USD771168S1 - Wire bonding ceramic capillary - Google Patents
Wire bonding ceramic capillary Download PDFInfo
- Publication number
- USD771168S1 USD771168S1 US29/507,914 US201429507914F USD771168S US D771168 S1 USD771168 S1 US D771168S1 US 201429507914 F US201429507914 F US 201429507914F US D771168 S USD771168 S US D771168S
- Authority
- US
- United States
- Prior art keywords
- wire bonding
- ceramic capillary
- bonding ceramic
- capillary
- depicts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The broken lines in the drawings illustrate environmental structure on the article and form no part of the claimed design.
Claims (1)
- The ornamental design for a wire bonding ceramic capillary, as shown and described.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/507,914 USD771168S1 (en) | 2014-10-31 | 2014-10-31 | Wire bonding ceramic capillary |
TW104302295F TWD174022S (en) | 2014-10-31 | 2015-04-30 | Portion of a wire bonding ceramic capillary |
JPD2015-9731F JP1551100S (en) | 2014-10-31 | 2015-04-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/507,914 USD771168S1 (en) | 2014-10-31 | 2014-10-31 | Wire bonding ceramic capillary |
Publications (1)
Publication Number | Publication Date |
---|---|
USD771168S1 true USD771168S1 (en) | 2016-11-08 |
Family
ID=56090493
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/507,914 Active USD771168S1 (en) | 2014-10-31 | 2014-10-31 | Wire bonding ceramic capillary |
Country Status (3)
Country | Link |
---|---|
US (1) | USD771168S1 (en) |
JP (1) | JP1551100S (en) |
TW (1) | TWD174022S (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD815168S1 (en) * | 2017-05-23 | 2018-04-10 | Rpm Wood Finishes Group, Inc. | Cartridge for heat pump dispenser |
USD868123S1 (en) | 2016-12-20 | 2019-11-26 | Coorstek, Inc. | Wire bonding wedge tool |
USD877219S1 (en) * | 2017-04-27 | 2020-03-03 | Hakko Corporation | Soldering tip |
Citations (53)
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US3101634A (en) * | 1960-09-12 | 1963-08-27 | Gulton Ind Inc | Sonic welder |
US3690538A (en) | 1970-02-25 | 1972-09-12 | Gaiser Tool Co | Bonding tool |
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USD271741S (en) | 1981-02-02 | 1983-12-13 | Eldon Industries, Inc. | Soldering iron tip |
US4600138A (en) | 1984-07-25 | 1986-07-15 | Hughes Aircraft Company | Bonding tool and clamp assembly and wire handling method |
JPS62190343U (en) | 1986-05-26 | 1987-12-03 | ||
JPS6380845U (en) | 1986-11-14 | 1988-05-27 | ||
USD297704S (en) * | 1985-03-11 | 1988-09-20 | Carol Bulow | Miniature welding torch with disposable tip |
USD305720S (en) * | 1987-02-09 | 1990-01-30 | Olgesby & Butler Plc | Soldering iron with removable cap |
US5217154A (en) | 1989-06-13 | 1993-06-08 | Small Precision Tools, Inc. | Semiconductor bonding tool |
US5248076A (en) | 1989-08-22 | 1993-09-28 | Cooper Industries, Inc. | Soldering tool |
US5445306A (en) | 1994-05-31 | 1995-08-29 | Motorola, Inc. | Wedge wire bonding tool tip |
US5485949A (en) | 1993-04-30 | 1996-01-23 | Matsushita Electric Industrial Co., Ltd. | Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary |
US5683603A (en) | 1995-04-19 | 1997-11-04 | Fortune; William S. | Electric soldering iron tip improvements |
US5954260A (en) | 1996-12-17 | 1999-09-21 | Texas Instruments Incorporated | Fine pitch bonding technique |
JPH11354569A (en) | 1998-06-05 | 1999-12-24 | Hitachi Ltd | Method and device for bonding wire and manufacture of semiconductor device |
US6041995A (en) | 1997-03-06 | 2000-03-28 | Kabushiki Kaisha Shinkawa | Wire bonding method |
US6068174A (en) | 1996-12-13 | 2000-05-30 | Micro)N Technology, Inc. | Device and method for clamping and wire-bonding the leads of a lead frame one set at a time |
USD431434S (en) * | 1998-01-08 | 2000-10-03 | Hakko Corporation | Soldering iron tip |
US6158647A (en) | 1998-09-29 | 2000-12-12 | Micron Technology, Inc. | Concave face wire bond capillary |
USD444175S1 (en) * | 2000-05-23 | 2001-06-26 | Pentel Kabushiki Kaisha | Correction pen |
US6260753B1 (en) | 1998-08-07 | 2001-07-17 | Stmicroelectronics S.R.L. | Gold bumps bonding on connection pads and subsequent coining of their vertex |
US6352197B1 (en) | 1999-01-29 | 2002-03-05 | Rohm Co., Ltd. | Method and apparatus for wire-bonding for electric components |
JP2003068784A (en) | 2001-08-28 | 2003-03-07 | Kyocera Corp | Capillary for wire bonding |
US6564989B2 (en) | 2000-08-22 | 2003-05-20 | Mitsubishi Denki Kabushiki Kaisha | Wire bonding method and wire bonding apparatus |
US6646228B2 (en) | 1999-08-18 | 2003-11-11 | Hyperion Innovations, Inc. | Cordless soldering iron |
JP2004087822A (en) | 2002-08-27 | 2004-03-18 | Mitsubishi Materials Corp | Wedge tool |
US6729527B2 (en) * | 2001-01-30 | 2004-05-04 | Kulicke & Soffa Investments, Inc. | Bonding tool with polymer coating |
USD517384S1 (en) * | 2004-01-22 | 2006-03-21 | Pentel Kabushiki Kaisha | Wire solder applicator |
US7051915B2 (en) | 2002-08-29 | 2006-05-30 | Rohm Co., Ltd. | Capillary for wire bonding and method of wire bonding using it |
US7216794B2 (en) | 2005-06-09 | 2007-05-15 | Texas Instruments Incorporated | Bond capillary design for ribbon wire bonding |
US7247588B2 (en) | 2002-11-22 | 2007-07-24 | Saint-Gobain Ceramics & Plastics, Inc. | Zirconia toughened alumina ESD safe ceramic composition, component, and methods for making same |
US7249702B2 (en) | 2003-12-04 | 2007-07-31 | Kulicke And Soffa Industries, Inc. | Multi-part capillary |
USD549255S1 (en) | 2004-11-08 | 2007-08-21 | Dragos Axinte | Soldering iron tip |
US7407080B2 (en) | 2004-04-02 | 2008-08-05 | Chippac, Inc. | Wire bond capillary tip |
JP2009147103A (en) | 2007-12-14 | 2009-07-02 | Renesas Technology Corp | Semiconductor device and manufacturing method of same |
USD598721S1 (en) | 2008-04-24 | 2009-08-25 | Luis Meza | Motorcycle maintenance tool |
JP2009283814A (en) | 2008-05-26 | 2009-12-03 | Toshiba Lighting & Technology Corp | Capillary for wire bonding and electronic component assembling apparatus |
US7918378B1 (en) | 2010-08-06 | 2011-04-05 | National Semiconductor Corporation | Wire bonding deflector for a wire bonder |
US8056794B2 (en) | 2006-10-09 | 2011-11-15 | Kulicke And Soffa Industries, Inc. | Combination wedge bonding and ball bonding transducer |
USD667857S1 (en) * | 2009-06-04 | 2012-09-25 | Smk Co., Ltd. | Electrode tip for resistive welders |
US8292160B2 (en) | 2009-02-23 | 2012-10-23 | Shinkawa Ltd. | Method of manufacturing semiconductor device, and bonding apparatus |
JP2013135008A (en) | 2011-12-26 | 2013-07-08 | Fuji Electric Co Ltd | Wedge tool for wire bonding, bonding device, wire bonding method, and method of manufacturing semiconductor device |
USD697956S1 (en) * | 2013-01-24 | 2014-01-21 | Tesa Tape Inc. | Ultrasonic welding sheath |
TW201412448A (en) | 2012-09-26 | 2014-04-01 | Toto Ltd | Soldering iron tip |
TW201429601A (en) | 2013-01-25 | 2014-08-01 | Toto Ltd | Bonding capillary |
TW201429600A (en) | 2013-01-25 | 2014-08-01 | Toto Ltd | Solder pin |
JP2014222729A (en) | 2013-05-14 | 2014-11-27 | 住友電気工業株式会社 | Method and apparatus for manufacturing semiconductor device |
USD720785S1 (en) * | 2013-10-30 | 2015-01-06 | Sei Optifrontier Co., Ltd. | Electrode bar for optical fiber fusion splicer |
USD741127S1 (en) * | 2013-11-14 | 2015-10-20 | Robert Bosch Gmbh | Glue applicator |
USD753739S1 (en) * | 2015-04-17 | 2016-04-12 | Coorstek, Inc. | Wire bonding wedge tool |
-
2014
- 2014-10-31 US US29/507,914 patent/USD771168S1/en active Active
-
2015
- 2015-04-30 JP JPD2015-9731F patent/JP1551100S/ja active Active
- 2015-04-30 TW TW104302295F patent/TWD174022S/en unknown
Patent Citations (54)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3101634A (en) * | 1960-09-12 | 1963-08-27 | Gulton Ind Inc | Sonic welder |
US3690538A (en) | 1970-02-25 | 1972-09-12 | Gaiser Tool Co | Bonding tool |
US4030657A (en) | 1972-12-26 | 1977-06-21 | Rca Corporation | Wire lead bonding tool |
USD255318S (en) * | 1977-11-22 | 1980-06-10 | Bakkeren Hans A | Ultrasonic welding head for polypropylene strapping |
USD271741S (en) | 1981-02-02 | 1983-12-13 | Eldon Industries, Inc. | Soldering iron tip |
US4415115A (en) | 1981-06-08 | 1983-11-15 | Motorola, Inc. | Bonding means and method |
US4600138A (en) | 1984-07-25 | 1986-07-15 | Hughes Aircraft Company | Bonding tool and clamp assembly and wire handling method |
USD297704S (en) * | 1985-03-11 | 1988-09-20 | Carol Bulow | Miniature welding torch with disposable tip |
JPS62190343U (en) | 1986-05-26 | 1987-12-03 | ||
JPS6380845U (en) | 1986-11-14 | 1988-05-27 | ||
USD305720S (en) * | 1987-02-09 | 1990-01-30 | Olgesby & Butler Plc | Soldering iron with removable cap |
US5217154A (en) | 1989-06-13 | 1993-06-08 | Small Precision Tools, Inc. | Semiconductor bonding tool |
US5248076A (en) | 1989-08-22 | 1993-09-28 | Cooper Industries, Inc. | Soldering tool |
US5485949A (en) | 1993-04-30 | 1996-01-23 | Matsushita Electric Industrial Co., Ltd. | Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary |
US5445306A (en) | 1994-05-31 | 1995-08-29 | Motorola, Inc. | Wedge wire bonding tool tip |
US5683603A (en) | 1995-04-19 | 1997-11-04 | Fortune; William S. | Electric soldering iron tip improvements |
US6068174A (en) | 1996-12-13 | 2000-05-30 | Micro)N Technology, Inc. | Device and method for clamping and wire-bonding the leads of a lead frame one set at a time |
US5954260A (en) | 1996-12-17 | 1999-09-21 | Texas Instruments Incorporated | Fine pitch bonding technique |
US6041995A (en) | 1997-03-06 | 2000-03-28 | Kabushiki Kaisha Shinkawa | Wire bonding method |
USD431434S (en) * | 1998-01-08 | 2000-10-03 | Hakko Corporation | Soldering iron tip |
JPH11354569A (en) | 1998-06-05 | 1999-12-24 | Hitachi Ltd | Method and device for bonding wire and manufacture of semiconductor device |
US6260753B1 (en) | 1998-08-07 | 2001-07-17 | Stmicroelectronics S.R.L. | Gold bumps bonding on connection pads and subsequent coining of their vertex |
US6158647A (en) | 1998-09-29 | 2000-12-12 | Micron Technology, Inc. | Concave face wire bond capillary |
US6352197B1 (en) | 1999-01-29 | 2002-03-05 | Rohm Co., Ltd. | Method and apparatus for wire-bonding for electric components |
US6646228B2 (en) | 1999-08-18 | 2003-11-11 | Hyperion Innovations, Inc. | Cordless soldering iron |
USD444175S1 (en) * | 2000-05-23 | 2001-06-26 | Pentel Kabushiki Kaisha | Correction pen |
US6564989B2 (en) | 2000-08-22 | 2003-05-20 | Mitsubishi Denki Kabushiki Kaisha | Wire bonding method and wire bonding apparatus |
US6729527B2 (en) * | 2001-01-30 | 2004-05-04 | Kulicke & Soffa Investments, Inc. | Bonding tool with polymer coating |
JP2003068784A (en) | 2001-08-28 | 2003-03-07 | Kyocera Corp | Capillary for wire bonding |
JP2004087822A (en) | 2002-08-27 | 2004-03-18 | Mitsubishi Materials Corp | Wedge tool |
US7051915B2 (en) | 2002-08-29 | 2006-05-30 | Rohm Co., Ltd. | Capillary for wire bonding and method of wire bonding using it |
US7247588B2 (en) | 2002-11-22 | 2007-07-24 | Saint-Gobain Ceramics & Plastics, Inc. | Zirconia toughened alumina ESD safe ceramic composition, component, and methods for making same |
US7249702B2 (en) | 2003-12-04 | 2007-07-31 | Kulicke And Soffa Industries, Inc. | Multi-part capillary |
USD517384S1 (en) * | 2004-01-22 | 2006-03-21 | Pentel Kabushiki Kaisha | Wire solder applicator |
US7407080B2 (en) | 2004-04-02 | 2008-08-05 | Chippac, Inc. | Wire bond capillary tip |
USD549255S1 (en) | 2004-11-08 | 2007-08-21 | Dragos Axinte | Soldering iron tip |
US7216794B2 (en) | 2005-06-09 | 2007-05-15 | Texas Instruments Incorporated | Bond capillary design for ribbon wire bonding |
US8056794B2 (en) | 2006-10-09 | 2011-11-15 | Kulicke And Soffa Industries, Inc. | Combination wedge bonding and ball bonding transducer |
JP2009147103A (en) | 2007-12-14 | 2009-07-02 | Renesas Technology Corp | Semiconductor device and manufacturing method of same |
USD598721S1 (en) | 2008-04-24 | 2009-08-25 | Luis Meza | Motorcycle maintenance tool |
JP2009283814A (en) | 2008-05-26 | 2009-12-03 | Toshiba Lighting & Technology Corp | Capillary for wire bonding and electronic component assembling apparatus |
US8292160B2 (en) | 2009-02-23 | 2012-10-23 | Shinkawa Ltd. | Method of manufacturing semiconductor device, and bonding apparatus |
USD667857S1 (en) * | 2009-06-04 | 2012-09-25 | Smk Co., Ltd. | Electrode tip for resistive welders |
US7918378B1 (en) | 2010-08-06 | 2011-04-05 | National Semiconductor Corporation | Wire bonding deflector for a wire bonder |
JP2013135008A (en) | 2011-12-26 | 2013-07-08 | Fuji Electric Co Ltd | Wedge tool for wire bonding, bonding device, wire bonding method, and method of manufacturing semiconductor device |
JP2014082450A (en) | 2012-09-26 | 2014-05-08 | Toto Ltd | Bonding capillary |
TW201412448A (en) | 2012-09-26 | 2014-04-01 | Toto Ltd | Soldering iron tip |
USD697956S1 (en) * | 2013-01-24 | 2014-01-21 | Tesa Tape Inc. | Ultrasonic welding sheath |
TW201429601A (en) | 2013-01-25 | 2014-08-01 | Toto Ltd | Bonding capillary |
TW201429600A (en) | 2013-01-25 | 2014-08-01 | Toto Ltd | Solder pin |
JP2014222729A (en) | 2013-05-14 | 2014-11-27 | 住友電気工業株式会社 | Method and apparatus for manufacturing semiconductor device |
USD720785S1 (en) * | 2013-10-30 | 2015-01-06 | Sei Optifrontier Co., Ltd. | Electrode bar for optical fiber fusion splicer |
USD741127S1 (en) * | 2013-11-14 | 2015-10-20 | Robert Bosch Gmbh | Glue applicator |
USD753739S1 (en) * | 2015-04-17 | 2016-04-12 | Coorstek, Inc. | Wire bonding wedge tool |
Non-Patent Citations (20)
Title |
---|
Decision of Grant issued on Jan. 26, 2016 in Japanese Design Application No. 2015-21935 with a listing of references considered. |
Decision to Grant date Apr. 19, 2016 issued in Japanese Patent Application No. 2015-016867. |
Decision to Grant date Apr. 19, 2016 issued in Japanese Patent Application No. 2015-016912. |
Decision to Grant date Apr. 19, 2016 issued in Japanese Patent Application No. 2015-017097. |
Decision to Grant dated Apr. 19, 2016 issued in Japanese Patent Application No. 2016-008039. |
Decision to Grant dated Aug. 23, 2016 issued in Japanese Patent Application No. 2016-008037. |
Decision to Grant dated Aug. 23, 2016 issued in Japanese Patent Application No. 2016-008038. |
Gaiser Precision Bonding Tools "Capillary Wire Bonding", pp. 5-27, located at http://www.coorstek.com/markets/semiconductors-equipment/bonding-tools/capillaries.php, catalog published 2006. |
Gaiser Precision Bonding Tools "Fine-Ptich Capillaries", pp. 41-59, located at http://www.coorstek.com/markets/semiconductors-equipment/bonding-tools/capillaries.php, catalog published 2006. |
Gaiser Precision Bonding Tools "Thermosonic Capillaries", pp. 28-40, located at http://www.coorstek.com/markets/semiconductors-equipment/bonding-tools/capillaries.php, catalog published 2006. |
Information about Other Patent Applications, see section 6 of the accompanying Information Disclosure Statement Letter, which concerns Other Patent Applications. |
Office Action dated Oct. 6, 2015, issued in Japanese Design Application No. 2015-9731. |
Search Report dated May 13, 2016 issued in Taiwan Application No. 104305492. |
Search Report issued in Taiwan Design Patent Application No. 105302375, dated Jul. 12, 2016. |
Search Report issued in Taiwan Design Patent Application No. 105302376, dated Jul. 12, 2016. |
Search Report issued in Taiwan Design Patent Application No. 105302377, dated Jul. 12, 2016. |
Search Report issued on Dec. 7, 2015 in Taiwanese Design Patent Application No. 104302295 (English Translation provided). |
Search Report issued on Mar. 15, 2016 in Taiwanese Design Patent Application No. 104304080 (English translation). |
Search Report issued on Mar. 15, 2016 in Taiwanese Design Patent Application No. 104304081 (English translation). |
Search Report issued on Mar. 15, 2016 in Taiwanese Design Patent Application No. 104304143 (English translation). |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD868123S1 (en) | 2016-12-20 | 2019-11-26 | Coorstek, Inc. | Wire bonding wedge tool |
USD877219S1 (en) * | 2017-04-27 | 2020-03-03 | Hakko Corporation | Soldering tip |
USD815168S1 (en) * | 2017-05-23 | 2018-04-10 | Rpm Wood Finishes Group, Inc. | Cartridge for heat pump dispenser |
Also Published As
Publication number | Publication date |
---|---|
JP1551100S (en) | 2016-06-06 |
TWD174022S (en) | 2016-03-01 |
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