USD800674S1 - Cooling plate row for in-line memory - Google Patents
Cooling plate row for in-line memory Download PDFInfo
- Publication number
- USD800674S1 USD800674S1 US29/565,755 US201629565755F USD800674S US D800674 S1 USD800674 S1 US D800674S1 US 201629565755 F US201629565755 F US 201629565755F US D800674 S USD800674 S US D800674S
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- United States
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- cooling plate
- line memory
- plate row
- row
- view
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Description
The dash-dash broken lines shown in the drawings illustrate portions of the cooling plate row that form no part of the claimed design.
Claims (1)
- The ornamental design for a cooling plate row for in-line memory, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US29/565,755 USD800674S1 (en) | 2016-05-24 | 2016-05-24 | Cooling plate row for in-line memory |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/565,755 USD800674S1 (en) | 2016-05-24 | 2016-05-24 | Cooling plate row for in-line memory |
Publications (1)
Publication Number | Publication Date |
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USD800674S1 true USD800674S1 (en) | 2017-10-24 |
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Family Applications (1)
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US29/565,755 Active USD800674S1 (en) | 2016-05-24 | 2016-05-24 | Cooling plate row for in-line memory |
Country Status (1)
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US (1) | USD800674S1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170347486A1 (en) * | 2016-05-24 | 2017-11-30 | Asetek Danmark A/S | Single ended cooling module rows and assemblies for thermal management of in-line memory modules |
US11924996B2 (en) | 2020-09-30 | 2024-03-05 | Coolit Systems, Inc. | Liquid-cooling devices, and systems, to cool multi-chip modules |
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-
2016
- 2016-05-24 US US29/565,755 patent/USD800674S1/en active Active
Patent Citations (83)
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US20160363967A1 (en) * | 2015-06-11 | 2016-12-15 | Cooler Master Co., Ltd. | Electronic device and liquid cooling heat dissipation device thereof |
US20160366788A1 (en) * | 2015-06-11 | 2016-12-15 | Cooler Master Co., Ltd. | Liquid supply mechanism and liquid cooling system |
USD772823S1 (en) * | 2015-08-26 | 2016-11-29 | Ebullient, Inc. | Heat sink module |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170347486A1 (en) * | 2016-05-24 | 2017-11-30 | Asetek Danmark A/S | Single ended cooling module rows and assemblies for thermal management of in-line memory modules |
US10021811B2 (en) * | 2016-05-24 | 2018-07-10 | Asetek Danmark A/S | Single ended cooling module rows and assemblies for thermal management of in-line memory modules |
US11924996B2 (en) | 2020-09-30 | 2024-03-05 | Coolit Systems, Inc. | Liquid-cooling devices, and systems, to cool multi-chip modules |
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