-10-09 2011-11-15 Kulicke And Soffa Industries, Inc. Combination wedge bonding and ball bonding transducer
JP2009147103A (en) 2007-12-14 2009-07-02 Renesas Technology Corp Semiconductor device and manufacturing method of same
USD598721S1 (en) 2008-04-24 2009-08-25 Luis Meza Motorcycle maintenance tool
JP2009283814A (en) 2008-05-26 2009-12-03 Toshiba Lighting & Technology Corp Capillary for wire bonding and electronic component assembling apparatus
US8292160B2 (en) 2009-02-23 2012-10-23 Shinkawa Ltd. Method of manufacturing semiconductor device, and bonding apparatus
USD667857S1 (en) * 2009-06-04 2012-09-25 Smk Co., Ltd. Electrode tip for resistive welders
US7918378B1 (en) 2010-08-06 2011-04-05 National Semiconductor Corporation Wire bonding deflector for a wire bonder
JP2013135008A (en) 2011-12-26 2013-07-08 Fuji Electric Co Ltd Wedge tool for wire bonding, bonding device, wire bonding method, and method of manufacturing semiconductor device
JP2014082450A (en) 2012-09-26 2014-05-08 Toto Ltd Bonding capillary
TW201412448A (en) 2012-09-26 2014-04-01 Toto Ltd Soldering iron tip
USD697956S1 (en) * 2013-01-24 2014-01-21 Tesa Tape Inc. Ultrasonic welding sheath
TW201429601A (en) 2013-01-25 2014-08-01 Toto Ltd Bonding capillary
TW201429600A (en) 2013-01-25 2014-08-01 Toto Ltd Solder pin
JP2014222729A (en) 2013-05-14 2014-11-27 住友電気工業株式会社 Method and apparatus for manufacturing semiconductor device
USD720785S1 (en) * 2013-10-30 2015-01-06 Sei Optifrontier Co., Ltd. Electrode bar for optical fiber fusion splicer
USD741127S1 (en) * 2013-11-14 2015-10-20 Robert Bosch Gmbh Glue applicator
USD753739S1 (en) * 2015-04-17 2016-04-12 Coorstek, Inc. Wire bonding wedge tool

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD868123S1 (en) 2016-12-20 2019-11-26 Coorstek, Inc. Wire bonding wedge tool
USD877219S1 (en) * 2017-04-27 2020-03-03 Hakko Corporation Soldering tip
USD815168S1 (en) * 2017-05-23 2018-04-10 Rpm Wood Finishes Group, Inc. Cartridge for heat pump dispenser

Also Published As

Publication number Publication date
JP1551100S (en) 2016-06-06
TWD174022S (en) 2016-03-01

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