USD785577S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD785577S1
USD785577S1 US29/555,470 US201629555470F USD785577S US D785577 S1 USD785577 S1 US D785577S1 US 201629555470 F US201629555470 F US 201629555470F US D785577 S USD785577 S US D785577S
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United States
Prior art keywords
semiconductor device
view
elevational view
broken lines
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/555,470
Inventor
Tatsuya Kawase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to US29/555,470 priority Critical patent/USD785577S1/en
Priority to US29/591,886 priority patent/USD805485S1/en
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Publication of USD785577S1 publication Critical patent/USD785577S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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FIG. 1 is a top, right and rear side perspective view of a semiconductor device, showing my new design;
FIG. 2 is a front, left and bottom side perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a right side elevational view thereof;
FIG. 7 is a top plan view thereof;
FIG. 8 is a bottom plan view thereof;
FIG. 9 is another perspective view thereof, shown in a used condition mounted to a board in broken lines; and,
FIG. 10 is another rear elevational view thereof, shown in a used condition mounted to a board in broken lines.
The broken lines shown in the drawings represent portions of the semiconductor device, that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor device, as shown and described.
US29/555,470 2013-08-21 2016-02-22 Semiconductor device Active USD785577S1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US29/555,470 USD785577S1 (en) 2013-08-21 2016-02-22 Semiconductor device
US29/591,886 USD805485S1 (en) 2013-08-21 2017-01-25 Semiconductor device

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2013019057 2013-08-21
JP2013019030 2013-08-21
JP2013-019057 2013-08-21
JP2013019056 2013-08-21
JP2013-019056 2013-08-21
JP2013-019030 2013-08-21
US29/472,087 USD754084S1 (en) 2013-08-21 2013-11-08 Semiconductor device
US29/555,470 USD785577S1 (en) 2013-08-21 2016-02-22 Semiconductor device

Related Parent Applications (1)

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US29/472,087 Division USD754084S1 (en) 2013-08-21 2013-11-08 Semiconductor device

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US29/591,886 Division USD805485S1 (en) 2013-08-21 2017-01-25 Semiconductor device

Publications (1)

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USD785577S1 true USD785577S1 (en) 2017-05-02

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US29/472,087 Active USD754084S1 (en) 2013-08-21 2013-11-08 Semiconductor device
US29/555,470 Active USD785577S1 (en) 2013-08-21 2016-02-22 Semiconductor device
US29/591,886 Active USD805485S1 (en) 2013-08-21 2017-01-25 Semiconductor device

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US29/472,087 Active USD754084S1 (en) 2013-08-21 2013-11-08 Semiconductor device

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US29/591,886 Active USD805485S1 (en) 2013-08-21 2017-01-25 Semiconductor device

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Cited By (32)

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USD799439S1 (en) * 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module
USD805485S1 (en) * 2013-08-21 2017-12-19 Mitsubishi Electric Corporation Semiconductor device
USD805680S1 (en) * 2013-12-09 2017-12-19 Kenall Manufacturing Company Driver housing
USD810036S1 (en) * 2016-11-08 2018-02-13 Fuji Electric Co., Ltd. Semiconductor module
USD810706S1 (en) * 2014-12-24 2018-02-20 Fuji Electric Co., Ltd Semiconductor module
USD814433S1 (en) * 2014-11-28 2018-04-03 Fuji Electric Co., Ltd Semiconductor module
USD827591S1 (en) * 2016-10-31 2018-09-04 Fuji Electric Co., Ltd. Semiconductor module
USD838680S1 (en) * 2015-02-20 2019-01-22 Microduino Inc. Modular electronic device
USD847103S1 (en) * 2017-09-07 2019-04-30 Rohm Co., Ltd. Power semiconductor module
USD847104S1 (en) * 2017-09-29 2019-04-30 Rohm Co., Ltd. Power semiconductor module
USD851612S1 (en) * 2017-06-30 2019-06-18 Microduino Inc. Electrical module
USD853342S1 (en) * 2017-02-28 2019-07-09 Infineon Technologies Ag High-performance semiconductor module
USD853978S1 (en) * 2017-02-28 2019-07-16 Infineon Technologies Ag High-performance semiconductor module
USD858467S1 (en) 2017-01-05 2019-09-03 Rohm Co., Ltd. Power semiconductor module
USD864132S1 (en) 2017-01-05 2019-10-22 Rohm Co., Ltd. Power semiconductor module
USD864882S1 (en) * 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD864883S1 (en) * 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD865690S1 (en) * 2017-09-27 2019-11-05 Hamamatsu Photonics K.K. Part for semiconductor device
USD865689S1 (en) * 2015-02-20 2019-11-05 Microduino Inc. Electrical module
USD879729S1 (en) * 2017-06-30 2020-03-31 Microduino Inc. Electrical module
USD884662S1 (en) * 2018-06-01 2020-05-19 Fuji Electric Co., Ltd. Semiconductor module
USD903611S1 (en) * 2019-03-29 2020-12-01 Mitsubishi Electric Corporation Semiconductor device
USD923591S1 (en) * 2019-03-15 2021-06-29 Tamura Corporation Semiconductor driving circuit module
USD927437S1 (en) * 2019-08-29 2021-08-10 Rohm Co., Ltd. Power semiconductor module
USD934190S1 (en) 2019-08-29 2021-10-26 Rohm Co., Ltd. Circuit board for power semiconductor module
USD934189S1 (en) 2019-08-29 2021-10-26 Rohm Co., Ltd. Circuit board for power semiconductor module
USD934188S1 (en) 2019-08-29 2021-10-26 Rohm Co., Ltd. Power semiconductor module
USD934822S1 (en) 2019-08-29 2021-11-02 Rohm Co., Ltd. Circuit board for power semiconductor module
USD969761S1 (en) 2019-08-29 2022-11-15 Rohm Co., Ltd. Power semiconductor module
USD981354S1 (en) 2019-08-29 2023-03-21 Rohm Co., Ltd. Power semiconductor module
USD981355S1 (en) 2019-08-29 2023-03-21 Rohm Co., Ltd. Power semiconductor module
USD1003889S1 (en) * 2019-12-24 2023-11-07 Hangzhou Chipjet Technology Co., Ltd. Data processing chip

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USD769832S1 (en) * 2013-02-19 2016-10-25 Sony Corporation Semiconductor device
USD803663S1 (en) 2014-11-20 2017-11-28 Green Inova Lighting Technology Limited Bracket
JP1551316S (en) * 2015-09-30 2016-06-13
JP1551317S (en) * 2015-09-30 2016-06-13
JP1577498S (en) * 2016-09-30 2017-05-29
JP1586205S (en) * 2017-01-26 2017-09-19
JP1584883S (en) * 2017-01-31 2017-08-28
JP1584651S (en) * 2017-01-31 2017-08-28
USD864884S1 (en) * 2017-10-23 2019-10-29 Mitsubishi Electric Corporation Semiconductor device
USD888673S1 (en) 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module
JP1641098S (en) 2018-06-26 2019-09-09
TWD206651S (en) * 2020-04-24 2020-08-21 財團法人工業技術研究院 Power module
USD984397S1 (en) * 2021-03-16 2023-04-25 Yidong Cai Circuit board

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USD805485S1 (en) * 2013-08-21 2017-12-19 Mitsubishi Electric Corporation Semiconductor device
USD805680S1 (en) * 2013-12-09 2017-12-19 Kenall Manufacturing Company Driver housing
USD844216S1 (en) * 2013-12-09 2019-03-26 Kenall Manufacturing Company Driver housing
USD814433S1 (en) * 2014-11-28 2018-04-03 Fuji Electric Co., Ltd Semiconductor module
USD827593S1 (en) 2014-11-28 2018-09-04 Fuji Electric Co., Ltd Semiconductor module
USD810706S1 (en) * 2014-12-24 2018-02-20 Fuji Electric Co., Ltd Semiconductor module
USD838680S1 (en) * 2015-02-20 2019-01-22 Microduino Inc. Modular electronic device
USD865689S1 (en) * 2015-02-20 2019-11-05 Microduino Inc. Electrical module
USD799439S1 (en) * 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module
USD827591S1 (en) * 2016-10-31 2018-09-04 Fuji Electric Co., Ltd. Semiconductor module
USD810036S1 (en) * 2016-11-08 2018-02-13 Fuji Electric Co., Ltd. Semiconductor module
USD864132S1 (en) 2017-01-05 2019-10-22 Rohm Co., Ltd. Power semiconductor module
USD858467S1 (en) 2017-01-05 2019-09-03 Rohm Co., Ltd. Power semiconductor module
USD875058S1 (en) 2017-01-05 2020-02-11 Rohm Co., Ltd. Power semiconductor module
USD853342S1 (en) * 2017-02-28 2019-07-09 Infineon Technologies Ag High-performance semiconductor module
USD853978S1 (en) * 2017-02-28 2019-07-16 Infineon Technologies Ag High-performance semiconductor module
USD879729S1 (en) * 2017-06-30 2020-03-31 Microduino Inc. Electrical module
USD851612S1 (en) * 2017-06-30 2019-06-18 Microduino Inc. Electrical module
USD847103S1 (en) * 2017-09-07 2019-04-30 Rohm Co., Ltd. Power semiconductor module
USD864882S1 (en) * 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD865690S1 (en) * 2017-09-27 2019-11-05 Hamamatsu Photonics K.K. Part for semiconductor device
USD864883S1 (en) * 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD847104S1 (en) * 2017-09-29 2019-04-30 Rohm Co., Ltd. Power semiconductor module
USD884662S1 (en) * 2018-06-01 2020-05-19 Fuji Electric Co., Ltd. Semiconductor module
USD923591S1 (en) * 2019-03-15 2021-06-29 Tamura Corporation Semiconductor driving circuit module
USD903611S1 (en) * 2019-03-29 2020-12-01 Mitsubishi Electric Corporation Semiconductor device
USD927437S1 (en) * 2019-08-29 2021-08-10 Rohm Co., Ltd. Power semiconductor module
USD934190S1 (en) 2019-08-29 2021-10-26 Rohm Co., Ltd. Circuit board for power semiconductor module
USD934189S1 (en) 2019-08-29 2021-10-26 Rohm Co., Ltd. Circuit board for power semiconductor module
USD934188S1 (en) 2019-08-29 2021-10-26 Rohm Co., Ltd. Power semiconductor module
USD934822S1 (en) 2019-08-29 2021-11-02 Rohm Co., Ltd. Circuit board for power semiconductor module
USD969761S1 (en) 2019-08-29 2022-11-15 Rohm Co., Ltd. Power semiconductor module
USD981354S1 (en) 2019-08-29 2023-03-21 Rohm Co., Ltd. Power semiconductor module
USD981355S1 (en) 2019-08-29 2023-03-21 Rohm Co., Ltd. Power semiconductor module
USD1003889S1 (en) * 2019-12-24 2023-11-07 Hangzhou Chipjet Technology Co., Ltd. Data processing chip

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Publication number Publication date
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USD754084S1 (en) 2016-04-19

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