USRE45035E1 - Verification circuits and methods for phase change memory array - Google Patents

Verification circuits and methods for phase change memory array Download PDF

Info

Publication number
USRE45035E1
USRE45035E1 US13/934,954 US201313934954A USRE45035E US RE45035 E1 USRE45035 E1 US RE45035E1 US 201313934954 A US201313934954 A US 201313934954A US RE45035 E USRE45035 E US RE45035E
Authority
US
United States
Prior art keywords
memory cell
signal
reset state
writing current
voltage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active, expires
Application number
US13/934,954
Inventor
Wen-Pin Lin
Shyh-Shyuan Sheu
Pei-Chia Chiang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gula Consulting LLC
Original Assignee
Higgs Opl Capital LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Higgs Opl Capital LLC filed Critical Higgs Opl Capital LLC
Priority to US13/934,954 priority Critical patent/USRE45035E1/en
Assigned to HIGGS OPL. CAPITAL LLC reassignment HIGGS OPL. CAPITAL LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Application granted granted Critical
Publication of USRE45035E1 publication Critical patent/USRE45035E1/en
Assigned to GULA CONSULTING LIMITED LIABILITY COMPANY reassignment GULA CONSULTING LIMITED LIABILITY COMPANY MERGER (SEE DOCUMENT FOR DETAILS). Assignors: HIGGS OPL. CAPITAL LLC
Active legal-status Critical Current
Adjusted expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0064Verifying circuits or methods
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0004Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising amorphous/crystalline phase transition cells
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/004Reading or sensing circuits or methods
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0069Writing or programming circuits or methods
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements

Landscapes

  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Semiconductor Memories (AREA)
  • Mram Or Spin Memory Techniques (AREA)

Abstract

A verification circuit for a phase change memory array is provided. A sensing unit senses a sensing voltage from a memory cell of the phase change memory array according to an enable signal. A comparator generates a comparing signal according to the sensing voltage and a reference voltage, so as to indicate whether the memory cell is in a reset state. A control unit generates a control signal according to the enable signal. An operating unit generates a first signal according to the control signal, so as to indicate whether the comparator is active. An adjustment unit provides a writing current to the cell, and increases the writing current according to the control signal until the comparing signal indicates that the memory cell is in a reset state.

Description

CROSS REFERENCE TO RELATED APPLICATIONS
This Application is a reissue of U.S. patent application Ser. No. 12/485,720, filed Jun. 16, 2009, now U.S. Pat. No. 7,974,122, issued Jul. 5, 2011, which claims priority of Taiwan Patent Application No. 097151378, filed on Dec. 30, 2008, the entirety of which is are incorporated by reference herein.
BACKGROUND
1. Technical Field
The present disclosure relates to a verification circuit, and more particularly to a verification circuit for a phase change memory array.
2. Description of the Related Art
A Phase Change Memory (PCM) is a non-volatile memory with high speed, high capacity and low energy consumption, wherein a plurality of PCM cells of the PCM cell is formed by phase change material, such as chalcogenide etc. The phase change material can be switched between two states, a crystalline state and an amorphous state, with the application of heat, wherein the phase change material has different resistances corresponding to the crystalline and amorphous states respectively, and the resistances respectively represent different stored data.
In general, different writing currents are provided to heat a PCM cell to change its resistance, such that data can be stored into the PCM cell. Furthermore, for a PCM cell, it is necessary for a writing current to transform the PCM cell into a reset state. Therefore, a verification circuit for verifying a PCM array is desired, which is used to verify that the memory cells of the PCM array have been transformed from a non-reset state to a reset state.
BRIEF SUMMARY
Verification circuits and verification methods for a phase change memory array are provided. An exemplary embodiment of such a verification circuit for a phase change memory array comprises: a sensing unit, sensing a first sensing voltage from a first memory cell of the phase change memory array according to an enable signal; a comparator, generating a comparing signal according to the first sensing voltage and a reference voltage, so as to indicate whether the first memory cell is in a reset state; a control unit, generating a control signal according to the enable signal; an operating unit, generating a first signal according to the control signal, so as to indicate whether the comparator is active; and an adjusting unit, providing a writing current to the first memory cell and adjusting the writing current according to the control signal until the comparing signal indicates that the first memory cell is in a reset state.
Furthermore, an exemplary embodiment of a verification method for a phase change memory array is provided. A memory cell of the phase change memory array is read to obtain a sensing voltage. The sensing voltage is compared with a reference voltage. When the sensing voltage is smaller than the reference voltage, a writing current is provided to the memory cell and the writing current is gradually increased until the sensing voltage corresponding to the writing current is larger than or equal to the reference voltage.
Moreover, another exemplary embodiment of a verification method for a phase change memory array is provided. A writing current is provided to a first memory cell of the phase change memory array and the writing current is gradually increased until a first sensing voltage sensed from the first memory cell is larger than or equal to a reference voltage. The current magnitude of the writing current is recorded as a reference current magnitude when the first sensing voltage is larger than or equal to a reference voltage. A second memory cell of the phase change memory array is read to obtain a second sensing voltage. It is determined whether the second memory cell is in a reset state by comparing the second sensing voltage and the reference voltage. The writing current with the reference current magnitude is provided to the second memory cell to transform the second memory cell into a reset state when the second memory cell is in a non-reset state. A detailed description is given in the following exemplary embodiments with reference to the accompanying drawings.
BRIEF DESCRIPTION OF DRAWINGS
FIG. 1 shows a verification circuit according to an exemplary embodiment;
FIG. 2 shows a waveform diagram of the signals of the verification circuit shown in FIG. 1;
FIG. 3A shows a schematic diagram of a control unit according to an exemplary embodiment;
FIG. 3B shows a schematic diagram of a detecting unit according to an exemplary embodiment;
FIG. 3C shows a schematic diagram of a calculating unit according to an exemplary embodiment;
FIG. 4 shows a verification circuit according to another exemplary embodiment;
FIGS. 5A and 5B show a waveform diagram illustrating the verification circuit of FIG. 4 performing a verification procedure for different memory cells, respectively;
FIG. 6 shows a verification method for a PCM array according to an exemplary embodiment; and
FIG. 7 shows a verification method for a PCM array according to another exemplary embodiment.
DETAILED DESCRIPTION
The following description is made for the purpose of illustrating the general principles of the disclosure and should not be taken in a limiting sense. The scope of the embodiments is best determined by reference to the appended claims and their equivalents.
FIG. 1 shows a verification circuit 110 for verifying whether each memory cell of a phase change memory (PCM) army 150 is in a reset state according to an exemplary embodiment. The verification circuit 110 comprises a sensing unit 112, a comparator 114, a control unit 116, an operating unit 118, a delay unit 124, a flip-flop 126, a determining unit 128, an adjusting unit 130 and two switches 120 and 122. The operating unit 118 is coupled between the control unit 116 and the delay unit 124, and the operating unit 118 is used to receive a control signal Sctrl to generate a signal S1, so as to indicate that the comparator 114 is active or not. The delay unit 124 receives and delays the signal S1 to generate a signal S2 and then provides the signal S2 to a clock input terminal of the flip-flop 126. In addition, the flip-flop 126 further comprises a data input terminal coupled to the switch 120 and a data output terminal coupled to the determining unit 128.
When receiving an enable signal SEN provided by the determining unit 128, the sensing unit 112 may read a memory cell of the PCM array 150 to sense a resistance Rcell of the memory cell, so as to obtain a sensing voltage Vcell corresponding to the resistance Rcell. Next, the comparator 114 may compare the sensing voltage Vcell with a reference voltage Vref, so as to generate a comparing signal Sc to indicate the state of the read memory cell. For example, the comparing signal Sc indicates that the read memory cell is in a non-reset state when the sensing voltage Vcell is smaller than the reference voltage Vref, and the comparing signal Sc indicates that the read memory cell has be transformed into a reset state when the sensing voltage Vcell is larger than or equal to the reference voltage Vref.
Furthermore, the determining unit 128 also provides the enable signal SEN to the control unit 116 to generate the control signal Sctrl. Next, the operating unit 118 generates the signal S1 according to the control signal Sctrl, so as to control the comparator 114 to operate or not. Next, the comparing signal Sc may control the switches 120 and 122 to turn on or off. The switch 120 is coupled between the control unit 116 and the adjusting unit 130 and the switch 122 is coupled between a voltage VDD and the switch 120, wherein the switches 120 and 122 are controlled by the comparing signal Sc. Therefore, the comparing signal Sc may control the switches 120 and 122 to change the control signal Sctrl into a signal Sclk and provide the signal Sclk to the adjusting unit 130 and the flip-flop 126. Referring to FIG. 1 and FIG. 2 together, FIG. 2 shows a waveform diagram of the signals of the verification circuit 110 shown in FIG. 1. The control signal Sctrl and the signal Sclk are the pulse signals with identical frequencies but different duty cycles. In addition, the adjusting unit 130 comprises a writing current generator 132 and a calculating unit 134. The calculating unit 134 may count/calculate the pulse number of the signal Sclk to generate an adjusting signal D comprising a plurality of bits. In the embodiment show in FIG. 2, the adjusting signal D comprises four bits D0, D1, D2 and D3. Next, the writing current generator 132 generates a writing current Iwrite to the memory cell of the PCM array 150 according to the adjusting signal D, so as to transform the state of the memory cell. Furthermore, the writing current generator 132 may also adjust a current magnitude of the writing current Iwrite according to the adjusting signal D, i.e. the writing current Iwrite has the current magnitude corresponding to the adjusting signal D. In the present disclosure, the bit number of the adjusting signal D may determine accuracy of the current magnitude for the writing current Iwrite.
Referring to FIG. 2, in a reading period TR, the control signal Sctrl is at a low voltage level, Simultaneously, the sensing unit 112 may sense the sensing voltage Vcell from the memory cell, i.e. the memory cell is read by the verification circuit 110. In a writing period TW, the adjusting unit 130 may provide the writing current Iwrite having the current magnitude corresponding to the adjusting signal D to the memory cell, so as to change the resistance of the memory cell. For example, for the duration that the data value of the adjusting signal D is “0010”, the verification circuit 110 may provide the writing current Iwrite with the current magnitude corresponding to “0010” to the memory cell in a writing period TW. Next, in a reading period TR, the verification circuit 110 may sense and determine whether the memory cell is in a reset state. If not, the verification circuit 110 may provide the writing current Iwrite with the current magnitude corresponding to “0011” to the memory cell in a next writing period TW. Therefore, the verification circuit 110 may gradually increase the writing current Iwrite until the memory cell is transformed from a non-reset state to a reset state. For example, for the duration that the data value of the adjusting signal D is “1000”, the verification circuit 110 may provide the writing current Iwrite with the current magnitude corresponding to “1000” to the memory cell in a writing period TW. Next, the verification circuit 110 may read the memory cell to obtain the sensing voltage Vcell corresponding to the current magnitude “1000” in a reading period TR. The comparing signal Sc may indicate that the read memory cell has been transformed into a reset state when the sensing voltage Vcell corresponding to the current magnitude “1000” is larger than or equal to the reference voltage Vref. Next, the flip-flop 126 may provide a verification signal Sver to the determining unit 128, so as to provide a next enable signal SEN to the sensing unit 112 for verifying another memory cell.
FIG. 3A shows a schematic diagram of a control unit according to an exemplary embodiment. Corresponding to an adjusting signal D with four bits, the control unit comprises sixteen detecting units 310, five NOR gates 320 and four inverters 330. FIG. 3B shows a schematic diagram of a detecting unit according to an exemplary embodiment. The detecting unit comprises two delay units 340 and 350, two XOR gates 360 and 370, an inverter 380 and a flip-flop 390. In a verification circuit, a period time of a writing period TW is determined by the delay unit 340, and an entire period time of a writing period TW and a reading period TR is determined by the delay unit 350. FIG. 3C shows a schematic diagram of a calculating unit according to an exemplary embodiment. In one embodiment, the calculating unit is an accumulator comprising four flip-flops.
FIG. 4 shows a verification circuit 410 according to another exemplary embodiment. Compared with the adjusting unit 130 of the verification circuit 110 in FIG. 1, an adjusting unit 430 further comprises a register 436. As described above, when the comparing signal Sc indicates that the read memory cell has been transformed into a reset state, the flip-flop 126 may generate the verification signal Sver to the determining unit 128 to verify another memory cell. Simultaneously, the flip-flop 126 may also provide the verification signal Sver to the register 436, so as to store an adjusting signal D corresponding to the present current magnitude of the writing current Iwrite as a reference adjusting signal Dref. Next, the determining unit 128 may provide a next enable signal SEN to the register 436, so as to provide the reference adjusting signal Dref stored in the register 436 to the calculating unit 134. Next, the calculating unit 134 may set the data value of the adjusting signal D according to the data value of the reference adjusting signal Dref such that the writing current generator 132 may provide a writing current Iwrite corresponding to the reference adjusting signal Dref to the another memory cell to be verified.
FIGS. 5A and 5B show a waveform diagram illustrating the verification circuit 410 of FIG. 4 performing a verification procedure for different memory cells, respectively. Referring to FIG. 4 and FIG. 5A together, first, the verification circuit 410 starts to verify a memory cell Cell 1 of the PCM array 150. As described above, for the duration that the data value of the adjusting signal D is “1000”, the verification circuit 410 senses that the memory cell Cell 1 has been transformed into a reset state. Next, the register 436 may store “1000” as the data value of the reference adjusting signal Dref according to the verification signal Sver. Next, the verification circuit 410 starts to verify another memory cell Cell 2 of the PCM array 150. The register 436 may provide the reference adjusting signal Dref to the calculating unit 134 as an initial value of the adjusting signal D according to an enable signal SEN corresponding to the memory cell Cell 2. For the memory cell Cell 2, first, the verification circuit 410 may read the memory cell Cell 2. Next, when sensing that the memory cell Cell 2 is in a non-reset state, the verification circuit 410 may provide a writing current Iwrite corresponding to the reference adjusting signal Dref, i.e. the calculating unit 134 may provide the adjusting signal D which has data value “1000” to the writing current generator 132, so as to generate the writing current Iwrite. Next, in a reading period TR, the verification circuit 410 may read the memory cell 2 to obtain a sensing voltage Vcell corresponding to “1000”. The comparing signal Sc indicates that the memory cell Cell 2 has been transformed into a reset state when the sensing voltage Vcell is larger than or equal to the reference voltage Vref. Next, the flip-flop 126 generates the verification signal Sver to the determining unit 128 to notify that the memory cell Cell 2 has been completely verified. Next, a next memory cell is verified until each memory cell of the PCM array has been completely verified. Accordingly, a verification time of a PCM memory array is decreased.
Referring to FIG. 4 and FIG. 5B together, after the memory cell Cell 1 has been verified, the data value “1000” of the adjusting signal D is stored into the register 436 as the data value of the reference adjusting signal Dref. Next, when sensing that the memory cell Cell2 is in a non-reset state, the verification circuit 410 may provide the writing current Iwrite with a current magnitude corresponding to the reference adjusting signal Dref to the memory cell Cell 2. Next, in a reading period TR, the verification circuit 410 may read the memory cell 2 to obtain a sensing voltage Vcell corresponding to “1000”. When the sensing voltage Vcell is smaller than the reference voltage Vref (i.e. the memory cell Cell 2 is in a non-reset state), the verification circuit 410 may gradually increase the writing current Iwrite according to the adjusting signal D until the memory cell Cell 2 is transformed into a reset state, as shown in FIG. 5B. In one embodiment, the calculating unit 134 may use the data value “1000” of the reference adjusting signal Dref as the initial value of the adjusting signal D, and increase the data value of the adjusting signal D according to the pulse number of the signal Sclk.
FIG. 6 shows a verification method for a PCM array according to an exemplary embodiment. First, in step S602, a memory cell of the PCM array is read to obtain a sensing voltage. Next, it is determined whether the memory cell has been transformed into a reset state by comparing the sensing voltage with a reference voltage (step S604). Next, in step S606, a writing current is provided to the memory cell when the sensing voltage is smaller than the reference voltage (i.e. the memory cell is in a non-reset state), and the writing current is gradually increased until the sensing voltage corresponding to the writing current is larger than or equal to the reference voltage, i.e. the memory cell is in a reset state, thus the memory cell is completely verified.
FIG. 7 shows a verification method for a PCM array according to another exemplary embodiment. First, in step S702, a writing current is provided to a first memory cell of the PCM array, and the writing current is gradually increased until a sensing voltage sensed from the first memory cell is larger than or equal to a reference voltage, i.e. the first memory cell has been transformed into a reset state. Next, a current magnitude of the writing current is recorded and stored as a reference current magnitude when the first memory cell has been transformed into a reset state (step S704). Next, a second memory cell of the PCM array is read to obtain a second sensing voltage (step S706). Next, it is determined whether the second memory cell is in a reset state by comparing the second sensing voltage with a reference voltage (step S708). A writing current with the reference current magnitude is provided to the second memory cell when the second memory cell is in a non-reset state, so as to transform the second memory cell from a non-reset state to a reset state (step S710). The second memory cell is in a non-reset state when the second sensing voltage corresponding to the writing current is smaller than the reference voltage. Therefore, the writing current is gradually increased until the second sensing voltage corresponding to the writing current is larger than or equal to the reference voltage, such that the second memory cell is transformed into a reset state.
While the disclosure has been described by way of example and in terms of embodiments, it is to be understood that the disclosure is not limited thereto. It will be apparent to those skilled in the art that various modifications and variations can be made in the disclosure. It is intended that the embodiments described be considered as exemplary only, with the true scope of the embodiments being indicated by the following claims and their equivalents.

Claims (29)

What is claimed is:
1. A verification circuit for a phase change memory array, comprising:
a sensing unit, sensing a first sensing voltage from a first memory cell of the phase change memory array according to an enable signal;
a comparator, generating a comparing signal according to the first sensing voltage and a reference voltage to indicate whether the first memory cell is in a reset state;
a control unit, generating a control signal according to the enable signal; an operating unit, generating a first signal according to the control signal to indicate whether the comparator is active; and
an adjusting unit, providing a writing current to the first memory cell and adjusting the writing current according to the control signal until the comparing signal indicates that the first memory cell is in a reset state.
2. The verification circuit as claimed in claim 1, wherein the comparing signal indicates that the first memory cell is in a non-reset state when the first sensing voltage is smaller than the reference voltage, and the comparing signal indicates that the first memory cell is in a reset state when the first sensing voltage is larger than or equal to the reference voltage.
3. The verification circuit as claimed in claim 2, wherein when the comparing signal indicates that the first memory cell is in a non-reset state, the adjusting unit gradually increases the writing current according to the control signal.
4. The verification circuit as claimed in claim 1, wherein the control signal is a pulse signal, and wherein the sensing unit senses the first sensing voltage from the first memory cell when the control signal is at a first voltage level, and the adjusting unit provides the writing current to the first memory cell when the control signal is at a second voltage level.
5. The verification circuit as claimed in claim 4, further comprising:
a first switch, having a first terminal coupled to the control unit and a second terminal coupled to the adjusting unit, wherein the first switch is controlled to transmit the control signal of the control unit to the adjusting unit according to the comparing signal; and
a second switch coupled between a specific voltage and the second terminal, having a control terminal for receiving the comparing signal.
6. The verification circuit as claimed in claim 5, further comprising:
a delay unit, delaying the first signal to generate a second signal;
a flip-flop, having a data input terminal coupled to the second terminal, a clock input terminal for receiving the second signal, and a data output terminal for providing a verification signal; and
a determining unit, providing the enable signal to the control unit.
7. The verification circuit as claimed in claim 6, wherein the adjusting unit further comprises:
a calculating unit, calculating the pulse number of the control signal to generate an adjusting signal with a plurality of bits; and
a writing current generator, generating the writing current which has a current magnitude corresponding to the adjusting signal, and wherein the current magnitude of the writing current is of reference current magnitude when the comparing signal indicates that the first memory cell is in a reset state.
8. The verification circuit as claimed in claim 7, wherein the adjusting unit further comprises:
a register, storing the reference current magnitude.
9. The verification circuit as claimed in claim 6, wherein when the comparing signal indicates that the first memory cell is in a reset state, the determining unit provides the enable signal to the sensing unit according to the verification signal such that the sensing unit senses a second sensing voltage from a second memory cell of the phase change memory array according to the enable signal.
10. The verification circuit as claimed in claim 9, wherein when the comparing signal indicates that the first memory cell is in a reset state, the determining unit provides the enable signal to the control unit according to the verification signal such that the control unit generates the control signal according to the enable signal.
11. The verification circuit as claimed in claim 10, wherein the adjusting unit provides the writing current with the reference current magnitude to the second memory cell according to the control signal.
12. The verification circuit as claimed in claim 11, wherein the comparator generates the comparing signal according to the reference voltage and the second sensing voltage corresponding to the reference current magnitude, so as to indicate whether the second memory cell is in a reset state.
13. The verification circuit as claimed in claim 12, wherein the comparing signal indicates that the second memory cell is in a reset state when the second sensing voltage is larger than or equal to the reference voltage, and wherein the comparing signal indicates that the second memory cell is in a non-reset state when the second sensing voltage is smaller than the reference voltage.
14. The verification circuit as claimed in claim 13, wherein when the comparing signal indicates that the second memory cell is in a non-reset state, the adjusting unit gradually increases the writing current provided to the second memory cell according to the control signal such that the current magnitude of the writing current is larger than the reference current magnitude.
15. A verification method for a phase change memory array, comprising:
providing a writing current to a first memory cell of the phase change memory array and gradually increasing the writing current until a first sensing voltage sensed from the first memory cell is larger than or equal to a reference voltage;
recording the current magnitude of the writing current as a reference current magnitude when the first sensing voltage is larger than or equal to a reference voltage;
reading a second memory cell of the phase change memory array to obtain a second sensing voltage;
determining whether the second memory cell is in a reset state by comparing the second sensing voltage and the reference voltage; and
providing the writing current with the reference current magnitude to the second memory cell to transform the second memory cell into a reset state when the second memory cell is in a non-reset state.
16. The verification method as claimed in claim 15, further comprising:
when the second sensing voltage corresponding to the reference current magnitude is smaller than the reference voltage, gradually increasing the writing current until the second sensing voltage corresponding to the writing current is larger than or equal to the reference voltage.
17. The verification method as claimed in claim 16, wherein the second memory cell is in a reset state when the second sensing voltage corresponding to the writing current is larger than or equal to the reference voltage, and wherein the second memory cell is in a non-reset state when the second sensing voltage corresponding to the writing current is smaller than the reference voltage.
18. A method, comprising:
increasing a writing current applied to a first memory cell of a non-volatile memory until a first sensing voltage is larger than or equal to a reference voltage;
identifying a magnitude of the writing current as a reference current magnitude;
determining that a second memory cell of the non-volatile memory is in a non-reset state by comparing a second sensing voltage and the reference voltage; and
providing the writing current with the reference current magnitude to the second memory cell in response to said determining.
19. The method of claim 18, wherein the non-volatile memory comprises a memory which has different resistances corresponding to at least two switchable states of the non-volatile memory.
20. The method of claim 19, wherein the two switchable states comprise a crystalline state and an amorphous state indicative of stored data in the non-volatile memory.
21. The method of claim 18, wherein the non-volatile memory comprises a phase change memory.
22. The method of claim 18, further comprising determining that the first memory cell is in a reset state if the first sensing voltage is larger than or equal to the reference voltage, wherein said identifying comprises identifying the magnitude of the writing current in response to determining that the first memory cell is in the reset state.
23. The method of claim 18, further comprising transforming the second memory cell into a reset state in response to providing the writing current with the reference current magnitude.
24. A circuit, comprising:
a sensing unit configured to identify a sensing voltage associated with a first memory cell of a non-volatile memory;
a writing current generator configured to increase a writing current applied to the first memory cell until the first sensing voltage is larger than or equal to a reference voltage, wherein a magnitude of the writing current is configured to be identified as a reference current magnitude; and
a comparator configured to compare a second sensing voltage and the reference voltage, wherein the writing current with the reference current magnitude is applied to a second memory cell of the non-volatile memory in response to determining that the second memory cell is in a non-reset state.
25. The circuit of claim 24, wherein the non-volatile memory comprises a memory device which changes resistance according to a switched state of the non-volatile memory.
26. The circuit of claim 25, wherein the switched state comprises a crystalline state or an amorphous state indicative of stored data in the non-volatile memory.
27. The circuit of claim 24, wherein the non-volatile memory comprises a phase change memory.
28. The circuit of claim 24, wherein the comparator is further configured to determine that the first memory cell is in a reset state if the first sensing voltage is larger than or equal to the reference voltage, and wherein the magnitude of the writing current is configured to be identified in response to determining that the first memory cell is in the reset state.
29. The circuit of claim 24, wherein the second memory cell is configured to be transformed into a reset state in response to applying the writing current with the reference current magnitude.
US13/934,954 2008-12-30 2013-07-03 Verification circuits and methods for phase change memory array Active 2029-09-12 USRE45035E1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US13/934,954 USRE45035E1 (en) 2008-12-30 2013-07-03 Verification circuits and methods for phase change memory array

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
TW097151378A TWI402845B (en) 2008-12-30 2008-12-30 Verification circuits and methods for phase change memory
TW097151378A 2008-12-30
US12/485,720 US7974122B2 (en) 2008-12-30 2009-06-16 Verification circuits and methods for phase change memory array
US13/934,954 USRE45035E1 (en) 2008-12-30 2013-07-03 Verification circuits and methods for phase change memory array

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US12/485,720 Reissue US7974122B2 (en) 2008-12-30 2009-06-16 Verification circuits and methods for phase change memory array

Publications (1)

Publication Number Publication Date
USRE45035E1 true USRE45035E1 (en) 2014-07-22

Family

ID=42284771

Family Applications (2)

Application Number Title Priority Date Filing Date
US12/485,720 Ceased US7974122B2 (en) 2008-12-30 2009-06-16 Verification circuits and methods for phase change memory array
US13/934,954 Active 2029-09-12 USRE45035E1 (en) 2008-12-30 2013-07-03 Verification circuits and methods for phase change memory array

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US12/485,720 Ceased US7974122B2 (en) 2008-12-30 2009-06-16 Verification circuits and methods for phase change memory array

Country Status (2)

Country Link
US (2) US7974122B2 (en)
TW (1) TWI402845B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8982634B2 (en) * 2012-07-11 2015-03-17 Ememory Technology Inc. Flash memory

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI347607B (en) 2007-11-08 2011-08-21 Ind Tech Res Inst Writing system and method for a phase change memory
US20090304775A1 (en) * 2008-06-04 2009-12-10 Joshi Ashok V Drug-Exuding Orthopedic Implant
TWI402845B (en) 2008-12-30 2013-07-21 Higgs Opl Capital Llc Verification circuits and methods for phase change memory
TWI412124B (en) 2008-12-31 2013-10-11 Higgs Opl Capital Llc Phase change memory
KR101652333B1 (en) 2010-02-10 2016-08-30 삼성전자주식회사 Variable resistance memory device and program method thereof
US8605531B2 (en) * 2011-06-20 2013-12-10 Intel Corporation Fast verify for phase change memory with switch
US8737120B2 (en) 2011-07-29 2014-05-27 Micron Technology, Inc. Reference voltage generators and sensing circuits
US9281061B2 (en) 2012-09-19 2016-03-08 Micron Technology, Inc. Methods and apparatuses having a voltage generator with an adjustable voltage drop for representing a voltage drop of a memory cell and/or a current mirror circuit and replica circuit
US9001553B1 (en) * 2012-11-06 2015-04-07 Adesto Technologies Corporation Resistive devices and methods of operation thereof
KR20140081027A (en) * 2012-12-21 2014-07-01 에스케이하이닉스 주식회사 Nonvolatile Memory Apparatus
US10049727B2 (en) * 2016-06-22 2018-08-14 Darryl G. Walker Semiconductor devices, circuits and methods for read and/or write assist of an SRAM circuit portion based on voltage detection and/or temperature detection circuits
US10861544B2 (en) 2016-09-21 2020-12-08 Hefei Reliance Memory Limited Adaptive memory cell write conditions
US10832770B2 (en) 2019-03-13 2020-11-10 Sandisk Technologies Llc Single pulse memory operation
KR20210048007A (en) * 2019-10-22 2021-05-03 삼성전자주식회사 Memory device and operating method thereof
KR20210047606A (en) * 2019-10-22 2021-04-30 삼성전자주식회사 Memory device
US11900992B2 (en) * 2022-02-03 2024-02-13 Micron Technology, Inc. Reference voltage adjustment for word line groups

Citations (79)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4974205A (en) 1988-10-24 1990-11-27 Fujitsu Limited Josephson memory and read/write circuit
US5694363A (en) 1995-04-28 1997-12-02 Sgs-Thomson Microelectronics S.R.L. Reading circuit for memory cell devices having a low supply voltage
US5787042A (en) 1997-03-18 1998-07-28 Micron Technology, Inc. Method and apparatus for reading out a programmable resistor memory
US5883837A (en) 1996-09-30 1999-03-16 Sgs-Thomson Microelectronics, S.R.L. Reading circuit for semiconductor memory cells
JP2002246561A (en) 2001-02-19 2002-08-30 Dainippon Printing Co Ltd Storage cell, memory matrix using the same, and their manufacturing methods
US6487113B1 (en) 2001-06-29 2002-11-26 Ovonyx, Inc. Programming a phase-change memory with slow quench time
CN1455412A (en) 2002-04-30 2003-11-12 惠普公司 Resistance crosspoint storage array with charge injection differential read-out amplifier
JP2004274055A (en) 2003-03-04 2004-09-30 Samsung Electronics Co Ltd Storage cell for memory element, as well as phase change type memory element and its forming method
US20050068804A1 (en) 2003-09-25 2005-03-31 Samsung Electronics Co., Ltd. Phase-change memory device and method that maintains the resistance of a phase-change material in a reset state within a constant resistance range
JP2005525690A (en) 2001-08-31 2005-08-25 オヴォニクス インコーポレイテッド Phase change memory with higher pore position
JP2006510220A (en) 2002-12-13 2006-03-23 オヴォニクス,インコーポレイテッド Memory and access device
JP2006108645A (en) 2004-10-08 2006-04-20 Ind Technol Res Inst Multilevel phase change memory, method of operating the same, and method of manufacturing the same
US7054213B2 (en) 2000-12-28 2006-05-30 Stmicroelectronics, Inc. Method and circuit for determining sense amplifier sensitivity
US7110286B2 (en) 2004-02-04 2006-09-19 Samsung Electronics Co., Ltd. Phase-change memory device and method of writing a phase-change memory device
US20060221678A1 (en) 2005-03-30 2006-10-05 Ferdinando Bedeschi Circuit for reading memory cells
JP2006295168A (en) 2005-04-06 2006-10-26 Samsung Electronics Co Ltd Multivalued resistive memory element, and its manufacture and operating method therefor
US7154774B2 (en) 2005-03-30 2006-12-26 Ovonyx, Inc. Detecting switching of access elements of phase change memory cells
US20070002654A1 (en) 2005-06-30 2007-01-04 Carlo Borromeo Method and apparatus for sensing a state of a memory cell
US7190607B2 (en) 2004-06-19 2007-03-13 Samsung Electronics Co., Ltd. Phase-change memory element driver circuits using measurement to control current and methods of controlling drive current of phase-change memory elements using measurement
JP2007103945A (en) 2005-10-06 2007-04-19 Samsung Electronics Co Ltd Phase change memory devices using magnetic resistance effect, methods of operating and methods of fabricating same
JP2007184591A (en) 2006-01-02 2007-07-19 Samsung Electronics Co Ltd Phase change storage element including contact with multi-bit cell and diameter to be adjusted therein, its manufacturing method, and its program method
US7259982B2 (en) 2005-01-05 2007-08-21 Intel Corporation Reading phase change memories to reduce read disturbs
US7324371B2 (en) 2001-12-27 2008-01-29 Stmicroelectronics S.R.L. Method of writing to a phase change memory device
CN101136452A (en) 2006-08-31 2008-03-05 财团法人工业技术研究院 Phase variation storage installation and its making method
US7359231B2 (en) 2004-06-30 2008-04-15 Intel Corporation Providing current for phase change memories
CN101202326A (en) 2006-12-14 2008-06-18 财团法人工业技术研究院 Phase-change storage apparatus and method of manufacture
TW200828506A (en) 2006-12-29 2008-07-01 Ind Tech Res Inst Phase-change memory element and method for fabricating the same
JP2008171541A (en) 2007-01-12 2008-07-24 Ind Technol Res Inst Method and system for driving phase change memory
JP2008193071A (en) 2007-02-01 2008-08-21 Ind Technol Res Inst Phase change memory
US7423897B2 (en) 2004-10-01 2008-09-09 Ovonyx, Inc. Method of operating a programmable resistance memory array
CN101266834A (en) 2007-03-15 2008-09-17 财团法人工业技术研究院 Writing drive method and system for phase change memory
CN101271862A (en) 2007-03-19 2008-09-24 财团法人工业技术研究院 Memory element and manufacturing method thereof
JP2008226427A (en) 2007-03-08 2008-09-25 Ind Technol Res Inst Writing method and system for phase change memory
CN101276643A (en) 2007-03-28 2008-10-01 财团法人工业技术研究院 Write-in method and system of phase variation memory
US7447092B2 (en) 2003-08-22 2008-11-04 Samsung Electronics Co., Ltd. Write driver circuit for controlling a write current applied to a phase change memory based on an ambient temperature
TW200845443A (en) 2007-05-14 2008-11-16 Ind Tech Res Inst Phase-change memory element
US7457151B2 (en) 2005-07-13 2008-11-25 Samsung Electronics Co., Ltd. Phase change random access memory (PRAM) device having variable drive voltages
CN101312230A (en) 2007-05-25 2008-11-26 财团法人工业技术研究院 Phase change storage apparatus and method of manufacture
TW200849278A (en) 2007-06-13 2008-12-16 Ind Tech Res Inst A writing circuit for a phase change memory
CN101330126A (en) 2007-06-19 2008-12-24 财团法人工业技术研究院 Phase variation storage unit structure and method for manufacturing the same
CN101335045A (en) 2007-06-27 2008-12-31 财团法人工业技术研究院 Write circuit of phase-change memory
TWI305042B (en) 2006-08-16 2009-01-01 Ind Tech Res Inst Phase-change memory devices and methods for fabricating the same
TW200901196A (en) 2007-06-25 2009-01-01 Ind Tech Res Inst Sensing circuits and methods of phase change memory
TW200908294A (en) 2007-08-14 2009-02-16 Ind Tech Res Inst Phase-change memory
CN101369450A (en) 2007-08-17 2009-02-18 财团法人工业技术研究院 Sensing circuit of phase-change memory
CN101383397A (en) 2007-09-04 2009-03-11 财团法人工业技术研究院 Phase change memory device and fabrication method thereof
TW200915318A (en) 2007-09-21 2009-04-01 Ind Tech Res Inst Device controlling phase change storage element and method of increasing realibility of phase change storage elememt
US7515460B2 (en) 2005-01-25 2009-04-07 Intel Corporation Multilevel programming of phase change memory cells
CN101414480A (en) 2007-10-19 2009-04-22 财团法人工业技术研究院 Control device for phase-change memory cell and method for adding phase-change memory cell reliability
TW200921682A (en) 2007-11-08 2009-05-16 Ind Tech Res Inst Writing system and method for a phase change memory
US7535747B2 (en) 2006-09-04 2009-05-19 Samsung Electronics Co., Ltd. Phase change random access memory and related methods of operation
US7542356B2 (en) 2006-11-01 2009-06-02 Samsung Electronics Co., Ltd. Semiconductor memory device and method for reducing cell activation during write operations
CN101452743A (en) 2007-12-05 2009-06-10 财团法人工业技术研究院 Writing-in system and method for phase change memory
TW200926186A (en) 2007-12-03 2009-06-16 Ind Tech Res Inst Memory and method for reducing power dissipation caused by current leakage
CN101471130A (en) 2007-12-25 2009-07-01 财团法人工业技术研究院 Phase-change memory device and its control method
US7566895B2 (en) 2006-11-24 2009-07-28 Industrial Technology Research Institute Phase change memory device and method for fabricating the same
US20090189142A1 (en) 2008-01-25 2009-07-30 Industrial Technology Research Institute Phase-Change Memory
CN101504968A (en) 2008-01-25 2009-08-12 财团法人工业技术研究院 Phase-change memory and its production method
CN101504863A (en) 2008-02-05 2009-08-12 财团法人工业技术研究院 Memory and method for suppressing energy consumption of memory leakage current
US7609544B2 (en) 2004-11-26 2009-10-27 Renesas Technology Corp. Programmable semiconductor memory device
US20090296458A1 (en) 2008-05-27 2009-12-03 Samsung Electronics Co., Ltd. Resistance variable memory device and method of writing data
CN101599301A (en) 2008-06-06 2009-12-09 财团法人工业技术研究院 Storer and memory-writing method
TW200951981A (en) 2008-06-02 2009-12-16 Ind Tech Res Inst Memory and writing method thereof
TW200952169A (en) 2008-06-03 2009-12-16 Ind Tech Res Inst Phase-change memory devices and methods for fabricating the same
US7639522B2 (en) * 2006-11-29 2009-12-29 Samsung Electronics Co., Ltd. Method of driving multi-level variable resistive memory device and multi-level variable resistive memory device
US7646627B2 (en) 2006-05-18 2010-01-12 Renesas Technology Corp. Magnetic random access memory having improved read disturb suppression and thermal disturbance resistance
CN101626060A (en) 2008-07-11 2010-01-13 财团法人工业技术研究院 Phase-change memory element
US7670869B2 (en) 2007-02-16 2010-03-02 Industrial Technology Research Institute Semiconductor device and fabrications thereof
US20100117050A1 (en) 2008-11-12 2010-05-13 Industrial Technology Research Institute Phase-change memory element
TW201025326A (en) 2008-12-30 2010-07-01 Ind Tech Res Inst Verification circuits and methods for phase change memory
TW201025573A (en) 2008-12-31 2010-07-01 Ind Tech Res Inst Phase change memory
US7773408B2 (en) 2005-11-30 2010-08-10 Renesas Technology Corp. Nonvolatile memory device
US7773411B2 (en) 2007-12-06 2010-08-10 Industrial Technology Research Institute Phase change memory and control method thereof
CN101814323A (en) 2009-02-23 2010-08-25 财团法人工业技术研究院 Verification circuit and method of phase change memory array
US7787281B2 (en) 2007-07-05 2010-08-31 Industrial Technology Research Institute Writing circuit for a phase change memory
CN101819816A (en) 2009-02-27 2010-09-01 财团法人工业技术研究院 Phase change memory
TWI334604B (en) 2007-06-25 2010-12-11 Ind Tech Res Inst Sensing circuits of phase change memory
TWI336925B (en) 2007-05-31 2011-02-01 Ind Tech Res Inst Phase-change memory cell structures and methods for fabricating the same
TWI343642B (en) 2007-04-24 2011-06-11 Ind Tech Res Inst Phase-change memory devices and methods for fabricating the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7280390B2 (en) * 2005-04-14 2007-10-09 Ovonyx, Inc. Reading phase change memories without triggering reset cell threshold devices
US7391664B2 (en) * 2006-04-27 2008-06-24 Ovonyx, Inc. Page mode access for non-volatile memory arrays

Patent Citations (116)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4974205A (en) 1988-10-24 1990-11-27 Fujitsu Limited Josephson memory and read/write circuit
US5694363A (en) 1995-04-28 1997-12-02 Sgs-Thomson Microelectronics S.R.L. Reading circuit for memory cell devices having a low supply voltage
US5883837A (en) 1996-09-30 1999-03-16 Sgs-Thomson Microelectronics, S.R.L. Reading circuit for semiconductor memory cells
US5787042A (en) 1997-03-18 1998-07-28 Micron Technology, Inc. Method and apparatus for reading out a programmable resistor memory
US7054213B2 (en) 2000-12-28 2006-05-30 Stmicroelectronics, Inc. Method and circuit for determining sense amplifier sensitivity
JP2002246561A (en) 2001-02-19 2002-08-30 Dainippon Printing Co Ltd Storage cell, memory matrix using the same, and their manufacturing methods
US6487113B1 (en) 2001-06-29 2002-11-26 Ovonyx, Inc. Programming a phase-change memory with slow quench time
JP2005525690A (en) 2001-08-31 2005-08-25 オヴォニクス インコーポレイテッド Phase change memory with higher pore position
US7324371B2 (en) 2001-12-27 2008-01-29 Stmicroelectronics S.R.L. Method of writing to a phase change memory device
CN1455412A (en) 2002-04-30 2003-11-12 惠普公司 Resistance crosspoint storage array with charge injection differential read-out amplifier
JP2006510220A (en) 2002-12-13 2006-03-23 オヴォニクス,インコーポレイテッド Memory and access device
JP2004274055A (en) 2003-03-04 2004-09-30 Samsung Electronics Co Ltd Storage cell for memory element, as well as phase change type memory element and its forming method
US7447092B2 (en) 2003-08-22 2008-11-04 Samsung Electronics Co., Ltd. Write driver circuit for controlling a write current applied to a phase change memory based on an ambient temperature
US20050068804A1 (en) 2003-09-25 2005-03-31 Samsung Electronics Co., Ltd. Phase-change memory device and method that maintains the resistance of a phase-change material in a reset state within a constant resistance range
US7110286B2 (en) 2004-02-04 2006-09-19 Samsung Electronics Co., Ltd. Phase-change memory device and method of writing a phase-change memory device
US7190607B2 (en) 2004-06-19 2007-03-13 Samsung Electronics Co., Ltd. Phase-change memory element driver circuits using measurement to control current and methods of controlling drive current of phase-change memory elements using measurement
US7359231B2 (en) 2004-06-30 2008-04-15 Intel Corporation Providing current for phase change memories
US7423897B2 (en) 2004-10-01 2008-09-09 Ovonyx, Inc. Method of operating a programmable resistance memory array
JP2006108645A (en) 2004-10-08 2006-04-20 Ind Technol Res Inst Multilevel phase change memory, method of operating the same, and method of manufacturing the same
US7609544B2 (en) 2004-11-26 2009-10-27 Renesas Technology Corp. Programmable semiconductor memory device
US7259982B2 (en) 2005-01-05 2007-08-21 Intel Corporation Reading phase change memories to reduce read disturbs
US7515460B2 (en) 2005-01-25 2009-04-07 Intel Corporation Multilevel programming of phase change memory cells
US20060221678A1 (en) 2005-03-30 2006-10-05 Ferdinando Bedeschi Circuit for reading memory cells
US7154774B2 (en) 2005-03-30 2006-12-26 Ovonyx, Inc. Detecting switching of access elements of phase change memory cells
US7388775B2 (en) 2005-03-30 2008-06-17 Ovonyx, Inc. Detecting switching of access elements of phase change memory cells
JP2006295168A (en) 2005-04-06 2006-10-26 Samsung Electronics Co Ltd Multivalued resistive memory element, and its manufacture and operating method therefor
US20070002654A1 (en) 2005-06-30 2007-01-04 Carlo Borromeo Method and apparatus for sensing a state of a memory cell
US7457151B2 (en) 2005-07-13 2008-11-25 Samsung Electronics Co., Ltd. Phase change random access memory (PRAM) device having variable drive voltages
JP2007103945A (en) 2005-10-06 2007-04-19 Samsung Electronics Co Ltd Phase change memory devices using magnetic resistance effect, methods of operating and methods of fabricating same
US7773408B2 (en) 2005-11-30 2010-08-10 Renesas Technology Corp. Nonvolatile memory device
JP2007184591A (en) 2006-01-02 2007-07-19 Samsung Electronics Co Ltd Phase change storage element including contact with multi-bit cell and diameter to be adjusted therein, its manufacturing method, and its program method
US7646627B2 (en) 2006-05-18 2010-01-12 Renesas Technology Corp. Magnetic random access memory having improved read disturb suppression and thermal disturbance resistance
US7745811B2 (en) 2006-08-16 2010-06-29 Industrial Technology Research Institute Phase change memory devices and methods for fabricating the same
TWI305042B (en) 2006-08-16 2009-01-01 Ind Tech Res Inst Phase-change memory devices and methods for fabricating the same
CN101136452A (en) 2006-08-31 2008-03-05 财团法人工业技术研究院 Phase variation storage installation and its making method
US7535747B2 (en) 2006-09-04 2009-05-19 Samsung Electronics Co., Ltd. Phase change random access memory and related methods of operation
US7542356B2 (en) 2006-11-01 2009-06-02 Samsung Electronics Co., Ltd. Semiconductor memory device and method for reducing cell activation during write operations
US7566895B2 (en) 2006-11-24 2009-07-28 Industrial Technology Research Institute Phase change memory device and method for fabricating the same
TWI318470B (en) 2006-11-24 2009-12-11 Ind Tech Res Inst Phase change memory device and method of fabricating the same
US7639522B2 (en) * 2006-11-29 2009-12-29 Samsung Electronics Co., Ltd. Method of driving multi-level variable resistive memory device and multi-level variable resistive memory device
CN101202326A (en) 2006-12-14 2008-06-18 财团法人工业技术研究院 Phase-change storage apparatus and method of manufacture
TW200828506A (en) 2006-12-29 2008-07-01 Ind Tech Res Inst Phase-change memory element and method for fabricating the same
CN101211959A (en) 2006-12-29 2008-07-02 财团法人工业技术研究院 Phase-change memory and fabrication method thereof
US7521372B2 (en) 2006-12-29 2009-04-21 Industrial Technology Research Institute Method of fabrication of phase-change memory
US7643373B2 (en) 2007-01-12 2010-01-05 Shyh-Shyuan Sheu Driving method and system for a phase change memory
JP2008171541A (en) 2007-01-12 2008-07-24 Ind Technol Res Inst Method and system for driving phase change memory
TWI320180B (en) 2007-01-12 2010-02-01 A driving method and a driving system for writing the phase change memory
TWI326917B (en) 2007-02-01 2010-07-01 Ind Tech Res Inst Phase-change memory
JP2008193071A (en) 2007-02-01 2008-08-21 Ind Technol Res Inst Phase change memory
US7670869B2 (en) 2007-02-16 2010-03-02 Industrial Technology Research Institute Semiconductor device and fabrications thereof
TWI324823B (en) 2007-02-16 2010-05-11 Ind Tech Res Inst Memory device and fabrications thereof
TWI330846B (en) 2007-03-08 2010-09-21 Ind Tech Res Inst A writing method and system for a phase change memory
JP2008226427A (en) 2007-03-08 2008-09-25 Ind Technol Res Inst Writing method and system for phase change memory
US7773409B2 (en) 2007-03-08 2010-08-10 Industrial Technology Research Institute Writing method and system for a phase change memory
CN101266834A (en) 2007-03-15 2008-09-17 财团法人工业技术研究院 Writing drive method and system for phase change memory
CN101271862A (en) 2007-03-19 2008-09-24 财团法人工业技术研究院 Memory element and manufacturing method thereof
CN101276643A (en) 2007-03-28 2008-10-01 财团法人工业技术研究院 Write-in method and system of phase variation memory
US7964862B2 (en) 2007-04-24 2011-06-21 Industrial Technology Research Institute Phase change memory devices and methods for manufacturing the same
TWI343642B (en) 2007-04-24 2011-06-11 Ind Tech Res Inst Phase-change memory devices and methods for fabricating the same
CN101308903A (en) 2007-05-14 2008-11-19 财团法人工业技术研究院 Phase-change memory element
TW200845443A (en) 2007-05-14 2008-11-16 Ind Tech Res Inst Phase-change memory element
JP2008283163A (en) 2007-05-14 2008-11-20 Ind Technol Res Inst Phase change memory element
US7679163B2 (en) 2007-05-14 2010-03-16 Industrial Technology Research Institute Phase-change memory element
CN101312230A (en) 2007-05-25 2008-11-26 财团法人工业技术研究院 Phase change storage apparatus and method of manufacture
TWI336925B (en) 2007-05-31 2011-02-01 Ind Tech Res Inst Phase-change memory cell structures and methods for fabricating the same
US7923714B2 (en) 2007-05-31 2011-04-12 Industrial Technology Research Institute Phase change memory cell structures and methods for manufacturing the same
TW200849278A (en) 2007-06-13 2008-12-16 Ind Tech Res Inst A writing circuit for a phase change memory
US7672176B2 (en) 2007-06-13 2010-03-02 Industrial Technology Research Institute Writing circuit for a phase change memory
CN101330126A (en) 2007-06-19 2008-12-24 财团法人工业技术研究院 Phase variation storage unit structure and method for manufacturing the same
US7796454B2 (en) 2007-06-25 2010-09-14 Industrial Technology Research Institute Sensing circuit of a phase change memory and sensing method thereof
TWI334604B (en) 2007-06-25 2010-12-11 Ind Tech Res Inst Sensing circuits of phase change memory
US7933147B2 (en) 2007-06-25 2011-04-26 Industrial Technology Research Institute Sensing circuit of a phase change memory and sensing method thereof
TW200901196A (en) 2007-06-25 2009-01-01 Ind Tech Res Inst Sensing circuits and methods of phase change memory
CN101335045A (en) 2007-06-27 2008-12-31 财团法人工业技术研究院 Write circuit of phase-change memory
US7787281B2 (en) 2007-07-05 2010-08-31 Industrial Technology Research Institute Writing circuit for a phase change memory
TWI342022B (en) 2007-07-05 2011-05-11 Ind Tech Res Inst A writing circuit for a phase change memory
TW200908294A (en) 2007-08-14 2009-02-16 Ind Tech Res Inst Phase-change memory
CN101369450A (en) 2007-08-17 2009-02-18 财团法人工业技术研究院 Sensing circuit of phase-change memory
US7678606B2 (en) 2007-09-04 2010-03-16 Industrial Technology Research Institute Phase change memory device and fabrication method thereof
TW200913252A (en) 2007-09-04 2009-03-16 Ind Tech Res Inst Phase change memory device and fabrications thereof
CN101383397A (en) 2007-09-04 2009-03-11 财团法人工业技术研究院 Phase change memory device and fabrication method thereof
US7796455B2 (en) 2007-09-21 2010-09-14 Industrial Technology Research Institute Device controlling phase change storage element and method thereof
TW200915318A (en) 2007-09-21 2009-04-01 Ind Tech Res Inst Device controlling phase change storage element and method of increasing realibility of phase change storage elememt
CN101414480A (en) 2007-10-19 2009-04-22 财团法人工业技术研究院 Control device for phase-change memory cell and method for adding phase-change memory cell reliability
TW200921682A (en) 2007-11-08 2009-05-16 Ind Tech Res Inst Writing system and method for a phase change memory
US7773410B2 (en) 2007-11-08 2010-08-10 Industrial Technology Research Institute Writing system and method for phase change memory
TW200926186A (en) 2007-12-03 2009-06-16 Ind Tech Res Inst Memory and method for reducing power dissipation caused by current leakage
US7885109B2 (en) 2007-12-03 2011-02-08 Industrial Technology Research Institute Memory and method for dissipation caused by current leakage
CN101452743A (en) 2007-12-05 2009-06-10 财团法人工业技术研究院 Writing-in system and method for phase change memory
US7773411B2 (en) 2007-12-06 2010-08-10 Industrial Technology Research Institute Phase change memory and control method thereof
TWI328816B (en) 2007-12-06 2010-08-11 Ind Tech Res Inst Phase change memory and method of controlling phase change memory
CN101471130A (en) 2007-12-25 2009-07-01 财团法人工业技术研究院 Phase-change memory device and its control method
CN101504968A (en) 2008-01-25 2009-08-12 财团法人工业技术研究院 Phase-change memory and its production method
TW200937693A (en) 2008-01-25 2009-09-01 Ind Tech Res Inst Phase-change memory and method for fabricating the same
US20090189142A1 (en) 2008-01-25 2009-07-30 Industrial Technology Research Institute Phase-Change Memory
CN101504863A (en) 2008-02-05 2009-08-12 财团法人工业技术研究院 Memory and method for suppressing energy consumption of memory leakage current
US20090296458A1 (en) 2008-05-27 2009-12-03 Samsung Electronics Co., Ltd. Resistance variable memory device and method of writing data
TW200951981A (en) 2008-06-02 2009-12-16 Ind Tech Res Inst Memory and writing method thereof
US7889547B2 (en) 2008-06-02 2011-02-15 Industrial Technology Research Institute Memory and writing method thereof
US7858961B2 (en) 2008-06-03 2010-12-28 Industrial Technology Research Institute Phase change memory devices and methods for fabricating the same
TW200952169A (en) 2008-06-03 2009-12-16 Ind Tech Res Inst Phase-change memory devices and methods for fabricating the same
CN101599301A (en) 2008-06-06 2009-12-09 财团法人工业技术研究院 Storer and memory-writing method
TW201003851A (en) 2008-07-11 2010-01-16 Ind Tech Res Inst Phase change memory and method for fabricating the same
CN101626060A (en) 2008-07-11 2010-01-13 财团法人工业技术研究院 Phase-change memory element
US7919768B2 (en) 2008-07-11 2011-04-05 Industrial Technology Research Institute Phase-change memory element
CN101740716A (en) 2008-11-12 2010-06-16 财团法人工业技术研究院 Phase-change memory element and its forming method
TW201019467A (en) 2008-11-12 2010-05-16 Ind Tech Res Inst Phase-change memory element and method for fabricating the same
US20100117050A1 (en) 2008-11-12 2010-05-13 Industrial Technology Research Institute Phase-change memory element
US7974122B2 (en) 2008-12-30 2011-07-05 Industrial Technology Research Institute Verification circuits and methods for phase change memory array
TW201025326A (en) 2008-12-30 2010-07-01 Ind Tech Res Inst Verification circuits and methods for phase change memory
US20100165723A1 (en) 2008-12-31 2010-07-01 Industrial Technology Research Institute Phase change memory
TW201025573A (en) 2008-12-31 2010-07-01 Ind Tech Res Inst Phase change memory
US8199561B2 (en) 2008-12-31 2012-06-12 Higgs Opl. Capital Llc Phase change memory
US20120230099A1 (en) 2008-12-31 2012-09-13 Higgs Opl. Capitol LLC Phase change memory
CN101814323A (en) 2009-02-23 2010-08-25 财团法人工业技术研究院 Verification circuit and method of phase change memory array
CN101819816A (en) 2009-02-27 2010-09-01 财团法人工业技术研究院 Phase change memory

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
J.H. Yi et al., "Novel Cell Structure of PRAM With Thin Metal Layer Inserted GeSbTe", IEEE, IEDM '03 Technical Digest; 2003; pp. 901-904.
Stolowitz Ford Cowger LLP, "Listing of Related Cases", Oct. 1, 2013, 1 page.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8982634B2 (en) * 2012-07-11 2015-03-17 Ememory Technology Inc. Flash memory

Also Published As

Publication number Publication date
TW201025326A (en) 2010-07-01
US7974122B2 (en) 2011-07-05
US20100165720A1 (en) 2010-07-01
TWI402845B (en) 2013-07-21

Similar Documents

Publication Publication Date Title
USRE45035E1 (en) Verification circuits and methods for phase change memory array
US10530347B2 (en) Receiver-side setup and hold time calibration for source synchronous systems
CN107093459B (en) Nonvolatile memory device, reading method thereof, and memory system
KR101310991B1 (en) Read distribution management for phase change memory
JP4129170B2 (en) Semiconductor memory device and memory data correction method for memory cell
US10134468B2 (en) Cross point memory control
EP2374129B1 (en) Digitally-controllable delay for sense amplifier
US6813208B2 (en) System and method for sensing data stored in a resistive memory element using one bit of a digital count
KR100827703B1 (en) Method for testing for use in pram
US9070438B2 (en) Programming of phase-change memory cells
TW201118876A (en) Voltage compensation circuit, multi-level memory device with the same, and voltage compensation method for reading the multi-level memory device
US7450446B2 (en) Semiconductor memory device having delay circuit
US11869575B2 (en) Memory device having low write error rate
KR100656432B1 (en) Apparatus and method for controlling column selecting signal of semiconductor memory
US10490240B2 (en) Semiconductor memory device capable of correctly reading data
CN111627477A (en) Nonvolatile memory device for performing read operation and method of operating the same
EP3680905B1 (en) Random code generator
KR101933645B1 (en) Phase change memory device, method of generating operation voltage of the same and memory system having the same
US10908636B2 (en) Skew correction for source synchronous systems
US8184469B2 (en) Stored multi-bit data characterized by multiple-dimensional memory states
US7936629B2 (en) Table-based reference voltage characterization scheme
JP2734017B2 (en) Non-volatile memory
JP2004362756A5 (en)
KR100333711B1 (en) An apparatus and method for generating a reference voltage in ferroelectric RAM
US7463524B2 (en) Reading and writing method for non-volatile memory with multiple data states

Legal Events

Date Code Title Description
AS Assignment

Owner name: HIGGS OPL. CAPITAL LLC, DELAWARE

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE;REEL/FRAME:032544/0907

Effective date: 20111122

FPAY Fee payment

Year of fee payment: 4

AS Assignment

Owner name: GULA CONSULTING LIMITED LIABILITY COMPANY, DELAWAR

Free format text: MERGER;ASSIGNOR:HIGGS OPL. CAPITAL LLC;REEL/FRAME:037360/0803

Effective date: 20150826

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 8TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1552); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

Year of fee payment: 8

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 12TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1553); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

Year of fee payment: 12