USD800674S1 - Cooling plate row for in-line memory - Google Patents

Cooling plate row for in-line memory Download PDF

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Publication number
USD800674S1
USD800674S1 US29/565,755 US201629565755F USD800674S US D800674 S1 USD800674 S1 US D800674S1 US 201629565755 F US201629565755 F US 201629565755F US D800674 S USD800674 S US D800674S
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Prior art keywords
cooling plate
line memory
plate row
row
view
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US29/565,755
Inventor
Torben Søgaard Schaltz
Jan Hunskjær
Kim Henriksen
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Asetek AS
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Asetek AS
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Priority to US29/565,755 priority Critical patent/USD800674S1/en
Assigned to ASETEK DANMARK A/S reassignment ASETEK DANMARK A/S ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HENRIKSEN, KIM, HUNSKJAER, Jan, SCHALTZ, TORBEN SØGAARD
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FIG. 1 is a top front right perspective view of a cooling plate row for in-line memory showing our new design;
FIG. 2 is a top rear left perspective view thereof;
FIG. 3 is a front elevation view thereof;
FIG. 4 is a rear elevation view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a right side elevation view thereof; and,
FIG. 8 is a left side elevation view thereof.
The dash-dash broken lines shown in the drawings illustrate portions of the cooling plate row that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a cooling plate row for in-line memory, as shown and described.
US29/565,755 2016-05-24 2016-05-24 Cooling plate row for in-line memory Active USD800674S1 (en)

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US29/565,755 USD800674S1 (en) 2016-05-24 2016-05-24 Cooling plate row for in-line memory

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170347486A1 (en) * 2016-05-24 2017-11-30 Asetek Danmark A/S Single ended cooling module rows and assemblies for thermal management of in-line memory modules
US11924996B2 (en) 2020-09-30 2024-03-05 Coolit Systems, Inc. Liquid-cooling devices, and systems, to cool multi-chip modules

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USD772823S1 (en) * 2015-08-26 2016-11-29 Ebullient, Inc. Heat sink module
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170347486A1 (en) * 2016-05-24 2017-11-30 Asetek Danmark A/S Single ended cooling module rows and assemblies for thermal management of in-line memory modules
US10021811B2 (en) * 2016-05-24 2018-07-10 Asetek Danmark A/S Single ended cooling module rows and assemblies for thermal management of in-line memory modules
US11924996B2 (en) 2020-09-30 2024-03-05 Coolit Systems, Inc. Liquid-cooling devices, and systems, to cool multi-chip modules

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