WO1987002472A1 - Movable member-mounting - Google Patents

Movable member-mounting Download PDF

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Publication number
WO1987002472A1
WO1987002472A1 PCT/GB1986/000628 GB8600628W WO8702472A1 WO 1987002472 A1 WO1987002472 A1 WO 1987002472A1 GB 8600628 W GB8600628 W GB 8600628W WO 8702472 A1 WO8702472 A1 WO 8702472A1
Authority
WO
WIPO (PCT)
Prior art keywords
movable member
assembly according
supports
connecting members
electrically conductive
Prior art date
Application number
PCT/GB1986/000628
Other languages
French (fr)
Inventor
Ian William Stanley
Original Assignee
British Telecommunications Public Limited Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB858525459A external-priority patent/GB8525459D0/en
Priority claimed from GB858525461A external-priority patent/GB8525461D0/en
Priority claimed from GB858525462A external-priority patent/GB8525462D0/en
Priority claimed from GB858525458A external-priority patent/GB8525458D0/en
Priority claimed from GB858525460A external-priority patent/GB8525460D0/en
Priority claimed from GB858526189A external-priority patent/GB8526189D0/en
Application filed by British Telecommunications Public Limited Company filed Critical British Telecommunications Public Limited Company
Priority to JP61505413A priority Critical patent/JPH0769520B2/en
Publication of WO1987002472A1 publication Critical patent/WO1987002472A1/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/10Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/14External cavity lasers
    • H01S5/141External cavity lasers using a wavelength selective device, e.g. a grating or etalon
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01DMEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/26Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
    • G01D5/266Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light by interferometric means
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J3/00Spectrometry; Spectrophotometry; Monochromators; Measuring colours
    • G01J3/12Generating the spectrum; Monochromators
    • G01J3/26Generating the spectrum; Monochromators using multiple reflection, e.g. Fabry-Perot interferometer, variable interference filters
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/001Optical devices or arrangements for the control of light using movable or deformable optical elements based on interference in an adjustable optical cavity
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/26Optical coupling means
    • G02B6/28Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals
    • G02B6/2804Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals forming multipart couplers without wavelength selective elements, e.g. "T" couplers, star couplers
    • G02B6/2817Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals forming multipart couplers without wavelength selective elements, e.g. "T" couplers, star couplers using reflective elements to split or combine optical signals
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/26Optical coupling means
    • G02B6/32Optical coupling means having lens focusing means positioned between opposed fibre ends
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/36Mechanical coupling means
    • G02B6/38Mechanical coupling means having fibre to fibre mating means
    • G02B6/3801Permanent connections, i.e. wherein fibres are kept aligned by mechanical means
    • G02B6/3803Adjustment or alignment devices for alignment prior to splicing
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4219Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/26Optical coupling means
    • G02B6/28Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals
    • G02B6/293Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
    • G02B6/29346Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means operating by wave or beam interference
    • G02B6/29358Multiple beam interferometer external to a light guide, e.g. Fabry-Pérot, etalon, VIPA plate, OTDL plate, continuous interferometer, parallel plate resonator
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/26Optical coupling means
    • G02B6/35Optical coupling means having switching means
    • G02B6/351Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements
    • G02B6/3512Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements the optical element being reflective, e.g. mirror
    • G02B6/3516Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements the optical element being reflective, e.g. mirror the reflective optical element moving along the beam path, e.g. controllable diffractive effects using multiple micromirrors within the beam
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/26Optical coupling means
    • G02B6/35Optical coupling means having switching means
    • G02B6/3564Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details
    • G02B6/3568Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details characterised by the actuating force
    • G02B6/357Electrostatic force
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/105Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling the mutual position or the reflecting properties of the reflectors of the cavity, e.g. by controlling the cavity length
    • H01S3/1055Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling the mutual position or the reflecting properties of the reflectors of the cavity, e.g. by controlling the cavity length one of the reflectors being constituted by a diffraction grating
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S359/00Optical: systems and elements
    • Y10S359/90Methods

Definitions

  • MOVABLE MEMBER-MOUNTING The invention relates to the mounting of a movable member, for example the mounting of an optical mirror.
  • the electrical conductivity of the assembly being such that at least one electrically conductive path extends from a support to the movable member and thereafter to the or another support, the resistivity of the path being such that the passage of a working current along the path causes thermal expansion of one or mere of the connecting members and the movable member thereby causing movement of the movable member relatively to the supports.
  • control of the position of the movable member is achieved by relying on the thermal expansion properties of one or more of the connecting members and the movable member itself. This reduces the complexity of the construction and also leac ; ⁇ to accurate control of the deflection angle. Furthermore, the invention enables constructions to be developed in which the movable member may be moved in any direction.
  • the movable member comprises an optical mirror
  • the movable member may be used as a support for other components such as diffraction gratings, laser diodes and the like whose angular position must be accurately controlled.
  • the supports, connecting members, and the movable member are all integrally formed and this may typically be achieved by using a micromachining technique to etch a substrate.
  • the assembly may be made from silicon and have relatively small dimensions. These features all lead to a relatively low manufacturing cost.
  • the movable member may be mounted between the supports by two connecting members.
  • the movable member is mounted to each support by a pair of connecting members.
  • each pair of connecting members is substantially colinear, the pairs being substantially parallel.
  • all the connecting members are electrically conductive since this leads to a larger number of deflection angle directions being obtainable.
  • part of at least one of the electrical paths is defined by an electrically conductive portion of the movable member.
  • the or each electrically conductive part of the movable member has a higher resitivity than the remainder of the electrically conductive path.
  • thermal expansion of the movable member will cause the connecting members to deflect and thus the movable member will be moved to a position substantially parallel with its rest position thus resulting in a piston like movement.
  • This is particularly useful where the movable member defines one end of a laser cavity.
  • the resistivity of the or each connecting member forming part of an electrically conductive path may be higher than the remainder of the electrically conductive path. This provides flexibility, particularly where two or more electrical paths are defined between the supports across the movable member since a larger number of deflection directions can be obtained.
  • a single current source is provided which is connected by a control means to a selected electrical path or paths.
  • a number of current sources may be provided, for example one corresponding to each electrical path, control means controlling whether the current source is connected to the respective electrical path.
  • the parts of the support, connecting members, and movable- member which define the or each electrical path are doped or metallised in a known manner.
  • Figure 1 is a schematic diagram of a first example ilustrating the connection of the electrical paths with a current source
  • Figures 2 and 3 are views similar to Figure 1, but omitting the electrical connections and the supporting substrate illustrating two further examples; and,
  • Figure 4 is a view similar to Figure 1, but omitting the electrical connections, of a fourth example.
  • the example shown in Figure 1 is constructed from a relatively thin single crystal silicon substrate using conventional micromachining or anisotropic etching techniques.
  • the assembly comprises a pair of support members 1, 2 between which is mounted a thin plate 3.
  • the plate 3 is mounted between the supports 1, 2 by bridges 4-7. It should be appreciated that the support members 1, 2, the bridges 4-7 and the plate 3 are all integrally formed.
  • the plate 3 may be between one and several mm square while the bridges 4-7 will have lengths between IG and 100um or more.
  • a pair of electrically conductive paths 8, 9 are formed between the two support members 1, 2. This is achieved by either doping or metallising respective pairs of bridges 4, 5; 6, 7 and connecting portions of the plate 3 together with adjacent portions of the support members 1, 2.
  • the paths 8, 9 are connected at one end with a common electrical conductor 10 and at the other end to respective electrical conductors 11, 12.
  • the conductors 11, 12 terminate at a switch 13.
  • the switch 13 and the conductor 10 are c r-onnected to a current source
  • cross-hatching in the drawings indicates electrically conductive parts although portions of these parts may have different resistivities.
  • the doping or metallisation is such that the bridges 4-7 have a higher resistivity thar. the supports 1,2 while the portions of the plate 3 connecting the bridges 4, 5; 6,7 respectively have a low resistivity relatively to the remainder of the silicon plate.
  • the switch 13 is connected either to the conductor 11 or the conductor 12 and the current is passed through the respective path 8,9. Due tc the relatively high resistivity f the bridges, the passage of a current through the bridges will cause an increase in their temperature and hence result in expansion of the bridge material thus causing deflection of the plate 3. For example, passing a current through the path 8 will cause the bridges 4, 5 to expand and thus the plate 3 will rotate about an axis defined by the path 9. Similarly, a current passed along the path 9 will cause expansion of the bridges 6, 7 and hence rotation of the plate 3 above an axis defined by the path 8. In a modification, not shown, the same current could be passed through both paths 8, 9 simultaneously. This would result in movement of the plate 3 to a position parallel with its rest position (shown in Figure 1) thus resulting in a piston action. This type of action will be particularly useful where the plate 3 constitutes an end of a laser cavity.
  • Pivotal movement of the plate 3 may be used for deflecting an incident optical beam of radiation towards one of a number of different optical components where the plate comprises a mirror or the device may be used for other applications such as wavelength selection where the plate carries a reflection diffraction grating. This is explained in more detail in our copending application of even date entitled Wavelength Selection Device and Method where the ability to deflect in any direction is particularly advantageous (Case 23333/GB) .
  • FIGS 2 and 3 illustrate two further examples which have more flexibility than the example shown in Figure 1.
  • each corner of the plate 3 is mounted by a pair of bridges 4, 4' - 7, 7' to the supports (not shown).
  • Each pair of bridges 4, 4' etc is connected to individual electrical circuits so that the current through each pair of bridges can be separately controlled. These currents are labelled I ⁇ I 4 respectively.
  • the bridges may be made significantly less resistive than the silicon material or blocking regions 13 can be inserted by suitable doping of the plate 3.
  • the plate 3 can be deflected angularly about any desired axis in the plane of the plate.
  • a parallel, piston action can be obtained by using all four currents together.
  • Optical sensing methods may also be used for position control.
  • the plate 3 itself can be made conductive but less conductive than the bridges 4-7. This is shown in Figure 4. - In this example, the same current I passes through the bridges 4, 6 into the plate 3 and out from the plate 3 across the bridges 5, 7. The plate 3 itself then expands and produces the parallel movement.

Abstract

The mounting of a movable member such as an optical mirror (3) by bridges (4-7) between a pair of supports (1, 2). The support (1, 2) bridges (4-7) and mirror (3) are integrally formed from a silicon substrate. A pair of electrically conductive paths (8, 9) are formed by doping or metallising portions of the assembly so that by passing controlled currents through the paths, thermal expansion of parts of the paths will cause deflection of the mirror (3). The assembly is particularly useful for deflecting optical beams.

Description

MOVABLE MEMBER-MOUNTING The invention relates to the mounting of a movable member, for example the mounting of an optical mirror.
In the field of optical signal transmission, it is important to be able to deflect an optical beam through a controlled angle. Previous proposals have involved the location of a torsion plate using a substrate, the torsion plate defining an optical mirror and being deflectable under the control of electrostatic fields. These arrangements are complex in construction and it is difficult to obtain accurate control of the deflection angle. In addition the torsion plate has very few degrees of freedom.
In accordance with the present invention, we provide an assembly of at least two supports and a movable member mounted by respective connecting members between the
-. _* supports, the electrical conductivity of the assembly being such that at least one electrically conductive path extends from a support to the movable member and thereafter to the or another support, the resistivity of the path being such that the passage of a working current along the path causes thermal expansion of one or mere of the connecting members and the movable member thereby causing movement of the movable member relatively to the supports.
With this invention, control of the position of the movable member is achieved by relying on the thermal expansion properties of one or more of the connecting members and the movable member itself. This reduces the complexity of the construction and also leac;~ to accurate control of the deflection angle. Furthermore, the invention enables constructions to be developed in which the movable member may be moved in any direction.
The invention is particular useful when the movable member comprises an optical mirror but in other applications, the movable member may be used as a support for other components such as diffraction gratings, laser diodes and the like whose angular position must be accurately controlled. Preferably, the supports, connecting members, and the movable member are all integrally formed and this may typically be achieved by using a micromachining technique to etch a substrate. For example, the assembly may be made from silicon and have relatively small dimensions. These features all lead to a relatively low manufacturing cost.
In a very simple arrangement, the movable member may be mounted between the supports by two connecting members. Preferably, however, the movable member is mounted to each support by a pair of connecting members. Conveniently, each pair of connecting members is substantially colinear, the pairs being substantially parallel.
Preferably, all the connecting members are electrically conductive since this leads to a larger number of deflection angle directions being obtainable.
In some examples, part of at least one of the electrical paths is defined by an electrically conductive portion of the movable member. Preferably, the or each electrically conductive part of the movable member has a higher resitivity than the remainder of the electrically conductive path.
In this case, thermal expansion of the movable member will cause the connecting members to deflect and thus the movable member will be moved to a position substantially parallel with its rest position thus resulting in a piston like movement. This is particularly useful where the movable member defines one end of a laser cavity. The resistivity of the or each connecting member forming part of an electrically conductive path may be higher than the remainder of the electrically conductive path. This provides flexibility, particularly where two or more electrical paths are defined between the supports across the movable member since a larger number of deflection directions can be obtained.
Conveniently, a single current source is provided which is connected by a control means to a selected electrical path or paths. Alternatively, a number of current sources may be provided, for example one corresponding to each electrical path, control means controlling whether the current source is connected to the respective electrical path. Typically, the parts of the support, connecting members, and movable- member which define the or each electrical path are doped or metallised in a known manner.
Some examples of assemblies in accordance with the present invention will now be described with reference to the accompanying drawings, in which:-
Figure 1 is a schematic diagram of a first example ilustrating the connection of the electrical paths with a current source; Figures 2 and 3 are views similar to Figure 1, but omitting the electrical connections and the supporting substrate illustrating two further examples; and,
Figure 4 is a view similar to Figure 1, but omitting the electrical connections, of a fourth example. The example shown in Figure 1 is constructed from a relatively thin single crystal silicon substrate using conventional micromachining or anisotropic etching techniques. The assembly comprises a pair of support members 1, 2 between which is mounted a thin plate 3. The plate 3 is mounted between the supports 1, 2 by bridges 4-7. It should be appreciated that the support members 1, 2, the bridges 4-7 and the plate 3 are all integrally formed.
The plate 3 may be between one and several mm square while the bridges 4-7 will have lengths between IG and 100um or more.
A pair of electrically conductive paths 8, 9 are formed between the two support members 1, 2. This is achieved by either doping or metallising respective pairs of bridges 4, 5; 6, 7 and connecting portions of the plate 3 together with adjacent portions of the support members 1, 2. The paths 8, 9 are connected at one end with a common electrical conductor 10 and at the other end to respective electrical conductors 11, 12. The conductors 11, 12 terminate at a switch 13. The switch 13 and the conductor 10 are c r-onnected to a current source
14.
In all these examples, cross-hatching in the drawings indicates electrically conductive parts although portions of these parts may have different resistivities.
In the Figure 1 example, the doping or metallisation is such that the bridges 4-7 have a higher resistivity thar. the supports 1,2 while the portions of the plate 3 connecting the bridges 4, 5; 6,7 respectively have a low resistivity relatively to the remainder of the silicon plate.
In operation, the switch 13 is connected either to the conductor 11 or the conductor 12 and the current is passed through the respective path 8,9. Due tc the relatively high resistivity f the bridges, the passage of a current through the bridges will cause an increase in their temperature and hence result in expansion of the bridge material thus causing deflection of the plate 3. For example, passing a current through the path 8 will cause the bridges 4, 5 to expand and thus the plate 3 will rotate about an axis defined by the path 9. Similarly, a current passed along the path 9 will cause expansion of the bridges 6, 7 and hence rotation of the plate 3 above an axis defined by the path 8. In a modification, not shown, the same current could be passed through both paths 8, 9 simultaneously. This would result in movement of the plate 3 to a position parallel with its rest position (shown in Figure 1) thus resulting in a piston action. This type of action will be particularly useful where the plate 3 constitutes an end of a laser cavity.
Pivotal movement of the plate 3 may be used for deflecting an incident optical beam of radiation towards one of a number of different optical components where the plate comprises a mirror or the device may be used for other applications such as wavelength selection where the plate carries a reflection diffraction grating. This is explained in more detail in our copending application of even date entitled Wavelength Selection Device and Method where the ability to deflect in any direction is particularly advantageous (Case 23333/GB) .
To appreciate the degree of movement involved, consider a bridge having a length of 1 cm. The coefficient of linear thermal expansion for silicon is 2.33 x 10~ °C~ . Thus a 1 cm length bridge will increase in length to 1.00023 cm for a 100°C temperature rise. This will cause transverse movement of the end of the bridge adjacent the plate of about 0.021 cm. In the case of a piston movement, the sensitivity is thus 0.00021 cm/°C or 2.1μm/°C. The deflection angle is 1./?°.
It should also be noted that the direction of the deflection can be adjusted by non-uniform doping of the bridges leading to the bridges having different resistivities. This would result in movement which was not about an axis defined by one of the electrical paths. Figures 2 and 3 illustrate two further examples which have more flexibility than the example shown in Figure 1. In these examples, each corner of the plate 3 is mounted by a pair of bridges 4, 4' - 7, 7' to the supports (not shown). Each pair of bridges 4, 4' etc is connected to individual electrical circuits so that the current through each pair of bridges can be separately controlled. These currents are labelled Iι~I4 respectively. To ensure that stray currents do not flow through the silicon plate 3, the bridges may be made significantly less resistive than the silicon material or blocking regions 13 can be inserted by suitable doping of the plate 3. By controlling each of the four currents I ι~I4 separately, the plate 3 can be deflected angularly about any desired axis in the plane of the plate. A parallel, piston action can be obtained by using all four currents together. In general, it is desirable to be able to monitor the degree of deflection imparted on the plate 3. This may be achieved by positioning four capacitance ser.scrε
(net shown), one near each edge or corner of the plate 3.
These sensors will provide electrical signals for automatic position control in a known manner. Optical sensing methods may also be used for position control.
If parallel (or piston) deflection only is required then the plate 3 itself can be made conductive but less conductive than the bridges 4-7. This is shown in Figure 4. - In this example, the same current I passes through the bridges 4, 6 into the plate 3 and out from the plate 3 across the bridges 5, 7. The plate 3 itself then expands and produces the parallel movement.

Claims

1. An assembly of at least two supports and a movable member mounted by respective connecting members between the supports, the electrical conductivity of the assembly being such that at least one electrically conductive path extends from a support to the movable member and thereafter to the or another support, the resistivity of the path being such that the passage of a working current along the path causes thermal expansion of one or more of the connecting members and the movable member thereby causing movement of the movable member relatively to the supports.
2. An assembly according to claim 1, wherein the movable member is mounted to each support by a pair of connecting members.
3. An assembly according to claim 2, wherein all the connecting members are electrically conductive.
4. An assembly according to any of the preceding claims, wherein part of at least one of the electrical paths is defined by an electrically conductive portion of the movable member.
5. An assembly according to claim 4, wherein the or each electrically conductive part of the movable member has a higher resitivity than the remainder of the electrically conductive path.
6. An assembly according to any of the preceding claims, wherein the resistivity of the cr each connecting member forming part of an electrically conductive path is higher than the remainder of the electrically conductive path.
7. An assembly according to at least claim 2, wherein two electrical paths are defined between the supports across the movable member.
8. An assembly according to any of claims 1 to 6, wherein four electrical paths are provided, each associated with a respective pair of connecting members.
9. An assembly according to any of the preceding claims, further comprising at least one current source; and control means for controlling the flow of current from the or each current source through the or each electrical path.
10. An assembly according to any of the preceding claims, wherein the supports, connecting members, and the movable member are all integrally formed.
11. An assembly according to any of the preceding claims, wherein those parts of the support, connecting members, and movable member which define the or each electrical path are doped or metallised.
12. An assembly according to any cf the preceding claims, wherein at least the movable member is made from silicon.
13. An assembly according to any of the preceding claims, wherein the movable member comprises an optical mirror.
14. An assembly of at least two supports and a movable member mounted by respective connecting members between the supports substantially as hereinbefore described with reference to any of the examples shown in the accompanying drawings.
PCT/GB1986/000628 1985-10-16 1986-10-16 Movable member-mounting WO1987002472A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61505413A JPH0769520B2 (en) 1985-10-16 1986-10-16 Movable member mounting structure

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
GB858525459A GB8525459D0 (en) 1985-10-16 1985-10-16 Mounting component to substrate
GB858525461A GB8525461D0 (en) 1985-10-16 1985-10-16 Wavelength selection device
GB858525462A GB8525462D0 (en) 1985-10-16 1985-10-16 Radiation deflector assembly
GB858525458A GB8525458D0 (en) 1985-10-16 1985-10-16 Positioning optical components & waveguides
GB8525458 1985-10-16
GB8525462 1985-10-16
GB8525460 1985-10-16
GB8525459 1985-10-16
GB8525461 1985-10-16
GB858525460A GB8525460D0 (en) 1985-10-16 1985-10-16 Movable member mounting
GB858526189A GB8526189D0 (en) 1985-10-23 1985-10-23 Fabry-perot interferometer
GB8526189 1985-10-23

Publications (1)

Publication Number Publication Date
WO1987002472A1 true WO1987002472A1 (en) 1987-04-23

Family

ID=27546918

Family Applications (6)

Application Number Title Priority Date Filing Date
PCT/GB1986/000630 WO1987002475A1 (en) 1985-10-16 1986-10-16 Radiation deflector assembly
PCT/GB1986/000628 WO1987002472A1 (en) 1985-10-16 1986-10-16 Movable member-mounting
PCT/GB1986/000626 WO1987002474A1 (en) 1985-10-16 1986-10-16 Positioning optical components and waveguides
PCT/GB1986/000631 WO1987002470A1 (en) 1985-10-16 1986-10-16 Fabry-perot interferometer
PCT/GB1986/000627 WO1987002518A1 (en) 1985-10-16 1986-10-16 Mounting a component to a substrate
PCT/GB1986/000629 WO1987002476A1 (en) 1985-10-16 1986-10-16 Wavelength selection device and method

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PCT/GB1986/000626 WO1987002474A1 (en) 1985-10-16 1986-10-16 Positioning optical components and waveguides
PCT/GB1986/000631 WO1987002470A1 (en) 1985-10-16 1986-10-16 Fabry-perot interferometer
PCT/GB1986/000627 WO1987002518A1 (en) 1985-10-16 1986-10-16 Mounting a component to a substrate
PCT/GB1986/000629 WO1987002476A1 (en) 1985-10-16 1986-10-16 Wavelength selection device and method

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EP (6) EP0219359B1 (en)
JP (5) JPH077149B2 (en)
AT (6) ATE50864T1 (en)
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EP0226296A1 (en) 1987-06-24
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US4846930A (en) 1989-07-11
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US4867532A (en) 1989-09-19
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US4854658A (en) 1989-08-08
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