USRE36916E - Apparatus for stacking semiconductor chips - Google Patents
Apparatus for stacking semiconductor chips Download PDFInfo
- Publication number
- USRE36916E USRE36916E US09/064,348 US6434898A USRE36916E US RE36916 E USRE36916 E US RE36916E US 6434898 A US6434898 A US 6434898A US RE36916 E USRE36916 E US RE36916E
- Authority
- US
- United States
- Prior art keywords
- chip
- surface mount
- module
- circuit board
- chips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/023—Stackable modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1017—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
- H01L2225/1029—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the support being a lead frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1047—Details of electrical connections between containers
- H01L2225/107—Indirect electrical connections, e.g. via an interposer, a flexible substrate, using TAB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
Claims (19)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/064,348 USRE36916E (en) | 1995-03-21 | 1998-04-22 | Apparatus for stacking semiconductor chips |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/408,552 US5514907A (en) | 1995-03-21 | 1995-03-21 | Apparatus for stacking semiconductor chips |
US09/064,348 USRE36916E (en) | 1995-03-21 | 1998-04-22 | Apparatus for stacking semiconductor chips |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/408,552 Reissue US5514907A (en) | 1995-03-21 | 1995-03-21 | Apparatus for stacking semiconductor chips |
Publications (1)
Publication Number | Publication Date |
---|---|
USRE36916E true USRE36916E (en) | 2000-10-17 |
Family
ID=23616743
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/408,552 Ceased US5514907A (en) | 1995-03-21 | 1995-03-21 | Apparatus for stacking semiconductor chips |
US09/064,348 Expired - Lifetime USRE36916E (en) | 1995-03-21 | 1998-04-22 | Apparatus for stacking semiconductor chips |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/408,552 Ceased US5514907A (en) | 1995-03-21 | 1995-03-21 | Apparatus for stacking semiconductor chips |
Country Status (1)
Country | Link |
---|---|
US (2) | US5514907A (en) |
Cited By (42)
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---|---|---|---|---|
US6225689B1 (en) * | 1998-08-21 | 2001-05-01 | Micron Technology, Inc. | Low profile multi-IC chip package connector |
US6278616B1 (en) * | 1998-07-07 | 2001-08-21 | Texas Instruments Incorporated | Modifying memory device organization in high density packages |
US6288907B1 (en) * | 1996-05-20 | 2001-09-11 | Staktek Group, L.P. | High density integrated circuit module with complex electrical interconnect rails having electrical interconnect strain relief |
US20020017709A1 (en) * | 2000-06-07 | 2002-02-14 | Yoshiyuki Yanagisawa | Assembly jig and manufacturing method of multilayer semiconductor device |
US6487078B2 (en) | 2000-03-13 | 2002-11-26 | Legacy Electronics, Inc. | Electronic module having a three dimensional array of carrier-mounted integrated circuit packages |
US20030040166A1 (en) * | 2001-05-25 | 2003-02-27 | Mark Moshayedi | Apparatus and method for stacking integrated circuits |
US20030067082A1 (en) * | 2001-05-25 | 2003-04-10 | Mark Moshayedi | Apparatus and methods for stacking integrated circuit devices with interconnected stacking structure |
US6552424B2 (en) | 2001-08-30 | 2003-04-22 | Micron Technology, Inc. | Angled edge connections for multichip structures |
US6576992B1 (en) | 2001-10-26 | 2003-06-10 | Staktek Group L.P. | Chip scale stacking system and method |
US6608763B1 (en) | 2000-09-15 | 2003-08-19 | Staktek Group L.P. | Stacking system and method |
US20030165051A1 (en) * | 2000-03-13 | 2003-09-04 | Kledzik Kenneth J. | Modular integrated circuit chip carrier |
US6670701B2 (en) * | 2001-02-01 | 2003-12-30 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor module and electronic component |
US6686654B2 (en) * | 2001-08-31 | 2004-02-03 | Micron Technology, Inc. | Multiple chip stack structure and cooling system |
US6719568B2 (en) * | 2001-12-19 | 2004-04-13 | Sumitomo Electric Industries, Ltd. | Electric circuit unit |
US6734538B1 (en) | 2001-04-12 | 2004-05-11 | Bae Systems Information & Electronic Systems Integration, Inc. | Article comprising a multi-layer electronic package and method therefor |
US20040096812A1 (en) * | 2001-01-02 | 2004-05-20 | Myers Dawes Andras ?amp; Sherman LLP Andras Joseph C. | Breadboard used for educational purposes |
US6762487B2 (en) | 2001-04-19 | 2004-07-13 | Simpletech, Inc. | Stack arrangements of chips and interconnecting members |
US20040194301A1 (en) * | 2001-03-14 | 2004-10-07 | Kledzik Kenneth J. | Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips |
US6806120B2 (en) | 2001-03-27 | 2004-10-19 | Staktek Group, L.P. | Contact member stacking system and method |
US20040214466A1 (en) * | 2003-04-25 | 2004-10-28 | Wen-Yen Lin | Joint connector of printed circuit board and manufacturing method thereof |
US6914324B2 (en) | 2001-10-26 | 2005-07-05 | Staktek Group L.P. | Memory expansion and chip scale stacking system and method |
US6940729B2 (en) | 2001-10-26 | 2005-09-06 | Staktek Group L.P. | Integrated circuit stacking system and method |
US7005584B2 (en) | 2004-02-13 | 2006-02-28 | Honeywell International Inc. | Compact navigation device assembly |
US20060107524A1 (en) * | 2000-10-16 | 2006-05-25 | Jason Engle | Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips |
US20060249829A1 (en) * | 2005-04-08 | 2006-11-09 | Mitsuaki Katagiri | Stacked type semiconductor device |
US20080067657A1 (en) * | 2006-09-19 | 2008-03-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Integrated circuit devices with multi-dimensional pad structures |
US7405471B2 (en) | 2000-10-16 | 2008-07-29 | Legacy Electronics, Inc. | Carrier-based electronic module |
US20080189480A1 (en) * | 2007-02-01 | 2008-08-07 | Jung Pill Kim | Memory configured on a common substrate |
US7435097B2 (en) | 2005-01-12 | 2008-10-14 | Legacy Electronics, Inc. | Radial circuit board, system, and methods |
US7465608B1 (en) | 2001-08-17 | 2008-12-16 | Micron Technology, Inc. | Three-dimensional multichip module |
US7608919B1 (en) | 2003-09-04 | 2009-10-27 | University Of Notre Dame Du Lac | Interconnect packaging systems |
US20090267220A1 (en) * | 2008-04-23 | 2009-10-29 | Kuhlman Mark A | 3-d stacking of active devices over passive devices |
US7626252B2 (en) | 2001-08-30 | 2009-12-01 | Micron Technology, Inc. | Multi-chip electronic package and cooling system |
US7656678B2 (en) | 2001-10-26 | 2010-02-02 | Entorian Technologies, Lp | Stacked module systems |
US7719098B2 (en) | 2001-10-26 | 2010-05-18 | Entorian Technologies Lp | Stacked modules and method |
US7737549B2 (en) | 2004-09-03 | 2010-06-15 | Entorian Technologies Lp | Circuit module with thermal casing systems |
US7760513B2 (en) | 2004-09-03 | 2010-07-20 | Entorian Technologies Lp | Modified core for circuit module system and method |
US7768796B2 (en) | 2004-09-03 | 2010-08-03 | Entorian Technologies L.P. | Die module system |
US7804985B2 (en) | 2006-11-02 | 2010-09-28 | Entorian Technologies Lp | Circuit module having force resistant construction |
US20100246141A1 (en) * | 2009-03-31 | 2010-09-30 | Hong Kong Applied Science and Technology Research Institute Co. Ltd. (ASTRI) | Electronic package and method of fabrication thereof |
US8236610B2 (en) | 2009-05-26 | 2012-08-07 | International Business Machines Corporation | Forming semiconductor chip connections |
US9620473B1 (en) | 2013-01-18 | 2017-04-11 | University Of Notre Dame Du Lac | Quilt packaging system with interdigitated interconnecting nodules for inter-chip alignment |
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US6205654B1 (en) * | 1992-12-11 | 2001-03-27 | Staktek Group L.P. | Method of manufacturing a surface mount package |
US5514907A (en) * | 1995-03-21 | 1996-05-07 | Simple Technology Incorporated | Apparatus for stacking semiconductor chips |
US5754405A (en) * | 1995-11-20 | 1998-05-19 | Mitsubishi Semiconductor America, Inc. | Stacked dual in-line package assembly |
US5696031A (en) * | 1996-11-20 | 1997-12-09 | Micron Technology, Inc. | Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice |
US7166495B2 (en) * | 1996-02-20 | 2007-01-23 | Micron Technology, Inc. | Method of fabricating a multi-die semiconductor package assembly |
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US5857858A (en) * | 1996-12-23 | 1999-01-12 | General Electric Company | Demountable and repairable low pitch interconnect for stacked multichip modules |
US6183301B1 (en) | 1997-01-16 | 2001-02-06 | Berg Technology, Inc. | Surface mount connector with integrated PCB assembly |
US6163459A (en) * | 1997-07-25 | 2000-12-19 | Matsushita Electric Industrial Co., Ltd. | Semiconductor mounting system and semiconductor chip |
US6331938B1 (en) * | 1997-10-28 | 2001-12-18 | Surecom Technology Corporation | Structural and electrical connections for stacked computer devices |
US5963464A (en) * | 1998-02-26 | 1999-10-05 | International Business Machines Corporation | Stackable memory card |
US6207474B1 (en) | 1998-03-09 | 2001-03-27 | Micron Technology, Inc. | Method of forming a stack of packaged memory die and resulting apparatus |
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US6051887A (en) * | 1998-08-28 | 2000-04-18 | Medtronic, Inc. | Semiconductor stacked device for implantable medical apparatus |
US6190425B1 (en) | 1998-11-03 | 2001-02-20 | Zomaya Group, Inc. | Memory bar and related circuits and methods |
US6295220B1 (en) | 1998-11-03 | 2001-09-25 | Zomaya Group, Inc. | Memory bar and related circuits and methods |
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US6222737B1 (en) | 1999-04-23 | 2001-04-24 | Dense-Pac Microsystems, Inc. | Universal package and method of forming the same |
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US6323060B1 (en) | 1999-05-05 | 2001-11-27 | Dense-Pac Microsystems, Inc. | Stackable flex circuit IC package and method of making same |
US6849480B1 (en) | 1999-05-07 | 2005-02-01 | Seagate Technology Llc | Surface mount IC stacking method and device |
JP3575001B2 (en) * | 1999-05-07 | 2004-10-06 | アムコー テクノロジー コリア インコーポレーティド | Semiconductor package and manufacturing method thereof |
JP3398721B2 (en) | 1999-05-20 | 2003-04-21 | アムコー テクノロジー コリア インコーポレーティド | Semiconductor package and manufacturing method thereof |
USRE40112E1 (en) | 1999-05-20 | 2008-02-26 | Amkor Technology, Inc. | Semiconductor package and method for fabricating the same |
DE19928733A1 (en) * | 1999-06-23 | 2001-01-04 | Giesecke & Devrient Gmbh | Semiconductor memory chip module |
JP2001077301A (en) * | 1999-08-24 | 2001-03-23 | Amkor Technology Korea Inc | Semiconductor package and its manufacturing method |
US6572387B2 (en) | 1999-09-24 | 2003-06-03 | Staktek Group, L.P. | Flexible circuit connector for stacked chip module |
US6352437B1 (en) * | 1999-10-20 | 2002-03-05 | John O. Tate | Solder ball terminal |
KR20010064907A (en) | 1999-12-20 | 2001-07-11 | 마이클 디. 오브라이언 | wire bonding method and semiconductor package using it |
US6262895B1 (en) | 2000-01-13 | 2001-07-17 | John A. Forthun | Stackable chip package with flex carrier |
US6414396B1 (en) | 2000-01-24 | 2002-07-02 | Amkor Technology, Inc. | Package for stacked integrated circuits |
US6437433B1 (en) | 2000-03-24 | 2002-08-20 | Andrew C. Ross | CSP stacking technology using rigid/flex construction |
KR100559664B1 (en) | 2000-03-25 | 2006-03-10 | 앰코 테크놀로지 코리아 주식회사 | Semiconductor package |
US6660561B2 (en) | 2000-06-15 | 2003-12-09 | Dpac Technologies Corp. | Method of assembling a stackable integrated circuit chip |
US6404043B1 (en) | 2000-06-21 | 2002-06-11 | Dense-Pac Microsystems, Inc. | Panel stacking of BGA devices to form three-dimensional modules |
US6452278B1 (en) | 2000-06-30 | 2002-09-17 | Amkor Technology, Inc. | Low profile package for plural semiconductor dies |
US6552416B1 (en) | 2000-09-08 | 2003-04-22 | Amkor Technology, Inc. | Multiple die lead frame package with enhanced die-to-die interconnect routing using internal lead trace wiring |
US7262082B1 (en) | 2000-10-13 | 2007-08-28 | Bridge Semiconductor Corporation | Method of making a three-dimensional stacked semiconductor package with a metal pillar and a conductive interconnect in an encapsulant aperture |
US7129113B1 (en) | 2000-10-13 | 2006-10-31 | Bridge Semiconductor Corporation | Method of making a three-dimensional stacked semiconductor package with a metal pillar in an encapsulant aperture |
US7009297B1 (en) | 2000-10-13 | 2006-03-07 | Bridge Semiconductor Corporation | Semiconductor chip assembly with embedded metal particle |
US6542376B1 (en) * | 2001-03-30 | 2003-04-01 | L-3 Communications Corporation | High density packaging of electronic components |
US6707684B1 (en) | 2001-04-02 | 2004-03-16 | Advanced Micro Devices, Inc. | Method and apparatus for direct connection between two integrated circuits via a connector |
US20030002267A1 (en) * | 2001-06-15 | 2003-01-02 | Mantz Frank E. | I/O interface structure |
US20020190367A1 (en) * | 2001-06-15 | 2002-12-19 | Mantz Frank E. | Slice interconnect structure |
US6451626B1 (en) | 2001-07-27 | 2002-09-17 | Charles W.C. Lin | Three-dimensional stacked semiconductor package |
US6765287B1 (en) | 2001-07-27 | 2004-07-20 | Charles W. C. Lin | Three-dimensional stacked semiconductor package |
US6409520B1 (en) * | 2001-07-31 | 2002-06-25 | Agilent Technologies, Inc. | Structure and method for interconnection of printed circuit boards |
US6573461B2 (en) | 2001-09-20 | 2003-06-03 | Dpac Technologies Corp | Retaining ring interconnect used for 3-D stacking |
US6573460B2 (en) * | 2001-09-20 | 2003-06-03 | Dpac Technologies Corp | Post in ring interconnect using for 3-D stacking |
US20050056921A1 (en) * | 2003-09-15 | 2005-03-17 | Staktek Group L.P. | Stacked module systems and methods |
US7053478B2 (en) * | 2001-10-26 | 2006-05-30 | Staktek Group L.P. | Pitch change and chip scale stacking system |
US20030234443A1 (en) * | 2001-10-26 | 2003-12-25 | Staktek Group, L.P. | Low profile stacking system and method |
US7026708B2 (en) * | 2001-10-26 | 2006-04-11 | Staktek Group L.P. | Low profile chip scale stacking system and method |
US20050009234A1 (en) * | 2001-10-26 | 2005-01-13 | Staktek Group, L.P. | Stacked module systems and methods for CSP packages |
US6486549B1 (en) | 2001-11-10 | 2002-11-26 | Bridge Semiconductor Corporation | Semiconductor module with encapsulant base |
US7190060B1 (en) | 2002-01-09 | 2007-03-13 | Bridge Semiconductor Corporation | Three-dimensional stacked semiconductor package device with bent and flat leads and method of making same |
US6891276B1 (en) | 2002-01-09 | 2005-05-10 | Bridge Semiconductor Corporation | Semiconductor package device |
US6542393B1 (en) | 2002-04-24 | 2003-04-01 | Ma Laboratories, Inc. | Dual-bank memory module with stacked DRAM chips having a concave-shaped re-route PCB in-between |
US20040057224A1 (en) * | 2002-07-25 | 2004-03-25 | Kiko Frederick J. | High density electronics assembly and method |
US20040252474A1 (en) * | 2002-11-25 | 2004-12-16 | Kwanghak Lee | Integrated circuit stack with lead frames |
US6856010B2 (en) * | 2002-12-05 | 2005-02-15 | Staktek Group L.P. | Thin scale outline package |
WO2004061861A2 (en) * | 2002-12-31 | 2004-07-22 | Matrix Semiconductor, Inc. | Nand memory array incorporating capacitance boosting of channel regions in unselected memory cells and method for operation of same |
US7233522B2 (en) * | 2002-12-31 | 2007-06-19 | Sandisk 3D Llc | NAND memory array incorporating capacitance boosting of channel regions in unselected memory cells and method for operation of same |
US7005350B2 (en) * | 2002-12-31 | 2006-02-28 | Matrix Semiconductor, Inc. | Method for fabricating programmable memory array structures incorporating series-connected transistor strings |
US7505321B2 (en) * | 2002-12-31 | 2009-03-17 | Sandisk 3D Llc | Programmable memory array structure incorporating series-connected transistor strings and methods for fabrication and operation of same |
US6841029B2 (en) * | 2003-03-27 | 2005-01-11 | Advanced Cardiovascular Systems, Inc. | Surface modification of expanded ultra high molecular weight polyethylene (eUHMWPE) for improved bondability |
US20040207990A1 (en) * | 2003-04-21 | 2004-10-21 | Rose Andrew C. | Stair-step signal routing |
US20040245615A1 (en) * | 2003-06-03 | 2004-12-09 | Staktek Group, L.P. | Point to point memory expansion system and method |
US7993983B1 (en) | 2003-11-17 | 2011-08-09 | Bridge Semiconductor Corporation | Method of making a semiconductor chip assembly with chip and encapsulant grinding |
US7023739B2 (en) * | 2003-12-05 | 2006-04-04 | Matrix Semiconductor, Inc. | NAND memory array incorporating multiple write pulse programming of individual memory cells and method for operation of same |
US7221588B2 (en) * | 2003-12-05 | 2007-05-22 | Sandisk 3D Llc | Memory array incorporating memory cells arranged in NAND strings |
US20050128807A1 (en) * | 2003-12-05 | 2005-06-16 | En-Hsing Chen | Nand memory array incorporating multiple series selection devices and method for operation of same |
US7227249B1 (en) | 2003-12-24 | 2007-06-05 | Bridge Semiconductor Corporation | Three-dimensional stacked semiconductor package with chips on opposite sides of lead |
US7009296B1 (en) | 2004-01-15 | 2006-03-07 | Amkor Technology, Inc. | Semiconductor package with substrate coupled to a peripheral side surface of a semiconductor die |
US7282791B2 (en) * | 2004-07-09 | 2007-10-16 | Elpida Memory, Inc. | Stacked semiconductor device and semiconductor memory module |
US20060033187A1 (en) * | 2004-08-12 | 2006-02-16 | Staktek Group, L.P. | Rugged CSP module system and method |
US7309914B2 (en) * | 2005-01-20 | 2007-12-18 | Staktek Group L.P. | Inverted CSP stacking system and method |
WO2006082620A1 (en) * | 2005-01-31 | 2006-08-10 | Spansion Llc | Layered semiconductor device and layered semiconductor device manufacturing method |
US20080203552A1 (en) * | 2005-02-15 | 2008-08-28 | Unisemicon Co., Ltd. | Stacked Package and Method of Fabricating the Same |
US7446403B2 (en) * | 2006-06-14 | 2008-11-04 | Entorian Technologies, Lp | Carrier structure stacking system and method |
US7375418B2 (en) * | 2006-06-14 | 2008-05-20 | Entorian Technologies, Lp | Interposer stacking system and method |
US7494843B1 (en) | 2006-12-26 | 2009-02-24 | Bridge Semiconductor Corporation | Method of making a semiconductor chip assembly with thermal conductor and encapsulant grinding |
US7811863B1 (en) | 2006-10-26 | 2010-10-12 | Bridge Semiconductor Corporation | Method of making a semiconductor chip assembly with metal pillar and encapsulant grinding and heat sink attachment |
US9466545B1 (en) | 2007-02-21 | 2016-10-11 | Amkor Technology, Inc. | Semiconductor package in package |
US8014166B2 (en) * | 2008-09-06 | 2011-09-06 | Broadpak Corporation | Stacking integrated circuits containing serializer and deserializer blocks using through silicon via |
USD680119S1 (en) * | 2011-11-15 | 2013-04-16 | Connectblue Ab | Module |
USD692896S1 (en) * | 2011-11-15 | 2013-11-05 | Connectblue Ab | Module |
USD668659S1 (en) * | 2011-11-15 | 2012-10-09 | Connectblue Ab | Module |
USD689053S1 (en) * | 2011-11-15 | 2013-09-03 | Connectblue Ab | Module |
USD668658S1 (en) * | 2011-11-15 | 2012-10-09 | Connectblue Ab | Module |
USD680545S1 (en) * | 2011-11-15 | 2013-04-23 | Connectblue Ab | Module |
US11272618B2 (en) | 2016-04-26 | 2022-03-08 | Analog Devices International Unlimited Company | Mechanically-compliant and electrically and thermally conductive leadframes for component-on-package circuits |
US10497635B2 (en) | 2018-03-27 | 2019-12-03 | Linear Technology Holding Llc | Stacked circuit package with molded base having laser drilled openings for upper package |
CN109411366B (en) * | 2018-09-17 | 2022-03-15 | 珠海欧比特电子有限公司 | Surface-protecting three-dimensional packaging method |
JP6589028B1 (en) * | 2018-09-21 | 2019-10-09 | 有限会社アイ電気 | Electronic circuit holder |
US11410977B2 (en) | 2018-11-13 | 2022-08-09 | Analog Devices International Unlimited Company | Electronic module for high power applications |
CN114158181A (en) * | 2019-01-31 | 2022-03-08 | 华为技术有限公司 | Circuit board assembly and terminal |
CN110054143B (en) * | 2019-04-30 | 2021-08-31 | 西安微电子技术研究所 | Miniaturized high-overload-resistant silicon-based microsystem device and assembling method thereof |
US11844178B2 (en) | 2020-06-02 | 2023-12-12 | Analog Devices International Unlimited Company | Electronic component |
Citations (88)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3246386A (en) * | 1962-01-26 | 1966-04-19 | Corning Glass Works | Electrical connected component and method |
US3290559A (en) * | 1964-06-16 | 1966-12-06 | Internat Energy Conversion Inc | Modular assembly for functional electronic blocks |
US3313986A (en) * | 1959-05-06 | 1967-04-11 | Texas Instruments Inc | Interconnecting miniature circuit modules |
US3377516A (en) * | 1966-08-04 | 1968-04-09 | Hughes Aircraft Co | Cordwood package with removable plugs |
US3403300A (en) * | 1966-09-01 | 1968-09-24 | Magnavox Co | Electronic module |
US3515949A (en) * | 1967-11-22 | 1970-06-02 | Bunker Ramo | 3-d flatpack module packaging technique |
US3535595A (en) * | 1967-11-09 | 1970-10-20 | Ferroxcube Corp | Universal cord-wood module |
US3614541A (en) * | 1969-04-08 | 1971-10-19 | North American Rockwell | Package for an electronic assembly |
US3671812A (en) * | 1970-07-01 | 1972-06-20 | Martin Marietta Corp | High density packaging of electronic components in three-dimensional modules |
US3746934A (en) * | 1971-05-06 | 1973-07-17 | Siemens Ag | Stack arrangement of semiconductor chips |
US3949274A (en) * | 1974-05-30 | 1976-04-06 | International Business Machines Corporation | Packaging and interconnection for superconductive circuitry |
US3959579A (en) * | 1974-08-19 | 1976-05-25 | International Business Machines Corporation | Apertured semi-conductor device mounted on a substrate |
US4017963A (en) * | 1973-02-26 | 1977-04-19 | Signetics Corporation | Semiconductor assembly and method |
US4116519A (en) * | 1977-08-02 | 1978-09-26 | Amp Incorporated | Electrical connections for chip carriers |
US4116518A (en) * | 1977-08-31 | 1978-09-26 | Ncr Corporation | Clip for paralleling packaged integrated circuit chips |
US4288808A (en) * | 1978-01-28 | 1981-09-08 | International Computers Limited | Circuit structures including integrated circuits |
US4288841A (en) * | 1979-09-20 | 1981-09-08 | Bell Telephone Laboratories, Incorporated | Double cavity semiconductor chip carrier |
US4364620A (en) * | 1980-09-05 | 1982-12-21 | Mostek Corporation | Socket for housing a plurality of integrated circuits |
US4371912A (en) * | 1980-10-01 | 1983-02-01 | Motorola, Inc. | Method of mounting interrelated components |
US4379259A (en) * | 1980-03-12 | 1983-04-05 | National Semiconductor Corporation | Process of performing burn-in and parallel functional testing of integrated circuit memories in an environmental chamber |
US4394712A (en) * | 1981-03-18 | 1983-07-19 | General Electric Company | Alignment-enhancing feed-through conductors for stackable silicon-on-sapphire wafers |
US4398235A (en) * | 1980-09-11 | 1983-08-09 | General Motors Corporation | Vertical integrated circuit package integration |
JPS58219757A (en) * | 1982-06-16 | 1983-12-21 | Toshiba Corp | Semiconductor device |
JPS60160641A (en) * | 1984-01-31 | 1985-08-22 | Sharp Corp | Mounting of leadless package ic for board |
JPS60194548A (en) * | 1984-03-16 | 1985-10-03 | Nec Corp | Chip carrier |
JPS60254762A (en) * | 1984-05-31 | 1985-12-16 | Fujitsu Ltd | Package for semiconductor element |
US4571663A (en) * | 1982-06-19 | 1986-02-18 | Ferranti Plc | Electrical circuit assemblies |
US4574331A (en) * | 1983-05-31 | 1986-03-04 | Trw Inc. | Multi-element circuit construction |
JPS6163048A (en) * | 1984-09-04 | 1986-04-01 | Toshiba Corp | Memory module |
JPS6175558A (en) * | 1984-09-21 | 1986-04-17 | Nec Corp | Hybrid integrated circuit device |
JPS61137335A (en) * | 1984-12-10 | 1986-06-25 | Toshiba Corp | Semiconductor device |
US4631573A (en) * | 1985-05-24 | 1986-12-23 | Sundstrand Corporation | Cooled stack of electrically isolated semiconductors |
US4638348A (en) * | 1982-08-10 | 1987-01-20 | Brown David F | Semiconductor chip carrier |
US4638406A (en) * | 1984-10-04 | 1987-01-20 | Motorola, Inc. | Discrete component mounting assembly |
US4642735A (en) * | 1984-02-27 | 1987-02-10 | General Electric Company | Frequency synthesizer module |
US4688864A (en) * | 1985-04-05 | 1987-08-25 | U.S. Philips Corporation | Electronic circuit constituted by stackable modules |
US4696525A (en) * | 1985-12-13 | 1987-09-29 | Amp Incorporated | Socket for stacking integrated circuit packages |
US4698663A (en) * | 1986-09-17 | 1987-10-06 | Fujitsu Limited | Heatsink package for flip-chip IC |
US4706166A (en) * | 1986-04-25 | 1987-11-10 | Irvine Sensors Corporation | High-density electronic modules--process and product |
US4761681A (en) * | 1982-09-08 | 1988-08-02 | Texas Instruments Incorporated | Method for fabricating a semiconductor contact and interconnect structure using orientation dependent etching and thermomigration |
US4770640A (en) * | 1983-06-24 | 1988-09-13 | Walter Howard F | Electrical interconnection device for integrated circuits |
US4821007A (en) * | 1987-02-06 | 1989-04-11 | Tektronix, Inc. | Strip line circuit component and method of manufacture |
US4841355A (en) * | 1988-02-10 | 1989-06-20 | Amdahl Corporation | Three-dimensional microelectronic package for semiconductor chips |
US4868712A (en) * | 1987-02-04 | 1989-09-19 | Woodman John K | Three dimensional integrated circuit package |
US4884237A (en) * | 1984-03-28 | 1989-11-28 | International Business Machines Corporation | Stacked double density memory module using industry standard memory chips |
US4924352A (en) * | 1987-12-22 | 1990-05-08 | Societe Anonyme Dite: Alcatel Cit | Method and device for cooling an integrated circuit package |
US4953005A (en) * | 1987-04-17 | 1990-08-28 | Xoc Devices, Inc. | Packaging system for stacking integrated circuits |
US4956694A (en) * | 1988-11-04 | 1990-09-11 | Dense-Pac Microsystems, Inc. | Integrated circuit chip stacking |
FR2645681A1 (en) * | 1989-04-07 | 1990-10-12 | Thomson Csf | Vertical interconnection device for integrated-circuit chips and its method of manufacture |
JPH02260448A (en) * | 1989-03-30 | 1990-10-23 | Mitsubishi Electric Corp | Semiconductor device and radiating fin |
US4996583A (en) * | 1989-02-15 | 1991-02-26 | Matsushita Electric Industrial Co., Ltd. | Stack type semiconductor package |
US4996587A (en) * | 1989-04-10 | 1991-02-26 | International Business Machines Corporation | Integrated semiconductor chip package |
JPH0396266A (en) * | 1989-09-08 | 1991-04-22 | Mitsubishi Electric Corp | Semiconductor integrated circuit module |
US5016138A (en) * | 1987-10-27 | 1991-05-14 | Woodman John K | Three dimensional integrated circuit package |
US5031072A (en) * | 1986-08-01 | 1991-07-09 | Texas Instruments Incorporated | Baseboard for orthogonal chip mount |
US5041395A (en) * | 1989-04-07 | 1991-08-20 | Sgs-Thomson Microelectronics S.A. | Method of encapsulating an integrated circuit using a punched metal grid attached to a perforated dielectric strip |
US5043794A (en) * | 1990-09-24 | 1991-08-27 | At&T Bell Laboratories | Integrated circuit package and compact assemblies thereof |
US5058265A (en) * | 1990-05-10 | 1991-10-22 | Rockwell International Corporation | Method for packaging a board of electronic components |
US5086018A (en) * | 1991-05-02 | 1992-02-04 | International Business Machines Corporation | Method of making a planarized thin film covered wire bonded semiconductor package |
US5107328A (en) * | 1991-02-13 | 1992-04-21 | Micron Technology, Inc. | Packaging means for a semiconductor die having particular shelf structure |
US5128831A (en) * | 1991-10-31 | 1992-07-07 | Micron Technology, Inc. | High-density electronic package comprising stacked sub-modules which are electrically interconnected by solder-filled vias |
JPH04209562A (en) * | 1990-12-06 | 1992-07-30 | Fujitsu Ltd | Module structure of semiconductor package |
US5140745A (en) * | 1990-07-23 | 1992-08-25 | Mckenzie Jr Joseph A | Method for forming traces on side edges of printed circuit boards and devices formed thereby |
US5155068A (en) * | 1989-08-31 | 1992-10-13 | Sharp Kabushiki Kaisha | Method for manufacturing an IC module for an IC card whereby an IC device and surrounding encapsulant are thinned by material removal |
US5198888A (en) * | 1987-12-28 | 1993-03-30 | Hitachi, Ltd. | Semiconductor stacked device |
US5222014A (en) * | 1992-03-02 | 1993-06-22 | Motorola, Inc. | Three-dimensional multi-chip pad array carrier |
US5231304A (en) * | 1989-07-27 | 1993-07-27 | Grumman Aerospace Corporation | Framed chip hybrid stacked layer assembly |
US5239447A (en) * | 1991-09-13 | 1993-08-24 | International Business Machines Corporation | Stepped electronic device package |
US5241454A (en) * | 1992-01-22 | 1993-08-31 | International Business Machines Corporation | Mutlilayered flexible circuit package |
US5281852A (en) * | 1991-12-10 | 1994-01-25 | Normington Peter J C | Semiconductor device including stacked die |
US5311401A (en) * | 1991-07-09 | 1994-05-10 | Hughes Aircraft Company | Stacked chip assembly and manufacturing method therefor |
US5313096A (en) * | 1992-03-16 | 1994-05-17 | Dense-Pac Microsystems, Inc. | IC chip package having chip attached to and wire bonded within an overlying substrate |
US5343366A (en) * | 1992-06-24 | 1994-08-30 | International Business Machines Corporation | Packages for stacked integrated circuit chip cubes |
US5343075A (en) * | 1991-06-29 | 1994-08-30 | Sony Corporation | Composite stacked semiconductor device with contact plates |
US5369058A (en) * | 1993-03-29 | 1994-11-29 | Staktek Corporation | Warp-resistent ultra-thin integrated circuit package fabrication method |
US5373189A (en) * | 1992-08-13 | 1994-12-13 | Commissariate A L'energie Atomique | Three-dimensional multichip module |
US5384689A (en) * | 1993-12-20 | 1995-01-24 | Shen; Ming-Tung | Integrated circuit chip including superimposed upper and lower printed circuit boards |
US5397916A (en) * | 1991-12-10 | 1995-03-14 | Normington; Peter J. C. | Semiconductor device including stacked die |
JPH07122842A (en) * | 1993-10-25 | 1995-05-12 | Toshiba Corp | Printed wiring board |
US5420751A (en) * | 1990-08-01 | 1995-05-30 | Staktek Corporation | Ultra high density modular integrated circuit package |
US5426566A (en) * | 1991-09-30 | 1995-06-20 | International Business Machines Corporation | Multichip integrated circuit packages and systems |
US5446313A (en) * | 1992-05-25 | 1995-08-29 | Hitachi, Ltd. | Thin type semiconductor device and module structure using the device |
US5479318A (en) * | 1994-03-07 | 1995-12-26 | Staktek Corporation | Bus communication system for stacked high density integrated circuit packages with trifurcated distal lead ends |
US5481133A (en) * | 1994-03-21 | 1996-01-02 | United Microelectronics Corporation | Three-dimensional multichip package |
US5499160A (en) * | 1990-08-01 | 1996-03-12 | Staktek Corporation | High density integrated circuit module with snap-on rail assemblies |
US5514907A (en) * | 1995-03-21 | 1996-05-07 | Simple Technology Incorporated | Apparatus for stacking semiconductor chips |
US5612570A (en) * | 1995-04-13 | 1997-03-18 | Dense-Pac Microsystems, Inc. | Chip stack and method of making same |
US5615475A (en) * | 1995-01-30 | 1997-04-01 | Staktek Corporation | Method of manufacturing an integrated package having a pair of die on a common lead frame |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60160664A (en) * | 1984-01-31 | 1985-08-22 | Fujitsu Ltd | Manufacture of semiconductor device |
-
1995
- 1995-03-21 US US08/408,552 patent/US5514907A/en not_active Ceased
-
1998
- 1998-04-22 US US09/064,348 patent/USRE36916E/en not_active Expired - Lifetime
Patent Citations (96)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3313986A (en) * | 1959-05-06 | 1967-04-11 | Texas Instruments Inc | Interconnecting miniature circuit modules |
US3246386A (en) * | 1962-01-26 | 1966-04-19 | Corning Glass Works | Electrical connected component and method |
US3290559A (en) * | 1964-06-16 | 1966-12-06 | Internat Energy Conversion Inc | Modular assembly for functional electronic blocks |
US3377516A (en) * | 1966-08-04 | 1968-04-09 | Hughes Aircraft Co | Cordwood package with removable plugs |
US3403300A (en) * | 1966-09-01 | 1968-09-24 | Magnavox Co | Electronic module |
US3535595A (en) * | 1967-11-09 | 1970-10-20 | Ferroxcube Corp | Universal cord-wood module |
US3515949A (en) * | 1967-11-22 | 1970-06-02 | Bunker Ramo | 3-d flatpack module packaging technique |
US3614541A (en) * | 1969-04-08 | 1971-10-19 | North American Rockwell | Package for an electronic assembly |
US3671812A (en) * | 1970-07-01 | 1972-06-20 | Martin Marietta Corp | High density packaging of electronic components in three-dimensional modules |
US3746934A (en) * | 1971-05-06 | 1973-07-17 | Siemens Ag | Stack arrangement of semiconductor chips |
US4017963A (en) * | 1973-02-26 | 1977-04-19 | Signetics Corporation | Semiconductor assembly and method |
US3949274A (en) * | 1974-05-30 | 1976-04-06 | International Business Machines Corporation | Packaging and interconnection for superconductive circuitry |
US3959579A (en) * | 1974-08-19 | 1976-05-25 | International Business Machines Corporation | Apertured semi-conductor device mounted on a substrate |
US4116519A (en) * | 1977-08-02 | 1978-09-26 | Amp Incorporated | Electrical connections for chip carriers |
US4116518A (en) * | 1977-08-31 | 1978-09-26 | Ncr Corporation | Clip for paralleling packaged integrated circuit chips |
US4288808A (en) * | 1978-01-28 | 1981-09-08 | International Computers Limited | Circuit structures including integrated circuits |
US4288841A (en) * | 1979-09-20 | 1981-09-08 | Bell Telephone Laboratories, Incorporated | Double cavity semiconductor chip carrier |
US4379259A (en) * | 1980-03-12 | 1983-04-05 | National Semiconductor Corporation | Process of performing burn-in and parallel functional testing of integrated circuit memories in an environmental chamber |
US4364620A (en) * | 1980-09-05 | 1982-12-21 | Mostek Corporation | Socket for housing a plurality of integrated circuits |
US4398235A (en) * | 1980-09-11 | 1983-08-09 | General Motors Corporation | Vertical integrated circuit package integration |
US4371912A (en) * | 1980-10-01 | 1983-02-01 | Motorola, Inc. | Method of mounting interrelated components |
US4394712A (en) * | 1981-03-18 | 1983-07-19 | General Electric Company | Alignment-enhancing feed-through conductors for stackable silicon-on-sapphire wafers |
JPS58219757A (en) * | 1982-06-16 | 1983-12-21 | Toshiba Corp | Semiconductor device |
US4571663A (en) * | 1982-06-19 | 1986-02-18 | Ferranti Plc | Electrical circuit assemblies |
US4638348A (en) * | 1982-08-10 | 1987-01-20 | Brown David F | Semiconductor chip carrier |
US4761681A (en) * | 1982-09-08 | 1988-08-02 | Texas Instruments Incorporated | Method for fabricating a semiconductor contact and interconnect structure using orientation dependent etching and thermomigration |
US4574331A (en) * | 1983-05-31 | 1986-03-04 | Trw Inc. | Multi-element circuit construction |
US4770640A (en) * | 1983-06-24 | 1988-09-13 | Walter Howard F | Electrical interconnection device for integrated circuits |
JPS60160641A (en) * | 1984-01-31 | 1985-08-22 | Sharp Corp | Mounting of leadless package ic for board |
US4642735A (en) * | 1984-02-27 | 1987-02-10 | General Electric Company | Frequency synthesizer module |
JPS60194548A (en) * | 1984-03-16 | 1985-10-03 | Nec Corp | Chip carrier |
US4884237A (en) * | 1984-03-28 | 1989-11-28 | International Business Machines Corporation | Stacked double density memory module using industry standard memory chips |
JPS60254762A (en) * | 1984-05-31 | 1985-12-16 | Fujitsu Ltd | Package for semiconductor element |
JPS6163048A (en) * | 1984-09-04 | 1986-04-01 | Toshiba Corp | Memory module |
JPS6175558A (en) * | 1984-09-21 | 1986-04-17 | Nec Corp | Hybrid integrated circuit device |
US4638406A (en) * | 1984-10-04 | 1987-01-20 | Motorola, Inc. | Discrete component mounting assembly |
JPS61137335A (en) * | 1984-12-10 | 1986-06-25 | Toshiba Corp | Semiconductor device |
US4688864A (en) * | 1985-04-05 | 1987-08-25 | U.S. Philips Corporation | Electronic circuit constituted by stackable modules |
US4631573A (en) * | 1985-05-24 | 1986-12-23 | Sundstrand Corporation | Cooled stack of electrically isolated semiconductors |
US4696525A (en) * | 1985-12-13 | 1987-09-29 | Amp Incorporated | Socket for stacking integrated circuit packages |
US4706166A (en) * | 1986-04-25 | 1987-11-10 | Irvine Sensors Corporation | High-density electronic modules--process and product |
US5031072A (en) * | 1986-08-01 | 1991-07-09 | Texas Instruments Incorporated | Baseboard for orthogonal chip mount |
US4698663A (en) * | 1986-09-17 | 1987-10-06 | Fujitsu Limited | Heatsink package for flip-chip IC |
US4868712A (en) * | 1987-02-04 | 1989-09-19 | Woodman John K | Three dimensional integrated circuit package |
US4821007A (en) * | 1987-02-06 | 1989-04-11 | Tektronix, Inc. | Strip line circuit component and method of manufacture |
US4953005A (en) * | 1987-04-17 | 1990-08-28 | Xoc Devices, Inc. | Packaging system for stacking integrated circuits |
US5016138A (en) * | 1987-10-27 | 1991-05-14 | Woodman John K | Three dimensional integrated circuit package |
US4924352A (en) * | 1987-12-22 | 1990-05-08 | Societe Anonyme Dite: Alcatel Cit | Method and device for cooling an integrated circuit package |
US5198888A (en) * | 1987-12-28 | 1993-03-30 | Hitachi, Ltd. | Semiconductor stacked device |
US4841355A (en) * | 1988-02-10 | 1989-06-20 | Amdahl Corporation | Three-dimensional microelectronic package for semiconductor chips |
US4956694A (en) * | 1988-11-04 | 1990-09-11 | Dense-Pac Microsystems, Inc. | Integrated circuit chip stacking |
US4996583A (en) * | 1989-02-15 | 1991-02-26 | Matsushita Electric Industrial Co., Ltd. | Stack type semiconductor package |
JPH02260448A (en) * | 1989-03-30 | 1990-10-23 | Mitsubishi Electric Corp | Semiconductor device and radiating fin |
US5025307A (en) * | 1989-03-30 | 1991-06-18 | Mitsubishi Denki Kabushiki Kaisha | Modular semiconductor device |
US5041395A (en) * | 1989-04-07 | 1991-08-20 | Sgs-Thomson Microelectronics S.A. | Method of encapsulating an integrated circuit using a punched metal grid attached to a perforated dielectric strip |
FR2645681A1 (en) * | 1989-04-07 | 1990-10-12 | Thomson Csf | Vertical interconnection device for integrated-circuit chips and its method of manufacture |
US4996587A (en) * | 1989-04-10 | 1991-02-26 | International Business Machines Corporation | Integrated semiconductor chip package |
US5231304A (en) * | 1989-07-27 | 1993-07-27 | Grumman Aerospace Corporation | Framed chip hybrid stacked layer assembly |
US5155068A (en) * | 1989-08-31 | 1992-10-13 | Sharp Kabushiki Kaisha | Method for manufacturing an IC module for an IC card whereby an IC device and surrounding encapsulant are thinned by material removal |
JPH0396266A (en) * | 1989-09-08 | 1991-04-22 | Mitsubishi Electric Corp | Semiconductor integrated circuit module |
US5058265A (en) * | 1990-05-10 | 1991-10-22 | Rockwell International Corporation | Method for packaging a board of electronic components |
US5140745A (en) * | 1990-07-23 | 1992-08-25 | Mckenzie Jr Joseph A | Method for forming traces on side edges of printed circuit boards and devices formed thereby |
US5420751A (en) * | 1990-08-01 | 1995-05-30 | Staktek Corporation | Ultra high density modular integrated circuit package |
US5561591A (en) * | 1990-08-01 | 1996-10-01 | Staktek Corporation | Multi-signal rail assembly with impedance control for a three-dimensional high density integrated circuit package |
US5499160A (en) * | 1990-08-01 | 1996-03-12 | Staktek Corporation | High density integrated circuit module with snap-on rail assemblies |
US5566051A (en) * | 1990-08-01 | 1996-10-15 | Staktek Corporation | Ultra high density integrated circuit packages method and apparatus |
US5043794A (en) * | 1990-09-24 | 1991-08-27 | At&T Bell Laboratories | Integrated circuit package and compact assemblies thereof |
JPH04209562A (en) * | 1990-12-06 | 1992-07-30 | Fujitsu Ltd | Module structure of semiconductor package |
US5107328A (en) * | 1991-02-13 | 1992-04-21 | Micron Technology, Inc. | Packaging means for a semiconductor die having particular shelf structure |
US5086018A (en) * | 1991-05-02 | 1992-02-04 | International Business Machines Corporation | Method of making a planarized thin film covered wire bonded semiconductor package |
US5343075A (en) * | 1991-06-29 | 1994-08-30 | Sony Corporation | Composite stacked semiconductor device with contact plates |
US5311401A (en) * | 1991-07-09 | 1994-05-10 | Hughes Aircraft Company | Stacked chip assembly and manufacturing method therefor |
US5239447A (en) * | 1991-09-13 | 1993-08-24 | International Business Machines Corporation | Stepped electronic device package |
US5426566A (en) * | 1991-09-30 | 1995-06-20 | International Business Machines Corporation | Multichip integrated circuit packages and systems |
US5128831A (en) * | 1991-10-31 | 1992-07-07 | Micron Technology, Inc. | High-density electronic package comprising stacked sub-modules which are electrically interconnected by solder-filled vias |
US5281852A (en) * | 1991-12-10 | 1994-01-25 | Normington Peter J C | Semiconductor device including stacked die |
US5397916A (en) * | 1991-12-10 | 1995-03-14 | Normington; Peter J. C. | Semiconductor device including stacked die |
US5241454A (en) * | 1992-01-22 | 1993-08-31 | International Business Machines Corporation | Mutlilayered flexible circuit package |
US5222014A (en) * | 1992-03-02 | 1993-06-22 | Motorola, Inc. | Three-dimensional multi-chip pad array carrier |
US5313096A (en) * | 1992-03-16 | 1994-05-17 | Dense-Pac Microsystems, Inc. | IC chip package having chip attached to and wire bonded within an overlying substrate |
US5446313A (en) * | 1992-05-25 | 1995-08-29 | Hitachi, Ltd. | Thin type semiconductor device and module structure using the device |
US5723903A (en) * | 1992-05-25 | 1998-03-03 | Hitachi, Ltd. | Thin type semiconductor device, module structure using the device and method of mounting the device on board |
US5343366A (en) * | 1992-06-24 | 1994-08-30 | International Business Machines Corporation | Packages for stacked integrated circuit chip cubes |
US5373189A (en) * | 1992-08-13 | 1994-12-13 | Commissariate A L'energie Atomique | Three-dimensional multichip module |
US5369058A (en) * | 1993-03-29 | 1994-11-29 | Staktek Corporation | Warp-resistent ultra-thin integrated circuit package fabrication method |
JPH07122842A (en) * | 1993-10-25 | 1995-05-12 | Toshiba Corp | Printed wiring board |
US5384689A (en) * | 1993-12-20 | 1995-01-24 | Shen; Ming-Tung | Integrated circuit chip including superimposed upper and lower printed circuit boards |
US5552963A (en) * | 1994-03-07 | 1996-09-03 | Staktek Corporation | Bus communication system for stacked high density integrated circuit packages |
US5479318A (en) * | 1994-03-07 | 1995-12-26 | Staktek Corporation | Bus communication system for stacked high density integrated circuit packages with trifurcated distal lead ends |
US5493476A (en) * | 1994-03-07 | 1996-02-20 | Staktek Corporation | Bus communication system for stacked high density integrated circuit packages with bifurcated distal lead ends |
US5586009A (en) * | 1994-03-07 | 1996-12-17 | Staktek Corporation | Bus communication system for stacked high density integrated circuit packages |
US5605592A (en) * | 1994-03-07 | 1997-02-25 | Staktek Corporation | Method of manufacturing a bus communication system for stacked high density integrated circuit packages |
US5481133A (en) * | 1994-03-21 | 1996-01-02 | United Microelectronics Corporation | Three-dimensional multichip package |
US5615475A (en) * | 1995-01-30 | 1997-04-01 | Staktek Corporation | Method of manufacturing an integrated package having a pair of die on a common lead frame |
US5514907A (en) * | 1995-03-21 | 1996-05-07 | Simple Technology Incorporated | Apparatus for stacking semiconductor chips |
US5612570A (en) * | 1995-04-13 | 1997-03-18 | Dense-Pac Microsystems, Inc. | Chip stack and method of making same |
Non-Patent Citations (38)
Title |
---|
"Alternative assembly for memory ICs," XP-002093051, Electronic Engineering, Jan. 1987, p. 22. |
"Introducing a Revolutionary 3 Dimensional Package Type--The SLCC," John Forthun, Advancement In Technology, Feb. 26, 1992, 12 pages. |
"New levels of hybrid IC density are provided by Three-Dimensional Packaging" article, 2 pages. |
1992 Proceedings, 42nd Electronic Components & Technology Conference, May 18 20, 1992. * |
1992 Proceedings, 42nd Electronic Components & Technology Conference, May 18-20, 1992. |
3 D Integrated Packging and Interconnect Technology, Wescon/90 Conference Record, held Nov. 13 15, 1990, Anaheim, CA. * |
3-D Integrated Packging and Interconnect Technology, Wescon/90 Conference Record, held Nov. 13-15, 1990, Anaheim, CA. |
Alternative assembly for memory ICs, XP 002093051, Electronic Engineering, Jan. 1987, p. 22. * |
Dense Pac Microsystems, 128 Megabyte SDRAM Sodimm. * |
Dense Pac Microsystems, 16 Megabit High Speed CMOS SRAM. * |
Dense Pac Microsystems, 256 Megabyte CMOS DRAM. * |
Dense Pac Microsystems, 3 D Technology, 1993, 15 pages. * |
Dense Pac MicroSystems, Inc., Memory Products Short Form Q4, 1994, 5 pages. * |
Dense Pac MicroSystems, Inc., Short Form Catalog, 1991, 20 pages. * |
Dense Pac MicroSystems, Inc., Short Order Catalog, 1990, 12 pages. * |
Dense Pac Microsystems, While others are still defining it . . . Our customers are cashing in flyer. * |
Dense-Pac Microsystems, "3-D Technology," 1993, 15 pages. |
Dense-Pac Microsystems, "While others are still defining it . . . Our customers are cashing in!" flyer. |
Dense-Pac Microsystems, 128-Megabyte SDRAM Sodimm. |
Dense-Pac Microsystems, 16-Megabit High Speed CMOS SRAM. |
Dense-Pac Microsystems, 256-Megabyte CMOS DRAM. |
Dense-Pac MicroSystems, Inc., "Memory Products--Short Form--Q4," 1994, 5 pages. |
Dense-Pac MicroSystems, Inc., "Short Form Catalog," 1991, 20 pages. |
Dense-Pac MicroSystems, Inc., "Short Order Catalog," 1990, 12 pages. |
Electronic Packaging & Production article, A Cahners Publication, Jan. 1992, 2 pages. * |
IBM Technical Disclosure Bulletin, Edge Mounted MLC Packaging Scheme, vol. 23, No. 12, May 1981. * |
IBM Technical Disclosure Bulletin, Edge-Mounted MLC Packaging Scheme, vol. 23, No. 12, May 1981. |
IBM Technical Disclosure Bulletin, Process for Producing Lateral Chip Connectors, vol. 32, No. 3B, Aug. 1989. * |
IBM Technical Disclosure Bulletin, Vertical Chip Packaging, vol. 20, No. 11A, Apr. 1978. * |
International Electronic Device Meeting, IEDM Technical Digest, Washington, D.C., Dec. 6 9, 1987. * |
International Electronic Device Meeting, IEDM Technical Digest, Washington, D.C., Dec. 6-9, 1987. |
Introducing a Revolutionary 3 Dimensional Package Type The SLCC, John Forthun, Advancement In Technology, Feb. 26, 1992, 12 pages. * |
New levels of hybrid IC density are provided by Three Dimensional Packaging article, 2 pages. * |
Patent Abstract of Japan, Publication No. 05029534, Published May 2, 1993, Inventor: Nakamura Shigemi, entitled "Memory Module", European Patent Office. |
Patent Abstract of Japan, Publication No. 05029534, Published May 2, 1993, Inventor: Nakamura Shigemi, entitled Memory Module , European Patent Office. * |
Research Disclosure, Organic Card Device Carrier, 31318, May 1990, No. 313. * |
Tuckerman, D.B. et al., "Laminated Memory: A New 3-Dimensional Packaging Technology for MCMs" article, nCHIP, Inc., IEEE, 1994. |
Tuckerman, D.B. et al., Laminated Memory: A New 3 Dimensional Packaging Technology for MCMs article, nCHIP, Inc., IEEE, 1994. * |
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