|Número de publicación||USRE35832 E|
|Tipo de publicación||Concesión|
|Número de solicitud||US 08/558,285|
|Fecha de publicación||30 Jun 1998|
|Fecha de presentación||13 Nov 1995|
|Fecha de prioridad||9 Sep 1991|
|También publicado como||DE69226999D1, DE69226999T2, DE69232087D1, EP0532160A2, EP0532160A3, EP0532160B1, EP0682322A2, EP0682322A3, EP0682322B1, US5319516|
|Número de publicación||08558285, 558285, US RE35832 E, US RE35832E, US-E-RE35832, USRE35832 E, USRE35832E|
|Inventores||Carl C. Perkins|
|Cesionario original||Itt Corporation|
|Exportar cita||BiBTeX, EndNote, RefMan|
|Citas de patentes (48), Otras citas (6), Citada por (2), Clasificaciones (13), Eventos legales (2)|
|Enlaces externos: USPTO, Cesión de USPTO, Espacenet|
This is a continuation of application Ser. No. 07/756,940, filed Sep. 9, 1991, now abandoned.
Memory cards commonly are constructed with a molded plastic body having opposite sides and ends, a combination circuit board and connector that is installed in the body, and top and bottom metallic covers installed at the top and bottom of the body. Such memory cards are especially useful in electronic equipment or devices of very small thickness, such as laptop computers that may have a width and length of 81/2 inches by 11 inches, and a thickness of much less than one inch. Standard JEIDA cards have a thickness, or height, of five .Iadd.or .Iaddend.3.3 . .or.!. millimeters, which enables them to be inserted into thin slots of the electronic device.
In accordance with one embodiment of the present invention, an IC memory card is provided which enables grounding of the card during its insertion into a slot of an electronic device. The card has a frame that includes a molded body with opposite sides and forward and rearward ends, which holds a circuit board assembly having a ground plane and which hold a connector connected to the circuit board. The frame has an electrically conductive region connected to the ground plane of the circuit board.
The body of the card frame can be molded of electrically conductive material. The electrically conductive body provides good EMI (electromagnetic interference) shielding for the card (in conjunction with conductive top and bottom covers of the frame).
The novel features of the invention are set forth with particularly in the appended claims. The invention will be best understood from the following description when read in conjunction with the accompanying drawings.
FIG. 1 is an isometric view of an IC memory card and an electronic device in the form of a laptop computer, constructed in accordance with the present invention.
FIG. 2 is a sectional top view of the memory card and a portion of the electronic device of FIG. 1.
FIG. 3 is an exploded isometric view of the memory card of FIG. 2.
FIG. 4 is an isometric view of just the body of the frame of the memory card of FIG. 3.
FIG. 5 is a partial sectional view of a memory card taken on the line 5--5 of FIG. 2.
FIG. 6 is a side view of a combination of connector and circuit board assembly of the card of FIG. 3.
FIG. 1 illustrates an IC (integrated circuit) memory card 10 of the present invention that is adapted to be inserted into a slot 12 of an electronic device 14, the particular device shown being a laptop computer. One style of electronic computer has a width and length of 8.5 inches and 11 inches respectively and a thickness T that is as small as possible, preferably a small fraction of an inch. Such as laptop computer can be carried around in space designed to be occupied by ordinary sheets of paper or booklets. One source of concern in using memory cards, is that the card may have a considerable static electric charge, which must be dissipated prior to full insertion of the card, to avoid damage to components in the electronic device.
FIG. 2 shows the memory card 10 as it is being inserted into the slot 12 of the device 14. The memory card includes a frame 16 with forward and rearward ends 20, 22 and opposite sides 24, 26. A connector 30 is mounted at the forward end of the frame and has multiple socket contacts 32 that are positioned to mate when the card moves in a forward direction. The electronic device has multiple corresponding pin contacts 34 at the front end 36 of the slot, which fully engage the socket contacts when the card is fully in a forward direction inserted into the slot. The connector 30 has a housing molded of dielectric material with holes that hold the card contacts 32.
FIG. 3 shows details of the memory card 10, which includes the frame 16 and connector 30 that is mounted at the forward end of the frame. A circuit board assembly 40 that is mounted on the frame, includes a circuit board 42 and a plurality of circuit components 44 mounted on the board. FIG. 6 illustrates how the rear ends 46 of the connector socket contacts 32 are connected to conductive traces on the board 42. The frame 16 (FIG. 3) includes an injection molded body 50 and upper and lower electrically conductive covers 52, 54 that can be mounted on the top and bottom of the frame body 50. The card is assembled by first installing the combination circuit board assembly 40 and connector 30 on the body 50. Then the upper and lower covers 52, 54 are attached to opposite faces of the body.
FIG. 4 illustrate details of the molded body 50. The body includes a pair of side beams 60, 62 forming the opposite sides or side edges 24, 26 of the card, .Iadd.with the side edges 24, 26 forming the outside of the side beams 60, 62, .Iaddend.and a rear beam 64 forming the rear end 22 of the card. The body also includes a pair of cross beams 66, 68 which strengthen the body. .Iadd.Each vertical crossbeam 66, 68 has a vertical thickness that is much less than that of the side beams 60, 62..Iaddend.
In accordance with the present invention, the injection molded body 50 is formed of injection molded plastic material which is electrically conductive. A variety of plastic conductive materials are known, which often include multiple particles or fibers of conductive material, such as silver, embedded in a dielectric plastic material, such as a polyester. Such material can be referred to as a molded electrically conductive primarily polymeric material. Although the electrical resistivity of molded plastic material is much higher than that of some metals such as silver and copper, often having a bulk resistivity that is about one or two orders of magnitude greater than that of copper. .. The dielectric material of the connector 30 (FIG. 2) therefore has a resistivity more than 4 orders of magnitude greater than that of copper (Whose.!. .Iadd.whose .Iaddend.electrical resistivity is 1.7 microhm-centimeter . .the.!..Iadd.. The .Iaddend.resistivity of such conductive plastic material.Iadd.s .Iaddend.is moderate and they are considered to be electrically conductive (their resistivities are less than four orders of magnitude greater than that of copper). .Iadd.The dielectric material of the connector 30 (FIG. 2) therefore has a resistivity more than 4 orders of magnitude greater than that of copper. .Iaddend.The use of an electrically conductive body results in important advantages for the memory card. One advantage is that the conductive side and rear beams provide protection against EMI (electromagnetic interference) that might otherwise pass between the metal upper and lower covers . .50.!. .Iadd.52.Iaddend., 54 of the frame. The circuitry in highly compact electronic devices such as laptop computers is typically very close together and it is important to minimize electromagnetic interference between components in the card and those in the electronic device. .Iadd.The sides 24, 26 of the electrically conductive body have electrically conductive surface regions, or portions 70, 72..Iaddend.
FIG. 5 illustrates some details of the connection of the circuit board assembly 40 and the electrically conductive body 50 of the frame. The circuit board 42 of the assembly includes a ground plane 80 of electrically conductive material such as foil, which is connected to grounded locations on the electronic components on the board. The ground plane lies on the opposite faces 82, 84 of the board adjacent to the edges 85 of the board. When the card is assembled as shown in FIG. 5, the ground plane 80 lies facewise against a surface 86 of the frame body 50, to ground the body 50. The bottom cover 54 has a horizontally-extending face 90 and has an edge portion 92 that is bent to extend largely vertically and that has an extreme edge 92e. The edge of the edge portion bears against the ground plane at 80, to assure that the lower cover 54 is maintained at the same potential as the ground plane of the circuit board and the conductive body 50. The top cover 52 also has a face 94 and a bent edge portion 96 whose edge contacts the conductive body to keep the upper cover grounded. This construction avoids the need to use springs or the like to connect the top and bottom covers to each other and to the ground plane, as is used in U.S. Pat. No. 4,780,791. The card can include a frame with a body having portions lying along opposite sides and the rear end of the card, with the body formed of electrically conductive material. Forming the body of electrically conductive material has the additional advantage of providing EMI (electromagnetic interference) shielding along most of the edge area of the card.
.Iadd.It is apparent from the drawings and from the fact that edge portions 92, 96 of the covers are bent, that the electrically conductive covers are formed of sheet metal, that is, of metal having a uniform thickness as opposed to a block of metal that has been machined to cut away metal so as to form depressions and projections..Iaddend.
Although particular embodiments of the invention have been described and illustrated herein, it is recognized that modifications and variations may readily occur to those skilled in the art, and consequently, it is intended that the claims be interpreted to cover such modifications and equivalents.
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|Clasificación de EE.UU.||361/220, 361/730|
|Clasificación internacional||G06K19/077, H01R4/64, H05K9/00, G06K13/077|
|Clasificación cooperativa||Y10S439/946, G06K13/077, G06K19/07735, G06K19/07743|
|Clasificación europea||G06K19/077E9, G06K19/077K, G06K13/077|
|6 Dic 2001||FPAY||Fee payment|
Year of fee payment: 8
|7 Dic 2005||FPAY||Fee payment|
Year of fee payment: 12