USRE40137E1 - Methods for forming integrated circuits within substrates - Google Patents

Methods for forming integrated circuits within substrates Download PDF

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Publication number
USRE40137E1
USRE40137E1 US10/734,072 US73407203A USRE40137E US RE40137 E1 USRE40137 E1 US RE40137E1 US 73407203 A US73407203 A US 73407203A US RE40137 E USRE40137 E US RE40137E
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United States
Prior art keywords
recess
antenna
integrated circuit
substrate
providing
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US10/734,072
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Mark E. Tuttle
Rickie C. Lake
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Round Rock Research LLC
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Micron Technology Inc
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Priority to US10/734,072 priority Critical patent/USRE40137E1/en
Assigned to KEYSTONE TECHNOLOGY SOLUTIONS, LLC reassignment KEYSTONE TECHNOLOGY SOLUTIONS, LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MICRON TECHNOLOGY, INC.
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Publication of USRE40137E1 publication Critical patent/USRE40137E1/en
Assigned to ROUND ROCK RESEARCH, LLC reassignment ROUND ROCK RESEARCH, LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MICRON TECHNOLOGY, INC.
Assigned to MICRON TECHNOLOGY, INC. reassignment MICRON TECHNOLOGY, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KEYSTONE TECHNOLOGY SOLUTIONS, LLC
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01078Platinum [Pt]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/1515Shape
    • H01L2924/15153Shape the die mounting substrate comprising a recess for hosting the device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/15165Monolayer substrate
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base

Definitions

  • More than one reissue application has been filed for the reissue of U.S. Pat. No. 6 , 329 , 213 B 1 .
  • the reissue applications are application Ser. Nos. 10 / 734 , 072 (the present application), 11 / 302 , 543 , and 11 / 496 , 088 , all of which are continuation reissues of U.S. Pat. No. 6 , 329 , 213 B 1 .
  • the invention pertains to methods of forming integrated circuits within substrates, and to embedded circuits.
  • the invention is thought to have particular application towards methods of forming integrated circuits within personal cards, such as personal identification cards and credit cards.
  • Smart cards typically include an integrated circuit providing both memory and processing functions, have words or pictures printed on them, and control who uses information stored in the integrated circuit and how the information is used.
  • Some smart cards have length and width dimensions corresponding to those of credit cards.
  • the size of such smart cards is determined by an international standard (ISO 7816).
  • ISO 7816 also defines the physical characteristics of the plastic, including temperature tolerance and flexibility.
  • ISO 7816 also defines the position of electrical contacts and their functions, and the protocol for communications between the integrated circuit and readers (vending machines, pay phones, etc.)
  • the term “smart card”, as used herein, is meant to include cards that include microprocessors. Such cards might not conform to ISO 7816.
  • PVC and ABS are typical.
  • PVC can be embossed, but is not recyclable.
  • ABS is not readily embossed, but is recyclable.
  • Smart cards have many different applications. For example, smart cards can be pre-paid cards used instead of money for making purchases from vending machines, gaming machines, gas stations, car washes, photocopiers, laundry machines, cinemas, fast-food restaurants, retail outlets, or anywhere where cash is used. For example, they are commonly used in Europe with public telephones. A timer is used to detect a balance from the card automatically while a conversation continues. Smart cards can be used as food stamps, or for redeeming other government-provided benefits. Because the transaction is electronic, the telephone, vending machine, etc. does not need to store cash, so risk of loss due to theft can be reduced. Change does not need to be stored and disbursed, and received payment can be directly wired to a bank. Pre-paid cards can be a form of advertising, because they can have logos or other information printed on them. The user would typically carry the card for weeks before using up the value on the card.
  • Smart cards To authenticate a conventional credit card, a telephone call must be made to verify that sufficient funds are available. Smart cards permit such verification to be performed off-line, thus saving telecommunication charges. Smart cards thus provide an advantage over conventional credit cards. Smart cards can also be used as keys to gain access to restricted areas, such as secure areas of buildings, or to access parking lots.
  • Radio frequency identification devices can also be considered smart cards if they include an integrated circuit. RFIDs are described in detail in U.S. patent application Ser. No. 08/705,043, filed Aug. 29, 1996, and incorporated herein by reference. RFIDs comprising integrated circuits may be referred to as intelligent RFIDs or as remote intelligent communication (RIC) devices.
  • RFIDs comprising integrated circuits may be referred to as intelligent RFIDs or as remote intelligent communication (RIC) devices.
  • Smart cards will typically contain an integrated circuit, typically provided as a packaged integrated circuit chip (IC chip).
  • the smart card may also comprise electrical interconnects for connecting the IC chip to terminals.
  • the electronic interconnects will comprise an antenna, such as, for example, when the integrated circuit comprises radio frequency identification device circuitry.
  • an antenna, battery and IC may be inserted into smart cards.
  • smart cards are intended to be conveniently carried by persons, it is desirable to produce smart cards which are relatively thin, preferably having a size and shape similar to credit cards. This enables the cards to be carried on a person, such as, for example, in a persons's wallet.
  • the invention encompasses methods for forming integrated circuits within substrates, and embedded circuits.
  • the invention encompasses a method of forming an integrated circuit within a substrate.
  • a recess is formed in the substrate, and an antenna is printed within the recess.
  • An integrated circuit chip and a battery are provided in operative electrical connection with the antenna.
  • the invention encompasses a method of forming a plurality of cards.
  • a substrate sheet is provided and a plurality of recesses are formed within the substrate sheet.
  • the individual recesses have bottom surfaces and sidewall surfaces joined to the bottom surfaces.
  • a conductive film is printed within the recesses to form electrical interconnects within the recesses.
  • the electrical interconnects extend along the bottom surfaces and the sidewall surfaces of the recesses, and also on top surfaces of the substrate sheet.
  • Integrated circuit chips are placed within the recesses and in electrical connection with the electrical interconnects.
  • the integrated circuit chips and the conductive film within the recesses are covered with a protective cover.
  • the substrate sheet is divided into a plurality of cards.
  • the invention encompasses an embedded circuit.
  • the embedded circuit includes a substrate having a recess therein; a conductive circuit printed within the recess and an integrated circuit chip bonded to the conductive circuit.
  • the invention encompasses an embedded circuit.
  • the embedded circuit includes a substrate having a recess therein; a conductive circuit provided within the recess; an integrated circuit chip bonded to the conductive circuit; and a battery in electrical connection with the integrated circuit chip.
  • a recess is provided in a plastic substrate containing an integrated circuit comprising RFID circuitry.
  • a conductive material extends over a sidewall of the recess and is coupled to the integrated circuit in a first region and to an antenna in a second region.
  • a flexible film may be disposed over the recess, the integrated circuit, and the conductive material.
  • FIG. 1 is a schematic perspective view of a card and a printing pad at a preliminary step of a first embodiment method of the present invention.
  • FIG. 2 is a schematic perspective view of the FIG. 1 card and printing pad shown at a processing step subsequent to that of FIG. 1 .
  • FIG. 3 is a perspective view of the FIG. 1 card shown at a processing step subsequent to that of FIG. 2 .
  • FIG. 4 is a perspective view of the FIG. 1 card shown at a processing step subsequent to that of FIG. 3 .
  • FIG. 5 is a cross-sectional view of the FIG. 4 card taken along line 5 — 5 in FIG. 4 .
  • FIG. 6 is a cross-sectional view of the FIG. 1 card taken along line 5 — 5 in FIG. 4 , and shown at a processing step subsequent to that of FIG. 5 .
  • FIG. 7 is a cross-sectional view of the FIG. 1 card taken alone line 5 — 5 in FIG. 4 , and shown at a processing step subsequent to that of FIG. 5 .
  • FIG. 8 is a perspective view of a card being produced according to a second embodiment method of the present invention.
  • FIG. 9 is a cross-sectional view of the FIG. 8 card taken along the line 9 — 9 in FIG. 8 .
  • FIG. 10 is a perspective view of a card being produced according to a third embodiment method of the present invention.
  • FIG. 11 is a cross-sectional view of the FIG. 10 card taken along the line 11 — 11 in FIG. 10 .
  • FIG. 12 is an elevational view of a substrate sheet processed according to a method of the present invention.
  • FIG. 13 is an elevational view of the sheet of FIG. 12 at a processing step shown subsequent to that of FIG. 12 .
  • a first embodiment method of the present invention is described with reference to FIGS. 1-7 .
  • a substrate 10 is shown at a preliminary step of the first embodiment method.
  • Substrate 10 is preferably a card substrate in the approximate shape of a credit card.
  • Substrate 10 can comprise any of a number of materials known to persons of ordinary skill in the art, such as for example, PVC or ABS plastic.
  • substrate 10 might ultimately be used for a radio frequency card, smart card, or other card built with multiple, interconnected composites, including an integrated circuit.
  • substrate 10 preferably comprises a configuration suitable for one or more of the above-discussed ultimate uses.
  • Substrate 10 comprises a substrate body 13 , a front surface 12 , and an opposing back surface 11 (shown in FIG. 5 ).
  • a recess 14 is provided through front surface 12 and into substrate 10 .
  • Recess 14 can be formed by conventional methods. Examples include cutting with a blade, grinding wheel or laser. Another example method for forming recess 14 is to form the recess in situ at a time of card creation by injection molding the card in a shape comprising recess 14 .
  • Recess 14 has a bottom surface 16 and sidewall surfaces 18 joined to bottom surface 16 . As most clearly shown in FIGS. 5-7 , sidewall surfaces 18 preferably extend non-perpendicularly from bottom surface 16 .
  • Such non-perpendicular orientation of sidewall surfaces 18 relative to bottom surface 16 can simplify a below-discussed printing of a circuit 22 (shown in FIG. 3 ) over such sidewall surfaces. It is noted, however, that the present invention also encompasses applications in which sidewall surfaces 18 extend perpendicularly from bottom surface 16 .
  • a printing pad 20 is elevated above substrate 10 .
  • Printing pad 20 preferably comprises a deformable material, such as for example, foam, sponge, or silicone rubber.
  • a circuit pattern 21 is formed on printing pad 20 , and comprises, for example, a conductive film. Circuit pattern 21 can be formed by, for example, pressing pad 20 onto a plate having a shape corresponding to circuit pattern 21 etched within it.
  • printing pad 20 is pressed against substrate 10 to transfer circuit pattern 21 to substrate 10 and thereby print a circuit 22 (shown in FIG. 3 ) upon substrate 10 and within recess 14 .
  • printing pad 20 is configured to print the circuit pattern on bottom surface 16 , on two of sidewall surfaces 18 , and on upper surf ace 12 .
  • printing pad 20 can be configured to print on less than all of surfaces 16 , 18 and 20 .
  • printing pad 20 may be configured to print only on bottom surface 16 , or only on bottom surface 16 and one of the sidewall surfaces 18 .
  • Suitable materials which may be pad printed to form circuit 22 are conductive films, such as, for example, printed thick film (PTFs) comprising silver-filled organic material. It is noted that, although pad printing is shown, the printing can comprise other printing methods known to persons of ordinary skill in the art, including, for example, stencil printing, screen printing spray printing, needle dispense printing etc. After conductive circuit 22 is printed, the circuit can be cured by conventional methods.
  • PPFs printed thick film
  • circuit 22 After curing, circuit 22 will have a thickness and associated degree of conductivity. If the conductive is lower than desired as may occur if, for example, conductive material of circuit 22 is too thin, or not adequately a low resistance material, the conductivity can be enhanced by providing an electroless plated metal, such as copper or nickel, against substrate 10 and circuit 22 .
  • the electroless plated metal selectively plates conductive circuit 22 , while not plating non-conductive surfaces of substrate 10 .
  • the electroless plating of metal can be accomplished by conventional methods.
  • circuit 22 preferably comprises conductive interconnects 23 and 24 , and an antenna 26 .
  • Interconnect 23 comprises nodes 25 and 27
  • interconnect 24 comprises nodes 28 and 30
  • antenna 26 comprises nodes 32 and 33 .
  • Nodes 25 , 27 , 28 , 30 , 32 and 33 are illustrated as being wider than the rest of interconnects 23 and 24 , and antenna 26 .
  • nodes 25 , 27 , 28 , 30 , 32 and 33 could also be a same size as the rest of interconnects 23 , 24 and antenna 26 ; or narrower than the rest of interconnects 23 , 24 and antenna 26 .
  • Note 27 preferably comprises the shown arcuate shape complementary to an outer surface of a battery 36 (shown in FIG. 4 ), which is to be joined to node 27 .
  • antenna 26 is a loop antenna comprising a predominant portion outside of recess 14 and on substrate surface 12 . In other embodiments (not shown), antenna 26 could be entirely within recess 14 , or comprise a predominate portion within recess 14 .
  • antenna 26 constitutes a part of, and is formed at the same time as, the other integrated circuitry. It is noted that antenna 26 could be formed in two steps, with a portion of antenna 26 being formed before or after pad printing of circuit 22 . For instance, the portion of antenna 26 extending along upper surface 12 could be formed prior to printing circuit 22 . Then, a portion of antenna 26 could be printed as part of circuit 22 to create nodes 32 and 33 , and to connect the previously formed portion of antenna 26 with nodes 32 and 33 . In such circumstances, the portion of antenna 26 which is not formed as part of circuit 22 could be formed by methods other than those utilized to form circuit 22 . For instance, if circuit 22 is pad printed, the portion of antenna 26 not formed as part of circuit 22 could be formed by a method other than pad printing. Such other methods will be recognized by persons of ordinary skill in the art.
  • electrical components 36 and 38 are bonded to one or more of nodes 25 , 27 , 28 , 30 , 32 and 33 (shown in FIG. 3 ).
  • electrical component 36 comprises a battery and component 38 comprises a monolithic integrated circuit formed on a chip.
  • Components 36 and 38 may be bonded to nodes 25 , 27 , 28 , 30 , 32 and 33 (shown in FIG. 3 ), utilizing a conductive adhesive 35 which is cured after provision of components 36 and 38 .
  • An example conductive adhesive 35 is a conductive epoxy.
  • Battery 36 could alternatively be provided directly bonded to integrated circuit chip 38 .
  • the bonding of battery 36 to integrated circuit 38 can occur either before or after placing integrated circuit 38 and battery 36 within recess 14 .
  • at least one of the electrical components 36 or 38 could be provided externally of recess 14 .
  • interconnects 23 and 24 connect battery 36 to integrated circuit 38
  • antenna 26 connects with integrated circuit 38
  • Battery 36 , interconnects 23 and 24 , integrated circuit 38 and antenna 26 together form a radio frequency identification device (RFID).
  • RFID radio frequency identification device
  • FIGS. 6 and 7 illustrate two methods of protectively covering circuit 22 and the components within recess 14 .
  • a cap 40 can be adhered over substrate 10 and over recess 14 .
  • Cap 40 may be adhered, for example, by adhesive, such as glue, or by mechanical fasteners, such as staples or screws.
  • Example materials for cap 40 include plastic metal, and flexible or rigid adhesive tape.
  • portions of loop antenna 26 are between cap 40 and substrate body 13 . Such portions of loop antenna 26 are generally thin enough that they do not interfere with bonding of cap 40 to substrate body 13 .
  • cap 40 can be formed of a material which conforms over and around loop antenna 26 , such as, for example, a deformable material. Also, in embodiments which are not shown, antenna 26 can be formed entirely within recess 14 to minimize interference of antenna 26 with bonding of cap 40 to substrate body 13 .
  • circuitry 22 and components 36 and 38 can be covered with an encapsulant 42 .
  • encapsulant may comprise, for example, a low temperature curing insulating material, such as, for example, a two-part epoxy or urethane.
  • Encapsulant 42 will preferably be provided initially as a liquid material and to overfill recess 14 and overlay antenna 26 . Encapsulant 42 can then be cured into a solid mass, and either milled or sanded to form the shown preferred substantially planar upper surface 44 .
  • FIGS. 6 and 7 are merely example methods for covering circuitry proximate and within recess 14 .
  • the invention encompasses other methods for covering such circuitry which will be recognized by persons of ordinary skill in the art.
  • the methods of FIGS. 6 and 7 could also be combined. For instance, a recess could be partially filled with an encapsulant and then covered. Such combined methods may have particular application toward sealing cards containing multiple recesses which are discussed below.
  • an integrated circuit could be within one recess and a battery within another.
  • the integrated circuit could be covered with encapsulant and/or a cap, and the battery covered only with a removable cap. In such applications the integrated circuit would be well-protected and the battery could be easily replaceable.
  • a protective cover over recess 14 , the construction of a card is substantially finished.
  • the card may then be covered with a laminating film for cosmetic, printability, or logo reasons.
  • An example laminating film would be a thin (less than about one mil) PVC sheet bonded to substrate 10 with an adhesive.
  • FIGS. 8 and 9 A second embodiment method of the present invention is described with reference to FIGS. 8 and 9 .
  • numbering similar to that utilized above in describing FIGS. 1-7 will be used, with differences indicated by the suffix “a” or by different numerals.
  • Substrate 10 a comprises a first recess 52 and a second recess 54 .
  • first recess 52 is formed in the substrate and second recess 54 is formed within first recess 52 and essentially constitutes a part thereof.
  • a conductive circuit 22 a is formed within recesses 52 and 54 and comprises interconnects 23 a and 24 , and antenna 26 a.
  • Antenna 26 a is a loop antenna which extends beyond recesses 52 and 54 .
  • Interconnects 23 a and 24 a connect electrical components 36 a and 38 a.
  • Interconnects 23 a and 24 a, and antenna 26 a are preferably formed by printing a conductive film within first and second recesses 52 and 54 , utilizing procedures analogous to those discussed above with reference to FIGS. 1-3 .
  • components 36 a and 38 a are each within a recess, with component 36 a being within first recess 52 and component 38 a being within second recess 54 .
  • First recess 52 comprises a bottom surface 56 and sidewall surfaces 58 .
  • Second recess 54 comprises a bottom surface 60 and sidewall surfaces 62 .
  • Sidewall surfaces 58 and 62 can extend non-perpendicularly form bottom surfaces 56 and 60 , respectively, to simply printing of circuit 22 a over such sidewall surfaces.
  • First recess 52 is separated from second recess 54 by one of the sidewall surfaces 62 .
  • the separating sidewall 62 extends non-perpendicularly from both of bottom surface 56 and bottom surface 60 .
  • Interconnects 23 a and 24 a extend over the separating sidewall surface 62 and along bottom surfaces 60 and 56 . Interconnects 23 a and 24 a thus extend continuously from electrical component 36 a to electrical component 38 a.
  • Substrate 10 a comprises a front surface 12 a and an opposing back surface 11 a.
  • first recess 52 and second recess 54 both extend through the same of either front surface 12 a or back surface 11 a.
  • recesses 52 and 54 are illustrated as both extending through front surface 12 a.
  • Subsequent processing of substrate 10 a can be performed in accordance with the processing of either FIG. 6 or FIG. 7 to cover first and second electrical components 36 a and 38 a, and electrical circuit 22 a, with at least one protective cover.
  • FIGS. 10 and 11 A third embodiment method of the present invention is described with reference to FIGS. 10 and 11 .
  • numbering similar to that utilized above in describing FIGS. 1-7 will be used, with differences indicated by the suffix “b” or by different numerals.
  • a substrate 10 b comprises a substrate body 13 b, a front surface 12 b, and an opposing back surface 11 b.
  • a recess 14 b is provided through front surface 12 b and into substrate 10 b.
  • Electrical components 36 b and 38 b are within recess 14 b and connected by interconnects 23 b and 24 b.
  • a loop antenna 26 b is electrically connected with component 38 b. Loop antenna 26 b extends from component 38 b, out of recess 14 b, and along surface 12 b of substrate 10 b.
  • Antenna 26 b crosses over itself at a bypass 70 .
  • Antenna 26 b comprises a first portion 66 and a second portion 68 at bypass 70 , with second portion 68 crossing over first portion 66 .
  • Bypass 70 comprises an insulative material 72 separating first portion 66 from second portion 68 .
  • Insulative material 72 can comprise, for example, silicon dioxide.
  • Methods for forming antenna 26 b will be recognized by persons of ordinary skill in the art. Such methods could include, for example, printing methods similar to those discussed above in discussing FIGS. 1-3 , with the exception that two printing steps would be utilized in forming antenna 26 b. More particularly, a first printing step would be utilized to form the portion of antenna 26 b underlying insulative material 72 , and a second printing step would be utilized to form the portion of antenna 26 b overlying material 72 . Insulative material 72 would be formed between the two printing steps. Insulative material 72 can be formed by conventional methods.
  • FIGS. 10 and 11 are illustrated with only two loops and only one bypass 70 , persons of ordinary skill in the art will recognize that alternate embodiments could be formed comprising more than two loops and a plurality of bypasses 70 .
  • the utilization of one or more bypasses 70 can advantageously permit relatively long loop antennas to be formed on a card substrate.
  • antenna second portion 68 is illustrated as being substantially perpendicular to antenna first portion 66 at bypass 70 , the invention encompasses other embodiments (not shown) in which an antenna second portion is non-perpendicular to an antenna first portion at a bypass of the antenna portions.
  • Such embedded circuits can comprise, for example, circuitry 22 , 22 a or 22 b, and one or more of components 36 , 36 a, 36 b, 38 , 38 a and 38 b.
  • FIGS. 1-11 illustrate formation of a single card
  • the invention encompasses methods in which a plurality of cards are formed.
  • Such plurality of cards may be formed by forming a number of recesses within a single sheet, and then dividing the sheet into singulated cards.
  • the division into singulated cards may occur before or after any of the steps illustrated in FIGS. 1-11 .
  • the division into singulated cards may occur after printing of conductive circuitry (shown in FIG. 2 ), and prior to provision of components 36 and 38 within a recess.
  • the division of a large sheet into singulated sheets can be performed by a number of methods known to persons of ordinary skill in the art, including, for example, sawing or cutting mechanically or by a laser.
  • FIGS. 12 and 13 The formation of a number of individual cards from a single sheet substrate is illustrated in FIGS. 12 and 13 .
  • a sheet substrate 50 comprises a plurality of recesses 14 c.
  • the sheet substrate 50 (shown in FIG. 12 ) is divided into a number of singular card substrates 10 c.
  • the individual card substrates 10 c comprise at least one recess 14 c.
  • the invention encompasses methods in which not all of the individual substrates 10 c comprise equal numbers of recesses 14 c, and encompasses embodiments in which some of the individual substrates comprise no recess 14 c. However, generally at least two of the formed substrates 10 c will comprise at least one recess 14 c.

Abstract

The invention includes methods for forming integrated circuits within substrates, and embedded circuits. In one aspect, the invention includes a method of forming an integrated circuit within a substrate comprising: a) providing a recess in a substrate; b) printing an antenna within the recess; and c) providing an integrated circuit chip and a battery in electrical connection with the antenna. In another aspect, the invention includes a method of forming an integrated circuit within a substrate comprising: a) providing a substrate having a first recess and a second recess formed therein; b) printing a conductive film between the first and second recesses and within the first and second recesses, the conductive film forming electrical interconnects between and within the first and second recesses; c) providing a first electrical component within the first recess and in electrical connection with the electrical interconnets therein; d) providing a second electrical component within the second recess and in electrical connection with the electrical interconnects therein; and e) covering the first electrical component, the second electrical component and the conductive film with at least one protective cover. In another aspect, the invention includes an embedded circuit comprising: a) a substrate having a recess therein, the recess having a bottom surface and a sidewall surface joined to the bottom surface; b) interconnect circuitry formed on the bottom and sidewall surfaces; and c) an integrated circuit chip within the recess and operatively connected to the interconnect circuitry.
Method of forming a radio frequency identification (RFID) device. In one embodiment, a recess is provided in a plastic substrate containing an integrated circuit comprising RFID circuitry. A conductive material extends over a sidewall of the recess and is coupled to the integrated circuit in a first region and to an antenna in a second region. A flexible film may be disposed over the recess, the integrated circuit, and the conductive material.

Description

More than one reissue application has been filed for the reissue of U.S. Pat. No. 6,329,213 B1. The reissue applications are application Ser. Nos. 10/734,072 (the present application), 11/302,543, and 11/496,088, all of which are continuation reissues of U.S. Pat. No. 6,329,213 B1.
TECHNICAL FIELD
The invention pertains to methods of forming integrated circuits within substrates, and to embedded circuits. The invention is thought to have particular application towards methods of forming integrated circuits within personal cards, such as personal identification cards and credit cards.
BACKGROUND OF THE INVENTION
Smart cards typically include an integrated circuit providing both memory and processing functions, have words or pictures printed on them, and control who uses information stored in the integrated circuit and how the information is used.
Some smart cards have length and width dimensions corresponding to those of credit cards. The size of such smart cards is determined by an international standard (ISO 7816). ISO 7816 also defines the physical characteristics of the plastic, including temperature tolerance and flexibility. ISO 7816 also defines the position of electrical contacts and their functions, and the protocol for communications between the integrated circuit and readers (vending machines, pay phones, etc.) The term “smart card”, as used herein, is meant to include cards that include microprocessors. Such cards might not conform to ISO 7816.
Several types of plastic are used for the casings or housings of smart cards. PVC and ABS are typical. PVC can be embossed, but is not recyclable. ABS is not readily embossed, but is recyclable.
Smart cards have many different applications. For example, smart cards can be pre-paid cards used instead of money for making purchases from vending machines, gaming machines, gas stations, car washes, photocopiers, laundry machines, cinemas, fast-food restaurants, retail outlets, or anywhere where cash is used. For example, they are commonly used in Europe with public telephones. A timer is used to detect a balance from the card automatically while a conversation continues. Smart cards can be used as food stamps, or for redeeming other government-provided benefits. Because the transaction is electronic, the telephone, vending machine, etc. does not need to store cash, so risk of loss due to theft can be reduced. Change does not need to be stored and disbursed, and received payment can be directly wired to a bank. Pre-paid cards can be a form of advertising, because they can have logos or other information printed on them. The user would typically carry the card for weeks before using up the value on the card.
To authenticate a conventional credit card, a telephone call must be made to verify that sufficient funds are available. Smart cards permit such verification to be performed off-line, thus saving telecommunication charges. Smart cards thus provide an advantage over conventional credit cards. Smart cards can also be used as keys to gain access to restricted areas, such as secure areas of buildings, or to access parking lots.
Radio frequency identification devices (RFIDs) can also be considered smart cards if they include an integrated circuit. RFIDs are described in detail in U.S. patent application Ser. No. 08/705,043, filed Aug. 29, 1996, and incorporated herein by reference. RFIDs comprising integrated circuits may be referred to as intelligent RFIDs or as remote intelligent communication (RIC) devices.
Smart cards will typically contain an integrated circuit, typically provided as a packaged integrated circuit chip (IC chip). The smart card may also comprise electrical interconnects for connecting the IC chip to terminals. In other instances, the electronic interconnects will comprise an antenna, such as, for example, when the integrated circuit comprises radio frequency identification device circuitry. In other instances, an antenna, battery and IC may be inserted into smart cards. As smart cards are intended to be conveniently carried by persons, it is desirable to produce smart cards which are relatively thin, preferably having a size and shape similar to credit cards. This enables the cards to be carried on a person, such as, for example, in a persons's wallet.
SUMMARY OF THE INVENTION
The invention encompasses methods for forming integrated circuits within substrates, and embedded circuits.
In one aspect, the invention encompasses a method of forming an integrated circuit within a substrate. A recess is formed in the substrate, and an antenna is printed within the recess. An integrated circuit chip and a battery are provided in operative electrical connection with the antenna.
In another aspect, the invention encompasses a method of forming a plurality of cards. A substrate sheet is provided and a plurality of recesses are formed within the substrate sheet. The individual recesses have bottom surfaces and sidewall surfaces joined to the bottom surfaces. A conductive film is printed within the recesses to form electrical interconnects within the recesses. The electrical interconnects extend along the bottom surfaces and the sidewall surfaces of the recesses, and also on top surfaces of the substrate sheet. Integrated circuit chips are placed within the recesses and in electrical connection with the electrical interconnects. The integrated circuit chips and the conductive film within the recesses are covered with a protective cover. The substrate sheet is divided into a plurality of cards.
In another aspect, the invention encompasses an embedded circuit. The embedded circuit includes a substrate having a recess therein; a conductive circuit printed within the recess and an integrated circuit chip bonded to the conductive circuit.
In another aspect, the invention encompasses an embedded circuit. The embedded circuit includes a substrate having a recess therein; a conductive circuit provided within the recess; an integrated circuit chip bonded to the conductive circuit; and a battery in electrical connection with the integrated circuit chip.
In accordance with another embodiment, a recess is provided in a plastic substrate containing an integrated circuit comprising RFID circuitry. A conductive material extends over a sidewall of the recess and is coupled to the integrated circuit in a first region and to an antenna in a second region. A flexible film may be disposed over the recess, the integrated circuit, and the conductive material.
BRIEF DESCRIPTION OF THE DRAWINGS
Preferred embodiments of the invention are described below with reference to the following accompanying drawings.
FIG. 1 is a schematic perspective view of a card and a printing pad at a preliminary step of a first embodiment method of the present invention.
FIG. 2 is a schematic perspective view of the FIG. 1 card and printing pad shown at a processing step subsequent to that of FIG. 1.
FIG. 3 is a perspective view of the FIG. 1 card shown at a processing step subsequent to that of FIG. 2.
FIG. 4 is a perspective view of the FIG. 1 card shown at a processing step subsequent to that of FIG. 3.
FIG. 5 is a cross-sectional view of the FIG. 4 card taken along line 55 in FIG. 4.
FIG. 6 is a cross-sectional view of the FIG. 1 card taken along line 55 in FIG. 4, and shown at a processing step subsequent to that of FIG. 5.
FIG. 7 is a cross-sectional view of the FIG. 1 card taken alone line 55 in FIG. 4, and shown at a processing step subsequent to that of FIG. 5.
FIG. 8 is a perspective view of a card being produced according to a second embodiment method of the present invention.
FIG. 9 is a cross-sectional view of the FIG. 8 card taken along the line 99 in FIG. 8.
FIG. 10 is a perspective view of a card being produced according to a third embodiment method of the present invention.
FIG. 11 is a cross-sectional view of the FIG. 10 card taken along the line 1111 in FIG. 10.
FIG. 12 is an elevational view of a substrate sheet processed according to a method of the present invention.
FIG. 13 is an elevational view of the sheet of FIG. 12 at a processing step shown subsequent to that of FIG. 12.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
This disclosure of the invention is submitted in furtherance of the constitutional purposes of the U.S. Patent Laws “to promote the progress of science and useful arts” (Article 1, Section 8).
A first embodiment method of the present invention is described with reference to FIGS. 1-7. Referring to FIG. 1, a substrate 10 is shown at a preliminary step of the first embodiment method. Substrate 10 is preferably a card substrate in the approximate shape of a credit card. Substrate 10 can comprise any of a number of materials known to persons of ordinary skill in the art, such as for example, PVC or ABS plastic. As will become apparent from the following discussion, substrate 10 might ultimately be used for a radio frequency card, smart card, or other card built with multiple, interconnected composites, including an integrated circuit. Accordingly, substrate 10 preferably comprises a configuration suitable for one or more of the above-discussed ultimate uses.
Substrate 10 comprises a substrate body 13, a front surface 12, and an opposing back surface 11 (shown in FIG. 5). A recess 14 is provided through front surface 12 and into substrate 10. Recess 14 can be formed by conventional methods. Examples include cutting with a blade, grinding wheel or laser. Another example method for forming recess 14 is to form the recess in situ at a time of card creation by injection molding the card in a shape comprising recess 14. Recess 14 has a bottom surface 16 and sidewall surfaces 18 joined to bottom surface 16. As most clearly shown in FIGS. 5-7, sidewall surfaces 18 preferably extend non-perpendicularly from bottom surface 16. Such non-perpendicular orientation of sidewall surfaces 18 relative to bottom surface 16 can simplify a below-discussed printing of a circuit 22 (shown in FIG. 3) over such sidewall surfaces. It is noted, however, that the present invention also encompasses applications in which sidewall surfaces 18 extend perpendicularly from bottom surface 16.
Still referring to FIG. 1, a printing pad 20 is elevated above substrate 10. Printing pad 20 preferably comprises a deformable material, such as for example, foam, sponge, or silicone rubber. A circuit pattern 21 is formed on printing pad 20, and comprises, for example, a conductive film. Circuit pattern 21 can be formed by, for example, pressing pad 20 onto a plate having a shape corresponding to circuit pattern 21 etched within it.
Referring to FIG. 2, printing pad 20 is pressed against substrate 10 to transfer circuit pattern 21 to substrate 10 and thereby print a circuit 22 (shown in FIG. 3) upon substrate 10 and within recess 14. In the shown embodiment, printing pad 20 is configured to print the circuit pattern on bottom surface 16, on two of sidewall surfaces 18, and on upper surf ace 12. In alternate embodiments which are not shown, printing pad 20 can be configured to print on less than all of surfaces 16, 18 and 20. For instance, in such alternate embodiments, printing pad 20 may be configured to print only on bottom surface 16, or only on bottom surface 16 and one of the sidewall surfaces 18. Suitable materials which may be pad printed to form circuit 22 are conductive films, such as, for example, printed thick film (PTFs) comprising silver-filled organic material. It is noted that, although pad printing is shown, the printing can comprise other printing methods known to persons of ordinary skill in the art, including, for example, stencil printing, screen printing spray printing, needle dispense printing etc. After conductive circuit 22 is printed, the circuit can be cured by conventional methods.
After curing, circuit 22 will have a thickness and associated degree of conductivity. If the conductive is lower than desired as may occur if, for example, conductive material of circuit 22 is too thin, or not adequately a low resistance material, the conductivity can be enhanced by providing an electroless plated metal, such as copper or nickel, against substrate 10 and circuit 22. The electroless plated metal selectively plates conductive circuit 22, while not plating non-conductive surfaces of substrate 10. The electroless plating of metal can be accomplished by conventional methods.
Referring to FIG. 3, circuit 22 preferably comprises conductive interconnects 23 and 24, and an antenna 26. Interconnect 23 comprises nodes 25 and 27, interconnect 24 comprises nodes 28 and 30, and antenna 26 comprises nodes 32 and 33. Nodes 25, 27, 28, 30, 32 and 33 are illustrated as being wider than the rest of interconnects 23 and 24, and antenna 26. However, as will be appreciated by persons of ordinary skill in the art, nodes 25, 27, 28, 30, 32 and 33 could also be a same size as the rest of interconnects 23, 24 and antenna 26; or narrower than the rest of interconnects 23, 24 and antenna 26. Note 27 preferably comprises the shown arcuate shape complementary to an outer surface of a battery 36 (shown in FIG. 4), which is to be joined to node 27. In the shown preferred embodiment, antenna 26 is a loop antenna comprising a predominant portion outside of recess 14 and on substrate surface 12. In other embodiments (not shown), antenna 26 could be entirely within recess 14, or comprise a predominate portion within recess 14.
In the preferred embodiment, antenna 26 constitutes a part of, and is formed at the same time as, the other integrated circuitry. It is noted that antenna 26 could be formed in two steps, with a portion of antenna 26 being formed before or after pad printing of circuit 22. For instance, the portion of antenna 26 extending along upper surface 12 could be formed prior to printing circuit 22. Then, a portion of antenna 26 could be printed as part of circuit 22 to create nodes 32 and 33, and to connect the previously formed portion of antenna 26 with nodes 32 and 33. In such circumstances, the portion of antenna 26 which is not formed as part of circuit 22 could be formed by methods other than those utilized to form circuit 22. For instance, if circuit 22 is pad printed, the portion of antenna 26 not formed as part of circuit 22 could be formed by a method other than pad printing. Such other methods will be recognized by persons of ordinary skill in the art.
Referring to FIG. 4, electrical components 36 and 38 are bonded to one or more of nodes 25, 27, 28, 30, 32 and 33 (shown in FIG. 3). By way of example only, electrical component 36 comprises a battery and component 38 comprises a monolithic integrated circuit formed on a chip. Components 36 and 38 may be bonded to nodes 25, 27, 28, 30, 32 and 33 (shown in FIG. 3), utilizing a conductive adhesive 35 which is cured after provision of components 36 and 38. An example conductive adhesive 35 is a conductive epoxy. Battery 36 could alternatively be provided directly bonded to integrated circuit chip 38. In such circumstances, the bonding of battery 36 to integrated circuit 38 can occur either before or after placing integrated circuit 38 and battery 36 within recess 14. Also, as will be recognized by persons of ordinary skill in the art, at least one of the electrical components 36 or 38 could be provided externally of recess 14.
In the illustrated embodiment, interconnects 23 and 24 connect battery 36 to integrated circuit 38, and antenna 26 connects with integrated circuit 38. Battery 36, interconnects 23 and 24, integrated circuit 38 and antenna 26 together form a radio frequency identification device (RFID).
After provision of circuit 22 and one or both of components 36 and 38 within recess 14, a protective cover is ideally formed over circuit 22 and recess 14. FIGS. 6 and 7 illustrate two methods of protectively covering circuit 22 and the components within recess 14. Referring first to FIG. 6, a cap 40 can be adhered over substrate 10 and over recess 14. Cap 40 may be adhered, for example, by adhesive, such as glue, or by mechanical fasteners, such as staples or screws. Example materials for cap 40 include plastic metal, and flexible or rigid adhesive tape. In the shown embodiment, portions of loop antenna 26 are between cap 40 and substrate body 13. Such portions of loop antenna 26 are generally thin enough that they do not interfere with bonding of cap 40 to substrate body 13. To further minimize interference of such portions of loops antenna 26 with bonding of cap 40 to substrate body 13, cap 40 can be formed of a material which conforms over and around loop antenna 26, such as, for example, a deformable material. Also, in embodiments which are not shown, antenna 26 can be formed entirely within recess 14 to minimize interference of antenna 26 with bonding of cap 40 to substrate body 13.
Referring to FIG. 7, circuitry 22 and components 36 and 38 can be covered with an encapsulant 42. Such encapsulant may comprise, for example, a low temperature curing insulating material, such as, for example, a two-part epoxy or urethane. Encapsulant 42 will preferably be provided initially as a liquid material and to overfill recess 14 and overlay antenna 26. Encapsulant 42 can then be cured into a solid mass, and either milled or sanded to form the shown preferred substantially planar upper surface 44.
It is noted that the methods of FIGS. 6 and 7 are merely example methods for covering circuitry proximate and within recess 14. The invention encompasses other methods for covering such circuitry which will be recognized by persons of ordinary skill in the art. The methods of FIGS. 6 and 7 could also be combined. For instance, a recess could be partially filled with an encapsulant and then covered. Such combined methods may have particular application toward sealing cards containing multiple recesses which are discussed below. In such cases, an integrated circuit could be within one recess and a battery within another. The integrated circuit could be covered with encapsulant and/or a cap, and the battery covered only with a removable cap. In such applications the integrated circuit would be well-protected and the battery could be easily replaceable.
After provision of a protective cover over recess 14, the construction of a card is substantially finished. The card may then be covered with a laminating film for cosmetic, printability, or logo reasons. An example laminating film would be a thin (less than about one mil) PVC sheet bonded to substrate 10 with an adhesive.
A second embodiment method of the present invention is described with reference to FIGS. 8 and 9. In describing FIGS. 8 and 9, numbering similar to that utilized above in describing FIGS. 1-7 will be used, with differences indicated by the suffix “a” or by different numerals.
Referring to FIGS. 8 and 9, a substrate 10a is illustrated. Substrate 10a comprises a first recess 52 and a second recess 54. In the illustrated and preferred embodiments, first recess 52 is formed in the substrate and second recess 54 is formed within first recess 52 and essentially constitutes a part thereof. A conductive circuit 22a is formed within recesses 52 and 54 and comprises interconnects 23a and 24, and antenna 26a. Antenna 26a is a loop antenna which extends beyond recesses 52 and 54. Interconnects 23a and 24a connect electrical components 36a and 38a. Interconnects 23a and 24a, and antenna 26a, are preferably formed by printing a conductive film within first and second recesses 52 and 54, utilizing procedures analogous to those discussed above with reference to FIGS. 1-3.
In the illustrated embodiment, components 36a and 38a are each within a recess, with component 36a being within first recess 52 and component 38a being within second recess 54. First recess 52 comprises a bottom surface 56 and sidewall surfaces 58. Second recess 54 comprises a bottom surface 60 and sidewall surfaces 62. Sidewall surfaces 58 and 62 can extend non-perpendicularly form bottom surfaces 56 and 60, respectively, to simply printing of circuit 22a over such sidewall surfaces. First recess 52 is separated from second recess 54 by one of the sidewall surfaces 62. The separating sidewall 62 extends non-perpendicularly from both of bottom surface 56 and bottom surface 60. Interconnects 23a and 24a extend over the separating sidewall surface 62 and along bottom surfaces 60 and 56. Interconnects 23a and 24a thus extend continuously from electrical component 36a to electrical component 38a.
Substrate 10a comprises a front surface 12a and an opposing back surface 11a. Preferably, first recess 52 and second recess 54 both extend through the same of either front surface 12a or back surface 11a. In FIGS. 8 and 9, recesses 52 and 54 are illustrated as both extending through front surface 12a.
Subsequent processing of substrate 10a can be performed in accordance with the processing of either FIG. 6 or FIG. 7 to cover first and second electrical components 36a and 38a, and electrical circuit 22a, with at least one protective cover.
A third embodiment method of the present invention is described with reference to FIGS. 10 and 11. In describing FIGS. 10 and 11, numbering similar to that utilized above in describing FIGS. 1-7 will be used, with differences indicated by the suffix “b” or by different numerals.
A substrate 10b comprises a substrate body 13b, a front surface 12b, and an opposing back surface 11b. A recess 14b is provided through front surface 12b and into substrate 10b. Electrical components 36b and 38b are within recess 14b and connected by interconnects 23b and 24b. A loop antenna 26b is electrically connected with component 38b. Loop antenna 26b extends from component 38b, out of recess 14b, and along surface 12b of substrate 10b. Antenna 26b crosses over itself at a bypass 70. Antenna 26b comprises a first portion 66 and a second portion 68 at bypass 70, with second portion 68 crossing over first portion 66. Bypass 70 comprises an insulative material 72 separating first portion 66 from second portion 68. Insulative material 72 can comprise, for example, silicon dioxide.
Methods for forming antenna 26b will be recognized by persons of ordinary skill in the art. Such methods could include, for example, printing methods similar to those discussed above in discussing FIGS. 1-3, with the exception that two printing steps would be utilized in forming antenna 26b. More particularly, a first printing step would be utilized to form the portion of antenna 26b underlying insulative material 72, and a second printing step would be utilized to form the portion of antenna 26 b overlying material 72. Insulative material 72 would be formed between the two printing steps. Insulative material 72 can be formed by conventional methods.
Although the embodiment of FIGS. 10 and 11 is illustrated with only two loops and only one bypass 70, persons of ordinary skill in the art will recognize that alternate embodiments could be formed comprising more than two loops and a plurality of bypasses 70. The utilization of one or more bypasses 70 can advantageously permit relatively long loop antennas to be formed on a card substrate.
It is noted that although antenna second portion 68 is illustrated as being substantially perpendicular to antenna first portion 66 at bypass 70, the invention encompasses other embodiments (not shown) in which an antenna second portion is non-perpendicular to an antenna first portion at a bypass of the antenna portions.
The processing described above with reference to FIGS. 1-11 forms embedded circuits within substrates. Such embedded circuits can comprise, for example, circuitry 22, 22a or 22b, and one or more of components 36,36a,36b,38, 38a and 38b.
Although FIGS. 1-11 illustrate formation of a single card, the invention encompasses methods in which a plurality of cards are formed. Such plurality of cards may be formed by forming a number of recesses within a single sheet, and then dividing the sheet into singulated cards. The division into singulated cards may occur before or after any of the steps illustrated in FIGS. 1-11. For example, the division into singulated cards may occur after printing of conductive circuitry (shown in FIG. 2), and prior to provision of components 36 and 38 within a recess. The division of a large sheet into singulated sheets can be performed by a number of methods known to persons of ordinary skill in the art, including, for example, sawing or cutting mechanically or by a laser.
The formation of a number of individual cards from a single sheet substrate is illustrated in FIGS. 12 and 13. In referring to FIGS. 12 and 13, similar numbering to that utilized above in describing FIGS. 1-7 is utilized, with differences being indicated by the suffix “c” or with different numerals. Referring to FIG. 12, a sheet substrate 50 comprises a plurality of recesses 14c. Referring to FIG. 13, the sheet substrate 50 (shown in FIG. 12) is divided into a number of singular card substrates 10c. The individual card substrates 10c comprise at least one recess 14c. It is noted that the invention encompasses methods in which not all of the individual substrates 10c comprise equal numbers of recesses 14c, and encompasses embodiments in which some of the individual substrates comprise no recess 14c. However, generally at least two of the formed substrates 10c will comprise at least one recess 14c.
In compliance with the statue, the invention has been described in language more or less specific as to structural and methodical features. It is to be understood, however, that the invention is not limited to the specific features shown and described, since the means herein disclosed comprise preferred forms of putting the invention into effect. The invention is, therefore, claimed in any of its forms or modifications within the proper scope of the appended claims appropriately interpreted in accordance with the doctrine of equivalents.

Claims (58)

1. A method of forming a radio frequency communication device comprising:
providing a recess within a substrate;
providing at least a portion of an antenna within the recess;
providing an integrated circuit at least partially within the recess and in operative electrical connection with the antenna; and
wherein the antenna is a loop antenna which crosses itself at a bypass, said bypass comprising dielectric material between crossing portions of the loop antenna.
2. A method of forming an integrated circuit within a substrate comprising:
providing a recess in a substrate;
providing substantially an entirety of an antenna within the recess; and
providing an integrated circuit chip and a battery supported by the substrate and in operative electrical connection with the antenna.
3. A method of forming an integrated circuit within a substrate comprising:
providing a recess in a substrate;
providing at least a portion of an antenna within the recess;
providing an integrated circuit chip and a battery supported by the substrate and in operative electrical connection with the antenna; and
wherein the antenna is provided within the recess and on a portion of the substrate outside of the recess.
4. The method of claim 3 wherein the antenna comprises a predominate portion within the recess.
5. The method of claim 3 wherein the antenna comprises a predominate portion outside of the recess.
6. A method of forming an integrated circuit within a substrate comprising:
providing a recess in a substrate;
providing at least a portion of an antenna within the recess;
providing an integrated circuit chip and a battery supported by the substrate and in operative electrical connection with the antenna; and
wherein the antenna is a loop antenna which crosses itself at a bypass, said bypass comprising dielectric material between crossing portions of the loop antenna.
7. The method of claim 3 wherein at least one of the battery and the integrated circuit chip are provided at least partially within the recess.
8. The method of claim 3 wherein the battery is bonded to the substrate within the recess.
9. The method of claim 3 wherein the step of providing the antenna comprises printing a conductive film.
10. The method of claim 3 wherein the step of providing the antenna comprises pad printing a conductive film.
11. A method of forming an integrated circuit within a substrate comprising:
providing a recess in a substrate;
providing at least a portion of a loop antenna within the recess, the loop antenna comprising a bypass where portions of the antenna cross one another, the bypass comprising a dielectric material between the crossing portions of the antenna; and
providing an integrated circuit chip in operative electrical connection with the antenna.
12. The method of claim 11 wherein the portions of the antenna which cross one another are substantially perpendicular to one another.
13. A method of forming an integrated circuit within a substrate comprising:
providing a recess in a substrate;
pad printing a conductive material within the recess to form at least a portion of a conductive circuit within the recess and to form at least a portion of an antenna within the recess;
placing an integrated circuit chip within the recess and bonding the integrated circuit chip to the conductive circuit and the antenna; and
placing a battery within the recess and in electrical connection with the integrated circuit chip.
14. The method of claim 13 wherein the substrate is a card configured for carrying on a person.
15. The method of claim 13 further comprising, after the printing, providing an electroless metal within the recess to selectively plate the conductive circuit.
16. The method of claim 13 further comprising, after bonding the chip to the conductive circuit, filling the recess with a liquid encapsulation material and curing the encapsulation material into a solid mass.
17. The method of claim 13 further comprising, after bonding the chip to the conductive circuit, covering the recess with a protective cover.
18. A method of forming an integrated circuit within a substrate comprising:
providing a substrate having a recess formed therein, said recess having a bottom surface and a sidewall surface joined to the bottom surface;
pad printing a conductive film within the recess to form electrical interconnects within the recess and to form at least a portion of an antenna, the electrical interconnects extending along the bottom surface and the sidewall surface of the recess;
placing an integrated circuit chip within the recess and in electrical connection with the electrical interconnects;
covering the integrated circuit and the conductive film within the recess with a protective cover; and
wherein the integrated circuit comprises radio frequency identification device circuitry, and further comprising placing a battery within the recess and in electrical connection with the radio frequency identification device circuitry through the electrical interconnects.
19. A method of forming a device comprising:
providing a recess within a substrate;
providing at least a portion of an antenna within the recess;
providing an integrated circuit at least partially within the recess and in operative electrical connection with the antenna;
wherein the antenna crosses itself at a bypass, said bypass comprising dielectric material between crossing portions of the antenna; and
wherein the antenna includes a connection between the integrated circuit and a first antenna portion, the first antenna portion extending from at least partially within the recess to outside the recess, a second connection between the integrated circuit and a second antenna portion, the second antenna portion extending from at least partially within the recess to outside the recess, and a third antenna portion outside of the recess and coupled to the first and second antenna portions.
20. A method comprising:
forming a recess in a plastic substrate, the recess having an approximately planar bottom surface and four sidewall surfaces that slope outward from the bottom surface toward an upper surface of the substrate; and subsequently performing the steps of:
providing a monolithic integrated circuit chip within the recess, the chip comprising RFID circuitry coupled to first and second antenna ports to provide memory and processing functions, the first and second antenna ports configured to be electrically coupled together via an antenna and, subsequent to the forming of the recess:
providing a first conductive layer coupled to the first antenna port of the chip and extending over at least a portion of a first of the sidewall surfaces; and
providing a second conductive layer coupled to the second antenna port of the chip and extending over at least a portion of a second of the sidewall surfaces.
21. The method of claim 20, wherein providing the first and second conductive layers comprises printing.
22. The method of claim 20, further comprising forming a conductive adhesive between the first conductive layer and the first antenna port and forming a conductive adhesive between the second conductive layer and the second antenna port.
23. The method of claim 20, further comprising:
providing at least a portion of an antenna over the upper surface of the substrate and coupling the antenna to the first and second conductive layers; and
providing a flexible plastic film over the recess, the chip, and the antenna, the flexible plastic film being bonded to the portion of the antenna.
24. The method of claim 20, further comprising:
providing at least a portion of an antenna formed using a first process over the upper surface of the substrate;
coupling the antenna to the first and second conductive layers, the first and second conductive layers having been formed using a second process; and
providing a flexible plastic film over the recess, the chip, and the antenna.
25. A method comprising:
providing a plastic substrate comprising a plurality of recesses, each of the recesses having a bottom surface and four sidewall surfaces that extend non-perpendicularly from the bottom surface toward an upper surface of the substrate; and subsequently performing the steps of:
disposing a plurality of integrated circuits within the plurality of recesses such that each of the recesses contains an integrated circuit, each of the integrated circuits comprising RFID circuitry coupled to first and second antenna ports to provide memory and processing functions, the first and second antenna ports configured to be electrically coupled together via an antenna; and
providing a plurality of continuous conductive films, each of the continuous conductive films having a first portion and a second portion, the first portion being coupled to respective ones of the integrated circuits disposed within the recesses and the second portions extending above the upper surface of the substrate.
26. The method of claim 25, wherein the substrate comprises a plurality of rows of recesses and a plurality of columns of recesses.
27. The method of claim 25, further comprising covering the plurality of integrated circuits and the plurality of continuous conductive films with an insulting material initially provided as a liquid material that is subsequently cured into a non-liquid material, and wherein each of the continuous conductive films is disposed over at least one respective sidewall surface between the first and second portions.
28. The method of claim 25, wherein the continuous conductive films comprise printed films.
29. The method of claim 25, wherein the first portion of each of the continuous conductive films is coupled to respective ones of the integrated circuits using a conductive adhesive.
30. A method comprising:
forming a recess in a plastic substrate, the recess having a bottom surface and four sidewall surfaces that extend non-perpendicularly from the bottom surface toward an upper surface of the substrate; and subsequently performing the steps of:
providing an antenna portion disposed outside of the recess;
disposing an integrated circuit within the recess, the integrated circuit comprising RFID circuitry coupled to first and second antenna ports to provide memory and processing functions;
disposing a conductive material layer over at least one of the four sidewall surfaces to couple the integrated circuit to the antenna portion outside the recess, wherein the antenna portion is configured to electrically couple the first antenna port to the second antenna port; and
providing a flexible film over the recess, the integrated circuit, and the conductive material layer.
31. The method of claim 30, wherein depositing the conductive material layer comprises printing a film.
32. The method of claim 30, further comprising coupling the integrated circuit to the conductive material layer using a conductive adhesive.
33. The method of claim 32, wherein the conductive material layer is disposed over the bottom surface at a first end and over the upper surface at a second end.
34. The method of claim 33, further comprising covering the conductive material layer with an insulating material and bonding the flexible film directly on at least a portion of the insulating material.
35. The method of claim 34, wherein the antenna comprises a material layer that is different from the conductive material layer.
36. The method of claim 30, further comprising covering the conductive material layer with an insulating material and bonding the flexible film over the insulating material.
37. The method of claim 36, wherein covering the conductive material layer with the insulating material comprises forming the insulting material directly on the conductive material layer and over the upper surface of the substrate.
38. The method of claim 37, wherein covering the conductive material layer with the insulating material includes depositing a liquid material and curing the liquid material to form the insulting material.
39. The method of claim 38, wherein depositing the conductive material layer comprises printing a film.
40. The method of claim 39, wherein the film is less than about one mil in thickness.
41. A method comprising:
providing a plastic substrate comprising a recess, the recess having a bottom surface and sidewall surfaces that extend non-perpendicularly from the bottom surface toward an upper surface of the substrate, each of the sidewall surfaces sloping outward from the bottom surface toward the upper surface;
providing an antenna, at least a portion of which is a first conductive film disposed above the upper surface;
providing an integrated circuit within the recess, the integrated circuit comprising RFID circuitry coupled to first and second antenna ports to provide memory and processing functions;
providing a second conductive film, separate from the first conductive film, having a first region coupled to the integrated circuit and a second region coupled to the portion of the antenna; and
disposing a flexible film above the recess, the antenna, the integrated circuit, and the second conductive film, and electrically coupling the first and second antenna ports together via the antenna.
42. The method of claim 41, wherein the second conductive film comprises a printed film.
43. The method of claim 41, wherein the first region of the second conductive film is disposed above the bottom surface.
44. The method of claim 41, wherein the second conductive film is disposed above at least one of the sidewall surfaces between the first and second regions.
45. The method of claim 41, further comprising bonding a conductive adhesive to the integrated circuit and to the first region of the first conductive film.
46. The method of claim 41, further comprising covering the second conductive film with an insulating material and disposing the flexible film over the insulating material.
47. The method of claim 41, wherein at least one of the sidewall surfaces slopes in at least a generally linear manner from the bottom surface.
48. The method of claim 47, further comprising covering the second conductive film with an insulating material and disposing the flexible film over the insulating material.
49. A method comprising:
providing a plastic substrate comprising a plurality of recesses, each of the recesses having a bottom surface and four sidewall surfaces that extend non-perpendicularly from the bottom surface toward an upper surface of the substrate; and subsequently performing the steps of:
disposing a plurality of integrated circuits within the plurality of recesses such that each of the recesses contains no more than a single respective integrated circuit, each respective integrated circuit comprising respective RFID circuitry to provide memory and processing functions, the respective RFID circuitry coupled to respective first and second antenna ports configured to be coupled together via a respective antenna; and
forming a plurality of continuous conductive films, each of the continuous conductive films having a first portion and a second portion, the first portion being coupled to respective ones of the integrated circuits disposed within the recesses and the second portion extending above the upper surface of the substrate.
50. The method of claim 49, wherein the substrate comprises a plurality of rows of recesses and a plurality of columns of recesses, and further comprising dividing the substrate into a plurality of singular substrates after forming the plurality of conductive films, each of the singular substrates comprising a single recess.
51. The method of claim 50, wherein each of the continuous conductive films is disposed above at least one respective sidewall surface between the first and second portions, and each of the singular substrates comprises two continuous conductive films.
52. The method of claim 51, wherein forming the plurality of continuous conductive films comprises printing a conductive material.
53. The method or claim 52, wherein the first portion of each of the continuous conductive films is coupled to respective ones of the integrated circuits using a conductive adhesive.
54. A method comprising:
providing a substrate comprising a recess, the recess having a bottom surface and four sidewall surfaces that extend non-perpendicularly from the bottom surface toward an upper surface of the substrate, each of the sidewall surfaces sloping outward from the bottom surface toward the upper surface;
providing an antenna, at least a portion of which is a first conductive material disposed above the upper surface;
providing an integrated circuit within the recess, the integrated circuit comprising RFID circuitry to provide memory and processing functions and coupled to first and second antenna ports of the integrated circuit;
providing a second conductive material, separated from the first conductive material, having a first region coupled to the integrated circuit and disposed above the bottom surface, having a second region coupled to the portion of the antenna and disposed above the upper surface, and having a third region between the first and second regions and disposed above one of the sidewall surfaces; and
disposing a flexible film over the recess, the integrated circuit, the antenna, and the second conductive material, wherein the first and second antenna ports are electrically coupled together via the antenna.
55. The method of claim 54, further comprising bonding a conductive adhesive to the integrated circuit and to the first region of the second conductive material.
56. The method of claim 55, wherein providing the second conductive material comprises printing the second conductive material.
57. The method of claim 56, further comprising the second conductive material with an insulating material and disposing the flexible film over the insulating material.
58. The method of claim 57 wherein at least one of the sidewall surfaces slopes in at least a generally linear manner from the bottom surface.
US10/734,072 1997-05-01 2003-12-10 Methods for forming integrated circuits within substrates Expired - Lifetime USRE40137E1 (en)

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Cited By (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050065884A1 (en) * 2003-09-24 2005-03-24 Eastman Kodak Company Card with embedded bistable display having short and long term information
US20050242964A1 (en) * 1992-08-12 2005-11-03 Tuttle John R Miniature radio frequency transceiver
US20080023793A1 (en) * 2006-07-28 2008-01-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US20080023810A1 (en) * 2006-07-28 2008-01-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US20090109000A1 (en) * 2007-10-26 2009-04-30 Fujitsu Limited Rfid tag and manufacturing method thereof
US20090212919A1 (en) * 2008-02-26 2009-08-27 Avery Dennison Corporation Rfid tag for direct and indirect food contact
US7839285B2 (en) 1997-08-20 2010-11-23 Round Rock Resarch, LLC Electronic communication devices, methods of forming electrical communication devices, and communications methods
US20110057628A1 (en) * 2006-07-28 2011-03-10 Semiconductor Energy Laboratory Co., Ltd. Power storage device
US7959769B2 (en) 2004-12-08 2011-06-14 Infinite Power Solutions, Inc. Deposition of LiCoO2
US7993773B2 (en) 2002-08-09 2011-08-09 Infinite Power Solutions, Inc. Electrochemical apparatus with barrier layer protected substrate
US8021778B2 (en) 2002-08-09 2011-09-20 Infinite Power Solutions, Inc. Electrochemical apparatus with barrier layer protected substrate
US8062708B2 (en) 2006-09-29 2011-11-22 Infinite Power Solutions, Inc. Masking of and material constraint for depositing battery layers on flexible substrates
US8197781B2 (en) 2006-11-07 2012-06-12 Infinite Power Solutions, Inc. Sputtering target of Li3PO4 and method for producing same
US8236443B2 (en) 2002-08-09 2012-08-07 Infinite Power Solutions, Inc. Metal film encapsulation
US8260203B2 (en) 2008-09-12 2012-09-04 Infinite Power Solutions, Inc. Energy device with integral conductive surface for data communication via electromagnetic energy and method thereof
US8268488B2 (en) 2007-12-21 2012-09-18 Infinite Power Solutions, Inc. Thin film electrolyte for thin film batteries
US8350519B2 (en) 2008-04-02 2013-01-08 Infinite Power Solutions, Inc Passive over/under voltage control and protection for energy storage devices associated with energy harvesting
US8394522B2 (en) 2002-08-09 2013-03-12 Infinite Power Solutions, Inc. Robust metal film encapsulation
US8404376B2 (en) 2002-08-09 2013-03-26 Infinite Power Solutions, Inc. Metal film encapsulation
US8431264B2 (en) 2002-08-09 2013-04-30 Infinite Power Solutions, Inc. Hybrid thin-film battery
US8445130B2 (en) 2002-08-09 2013-05-21 Infinite Power Solutions, Inc. Hybrid thin-film battery
US8508193B2 (en) 2008-10-08 2013-08-13 Infinite Power Solutions, Inc. Environmentally-powered wireless sensor module
US8518581B2 (en) 2008-01-11 2013-08-27 Inifinite Power Solutions, Inc. Thin film encapsulation for thin film batteries and other devices
US8599572B2 (en) 2009-09-01 2013-12-03 Infinite Power Solutions, Inc. Printed circuit board with integrated thin film battery
US8636876B2 (en) 2004-12-08 2014-01-28 R. Ernest Demaray Deposition of LiCoO2
US8728285B2 (en) 2003-05-23 2014-05-20 Demaray, Llc Transparent conductive oxides
US8906523B2 (en) 2008-08-11 2014-12-09 Infinite Power Solutions, Inc. Energy device with integral collector surface for electromagnetic energy harvesting and method thereof
US9334557B2 (en) 2007-12-21 2016-05-10 Sapurast Research Llc Method for sputter targets for electrolyte films
US9634296B2 (en) 2002-08-09 2017-04-25 Sapurast Research Llc Thin film battery on an integrated circuit or circuit board and method thereof
US9980724B2 (en) 2008-09-23 2018-05-29 Covidien Lp Surgical instrument and loading unit for use therewith
US10092290B2 (en) 2015-03-17 2018-10-09 Covidien Lp Surgical instrument, loading unit for use therewith and related methods
US10680277B2 (en) 2010-06-07 2020-06-09 Sapurast Research Llc Rechargeable, high-density electrochemical device

Families Citing this family (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6817532B2 (en) * 1992-02-12 2004-11-16 Lenscard U.S., Llc Wallet card with built-in light
FR2779255B1 (en) * 1998-05-27 2001-10-12 Gemplus Card Int METHOD FOR MANUFACTURING A PORTABLE ELECTRONIC DEVICE COMPRISING AT LEAST ONE INTEGRATED CIRCUIT CHIP
JP3180086B2 (en) * 1998-08-31 2001-06-25 株式会社シーメディア Mobile communication device, information transmission system and method, non-contact IC media usable in mobile communication device
DE19921678A1 (en) * 1999-05-11 2000-11-23 Giesecke & Devrient Gmbh Manufacture of carrier e.g. multifunctional chip card with display, involves covering base with flowable plastic material so that electronic components are partially embedded and processing upper side of plastics material
FR2797076B1 (en) * 1999-07-30 2003-11-28 Gemplus Card Int METHOD FOR MANUFACTURING A CONTACT CHIP CARD
US6518885B1 (en) * 1999-10-14 2003-02-11 Intermec Ip Corp. Ultra-thin outline package for integrated circuit
US6421011B1 (en) * 1999-10-22 2002-07-16 Lucent Technologies Inc. Patch antenna using non-conductive frame
US6407704B1 (en) * 1999-10-22 2002-06-18 Lucent Technologies Inc. Patch antenna using non-conductive thermo form frame
DE10047213A1 (en) * 2000-09-23 2002-04-11 Philips Corp Intellectual Pty Electric or electronic component e.g. for microelectronics, has electrically-conducting connection element between contact surface of component and section of contact path
GB2372012A (en) * 2001-01-18 2002-08-14 Pioneer Oriental Engineering L Forming a high frequency contact-less smart card with an antenna coil
US6951596B2 (en) * 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
FR2820548A1 (en) * 2001-02-02 2002-08-09 Schlumberger Systems & Service PORTABLE CHIP AND ANTENNA OBJECT, MODULE FOR FORMING PORTABLE CHIP AND ANTENNA OBJECT AND METHODS OF MAKING SAME
US6462711B1 (en) * 2001-04-02 2002-10-08 Comsat Corporation Multi-layer flat plate antenna with low-cost material and high-conductivity additive processing
US6606247B2 (en) 2001-05-31 2003-08-12 Alien Technology Corporation Multi-feature-size electronic structures
US8430749B2 (en) 2001-08-10 2013-04-30 Igt Dynamic casino tracking and optimization
US7946917B2 (en) 2001-08-10 2011-05-24 Igt Flexible loyalty points programs
US7993197B2 (en) 2001-08-10 2011-08-09 Igt Flexible loyalty points programs
US6992585B2 (en) * 2001-10-02 2006-01-31 Rameez Saleh Security system incorporating a single modular unit motion sensor
US20030076093A1 (en) * 2001-10-18 2003-04-24 Microchip Technology Incorporated Reducing orientation directivity and improving operating distance of magnetic sensor coils in a magnetic field
GB2388744A (en) * 2002-03-01 2003-11-19 Btg Int Ltd An RFID tag
US20030212597A1 (en) * 2002-05-10 2003-11-13 Igt Multi-level point accumulation for a player tracking system and method
US8979646B2 (en) 2002-06-12 2015-03-17 Igt Casino patron tracking and information use
US6867983B2 (en) * 2002-08-07 2005-03-15 Avery Dennison Corporation Radio frequency identification device and method
US7253735B2 (en) * 2003-03-24 2007-08-07 Alien Technology Corporation RFID tags and processes for producing RFID tags
US7051429B2 (en) * 2003-04-11 2006-05-30 Eastman Kodak Company Method for forming a medium having data storage and communication capabilities
JP4037332B2 (en) * 2003-07-10 2008-01-23 シャープ株式会社 IC module and IC card
DE102004007458A1 (en) * 2004-02-13 2005-09-01 Man Roland Druckmaschinen Ag Process for the production of RFID labels
GB0401575D0 (en) * 2004-01-24 2004-02-25 Kam Kin F A compact electronic activity reminder device
US7268063B1 (en) * 2004-06-01 2007-09-11 University Of Central Florida Process for fabricating semiconductor component
DE102004029440A1 (en) * 2004-06-18 2006-01-12 Infineon Technologies Ag Transmitting / receiving device
US7500307B2 (en) 2004-09-22 2009-03-10 Avery Dennison Corporation High-speed RFID circuit placement method
US7688206B2 (en) 2004-11-22 2010-03-30 Alien Technology Corporation Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
US7239244B2 (en) * 2005-04-22 2007-07-03 Se-Kure Controls, Inc. System and method for monitoring a portable article
US7623034B2 (en) 2005-04-25 2009-11-24 Avery Dennison Corporation High-speed RFID circuit placement method and device
KR100618903B1 (en) * 2005-06-18 2006-09-01 삼성전자주식회사 Semiconductor integrated circuit and semiconductor system having independent power supply and manufacturing method thereof
US20060289636A1 (en) * 2005-06-27 2006-12-28 Hoblit Robert S Food card to restrict purchases
CN2833904Y (en) * 2005-07-29 2006-11-01 北京握奇数据系统有限公司 Antenna for plug-type double-interface smart card
AU2006274535A1 (en) 2005-08-01 2007-02-08 Powerid Ltd. Intermediate attachment mechanism and use thereof in RFID transponder
US7608469B2 (en) * 2005-08-25 2009-10-27 Kingston Technology Corporation Method of fabricating a chip
US7555826B2 (en) 2005-12-22 2009-07-07 Avery Dennison Corporation Method of manufacturing RFID devices
DE102006025000A1 (en) * 2006-03-03 2007-09-06 Hamedani, Soheil Precious metal object with RFID identifier
EP2060591A4 (en) * 2006-09-14 2011-05-25 Yokohama Rubber Co Ltd Urethane emulsion
US20080179404A1 (en) * 2006-09-26 2008-07-31 Advanced Microelectronic And Automation Technology Ltd. Methods and apparatuses to produce inlays with transponders
EP2001078A1 (en) * 2007-05-25 2008-12-10 Laird Technologies AB An antenna device and a portable radio communication device comprising such an antenna device
JP5248240B2 (en) * 2007-08-30 2013-07-31 株式会社半導体エネルギー研究所 Semiconductor device
JP4756020B2 (en) * 2007-09-25 2011-08-24 株式会社東芝 Housing, method for manufacturing the same, and electronic device
JP5899575B2 (en) * 2008-11-25 2016-04-06 シン フィルム エレクトロニクス エーエスエー Device manufacturing method and device provided with printed antenna
US8162737B2 (en) * 2009-05-27 2012-04-24 Igt Contactless player card with improved security
TWI485825B (en) * 2009-07-28 2015-05-21 Xintec Inc Chip package and manufacturing method thereof
US8390083B2 (en) * 2009-09-04 2013-03-05 Analog Devices, Inc. System with recessed sensing or processing elements
JP5522386B2 (en) * 2010-04-27 2014-06-18 ミツミ電機株式会社 Patch antenna and manufacturing method thereof
US9407997B2 (en) 2010-10-12 2016-08-02 Invensense, Inc. Microphone package with embedded ASIC
WO2012137962A1 (en) * 2011-04-07 2012-10-11 日本電気株式会社 Component-containing module and method for producing component-containing module
DE102011051946A1 (en) * 2011-07-19 2013-01-24 Dorma Gmbh + Co. Kg Door opener with means for detecting the position of moving parts of the door opener
FR3009411A1 (en) * 2013-08-02 2015-02-06 Ask Sa IDENTITY BOOK COVER WITH RADIO FREQUENCY DEVICE AND METHOD FOR MANUFACTURING THE SAME
EP2840530A1 (en) * 2013-08-23 2015-02-25 Gemalto SA Electronic memory device
CN104576883B (en) 2013-10-29 2018-11-16 普因特工程有限公司 Chip installation array substrate and its manufacturing method
US9666558B2 (en) 2015-06-29 2017-05-30 Point Engineering Co., Ltd. Substrate for mounting a chip and chip package using the substrate
CN106485311A (en) * 2016-09-13 2017-03-08 上海商格信息科技有限公司 A kind of novel electronic label production technology
US10320054B2 (en) 2016-10-28 2019-06-11 Avery Dennison Retail Information Services, Llc RFID tags designed to work on difficult substrates

Citations (97)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3701317A (en) 1967-09-19 1972-10-31 Hiroshi Miyamoto Method for printing electrical circuits on substrates
US3706094A (en) 1970-02-26 1972-12-12 Peter Harold Cole Electronic surveillance system
US3750167A (en) 1971-07-22 1973-07-31 Gen Dynamics Corp Postal tracking system
US3780368A (en) 1970-02-20 1973-12-18 Svejsecentralen Method of marking and subsequently localizing, identifying and recording physical objects
US3832530A (en) 1972-01-04 1974-08-27 Westinghouse Electric Corp Object identifying apparatus
US3849633A (en) 1972-01-04 1974-11-19 Westinghouse Electric Corp Object identifying apparatus
US3981761A (en) 1972-09-11 1976-09-21 Nippon Toki Kabushiki Kaisha Process for manufacturing printed substrates and decalcomania compositions used therefor
US4049969A (en) 1970-03-19 1977-09-20 The United States Of America As Represented By The Secretary Of The Air Force Passive optical transponder
US4075632A (en) 1974-08-27 1978-02-21 The United States Of America As Represented By The United States Department Of Energy Interrogation, and detection system
US4135184A (en) 1977-08-31 1979-01-16 Knogo Corporation Electronic theft detection system for monitoring wide passageways
GB1567784A (en) 1975-12-31 1980-05-21 Inf Cit Honeywe Comp Int Portable card for systems for processing electrical signals and a method of manufacturing such a card
US4232512A (en) 1976-12-27 1980-11-11 Citizen Watch Co., Ltd. Solid state watch module construction
US4331957A (en) 1979-04-20 1982-05-25 Bengt Enander Transponder for use in locating avalanche victims
DE3201065A1 (en) 1982-01-15 1983-07-28 Schwarzwälder Elektronik-Werke GmbH, 7730 Villingen-Schwenningen Method of printing printed circuit boards
US4399441A (en) 1980-01-25 1983-08-16 Unisearch Limited Apparatus for remote temperature reading
US4412356A (en) 1980-01-14 1983-10-25 Iowa State University Research Foundation, Inc. Light actuated remote control security system
US4413254A (en) 1981-09-04 1983-11-01 Sensormatic Electronics Corporation Combined radio and magnetic energy responsive surveillance marker and system
US4418411A (en) 1980-03-11 1983-11-29 Brown, Boveri & Cif Ag Method and apparatus for generating an equipment reply signal for the automatic identification of objects and/or living beings
US4484355A (en) 1983-04-11 1984-11-20 Ritron, Inc. Handheld transceiver with frequency synthesizer and sub-audible tone squelch system
US4506148A (en) 1981-11-05 1985-03-19 Brown, Boveri & Cie Ag Identification card
US4539472A (en) 1984-01-06 1985-09-03 Horizon Technology, Inc. Data processing card system and method of forming same
US4724427A (en) 1986-07-18 1988-02-09 B. I. Incorporated Transponder device
US4727560A (en) 1985-05-30 1988-02-23 U.S. Philips Corporation Charge-coupled device with reduced signal distortion
US4742340A (en) 1986-12-04 1988-05-03 Isomed, Inc. Method and apparatus for detecting counterfeit articles
US4746830A (en) 1986-03-14 1988-05-24 Holland William R Electronic surveillance and identification
US4746618A (en) 1987-08-31 1988-05-24 Energy Conversion Devices, Inc. Method of continuously forming an array of photovoltaic cells electrically connected in series
US4756717A (en) 1981-08-24 1988-07-12 Polaroid Corporation Laminar batteries and methods of making the same
US4777563A (en) 1986-05-02 1988-10-11 Toshiba Battery Co., Ltd. Thin type electronic instrument
US4783646A (en) 1986-03-07 1988-11-08 Kabushiki Kaisha Toshiba Stolen article detection tag sheet, and method for manufacturing the same
DE3824870A1 (en) 1987-09-28 1989-04-13 Mitsubishi Electric Corp SYSTEM FOR CONTACT-FREE INFORMATION TRANSFER BETWEEN AN IC CARD AND A CARD READING / WRITING DEVICE AND IC CARD
US4827395A (en) 1983-04-21 1989-05-02 Intelli-Tech Corporation Manufacturing monitoring and control systems
US4827110A (en) 1987-06-11 1989-05-02 Fluoroware, Inc. Method and apparatus for monitoring the location of wafer disks
JPH01191082A (en) 1988-01-27 1989-08-01 Sony Corp Transmitter receiver
US4854328A (en) 1987-03-23 1989-08-08 Philip Pollack Animal monitoring telltale and information system
US4857893A (en) 1986-07-18 1989-08-15 Bi Inc. Single chip transponder device
JPH0236476A (en) 1988-07-27 1990-02-06 Fujitsu Ltd Displaying system for period of data base
US4911217A (en) 1989-03-24 1990-03-27 The Goodyear Tire & Rubber Company Integrated circuit transponder in a pneumatic tire for tire identification
US4918631A (en) 1984-09-07 1990-04-17 Casio Computer Co., Ltd. Compact type electronic information card
US4926182A (en) 1986-05-30 1990-05-15 Sharp Kabushiki Kaisha Microwave data transmission apparatus
JPH02179794A (en) 1988-12-29 1990-07-12 Sony Corp Data card
US4942327A (en) 1988-06-01 1990-07-17 Hitachi, Ltd. Solid state electronic device
US4962415A (en) 1986-12-15 1990-10-09 Hitachi Maxell, Ltd. IC card
US5008776A (en) 1990-06-06 1991-04-16 Sgs-Thomson Microelectronics, Inc. Zero power IC module
US5023573A (en) 1989-09-21 1991-06-11 Westinghouse Electric Corp. Compact frequency selective limiter configuration
JPH03224799A (en) 1990-01-31 1991-10-03 Sony Corp Data card
US5055968A (en) 1988-07-04 1991-10-08 Sony Corporation Thin electronic device having an integrated circuit chip and a power battery and a method for producing same
DE4120265A1 (en) 1990-06-22 1992-01-09 Mitsubishi Electric Corp Data card without contacts - contains battery and interruptable clock circuit supplying signal to CPU
US5095240A (en) 1989-11-13 1992-03-10 X-Cyte, Inc. Inductively coupled saw device and method for making the same
US5124782A (en) 1990-01-26 1992-06-23 Sgs-Thomson Microelectronics, Inc. Integrated circuit package with molded cell
US5134277A (en) 1983-11-07 1992-07-28 Australian Meat And Live-Stock Corporation Remote data transfer system with ambient light insensitive circuitry
US5144314A (en) 1987-10-23 1992-09-01 Allen-Bradley Company, Inc. Programmable object identification transponder system
US5148504A (en) 1991-10-16 1992-09-15 At&T Bell Laboratories Optical integrated circuit designed to operate by use of photons
US5148355A (en) 1988-12-24 1992-09-15 Technology Applications Company Limited Method for making printed circuits
US5153710A (en) 1991-07-26 1992-10-06 Sgs-Thomson Microelectronics, Inc. Integrated circuit package with laminated backup cell
US5164732A (en) 1980-02-13 1992-11-17 Eid Electronic Identification Systems Ltd. Highway vehicle identification system with high gain antenna
US5166502A (en) 1990-01-05 1992-11-24 Trend Plastics, Inc. Gaming chip with implanted programmable identifier means and process for fabricating same
JPH04359183A (en) 1991-06-06 1992-12-11 Nippondenso Co Ltd Electronic tag and manufacture thereof
US5175418A (en) 1989-12-19 1992-12-29 Sony Corporation Information card system
US5206495A (en) * 1989-10-24 1993-04-27 Angewandte Digital Elektronik Gmbh Chip card
US5214410A (en) 1989-07-10 1993-05-25 Csir Location of objects
US5266925A (en) 1991-09-30 1993-11-30 Westinghouse Electric Corp. Electronic identification tag interrogation method
US5274221A (en) 1990-06-22 1993-12-28 Mitsubishi Denki Kabushiki Kaisha Non-contact integrated circuit card
US5302954A (en) 1987-12-04 1994-04-12 Magellan Corporation (Australia) Pty. Ltd. Identification apparatus and methods
EP0595549A2 (en) 1992-10-26 1994-05-04 Hughes Microelectronics Europa Limited Radio frequency baggage tags
US5313211A (en) 1990-08-13 1994-05-17 Sharp Kabushiki Kaisha Portable data processing device capable of transmitting processed data on a radio by reflection of unmodulated carrier signal externally applied
US5317309A (en) 1990-11-06 1994-05-31 Westinghouse Electric Corp. Dual mode electronic identification system
US5337063A (en) 1991-04-22 1994-08-09 Mitsubishi Denki Kabushiki Kaisha Antenna circuit for non-contact IC card and method of manufacturing the same
US5340968A (en) 1991-05-07 1994-08-23 Nippondenso Company, Ltd. Information storage medium with electronic and visual areas
US5347263A (en) 1993-02-05 1994-09-13 Gnuco Technology Corporation Electronic identifier apparatus and method utilizing a single chip microcontroller and an antenna coil
JPH0722831A (en) 1993-03-11 1995-01-24 Csir Method for mounting electronic circuit on board and packaging component
US5402095A (en) 1991-09-20 1995-03-28 Itt Composants Et Instruments Portable case for an electronic smart card
US5412192A (en) 1993-07-20 1995-05-02 American Express Company Radio frequency activated charge card
US5414427A (en) 1990-07-24 1995-05-09 Gunnarsson; Staffan Device for information transmission
US5428214A (en) 1992-05-11 1995-06-27 N.V. Nederlandsche Apparatenfabriek Nedap Contactlessly operating electronic responder card
US5448110A (en) 1992-06-17 1995-09-05 Micron Communications, Inc. Enclosed transceiver
EP0682321A2 (en) 1994-05-11 1995-11-15 Giesecke & Devrient GmbH Record carrier with integrated circuit
US5497140A (en) 1992-08-12 1996-03-05 Micron Technology, Inc. Electrically powered postage stamp or mailing or shipping label operative with radio frequency (RF) communication
DE4431605A1 (en) 1994-09-05 1996-03-07 Siemens Ag Chip card module for contactless chip cards and method for its production
US5528222A (en) 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
US5541399A (en) 1994-09-30 1996-07-30 Palomar Technologies Corporation RF transponder with resonant crossover antenna coil
US5572226A (en) 1992-05-15 1996-11-05 Micron Technology, Inc. Spherical antenna pattern(s) from antenna(s) arranged in a two-dimensional plane for use in RFID tags and labels
US5598032A (en) 1994-02-14 1997-01-28 Gemplus Card International Hybrid chip card capable of both contact and contact-free operation and having antenna contacts situated in a cavity for an electronic module
US5600175A (en) 1994-07-27 1997-02-04 Texas Instruments Incorporated Apparatus and method for flat circuit assembly
US5621412A (en) 1994-04-26 1997-04-15 Texas Instruments Incorporated Multi-stage transponder wake-up, method and structure
US5647122A (en) 1994-06-15 1997-07-15 U.S. Philips Corporation Manufacturing method for an integrated circuit card
US5649296A (en) 1995-06-19 1997-07-15 Lucent Technologies Inc. Full duplex modulated backscatter system
US5735040A (en) 1991-12-26 1998-04-07 Mitsubishi Denki Kabushiki Kaisha Method of making IC card
US5776278A (en) 1992-06-17 1998-07-07 Micron Communications, Inc. Method of manufacturing an enclosed transceiver
US5779839A (en) 1992-06-17 1998-07-14 Micron Communications, Inc. Method of manufacturing an enclosed transceiver
US5850690A (en) 1995-07-11 1998-12-22 De La Rue Cartes Et Systemes Sas Method of manufacturing and assembling an integrated circuit card
US5880937A (en) 1996-03-08 1999-03-09 Patent-Treuhand-Gesellschaft Fuer Elektrische Gluehlampen Mbh Electrical circuit arrangement having equipotential surface for reduced high-frequency interference
US5955949A (en) 1997-08-18 1999-09-21 X-Cyte, Inc. Layered structure for a transponder tag
US5982284A (en) 1997-09-19 1999-11-09 Avery Dennison Corporation Tag or label with laminated thin, flat, flexible device
US6036099A (en) * 1995-10-17 2000-03-14 Leighton; Keith Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom
US6130602A (en) 1996-05-13 2000-10-10 Micron Technology, Inc. Radio frequency data communications device
US6265977B1 (en) 1998-09-11 2001-07-24 Motorola, Inc. Radio frequency identification tag apparatus and related method
US6294998B1 (en) 2000-06-09 2001-09-25 Intermec Ip Corp. Mask construction for profile correction on an RFID smart label to improve print quality and eliminate detection

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4065343A (en) * 1975-11-14 1977-12-27 Rexnord Inc. Label system for package and baggage handling
US4587038A (en) * 1980-06-26 1986-05-06 Canon Kabushiki Kaisha Electro-optic display device and a method of producing the same
US4634849A (en) * 1985-04-02 1987-01-06 Klingen Leonard G Uniquely numbered baggage split tag and system for handling baggage
JPH01245721A (en) * 1988-03-28 1989-09-29 Matsushita Electric Works Ltd Radio equipment
JPH03263903A (en) * 1989-04-28 1991-11-25 Misao Haishi Miniature antenna
US5480834A (en) * 1993-12-13 1996-01-02 Micron Communications, Inc. Process of manufacturing an electrical bonding interconnect having a metal bond pad portion and having a conductive epoxy portion comprising an oxide reducing agent
JP3559322B2 (en) * 1994-11-14 2004-09-02 株式会社東芝 Method of manufacturing thin composite IC card
DE19527359A1 (en) * 1995-07-26 1997-02-13 Giesecke & Devrient Gmbh Circuit unit and method for manufacturing a circuit unit
US5817207A (en) * 1995-10-17 1998-10-06 Leighton; Keith R. Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards
US6052062A (en) * 1997-08-20 2000-04-18 Micron Technology, Inc. Cards, communication devices, and methods of forming and encoding visibly perceptible information on the same
US6043745A (en) * 1997-11-13 2000-03-28 Micron Technology, Inc. Electronic devices and methods of forming electronic devices
US6714121B1 (en) * 1999-08-09 2004-03-30 Micron Technology, Inc. RFID material tracking method and apparatus
JP5395429B2 (en) * 2005-06-03 2014-01-22 シナプティクス インコーポレイテッド Method and system for detecting capacitance using sigma delta measurement

Patent Citations (104)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3701317A (en) 1967-09-19 1972-10-31 Hiroshi Miyamoto Method for printing electrical circuits on substrates
US3780368A (en) 1970-02-20 1973-12-18 Svejsecentralen Method of marking and subsequently localizing, identifying and recording physical objects
US3706094A (en) 1970-02-26 1972-12-12 Peter Harold Cole Electronic surveillance system
US4049969A (en) 1970-03-19 1977-09-20 The United States Of America As Represented By The Secretary Of The Air Force Passive optical transponder
US3750167A (en) 1971-07-22 1973-07-31 Gen Dynamics Corp Postal tracking system
US3832530A (en) 1972-01-04 1974-08-27 Westinghouse Electric Corp Object identifying apparatus
US3849633A (en) 1972-01-04 1974-11-19 Westinghouse Electric Corp Object identifying apparatus
US3981761A (en) 1972-09-11 1976-09-21 Nippon Toki Kabushiki Kaisha Process for manufacturing printed substrates and decalcomania compositions used therefor
US4075632A (en) 1974-08-27 1978-02-21 The United States Of America As Represented By The United States Department Of Energy Interrogation, and detection system
GB1567784A (en) 1975-12-31 1980-05-21 Inf Cit Honeywe Comp Int Portable card for systems for processing electrical signals and a method of manufacturing such a card
US4232512A (en) 1976-12-27 1980-11-11 Citizen Watch Co., Ltd. Solid state watch module construction
US4135184A (en) 1977-08-31 1979-01-16 Knogo Corporation Electronic theft detection system for monitoring wide passageways
US4331957A (en) 1979-04-20 1982-05-25 Bengt Enander Transponder for use in locating avalanche victims
US4412356A (en) 1980-01-14 1983-10-25 Iowa State University Research Foundation, Inc. Light actuated remote control security system
US4399441A (en) 1980-01-25 1983-08-16 Unisearch Limited Apparatus for remote temperature reading
US5164732A (en) 1980-02-13 1992-11-17 Eid Electronic Identification Systems Ltd. Highway vehicle identification system with high gain antenna
US4418411A (en) 1980-03-11 1983-11-29 Brown, Boveri & Cif Ag Method and apparatus for generating an equipment reply signal for the automatic identification of objects and/or living beings
US4756717A (en) 1981-08-24 1988-07-12 Polaroid Corporation Laminar batteries and methods of making the same
US4413254A (en) 1981-09-04 1983-11-01 Sensormatic Electronics Corporation Combined radio and magnetic energy responsive surveillance marker and system
US4506148A (en) 1981-11-05 1985-03-19 Brown, Boveri & Cie Ag Identification card
DE3201065A1 (en) 1982-01-15 1983-07-28 Schwarzwälder Elektronik-Werke GmbH, 7730 Villingen-Schwenningen Method of printing printed circuit boards
US4484355A (en) 1983-04-11 1984-11-20 Ritron, Inc. Handheld transceiver with frequency synthesizer and sub-audible tone squelch system
US4827395A (en) 1983-04-21 1989-05-02 Intelli-Tech Corporation Manufacturing monitoring and control systems
US5134277A (en) 1983-11-07 1992-07-28 Australian Meat And Live-Stock Corporation Remote data transfer system with ambient light insensitive circuitry
US4539472A (en) 1984-01-06 1985-09-03 Horizon Technology, Inc. Data processing card system and method of forming same
US4918631A (en) 1984-09-07 1990-04-17 Casio Computer Co., Ltd. Compact type electronic information card
US4727560A (en) 1985-05-30 1988-02-23 U.S. Philips Corporation Charge-coupled device with reduced signal distortion
US4783646A (en) 1986-03-07 1988-11-08 Kabushiki Kaisha Toshiba Stolen article detection tag sheet, and method for manufacturing the same
US4746830A (en) 1986-03-14 1988-05-24 Holland William R Electronic surveillance and identification
US4777563A (en) 1986-05-02 1988-10-11 Toshiba Battery Co., Ltd. Thin type electronic instrument
US4926182A (en) 1986-05-30 1990-05-15 Sharp Kabushiki Kaisha Microwave data transmission apparatus
US4724427A (en) 1986-07-18 1988-02-09 B. I. Incorporated Transponder device
US4857893A (en) 1986-07-18 1989-08-15 Bi Inc. Single chip transponder device
US4742340A (en) 1986-12-04 1988-05-03 Isomed, Inc. Method and apparatus for detecting counterfeit articles
US4962415A (en) 1986-12-15 1990-10-09 Hitachi Maxell, Ltd. IC card
US4854328A (en) 1987-03-23 1989-08-08 Philip Pollack Animal monitoring telltale and information system
US4827110A (en) 1987-06-11 1989-05-02 Fluoroware, Inc. Method and apparatus for monitoring the location of wafer disks
US4746618A (en) 1987-08-31 1988-05-24 Energy Conversion Devices, Inc. Method of continuously forming an array of photovoltaic cells electrically connected in series
US4960983A (en) * 1987-09-28 1990-10-02 Mitsubishi Denki Kabushiki Kaisha Noncontact type IC card and system for noncontact transfer of information using the same
DE3824870A1 (en) 1987-09-28 1989-04-13 Mitsubishi Electric Corp SYSTEM FOR CONTACT-FREE INFORMATION TRANSFER BETWEEN AN IC CARD AND A CARD READING / WRITING DEVICE AND IC CARD
US5144314A (en) 1987-10-23 1992-09-01 Allen-Bradley Company, Inc. Programmable object identification transponder system
US5302954A (en) 1987-12-04 1994-04-12 Magellan Corporation (Australia) Pty. Ltd. Identification apparatus and methods
JPH01191082A (en) 1988-01-27 1989-08-01 Sony Corp Transmitter receiver
US4942327A (en) 1988-06-01 1990-07-17 Hitachi, Ltd. Solid state electronic device
US5055968A (en) 1988-07-04 1991-10-08 Sony Corporation Thin electronic device having an integrated circuit chip and a power battery and a method for producing same
JPH0236476A (en) 1988-07-27 1990-02-06 Fujitsu Ltd Displaying system for period of data base
US5148355A (en) 1988-12-24 1992-09-15 Technology Applications Company Limited Method for making printed circuits
JPH02179794A (en) 1988-12-29 1990-07-12 Sony Corp Data card
US4911217A (en) 1989-03-24 1990-03-27 The Goodyear Tire & Rubber Company Integrated circuit transponder in a pneumatic tire for tire identification
US5214410A (en) 1989-07-10 1993-05-25 Csir Location of objects
US5023573A (en) 1989-09-21 1991-06-11 Westinghouse Electric Corp. Compact frequency selective limiter configuration
US5206495A (en) * 1989-10-24 1993-04-27 Angewandte Digital Elektronik Gmbh Chip card
US5095240A (en) 1989-11-13 1992-03-10 X-Cyte, Inc. Inductively coupled saw device and method for making the same
US5175418A (en) 1989-12-19 1992-12-29 Sony Corporation Information card system
US5166502A (en) 1990-01-05 1992-11-24 Trend Plastics, Inc. Gaming chip with implanted programmable identifier means and process for fabricating same
US5124782A (en) 1990-01-26 1992-06-23 Sgs-Thomson Microelectronics, Inc. Integrated circuit package with molded cell
JPH03224799A (en) 1990-01-31 1991-10-03 Sony Corp Data card
US5008776A (en) 1990-06-06 1991-04-16 Sgs-Thomson Microelectronics, Inc. Zero power IC module
US5274221A (en) 1990-06-22 1993-12-28 Mitsubishi Denki Kabushiki Kaisha Non-contact integrated circuit card
DE4120265A1 (en) 1990-06-22 1992-01-09 Mitsubishi Electric Corp Data card without contacts - contains battery and interruptable clock circuit supplying signal to CPU
US5414427A (en) 1990-07-24 1995-05-09 Gunnarsson; Staffan Device for information transmission
US5313211A (en) 1990-08-13 1994-05-17 Sharp Kabushiki Kaisha Portable data processing device capable of transmitting processed data on a radio by reflection of unmodulated carrier signal externally applied
US5317309A (en) 1990-11-06 1994-05-31 Westinghouse Electric Corp. Dual mode electronic identification system
US5337063A (en) 1991-04-22 1994-08-09 Mitsubishi Denki Kabushiki Kaisha Antenna circuit for non-contact IC card and method of manufacturing the same
US5340968A (en) 1991-05-07 1994-08-23 Nippondenso Company, Ltd. Information storage medium with electronic and visual areas
JPH04359183A (en) 1991-06-06 1992-12-11 Nippondenso Co Ltd Electronic tag and manufacture thereof
US5153710A (en) 1991-07-26 1992-10-06 Sgs-Thomson Microelectronics, Inc. Integrated circuit package with laminated backup cell
US5402095A (en) 1991-09-20 1995-03-28 Itt Composants Et Instruments Portable case for an electronic smart card
US5266925A (en) 1991-09-30 1993-11-30 Westinghouse Electric Corp. Electronic identification tag interrogation method
US5148504A (en) 1991-10-16 1992-09-15 At&T Bell Laboratories Optical integrated circuit designed to operate by use of photons
US5735040A (en) 1991-12-26 1998-04-07 Mitsubishi Denki Kabushiki Kaisha Method of making IC card
US5428214A (en) 1992-05-11 1995-06-27 N.V. Nederlandsche Apparatenfabriek Nedap Contactlessly operating electronic responder card
US5719586A (en) 1992-05-15 1998-02-17 Micron Communications, Inc. Spherical antenna pattern(s) from antenna(s) arranged in a two-dimensional plane for use in RFID tags and labels
US5572226A (en) 1992-05-15 1996-11-05 Micron Technology, Inc. Spherical antenna pattern(s) from antenna(s) arranged in a two-dimensional plane for use in RFID tags and labels
US5448110A (en) 1992-06-17 1995-09-05 Micron Communications, Inc. Enclosed transceiver
US5779839A (en) 1992-06-17 1998-07-14 Micron Communications, Inc. Method of manufacturing an enclosed transceiver
US5776278A (en) 1992-06-17 1998-07-07 Micron Communications, Inc. Method of manufacturing an enclosed transceiver
US5497140A (en) 1992-08-12 1996-03-05 Micron Technology, Inc. Electrically powered postage stamp or mailing or shipping label operative with radio frequency (RF) communication
EP0595549A2 (en) 1992-10-26 1994-05-04 Hughes Microelectronics Europa Limited Radio frequency baggage tags
US5347263A (en) 1993-02-05 1994-09-13 Gnuco Technology Corporation Electronic identifier apparatus and method utilizing a single chip microcontroller and an antenna coil
JPH0722831A (en) 1993-03-11 1995-01-24 Csir Method for mounting electronic circuit on board and packaging component
US5566441A (en) * 1993-03-11 1996-10-22 British Technology Group Limited Attaching an electronic circuit to a substrate
US5412192A (en) 1993-07-20 1995-05-02 American Express Company Radio frequency activated charge card
US5598032A (en) 1994-02-14 1997-01-28 Gemplus Card International Hybrid chip card capable of both contact and contact-free operation and having antenna contacts situated in a cavity for an electronic module
US5621412A (en) 1994-04-26 1997-04-15 Texas Instruments Incorporated Multi-stage transponder wake-up, method and structure
US5880934A (en) 1994-05-11 1999-03-09 Giesecke & Devrient Gmbh Data carrier having separately provided integrated circuit and induction coil
EP0682321A2 (en) 1994-05-11 1995-11-15 Giesecke & Devrient GmbH Record carrier with integrated circuit
US5647122A (en) 1994-06-15 1997-07-15 U.S. Philips Corporation Manufacturing method for an integrated circuit card
US5600175A (en) 1994-07-27 1997-02-04 Texas Instruments Incorporated Apparatus and method for flat circuit assembly
US5729053A (en) 1994-07-27 1998-03-17 Texas Instruments Incorporated Apparatus and method for flat circuit assembly
DE4431605A1 (en) 1994-09-05 1996-03-07 Siemens Ag Chip card module for contactless chip cards and method for its production
US5809633A (en) * 1994-09-05 1998-09-22 Siemens Aktiengesellschaft Method for producing a smart card module for contactless smart cards
US5528222A (en) 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
US5541399A (en) 1994-09-30 1996-07-30 Palomar Technologies Corporation RF transponder with resonant crossover antenna coil
US5649296A (en) 1995-06-19 1997-07-15 Lucent Technologies Inc. Full duplex modulated backscatter system
US5850690A (en) 1995-07-11 1998-12-22 De La Rue Cartes Et Systemes Sas Method of manufacturing and assembling an integrated circuit card
US6036099A (en) * 1995-10-17 2000-03-14 Leighton; Keith Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom
US6514367B1 (en) * 1995-10-17 2003-02-04 Keith R. Leighton Hot lamination process for the manufacture of a combination contact/contactless smart card
US5880937A (en) 1996-03-08 1999-03-09 Patent-Treuhand-Gesellschaft Fuer Elektrische Gluehlampen Mbh Electrical circuit arrangement having equipotential surface for reduced high-frequency interference
US6130602A (en) 1996-05-13 2000-10-10 Micron Technology, Inc. Radio frequency data communications device
US5955949A (en) 1997-08-18 1999-09-21 X-Cyte, Inc. Layered structure for a transponder tag
US5982284A (en) 1997-09-19 1999-11-09 Avery Dennison Corporation Tag or label with laminated thin, flat, flexible device
US6265977B1 (en) 1998-09-11 2001-07-24 Motorola, Inc. Radio frequency identification tag apparatus and related method
US6294998B1 (en) 2000-06-09 2001-09-25 Intermec Ip Corp. Mask construction for profile correction on an RFID smart label to improve print quality and eliminate detection

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
Casson, K., et al., "High Temperature Packaging: Flip Chip on Flexible Laminate", Surface Mount Technology, pp. 19-20 (Jan. 1992).
Gilleo, K., "Using SM Devices on Flexible Circuitry", ELECTRI-ONICS, pp. 20-23 (Mar. 1986).
Johnson, R.W., "Polymer Thick Films: Technology and Materials", Circuits Manufacturing (reprint), 4 pages (Jul. 1982).

Cited By (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7746230B2 (en) 1992-08-12 2010-06-29 Round Rock Research, Llc Radio frequency identification device and method
US20050242964A1 (en) * 1992-08-12 2005-11-03 Tuttle John R Miniature radio frequency transceiver
US20070103316A1 (en) * 1992-08-12 2007-05-10 Tuttle John R Radio frequency identification device and method
US8018340B2 (en) 1992-08-12 2011-09-13 Round Rock Research, Llc System and method to track articles at a point of origin and at a point of destination using RFID
US7948382B2 (en) 1997-08-20 2011-05-24 Round Rock Research, Llc Electronic communication devices, methods of forming electrical communication devices, and communications methods
US7839285B2 (en) 1997-08-20 2010-11-23 Round Rock Resarch, LLC Electronic communication devices, methods of forming electrical communication devices, and communications methods
US9634296B2 (en) 2002-08-09 2017-04-25 Sapurast Research Llc Thin film battery on an integrated circuit or circuit board and method thereof
US8404376B2 (en) 2002-08-09 2013-03-26 Infinite Power Solutions, Inc. Metal film encapsulation
US8431264B2 (en) 2002-08-09 2013-04-30 Infinite Power Solutions, Inc. Hybrid thin-film battery
US8236443B2 (en) 2002-08-09 2012-08-07 Infinite Power Solutions, Inc. Metal film encapsulation
US8021778B2 (en) 2002-08-09 2011-09-20 Infinite Power Solutions, Inc. Electrochemical apparatus with barrier layer protected substrate
US8394522B2 (en) 2002-08-09 2013-03-12 Infinite Power Solutions, Inc. Robust metal film encapsulation
US9793523B2 (en) 2002-08-09 2017-10-17 Sapurast Research Llc Electrochemical apparatus with barrier layer protected substrate
US8535396B2 (en) 2002-08-09 2013-09-17 Infinite Power Solutions, Inc. Electrochemical apparatus with barrier layer protected substrate
US8445130B2 (en) 2002-08-09 2013-05-21 Infinite Power Solutions, Inc. Hybrid thin-film battery
US7993773B2 (en) 2002-08-09 2011-08-09 Infinite Power Solutions, Inc. Electrochemical apparatus with barrier layer protected substrate
US8728285B2 (en) 2003-05-23 2014-05-20 Demaray, Llc Transparent conductive oxides
US20080314983A1 (en) * 2003-09-24 2008-12-25 Capurso Robert G Card with embedded bistable display having short and long term information
US7925538B2 (en) 2003-09-24 2011-04-12 Industrial Technology Research Institute Card with embedded bistable display having short and long term information
US7761332B2 (en) * 2003-09-24 2010-07-20 Eastman Kodak Company Card with embedded bistable display having short and long term information
US7689459B2 (en) * 2003-09-24 2010-03-30 Industiral Technology Research Institute Card with embedded bistable display having short and long term information
US20050065884A1 (en) * 2003-09-24 2005-03-24 Eastman Kodak Company Card with embedded bistable display having short and long term information
US20080314976A1 (en) * 2003-09-24 2008-12-25 Capurso Robert G Card with embedded bistable display having short and long term information
US7959769B2 (en) 2004-12-08 2011-06-14 Infinite Power Solutions, Inc. Deposition of LiCoO2
US8636876B2 (en) 2004-12-08 2014-01-28 R. Ernest Demaray Deposition of LiCoO2
US8692249B2 (en) 2006-07-28 2014-04-08 Semiconductor Energy Laboratory Co., Ltd. Power storage device
US20110068438A1 (en) * 2006-07-28 2011-03-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US20080023793A1 (en) * 2006-07-28 2008-01-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US20080023810A1 (en) * 2006-07-28 2008-01-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9070563B2 (en) 2006-07-28 2015-06-30 Semiconductor Energy Laboratory Co., Ltd. Power storage device
US7838976B2 (en) * 2006-07-28 2010-11-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having a semiconductor chip enclosed by a body structure and a base
US8378473B2 (en) 2006-07-28 2013-02-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having semiconductor chip within multilayer substrate
US20110057628A1 (en) * 2006-07-28 2011-03-10 Semiconductor Energy Laboratory Co., Ltd. Power storage device
US8232621B2 (en) 2006-07-28 2012-07-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8054035B2 (en) 2006-07-28 2011-11-08 Semiconductor Energy Laboratory Co., Ltd. Power storage device including an antenna
US8062708B2 (en) 2006-09-29 2011-11-22 Infinite Power Solutions, Inc. Masking of and material constraint for depositing battery layers on flexible substrates
US8197781B2 (en) 2006-11-07 2012-06-12 Infinite Power Solutions, Inc. Sputtering target of Li3PO4 and method for producing same
US8299925B2 (en) * 2007-10-26 2012-10-30 Fujitsu Limited RFID tag and manufacturing method thereof
US20090109000A1 (en) * 2007-10-26 2009-04-30 Fujitsu Limited Rfid tag and manufacturing method thereof
US8268488B2 (en) 2007-12-21 2012-09-18 Infinite Power Solutions, Inc. Thin film electrolyte for thin film batteries
US9334557B2 (en) 2007-12-21 2016-05-10 Sapurast Research Llc Method for sputter targets for electrolyte films
US8518581B2 (en) 2008-01-11 2013-08-27 Inifinite Power Solutions, Inc. Thin film encapsulation for thin film batteries and other devices
US9786873B2 (en) 2008-01-11 2017-10-10 Sapurast Research Llc Thin film encapsulation for thin film batteries and other devices
US20090212919A1 (en) * 2008-02-26 2009-08-27 Avery Dennison Corporation Rfid tag for direct and indirect food contact
US8786443B2 (en) * 2008-02-26 2014-07-22 Avery Dennison Corporation RFID tag for direct and indirect food contact
US10074048B2 (en) * 2008-02-26 2018-09-11 Avery Dennison Retail Information Services, Llc RFID tag for direct and indirect food contact
US8350519B2 (en) 2008-04-02 2013-01-08 Infinite Power Solutions, Inc Passive over/under voltage control and protection for energy storage devices associated with energy harvesting
US8906523B2 (en) 2008-08-11 2014-12-09 Infinite Power Solutions, Inc. Energy device with integral collector surface for electromagnetic energy harvesting and method thereof
US8260203B2 (en) 2008-09-12 2012-09-04 Infinite Power Solutions, Inc. Energy device with integral conductive surface for data communication via electromagnetic energy and method thereof
US9980724B2 (en) 2008-09-23 2018-05-29 Covidien Lp Surgical instrument and loading unit for use therewith
US8508193B2 (en) 2008-10-08 2013-08-13 Infinite Power Solutions, Inc. Environmentally-powered wireless sensor module
US9532453B2 (en) 2009-09-01 2016-12-27 Sapurast Research Llc Printed circuit board with integrated thin film battery
US8599572B2 (en) 2009-09-01 2013-12-03 Infinite Power Solutions, Inc. Printed circuit board with integrated thin film battery
US10680277B2 (en) 2010-06-07 2020-06-09 Sapurast Research Llc Rechargeable, high-density electrochemical device
US10092290B2 (en) 2015-03-17 2018-10-09 Covidien Lp Surgical instrument, loading unit for use therewith and related methods
US10918384B2 (en) 2015-03-17 2021-02-16 Covidien Lp Surgical instrument, loading unit for use therewith and related methods

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US6271801B2 (en) 2001-08-07
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