USRE45881E1 - Method for enhancing the solderability of a surface - Google Patents
Method for enhancing the solderability of a surface Download PDFInfo
- Publication number
- USRE45881E1 USRE45881E1 US13/463,110 US201213463110A USRE45881E US RE45881 E1 USRE45881 E1 US RE45881E1 US 201213463110 A US201213463110 A US 201213463110A US RE45881 E USRE45881 E US RE45881E
- Authority
- US
- United States
- Prior art keywords
- acids
- ethoxylated
- process according
- resinous
- amines
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime, expires
Links
- 0 [1*]N1C([2*])=NC([3*])=C1[4*] Chemical compound [1*]N1C([2*])=NC([3*])=C1[4*] 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
- B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/46—Electroplating: Baths therefor from solutions of silver
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
-
- a). cleaning the metal surface;
- b). optionally, etching the metal surface;
- c). treating the metal surface with an immersion silver plating solution, said solution comprising:
- 1. a soluble source of silver ions;
- 2. an acid;
- 3. an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphoteric salts, resinous amines, resinous amides, fatty acids, resinous acids, and mixtures of the foregoing;
- 4. optionally, an imidazole, benzimidazole, or imidazole derivative; and
- 5. optionally, an oxidant.
-
- a). cleaning the metal surfaces;
- b). optionally, etching the metal surfaces;
- c). treating the metal surface with an immersion silver plating solution;
- d). treating the immersion silver plated surface with a solution which comprises an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphoteric salts, resinous amines, resinous amides, fatty acids, resinous acids and mixtures of the foregoing.
-
- a). Acid Cleaner, 5 minutes, 120° F.
- b). Water Rinse
- c). Sodium persulfate/sulfuric acid microetch, 1 minute, 95° F.
- d). Water rinse
- e). Water rinse
- f). Immersion silver plate using the following composition
hydroxy ethylenediamine tetraacetic acid | 10 | gr/l | ||
silver nitrate | 2.4 | gr/l | ||
igepal Co730 | 5.0 | gr/l | ||
imidazole | 10 | gr/l | ||
nitric acid | 32.0 | ml/l | ||
-
- g). water rinse.
-
- h). treatment with an aqueous solution containing: 5.0 gr/l Cyastat L5 (quaternary ammonium methylsulfate of a fatty amidoalkyl amine) 32 ml/l Nitric Acid (70%) balance-water.
- i). water rinse.
TABLE 1 | ||
Example | Initial Value (ohms) | Final Value (ohms) |
1 | 2.0E+09 | <1.0E+06 |
2 | 2.6E+09 | 3.3E+09 |
3 | 4.1E+09 | 7.9E+09 |
4 | 3.0E+09 | 6.8E+08 |
5 | 1.9E+09 | 4.5E+09 |
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/463,110 USRE45881E1 (en) | 1996-03-22 | 2012-05-03 | Method for enhancing the solderability of a surface |
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/621,098 US5733599A (en) | 1996-03-22 | 1996-03-22 | Method for enhancing the solderability of a surface |
US08/982,980 US5935640A (en) | 1996-03-22 | 1997-12-02 | Method for enhancing the solderability of a surface |
US09/251,641 US6200451B1 (en) | 1996-03-22 | 1999-02-17 | Method for enhancing the solderability of a surface |
US09/698,370 US6444109B1 (en) | 1996-03-22 | 2000-10-26 | Method for enhancing the solderability of a surface |
US09/821,205 US6544397B2 (en) | 1996-03-22 | 2001-03-29 | Method for enhancing the solderability of a surface |
US10/341,859 US6905587B2 (en) | 1996-03-22 | 2003-01-14 | Method for enhancing the solderability of a surface |
US13/463,110 USRE45881E1 (en) | 1996-03-22 | 2012-05-03 | Method for enhancing the solderability of a surface |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/341,859 Reissue US6905587B2 (en) | 1996-03-22 | 2003-01-14 | Method for enhancing the solderability of a surface |
Publications (1)
Publication Number | Publication Date |
---|---|
USRE45881E1 true USRE45881E1 (en) | 2016-02-09 |
Family
ID=51211949
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/821,205 Ceased US6544397B2 (en) | 1996-03-22 | 2001-03-29 | Method for enhancing the solderability of a surface |
US13/463,110 Expired - Lifetime USRE45881E1 (en) | 1996-03-22 | 2012-05-03 | Method for enhancing the solderability of a surface |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/821,205 Ceased US6544397B2 (en) | 1996-03-22 | 2001-03-29 | Method for enhancing the solderability of a surface |
Country Status (1)
Country | Link |
---|---|
US (2) | US6544397B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10184189B2 (en) | 2016-07-18 | 2019-01-22 | ECSI Fibrotools, Inc. | Apparatus and method of contact electroplating of isolated structures |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6905587B2 (en) | 1996-03-22 | 2005-06-14 | Ronald Redline | Method for enhancing the solderability of a surface |
US7267259B2 (en) * | 1999-02-17 | 2007-09-11 | Ronald Redline | Method for enhancing the solderability of a surface |
US6544397B2 (en) | 1996-03-22 | 2003-04-08 | Ronald Redline | Method for enhancing the solderability of a surface |
USRE45842E1 (en) | 1999-02-17 | 2016-01-12 | Ronald Redline | Method for enhancing the solderability of a surface |
US6773757B1 (en) * | 2003-04-14 | 2004-08-10 | Ronald Redline | Coating for silver plated circuits |
US20050077502A1 (en) * | 2003-10-09 | 2005-04-14 | Munie Gregory C. | Surface reactive preservative for use with solder preforms |
US8349393B2 (en) | 2004-07-29 | 2013-01-08 | Enthone Inc. | Silver plating in electronics manufacture |
US7288462B2 (en) * | 2004-10-27 | 2007-10-30 | Carleton Life Support Systems, Inc. | Buffer zone for the prevention of metal migration |
US8869165B2 (en) * | 2008-03-20 | 2014-10-21 | International Business Machines Corporation | Integrating flow orchestration and scheduling of jobs and data activities for a batch of workflows over multiple domains subject to constraints |
Citations (92)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB592443A (en) | 1944-09-14 | 1947-09-18 | Westinghouse Electric Int Co | Improvements in or relating to electro-plating |
GB602591A (en) | 1945-02-12 | 1948-05-31 | Du Pont | Improvements in or relating to the electro-deposition of metals |
US2757104A (en) | 1953-04-15 | 1956-07-31 | Metalholm Engineering Corp | Process of forming precision resistor |
US2883288A (en) | 1955-08-17 | 1959-04-21 | Lewco Inc | Silver plating bath |
US3130072A (en) | 1961-09-22 | 1964-04-21 | Sel Rex Corp | Silver-palladium immersion plating composition and process |
US3162512A (en) | 1961-03-21 | 1964-12-22 | Engelhard Ind Inc | Immersion plating with noble metals and the product thereof |
US3202488A (en) | 1964-03-04 | 1965-08-24 | Chomerics Inc | Silver-plated copper powder |
US3230098A (en) | 1962-10-09 | 1966-01-18 | Engelhard Ind Inc | Immersion plating with noble metals |
US3294578A (en) | 1963-10-22 | 1966-12-27 | Gen Aniline & Film Corp | Deposition of a metallic coat on metal surfaces |
US3330672A (en) | 1964-06-29 | 1967-07-11 | Hunt Chem Corp Philip A | Silver antitarnish compositions |
GB1120583A (en) | 1965-05-19 | 1968-07-17 | British Aircraft Corp Ltd | Improvements relating to printed circuits |
US3460953A (en) | 1966-05-27 | 1969-08-12 | Pennsalt Chemicals Corp | Process for depositing brasslike coatings and composition therefor |
US3468804A (en) | 1964-03-13 | 1969-09-23 | Winfield Brooks Co Inc | Silver cleaning composition |
US3531315A (en) | 1967-07-17 | 1970-09-29 | Minnesota Mining & Mfg | Mechanical plating |
US3729394A (en) * | 1972-04-17 | 1973-04-24 | Conversion Chem Corp | Composition and method for electrodeposition of zinc |
AU5019272A (en) | 1971-12-20 | 1974-06-20 | Ici Australia Limited | Composition and process |
JPS5127819A (en) | 1974-09-02 | 1976-03-09 | Mitsubishi Gas Chemical Co | Do oyobi dogokinyokagakushorieki |
US3978271A (en) | 1975-04-15 | 1976-08-31 | Ppg Industries, Inc. | Thin metallic nickel-silver films by chemical replacement |
US3993845A (en) | 1973-07-30 | 1976-11-23 | Ppg Industries, Inc. | Thin films containing metallic copper and silver by replacement without subsequent accelerated oxidation |
US4013523A (en) * | 1975-12-24 | 1977-03-22 | Oxy Metal Industries Corporation | Tin-gold electroplating bath and process |
US4067784A (en) * | 1976-06-09 | 1978-01-10 | Oxy Metal Industries Corporation | Non-cyanide acidic silver electroplating bath and additive therefore |
US4079078A (en) * | 1974-06-21 | 1978-03-14 | The Procter & Gamble Company | Liquid detergent compositions |
US4091172A (en) | 1976-12-14 | 1978-05-23 | Ppg Industries, Inc. | Uniform gold films |
JPS53134759A (en) | 1977-04-28 | 1978-11-24 | Fujikura Kasei Kk | Production of copmosite metal powder |
US4151099A (en) * | 1977-01-03 | 1979-04-24 | Basf Wyandotte Corporation | Water-based hydraulic fluid and metalworking lubricant |
US4187198A (en) | 1972-08-07 | 1980-02-05 | Kollmorgen Technologies Corp. | Novel precious metal sensitizing solutions |
US4189510A (en) | 1978-09-05 | 1980-02-19 | The Dow Chemical Company | Replacement plating procedure for silver on nickel |
US4255214A (en) | 1977-11-21 | 1981-03-10 | Falconer Plate Glass Corporation | Methods of manufacturing and protecting mirrors |
US4265715A (en) | 1979-07-13 | 1981-05-05 | Oxy Metal Industries Corporation | Silver electrodeposition process |
US4304846A (en) | 1979-02-09 | 1981-12-08 | Ciba-Geigy Ag | Method for processing silver dye-bleach materials |
US4368223A (en) | 1981-06-01 | 1983-01-11 | Asahi Glass Company, Ltd. | Process for preparing nickel layer |
US4389431A (en) | 1980-05-12 | 1983-06-21 | Minnesota Mining And Manufacturing Company | Process for mechanically depositing heavy metallic coatings |
US4440805A (en) | 1975-10-23 | 1984-04-03 | Nathan Feldstein | Stabilized dispersion for electroless plating catalysts using corrosion inhibitors as stabilizers |
JPS60100679A (en) | 1983-11-04 | 1985-06-04 | C Uyemura & Co Ltd | Method for coating silver to metallic material |
US4568476A (en) * | 1983-08-15 | 1986-02-04 | Lever Brothers Company | Enzymatic machine-dishwashing compositions |
US4568570A (en) | 1983-10-18 | 1986-02-04 | Bayer Aktiengesellschaft | Process for activating substrates for electroless metallization |
US4620936A (en) * | 1983-08-15 | 1986-11-04 | Lever Brothers Company | Machine-dishwashing compositions |
US4647347A (en) * | 1984-08-16 | 1987-03-03 | Amchen Products, Inc. | Process and sealant compositions for sealing anodized aluminum |
US4666735A (en) | 1983-04-15 | 1987-05-19 | Polyonics Corporation | Process for producing product having patterned metal layer |
US4753821A (en) | 1984-09-19 | 1988-06-28 | Bayer Aktiengesellschaft | Process for the partial metallization of substrate surfaces |
US4755265A (en) | 1985-06-28 | 1988-07-05 | Union Oil Company Of California | Processes for the deposition or removal of metals |
GB2201163A (en) | 1987-02-17 | 1988-08-24 | Green Anthony J | Electroless silver plating compositions |
US4777078A (en) | 1986-03-12 | 1988-10-11 | Brother Kogyo Kabushiki Kaisha | Process for forming copper coating having excellent mechanical properties, and printed-wiring board with conductor pattern formed of such copper coating |
US4781980A (en) | 1986-03-28 | 1988-11-01 | Fukuda Metal Foil & Powder Co., Ltd. | Copper powder for use in conductive paste |
US4800132A (en) | 1986-10-22 | 1989-01-24 | Macdermid, Incorporated | Mechanical plating with oxidation-prone metals |
US4821148A (en) | 1985-06-14 | 1989-04-11 | Hitachi, Ltd. | Resin packaged semiconductor device having a protective layer made of a metal-organic matter compound |
US4846918A (en) | 1988-02-24 | 1989-07-11 | Psi Star | Copper etching process and product with controlled nitrous acid reaction |
US4873139A (en) | 1988-03-29 | 1989-10-10 | Minnesota Mining And Manufacturing Company | Corrosion resistant silver and copper surfaces |
US4908241A (en) | 1981-12-07 | 1990-03-13 | Max-Planck-Gesellschaft Zur Foederung Der Wissenschaften E.V. | Process for the currentless deposition of electropositive metal layers on the surfaces of less electropositive metals |
US4940181A (en) | 1989-04-06 | 1990-07-10 | Motorola, Inc. | Pad grid array for receiving a solder bumped chip carrier |
US4978423A (en) | 1988-09-26 | 1990-12-18 | At&T Bell Laboratories | Selective solder formation on printed circuit boards |
US5037482A (en) | 1990-02-16 | 1991-08-06 | Macdermid, Incorporated | Composition and method for improving adhesion of coatings to copper surfaces |
US5061566A (en) | 1989-12-28 | 1991-10-29 | Chomerics, Inc. | Corrosion inhibiting emi/rfi shielding coating and method of its use |
US5094726A (en) * | 1981-09-11 | 1992-03-10 | Learonal, Inc. | Limiting tin sludge formation in tin or tin-lead electroplating solutions |
JPH04110474A (en) | 1990-08-30 | 1992-04-10 | Meidensha Corp | Post-treatment of silver plating |
US5115051A (en) | 1988-12-09 | 1992-05-19 | Shin-Etsu Chemical Co., Ltd. | Method of preventing polymer scale deposition in a polymerization vessel |
US5159105A (en) * | 1990-02-28 | 1992-10-27 | Minnesota Mining And Manufacturing Company | Higher pentafluorosulfanyl-fluoroaliphatic carbonyl and sulfonyl fluorides, and derivatives |
US5160579A (en) | 1991-06-05 | 1992-11-03 | Macdermid, Incorporated | Process for manufacturing printed circuit employing selective provision of solderable coating |
US5173130A (en) | 1989-11-13 | 1992-12-22 | Shikoku Chemicals Corporation | Process for surface treatment of copper and copper alloy |
US5178909A (en) | 1990-07-24 | 1993-01-12 | Mitsui Kinzoku Kogyo Kabushiki Kaisha | Production of silver-coated copper-based powders |
US5186984A (en) | 1990-06-28 | 1993-02-16 | Monsanto Company | Silver coatings |
US5196053A (en) | 1991-11-27 | 1993-03-23 | Mcgean-Rohco, Inc. | Complexing agent for displacement tin plating |
US5203986A (en) * | 1990-03-08 | 1993-04-20 | Nkk Corporation | Method for manufacturing electrogalvanized steel sheet excellent in spot weldability |
US5235139A (en) | 1990-09-12 | 1993-08-10 | Macdermid, Incorprated | Method for fabricating printed circuits |
US5256275A (en) | 1992-04-15 | 1993-10-26 | Learonal, Inc. | Electroplated gold-copper-silver alloys |
US5322553A (en) | 1993-02-22 | 1994-06-21 | Applied Electroless Concepts | Electroless silver plating composition |
DE4316679C1 (en) | 1993-05-13 | 1994-07-28 | Atotech Deutschland Gmbh | Palladium surface-coating of copper, nickel and their alloys |
US5348590A (en) | 1992-08-31 | 1994-09-20 | Hitachi, Ltd. | Surface treating agent for copper or copper alloys |
WO1994026954A1 (en) | 1993-05-13 | 1994-11-24 | Atotech Deutschland Gmbh | Palladium layers deposition process |
US5393861A (en) | 1989-10-18 | 1995-02-28 | Toray Thiokol Co., Ltd. | Polysulfide polyether and polymer composition comprising polysulfide and polyether |
US5411595A (en) * | 1993-07-13 | 1995-05-02 | Mcgean-Rohco, Inc. | Post-etch, printed circuit board cleaning process |
US5468515A (en) | 1994-10-14 | 1995-11-21 | Macdermid, Incorporated | Composition and method for selective plating |
US5518760A (en) | 1994-10-14 | 1996-05-21 | Macdermid, Incorporated | Composition and method for selective plating |
WO1996017975A1 (en) | 1994-12-09 | 1996-06-13 | Alpha Fry Limited | Printed circuit board manufacture |
WO1996017974A1 (en) | 1994-12-09 | 1996-06-13 | Alpha Fry Limited | Silver plating |
US5567357A (en) | 1993-08-25 | 1996-10-22 | Tatsuta Electric Wire & Cable Co., Ltd. | Conductive paint having good adhesion to molding of metallic oxide |
US5576053A (en) | 1993-05-11 | 1996-11-19 | Murata Manufacturing Co., Ltd. | Method for forming an electrode on an electronic part |
EP0797380A1 (en) | 1996-03-22 | 1997-09-24 | Macdermid Incorporated | Method for enhancing the solderability of a surface |
US5725640A (en) | 1993-03-18 | 1998-03-10 | Atotech Usa, Inc. | Composition and process for treating a surface coated with a self-accelerating and replenishing non-formaldehyde immersion coating |
US5733598A (en) | 1992-10-05 | 1998-03-31 | Matsushita Electric Industrial Co., Ltd. | Flexible wiring board and its fabrication method |
US5824631A (en) | 1994-06-03 | 1998-10-20 | Wagenknecht; John H. | Compositions for dissolution of soft metals |
US5876517A (en) | 1994-12-07 | 1999-03-02 | Atotech Deutschland Gmbh | Chromate-plating bath and process for finishing zinc zinc alloy or cadmium surfaces |
US6025077A (en) * | 1996-12-13 | 2000-02-15 | Matsushita Electric Works, Ltd. | Silicone emulsion coating composition and processes for the preparation thereof |
US6136460A (en) * | 1998-04-03 | 2000-10-24 | Olin Corporation | Tin coatings incorporating selected elemental additions to reduce discoloration |
US6183545B1 (en) | 1998-07-14 | 2001-02-06 | Daiwa Fine Chemicals Co., Ltd. | Aqueous solutions for obtaining metals by reductive deposition |
US6200451B1 (en) | 1996-03-22 | 2001-03-13 | Macdermid, Incorporated | Method for enhancing the solderability of a surface |
US6235348B1 (en) | 1998-05-13 | 2001-05-22 | Shin-Etsu Chemical Co., Ltd. | Rust prevention |
US6319543B1 (en) | 1999-03-31 | 2001-11-20 | Alpha Metals, Inc. | Process for silver plating in printed circuit board manufacture |
US6331201B1 (en) | 1997-04-28 | 2001-12-18 | Fry's Metals, Inc. | Bismuth coating protection for copper |
US6375822B1 (en) | 2000-10-03 | 2002-04-23 | Lev Taytsas | Method for enhancing the solderability of a surface |
US6544397B2 (en) | 1996-03-22 | 2003-04-08 | Ronald Redline | Method for enhancing the solderability of a surface |
US6905587B2 (en) | 1996-03-22 | 2005-06-14 | Ronald Redline | Method for enhancing the solderability of a surface |
-
2001
- 2001-03-29 US US09/821,205 patent/US6544397B2/en not_active Ceased
-
2012
- 2012-05-03 US US13/463,110 patent/USRE45881E1/en not_active Expired - Lifetime
Patent Citations (102)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB592443A (en) | 1944-09-14 | 1947-09-18 | Westinghouse Electric Int Co | Improvements in or relating to electro-plating |
GB602591A (en) | 1945-02-12 | 1948-05-31 | Du Pont | Improvements in or relating to the electro-deposition of metals |
US2757104A (en) | 1953-04-15 | 1956-07-31 | Metalholm Engineering Corp | Process of forming precision resistor |
US2883288A (en) | 1955-08-17 | 1959-04-21 | Lewco Inc | Silver plating bath |
US3162512A (en) | 1961-03-21 | 1964-12-22 | Engelhard Ind Inc | Immersion plating with noble metals and the product thereof |
US3130072A (en) | 1961-09-22 | 1964-04-21 | Sel Rex Corp | Silver-palladium immersion plating composition and process |
US3230098A (en) | 1962-10-09 | 1966-01-18 | Engelhard Ind Inc | Immersion plating with noble metals |
US3294578A (en) | 1963-10-22 | 1966-12-27 | Gen Aniline & Film Corp | Deposition of a metallic coat on metal surfaces |
US3202488A (en) | 1964-03-04 | 1965-08-24 | Chomerics Inc | Silver-plated copper powder |
US3468804A (en) | 1964-03-13 | 1969-09-23 | Winfield Brooks Co Inc | Silver cleaning composition |
US3330672A (en) | 1964-06-29 | 1967-07-11 | Hunt Chem Corp Philip A | Silver antitarnish compositions |
GB1120583A (en) | 1965-05-19 | 1968-07-17 | British Aircraft Corp Ltd | Improvements relating to printed circuits |
US3460953A (en) | 1966-05-27 | 1969-08-12 | Pennsalt Chemicals Corp | Process for depositing brasslike coatings and composition therefor |
US3531315A (en) | 1967-07-17 | 1970-09-29 | Minnesota Mining & Mfg | Mechanical plating |
AU5019272A (en) | 1971-12-20 | 1974-06-20 | Ici Australia Limited | Composition and process |
US3729394A (en) * | 1972-04-17 | 1973-04-24 | Conversion Chem Corp | Composition and method for electrodeposition of zinc |
US4187198A (en) | 1972-08-07 | 1980-02-05 | Kollmorgen Technologies Corp. | Novel precious metal sensitizing solutions |
US3993845A (en) | 1973-07-30 | 1976-11-23 | Ppg Industries, Inc. | Thin films containing metallic copper and silver by replacement without subsequent accelerated oxidation |
US4079078A (en) * | 1974-06-21 | 1978-03-14 | The Procter & Gamble Company | Liquid detergent compositions |
JPS5127819A (en) | 1974-09-02 | 1976-03-09 | Mitsubishi Gas Chemical Co | Do oyobi dogokinyokagakushorieki |
US3978271A (en) | 1975-04-15 | 1976-08-31 | Ppg Industries, Inc. | Thin metallic nickel-silver films by chemical replacement |
US4440805A (en) | 1975-10-23 | 1984-04-03 | Nathan Feldstein | Stabilized dispersion for electroless plating catalysts using corrosion inhibitors as stabilizers |
US4013523A (en) * | 1975-12-24 | 1977-03-22 | Oxy Metal Industries Corporation | Tin-gold electroplating bath and process |
US4067784A (en) * | 1976-06-09 | 1978-01-10 | Oxy Metal Industries Corporation | Non-cyanide acidic silver electroplating bath and additive therefore |
US4091172A (en) | 1976-12-14 | 1978-05-23 | Ppg Industries, Inc. | Uniform gold films |
US4151099A (en) * | 1977-01-03 | 1979-04-24 | Basf Wyandotte Corporation | Water-based hydraulic fluid and metalworking lubricant |
JPS53134759A (en) | 1977-04-28 | 1978-11-24 | Fujikura Kasei Kk | Production of copmosite metal powder |
US4255214A (en) | 1977-11-21 | 1981-03-10 | Falconer Plate Glass Corporation | Methods of manufacturing and protecting mirrors |
US4189510A (en) | 1978-09-05 | 1980-02-19 | The Dow Chemical Company | Replacement plating procedure for silver on nickel |
US4304846A (en) | 1979-02-09 | 1981-12-08 | Ciba-Geigy Ag | Method for processing silver dye-bleach materials |
US4265715A (en) | 1979-07-13 | 1981-05-05 | Oxy Metal Industries Corporation | Silver electrodeposition process |
US4389431A (en) | 1980-05-12 | 1983-06-21 | Minnesota Mining And Manufacturing Company | Process for mechanically depositing heavy metallic coatings |
US4368223A (en) | 1981-06-01 | 1983-01-11 | Asahi Glass Company, Ltd. | Process for preparing nickel layer |
US5094726A (en) * | 1981-09-11 | 1992-03-10 | Learonal, Inc. | Limiting tin sludge formation in tin or tin-lead electroplating solutions |
US5094726B1 (en) * | 1981-09-11 | 1993-12-21 | I. Nobel Fred | Limiting tin sludge formation in tin or tin/lead electroplating solutions |
US4908241A (en) | 1981-12-07 | 1990-03-13 | Max-Planck-Gesellschaft Zur Foederung Der Wissenschaften E.V. | Process for the currentless deposition of electropositive metal layers on the surfaces of less electropositive metals |
US4666735A (en) | 1983-04-15 | 1987-05-19 | Polyonics Corporation | Process for producing product having patterned metal layer |
US4568476A (en) * | 1983-08-15 | 1986-02-04 | Lever Brothers Company | Enzymatic machine-dishwashing compositions |
US4620936A (en) * | 1983-08-15 | 1986-11-04 | Lever Brothers Company | Machine-dishwashing compositions |
US4568570A (en) | 1983-10-18 | 1986-02-04 | Bayer Aktiengesellschaft | Process for activating substrates for electroless metallization |
JPS60100679A (en) | 1983-11-04 | 1985-06-04 | C Uyemura & Co Ltd | Method for coating silver to metallic material |
US4647347A (en) * | 1984-08-16 | 1987-03-03 | Amchen Products, Inc. | Process and sealant compositions for sealing anodized aluminum |
US4753821A (en) | 1984-09-19 | 1988-06-28 | Bayer Aktiengesellschaft | Process for the partial metallization of substrate surfaces |
US4821148A (en) | 1985-06-14 | 1989-04-11 | Hitachi, Ltd. | Resin packaged semiconductor device having a protective layer made of a metal-organic matter compound |
US4755265A (en) | 1985-06-28 | 1988-07-05 | Union Oil Company Of California | Processes for the deposition or removal of metals |
US4777078A (en) | 1986-03-12 | 1988-10-11 | Brother Kogyo Kabushiki Kaisha | Process for forming copper coating having excellent mechanical properties, and printed-wiring board with conductor pattern formed of such copper coating |
US4781980A (en) | 1986-03-28 | 1988-11-01 | Fukuda Metal Foil & Powder Co., Ltd. | Copper powder for use in conductive paste |
US4800132A (en) | 1986-10-22 | 1989-01-24 | Macdermid, Incorporated | Mechanical plating with oxidation-prone metals |
GB2201163A (en) | 1987-02-17 | 1988-08-24 | Green Anthony J | Electroless silver plating compositions |
US4846918A (en) | 1988-02-24 | 1989-07-11 | Psi Star | Copper etching process and product with controlled nitrous acid reaction |
US4873139A (en) | 1988-03-29 | 1989-10-10 | Minnesota Mining And Manufacturing Company | Corrosion resistant silver and copper surfaces |
US4978423A (en) | 1988-09-26 | 1990-12-18 | At&T Bell Laboratories | Selective solder formation on printed circuit boards |
US5115051A (en) | 1988-12-09 | 1992-05-19 | Shin-Etsu Chemical Co., Ltd. | Method of preventing polymer scale deposition in a polymerization vessel |
US4940181A (en) | 1989-04-06 | 1990-07-10 | Motorola, Inc. | Pad grid array for receiving a solder bumped chip carrier |
US5393861A (en) | 1989-10-18 | 1995-02-28 | Toray Thiokol Co., Ltd. | Polysulfide polyether and polymer composition comprising polysulfide and polyether |
US5173130A (en) | 1989-11-13 | 1992-12-22 | Shikoku Chemicals Corporation | Process for surface treatment of copper and copper alloy |
US5061566A (en) | 1989-12-28 | 1991-10-29 | Chomerics, Inc. | Corrosion inhibiting emi/rfi shielding coating and method of its use |
US5037482A (en) | 1990-02-16 | 1991-08-06 | Macdermid, Incorporated | Composition and method for improving adhesion of coatings to copper surfaces |
US5159105A (en) * | 1990-02-28 | 1992-10-27 | Minnesota Mining And Manufacturing Company | Higher pentafluorosulfanyl-fluoroaliphatic carbonyl and sulfonyl fluorides, and derivatives |
US5203986A (en) * | 1990-03-08 | 1993-04-20 | Nkk Corporation | Method for manufacturing electrogalvanized steel sheet excellent in spot weldability |
US5186984A (en) | 1990-06-28 | 1993-02-16 | Monsanto Company | Silver coatings |
US5178909A (en) | 1990-07-24 | 1993-01-12 | Mitsui Kinzoku Kogyo Kabushiki Kaisha | Production of silver-coated copper-based powders |
JPH04110474A (en) | 1990-08-30 | 1992-04-10 | Meidensha Corp | Post-treatment of silver plating |
US5235139A (en) | 1990-09-12 | 1993-08-10 | Macdermid, Incorprated | Method for fabricating printed circuits |
US5160579A (en) | 1991-06-05 | 1992-11-03 | Macdermid, Incorporated | Process for manufacturing printed circuit employing selective provision of solderable coating |
JPH05263258A (en) | 1991-11-27 | 1993-10-12 | Mcgean Rohco Inc | Complexing agent for displacement tin plating |
US5196053A (en) | 1991-11-27 | 1993-03-23 | Mcgean-Rohco, Inc. | Complexing agent for displacement tin plating |
US5256275A (en) | 1992-04-15 | 1993-10-26 | Learonal, Inc. | Electroplated gold-copper-silver alloys |
US5348590A (en) | 1992-08-31 | 1994-09-20 | Hitachi, Ltd. | Surface treating agent for copper or copper alloys |
US5733598A (en) | 1992-10-05 | 1998-03-31 | Matsushita Electric Industrial Co., Ltd. | Flexible wiring board and its fabrication method |
US5322553A (en) | 1993-02-22 | 1994-06-21 | Applied Electroless Concepts | Electroless silver plating composition |
US5725640A (en) | 1993-03-18 | 1998-03-10 | Atotech Usa, Inc. | Composition and process for treating a surface coated with a self-accelerating and replenishing non-formaldehyde immersion coating |
US5576053A (en) | 1993-05-11 | 1996-11-19 | Murata Manufacturing Co., Ltd. | Method for forming an electrode on an electronic part |
DE4316679C1 (en) | 1993-05-13 | 1994-07-28 | Atotech Deutschland Gmbh | Palladium surface-coating of copper, nickel and their alloys |
WO1994026954A1 (en) | 1993-05-13 | 1994-11-24 | Atotech Deutschland Gmbh | Palladium layers deposition process |
US5411595A (en) * | 1993-07-13 | 1995-05-02 | Mcgean-Rohco, Inc. | Post-etch, printed circuit board cleaning process |
US5567357A (en) | 1993-08-25 | 1996-10-22 | Tatsuta Electric Wire & Cable Co., Ltd. | Conductive paint having good adhesion to molding of metallic oxide |
US5824631A (en) | 1994-06-03 | 1998-10-20 | Wagenknecht; John H. | Compositions for dissolution of soft metals |
US5518760A (en) | 1994-10-14 | 1996-05-21 | Macdermid, Incorporated | Composition and method for selective plating |
US5468515A (en) | 1994-10-14 | 1995-11-21 | Macdermid, Incorporated | Composition and method for selective plating |
US5876517A (en) | 1994-12-07 | 1999-03-02 | Atotech Deutschland Gmbh | Chromate-plating bath and process for finishing zinc zinc alloy or cadmium surfaces |
US5955141A (en) | 1994-12-09 | 1999-09-21 | Alpha Metals, Inc. | Process for silver plating in printed circuit board manufacture |
JPH08255968A (en) | 1994-12-09 | 1996-10-01 | Alpha Metals Ltd | Manufacturing of printed-circuit board |
US6395329B2 (en) | 1994-12-09 | 2002-05-28 | Soutar Andrew Mcintosh | Printed circuit board manufacture |
WO1996017975A1 (en) | 1994-12-09 | 1996-06-13 | Alpha Fry Limited | Printed circuit board manufacture |
WO1996017974A1 (en) | 1994-12-09 | 1996-06-13 | Alpha Fry Limited | Silver plating |
US20020150692A1 (en) | 1994-12-09 | 2002-10-17 | Soutar Andrew Mcintosh | Printed circuit board manufacture |
US6860925B2 (en) | 1994-12-09 | 2005-03-01 | Enthone Incorporated | Printed circuit board manufacture |
US6200451B1 (en) | 1996-03-22 | 2001-03-13 | Macdermid, Incorporated | Method for enhancing the solderability of a surface |
US6905587B2 (en) | 1996-03-22 | 2005-06-14 | Ronald Redline | Method for enhancing the solderability of a surface |
EP0797380A1 (en) | 1996-03-22 | 1997-09-24 | Macdermid Incorporated | Method for enhancing the solderability of a surface |
US6444109B1 (en) | 1996-03-22 | 2002-09-03 | Ronald Redline | Method for enhancing the solderability of a surface |
US6544397B2 (en) | 1996-03-22 | 2003-04-08 | Ronald Redline | Method for enhancing the solderability of a surface |
US5935640A (en) | 1996-03-22 | 1999-08-10 | Macdermid, Incorporated | Method for enhancing the solderability of a surface |
US5733599A (en) | 1996-03-22 | 1998-03-31 | Macdermid, Incorporated | Method for enhancing the solderability of a surface |
US6025077A (en) * | 1996-12-13 | 2000-02-15 | Matsushita Electric Works, Ltd. | Silicone emulsion coating composition and processes for the preparation thereof |
US6331201B1 (en) | 1997-04-28 | 2001-12-18 | Fry's Metals, Inc. | Bismuth coating protection for copper |
US6136460A (en) * | 1998-04-03 | 2000-10-24 | Olin Corporation | Tin coatings incorporating selected elemental additions to reduce discoloration |
US6235348B1 (en) | 1998-05-13 | 2001-05-22 | Shin-Etsu Chemical Co., Ltd. | Rust prevention |
US6183545B1 (en) | 1998-07-14 | 2001-02-06 | Daiwa Fine Chemicals Co., Ltd. | Aqueous solutions for obtaining metals by reductive deposition |
US6319543B1 (en) | 1999-03-31 | 2001-11-20 | Alpha Metals, Inc. | Process for silver plating in printed circuit board manufacture |
US6375822B1 (en) | 2000-10-03 | 2002-04-23 | Lev Taytsas | Method for enhancing the solderability of a surface |
Non-Patent Citations (6)
Title |
---|
Arthur Rose et al, The Condensed Chemical Dictionary, Reinhold Book Corporation, New York, 1966, pp. 409, 691, 704, 891. * |
F. A. Lowenheim, Modern Electroplating, John Wiley & Sons, Inc., New York, 1974, pp. 36-38, 358-365. * |
Li et al., Tarnish Protection for Silver Electrodeposits, Plating and Surface Finishing, pp. 58-61, Feb. 1988. |
Philpott, An Economic Process for the Deposition of Thin Tarnish Resistant Coatings, Platinum Metals Rev., vol. 6, pp. 144-146, 1962. |
Russev et al., Immersion Silvering of Copper, Metal Finishing, pp. 27-30, Jan. 1983. |
Singh et al., Silver tarnishing and its prevention-A review, Anti-Corrosion, pp. 4-8, Jul. 1983. |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10184189B2 (en) | 2016-07-18 | 2019-01-22 | ECSI Fibrotools, Inc. | Apparatus and method of contact electroplating of isolated structures |
US10480092B2 (en) | 2016-07-18 | 2019-11-19 | ECSI Fibrotools Inc. | Apparatus and method of contact electroplating of isolated structures |
Also Published As
Publication number | Publication date |
---|---|
US20010016232A1 (en) | 2001-08-23 |
US6544397B2 (en) | 2003-04-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
USRE45297E1 (en) | Method for enhancing the solderability of a surface | |
USRE45881E1 (en) | Method for enhancing the solderability of a surface | |
US6444109B1 (en) | Method for enhancing the solderability of a surface | |
JP3220784B2 (en) | Method for enhancing surface solderability | |
USRE45279E1 (en) | Process for silver plating in printed circuit board manufacture | |
US6773757B1 (en) | Coating for silver plated circuits | |
US20010022989A1 (en) | Printed circuit board manufacture | |
TWI408254B (en) | Metal surface treatment aqueous solution and method for inhibiting whiskers on a metal surface | |
US6375822B1 (en) | Method for enhancing the solderability of a surface | |
US7267259B2 (en) | Method for enhancing the solderability of a surface | |
EP1029944B1 (en) | Method for enhancing the solderability of a surface | |
USRE45842E1 (en) | Method for enhancing the solderability of a surface | |
US7631798B1 (en) | Method for enhancing the solderability of a surface | |
US6090493A (en) | Bismuth coating protection for copper |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS FIRST Free format text: FIRST LIEN PATENT SECURITY AGREEMENT;ASSIGNOR:MACDERMID, INCORPORATED;REEL/FRAME:030833/0660 Effective date: 20130607 Owner name: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS SECOND Free format text: SECOND LIEN PATENT SECURITY AGREEMENT;ASSIGNOR:MACDERMID, INCORPORATED;REEL/FRAME:030834/0014 Effective date: 20130607 |
|
AS | Assignment |
Owner name: BARCLAYS BANK PLC, AS SUCCESSOR COLLATERAL AGENT, Free format text: ASSIGNMENT AND ASSUMPTION OF SECURITY INTERESTS AT REEL/FRAME NOS. 30831/0549, 30833/0660, 30831/0606, 30833/0700, AND 30833/0727;ASSIGNOR:CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS FIRST LIEN COLLATERAL AGENT;REEL/FRAME:031536/0778 Effective date: 20131031 Owner name: MACDERMID, INCORPORATED, CONNECTICUT Free format text: RELEASE OF SECURITY INTEREST IN PATENT COLLATERAL AT REEL/FRAME NO. 30834/0014;ASSIGNOR:CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS SECOND LIEN COLLATERAL AGENT;REEL/FRAME:031551/0319 Effective date: 20131031 |
|
FPAY | Fee payment |
Year of fee payment: 12 |
|
AS | Assignment |
Owner name: MACDERMID, INCORPORATED, GEORGIA Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BARCLAYS BANK PLC, AS COLLATERAL AGENT;REEL/FRAME:048227/0676 Effective date: 20190131 |
|
AS | Assignment |
Owner name: BARCLAYS BANK PLC, AS COLLATERAL AGENT, NEW YORK Free format text: SECURITY INTEREST;ASSIGNOR:MACDERMID, INCORPORATED;REEL/FRAME:048262/0321 Effective date: 20190131 |
|
AS | Assignment |
Owner name: CITIBANK, N.A., NEW YORK Free format text: ASSIGNMENT OF SECURITY INTEREST IN PATENT COLLATERAL;ASSIGNOR:BARCLAYS BANK PLC;REEL/FRAME:061956/0643 Effective date: 20221115 |