WO1987002518A1 - Mounting a component to a substrate - Google Patents

Mounting a component to a substrate Download PDF

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Publication number
WO1987002518A1
WO1987002518A1 PCT/GB1986/000627 GB8600627W WO8702518A1 WO 1987002518 A1 WO1987002518 A1 WO 1987002518A1 GB 8600627 W GB8600627 W GB 8600627W WO 8702518 A1 WO8702518 A1 WO 8702518A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
support
component
combination according
mounting
Prior art date
Application number
PCT/GB1986/000627
Other languages
French (fr)
Inventor
Ian William Stanley
Original Assignee
British Telecommunications Public Limited Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB858525460A external-priority patent/GB8525460D0/en
Priority claimed from GB858525458A external-priority patent/GB8525458D0/en
Priority claimed from GB858525462A external-priority patent/GB8525462D0/en
Priority claimed from GB858525459A external-priority patent/GB8525459D0/en
Priority claimed from GB858525461A external-priority patent/GB8525461D0/en
Priority claimed from GB858526189A external-priority patent/GB8526189D0/en
Application filed by British Telecommunications Public Limited Company filed Critical British Telecommunications Public Limited Company
Publication of WO1987002518A1 publication Critical patent/WO1987002518A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/14—External cavity lasers
    • H01S5/141—External cavity lasers using a wavelength selective device, e.g. a grating or etalon
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
    • G01D5/266—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light by interferometric means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
    • G01J3/12—Generating the spectrum; Monochromators
    • G01J3/26—Generating the spectrum; Monochromators using multiple reflection, e.g. Fabry-Perot interferometer, variable interference filters
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/001—Optical devices or arrangements for the control of light using movable or deformable optical elements based on interference in an adjustable optical cavity
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/28—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals
    • G02B6/2804—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals forming multipart couplers without wavelength selective elements, e.g. "T" couplers, star couplers
    • G02B6/2817—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals forming multipart couplers without wavelength selective elements, e.g. "T" couplers, star couplers using reflective elements to split or combine optical signals
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/32—Optical coupling means having lens focusing means positioned between opposed fibre ends
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/38—Mechanical coupling means having fibre to fibre mating means
    • G02B6/3801—Permanent connections, i.e. wherein fibres are kept aligned by mechanical means
    • G02B6/3803—Adjustment or alignment devices for alignment prior to splicing
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/28—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals
    • G02B6/293—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
    • G02B6/29346—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means operating by wave or beam interference
    • G02B6/29358—Multiple beam interferometer external to a light guide, e.g. Fabry-Pérot, etalon, VIPA plate, OTDL plate, continuous interferometer, parallel plate resonator
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/35—Optical coupling means having switching means
    • G02B6/351—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements
    • G02B6/3512—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements the optical element being reflective, e.g. mirror
    • G02B6/3516—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements the optical element being reflective, e.g. mirror the reflective optical element moving along the beam path, e.g. controllable diffractive effects using multiple micromirrors within the beam
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/35—Optical coupling means having switching means
    • G02B6/3564—Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details
    • G02B6/3568—Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details characterised by the actuating force
    • G02B6/357—Electrostatic force
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/105—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling the mutual position or the reflecting properties of the reflectors of the cavity, e.g. by controlling the cavity length
    • H01S3/1055—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling the mutual position or the reflecting properties of the reflectors of the cavity, e.g. by controlling the cavity length one of the reflectors being constituted by a diffraction grating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S359/00—Optical: systems and elements
    • Y10S359/90—Methods

Definitions

  • the invention relates to a method of mounting a component to a substrate, for example the mounting of an optical component such as a laser chip to a substrate.
  • an optical component such as a laser chip
  • Recent developments in optical technology have lead to the construction of laser chips and photosensor chips which have relatively small dimensions of the order of 200 microns. It is now proposed that these components should be mounted on substrates and accurately aligned with optical waveguides or other optical components.
  • One of the difficulties with this is that it is difficult to hold the component accurately using a micromanipulator or the like during mounting ot the component on a substrate.
  • the heat sink is a slab of silicon which is apparently layed on the substrate.
  • the laser diode cannot, however, be accurately positioned on the substrate.
  • a method of mounting a component on a substrate comprises mounting the component on a support; positioning the support on the substrate, wherein at least one of the support and the substrate includes locator means such that the support is located in at least one direction relatively to the substrate; and securing the component to the substrate.
  • the location of the support in at lease one direction relatively to the substrate automatically locates the component also in that direction.
  • the locator means can be positioned remotely of the component and will not interfere with the mounting of the component.
  • a component secured to a substrate the combination further comprising a support to which the component is mounted, at least one of the support and the substrate including locator means for locating the support in at least one direction relatively to the substrate.
  • the locator means comprises two or more legs positioned on either the support or the substrate, the support being positioned on the legs spaced from the substrate by a predetermined amount determined by the length of the legs.
  • complementary locating portions are formed in the support and the substrate. This has the advantage that the support is located in two directions relative to the substrate.
  • the locating portions may comprise complementary ridges and recesses.
  • the substrate comprises a single crystal such as silicon it is particularly convenient if the complementary ridge ⁇ and recesses have a V-shaped cross-section since these can be formed using known masking and anistropic etching techniques.
  • the component may be directly bonded to the substrate, for example by soldering, or indirectly by bonding the support to the substrate.
  • both the support and component are bonded to the substrate.
  • Figure 1 is a side elevation of a first example with some parts omitted for clarity;
  • Figure 2 is a plan of the first example with some parts omitted for clarity; and, Figures 3, 4, and 5 are a side elevation, partial end elevation, and plan respectively of a second example.
  • Figures 1 and 2 illustrate a lithium niobate substrate 1. Titanium is diffused into a narrow rectilinear section 2 of the top surface of the substrate 1 to define an optical waveguide by modifying the refractive index of the substrate.
  • a generally U-shaped recess or slot 3 is then cut in the surface of the substrate 1 orthogonal to the waveguide 2 by using a ' suitable technique such as ion beam milling or reactive ion etch. As can be seen in Figure 1, the slot 3 has a rectangular cross-section.
  • the formation of the slot 3 divides the optical waveguide 2 into two subsidiary optical waveguides 5, 6 which are automatically in alignment with one another.
  • a conventional laser chip 4 is then mounted in the slot 3 (by a method to be described below) with opposite facets 7, 8 in alignment with the subsidiary waveguides 6, 5 respectively.
  • the depth (D) of the slot 3 is chosen so that the light emitting stripe in the laser chip 4 is matched to the optical waveguides 5, 6.
  • the length (L) of the slot 3 is chosen to allow the maximum possible light transmission between the laser chip 4 and the substrate 1 and it can be tailored to suit a given chip length.
  • the third dimension (W) is not critical and is chosen to allow adjustment of the laser chip 4 along the slot 3 to enable the optimum position of the laser chip relatively to the optical waveguides 5, 6 to be found and to permit a number of chips to be mounted side by side.
  • L is about 200 and D ⁇ 15 . m.
  • the laser chip is initially soldered to the undersurface of a metal bridge 9.
  • the bridge 9 has a pair of integral depending legs 10 which rest on an upper surface of the substrate 1 with the laser chip 4 suspended in the slot 3. This locates the laser chip 4 in the vertical direction by controlling the extent to which the laser chip 4 is received in the slot 3. Furthermore, it is easier for a micromanipulator to hold the bridge 9 than the laser chip itself.
  • Optimum alignment of the laser chip 4 with the optical waveguides 5, 6 is achieved using an optical method by monitoring the power transmitted along the waveguides while the activated laser chip is moved along the slot 3. Once the optimum position has been found, corresponding to maximum power coupling with the waveguides 5, 6, the laser chip 4 and the legs 10 of the bridge 9 are soldered to the substrate 1.
  • a transverse lower connection 11 to the laser chip 4 extends along the base of the slot 3 ( Figure 2) .
  • One of the advantages of providing an elongate slot 3 is that a number of laser chips could be mounted side by side. This is shown in Figure 2 where additional laser chips 12, 13 are provided in alignment with optical waveguides 14, 15; 16, 17 respectively, each pair having a similar form to the optical waveguides 5, 6.
  • bridges corresponding to the bridge 9 and supporting the laser chips 12, 13 have been omitted.
  • lithium niobate is that it can be used to form electro-optic components which would be incorporated into areas of the substrate adjacent the slot 3 with suitable connections being made with the optical waveguides.
  • Figures 3 to 5 illustrate a second example in which a silicon substrate 18 is used.
  • silicon is that it can be very accurately etched using its anisotropic etching properties to produce grooves with depths accurate to 1 micron and with accurately determined included angles.
  • a flat bottomed channel 19 is formed having a generally U-shaped cross-section with sloping sides by etching the 111 faces of the crystal.
  • a pair of parallel V-shaped grooves 20 are etched parallel with the channel 19 and on either side of the channel 19.
  • a V-shaped groove 21 is etched at right angles to the channel 19 and grooves 20, having a depth approximately equal to half the diameter of a monomode optical fibre 22 which is subsequently to be mounted in the groove.
  • a photodiode 23 is bonded (eg. soldered) to the sloping surface of the channel 19 facing the optical fibre 22.
  • a second silicon substrate or chip 24 is provided which corresponds to the bridge 9 in the previous example.
  • the chip 24 has two pairs of depending, V-shaped ridges 25 and a " central depending ridge 26.
  • the included angle of each ridge 25 is substantially the same as the included angle of the V-shaped grooves 20 in the substrate 18.
  • a laser diode 27 is bonded to the ridge 26.
  • the substrate 24 is then mounted on the substrate 18 with each pair of ridges 25 being received in the corresponding groove 20 and straddling the groove 21.
  • the depth of the grooves 20 and the height of the ridge 26 are chosen such that when the substrate 24 is mounted on the substrate 18, the laser diode 27 is accurately located and aligned with an optical fibre 22 in the groove 21 ( Figure 4) .
  • A-. feature of this example is that the position of the laser diode 27 with respect to the optical fibre 22 can be adjusted in the direction of the grooves 20 to obtain maximum power coupling into the optical fibre.
  • the separation of the end of the optical fibre 22 from the laser diode 27 can also be altered by sliding the fibre within the groove 21.
  • the photodiode 23 may be used for a variety of purposes similar to those outlined in the previous example for monitoring laser emission from the facet of the laser diode 27 opposite to the optical fibre 22.
  • the upper substrate 24 may include a further depending ridge which clamps the optical fibre 22 into the groove 21.

Abstract

A method of mounting an optical component such as a laser chip (4) on a substrate (1). The method comprises mounting the chip (4) on a bridge (9); and positioning the bridge (9) on the substrate (1). Locator means in the form of depending legs (10) are provided on the bridge (9) so that the bridge is located in the vertical direction relatively to the substrate (1) and hence the laser chip (4) is also located. Finally, the chip (4) is secured to the substrate (1) by, for example, soldering.

Description

MOUNTING A COMPONENT TO A SUBSTRATE The invention relates to a method of mounting a component to a substrate, for example the mounting of an optical component such as a laser chip to a substrate. Recent developments in optical technology have lead to the construction of laser chips and photosensor chips which have relatively small dimensions of the order of 200 microns. It is now proposed that these components should be mounted on substrates and accurately aligned with optical waveguides or other optical components. One of the difficulties with this is that it is difficult to hold the component accurately using a micromanipulator or the like during mounting ot the component on a substrate.
A paper by M. Kobayashi et al entitled "Guided-Kave optical gate matrix switch" in the Proc. 11th European
Conference on Optical Communication (pages 73-76)
• 'describes the mounting of a laser diode to a silicon heat sink. The heat sink is a slab of silicon which is apparently layed on the substrate. The laser diode cannot, however, be accurately positioned on the substrate.
In accordance with one aspect of the present invention, a method of mounting a component on a substrate comprises mounting the component on a support; positioning the support on the substrate, wherein at least one of the support and the substrate includes locator means such that the support is located in at least one direction relatively to the substrate; and securing the component to the substrate. The location of the support in at lease one direction relatively to the substrate automatically locates the component also in that direction. Thus, the locator means can be positioned remotely of the component and will not interfere with the mounting of the component. In accordance with a second aspect of the present invention we provide in combination a component secured to a substrate, the combination further comprising a support to which the component is mounted, at least one of the support and the substrate including locator means for locating the support in at least one direction relatively to the substrate.
In one simple arrangement, the locator means comprises two or more legs positioned on either the support or the substrate, the support being positioned on the legs spaced from the substrate by a predetermined amount determined by the length of the legs.
Preferably, however, complementary locating portions are formed in the support and the substrate. This has the advantage that the support is located in two directions relative to the substrate.
For example, the locating portions may comprise complementary ridges and recesses. Where the substrate comprises a single crystal such as silicon it is particularly convenient if the complementary ridgeε and recesses have a V-shaped cross-section since these can be formed using known masking and anistropic etching techniques.
The component may be directly bonded to the substrate, for example by soldering, or indirectly by bonding the support to the substrate. Preferably, both the support and component are bonded to the substrate.
Some examples of methods and combinations in accordance with the invention will now be described with reference^to the accompanying drawings, in which:-
Figure 1 is a side elevation of a first example with some parts omitted for clarity;
Figure 2 is a plan of the first example with some parts omitted for clarity; and, Figures 3, 4, and 5 are a side elevation, partial end elevation, and plan respectively of a second example. Figures 1 and 2 illustrate a lithium niobate substrate 1. Titanium is diffused into a narrow rectilinear section 2 of the top surface of the substrate 1 to define an optical waveguide by modifying the refractive index of the substrate. A generally U-shaped recess or slot 3 is then cut in the surface of the substrate 1 orthogonal to the waveguide 2 by using a ' suitable technique such as ion beam milling or reactive ion etch. As can be seen in Figure 1, the slot 3 has a rectangular cross-section. It will be seen that the formation of the slot 3 divides the optical waveguide 2 into two subsidiary optical waveguides 5, 6 which are automatically in alignment with one another. A conventional laser chip 4 is then mounted in the slot 3 (by a method to be described below) with opposite facets 7, 8 in alignment with the subsidiary waveguides 6, 5 respectively. The depth (D) of the slot 3 is chosen so that the light emitting stripe in the laser chip 4 is matched to the optical waveguides 5, 6. The length (L) of the slot 3 is chosen to allow the maximum possible light transmission between the laser chip 4 and the substrate 1 and it can be tailored to suit a given chip length. The third dimension (W) is not critical and is chosen to allow adjustment of the laser chip 4 along the slot 3 to enable the optimum position of the laser chip relatively to the optical waveguides 5, 6 to be found and to permit a number of chips to be mounted side by side.
Typically, L is about 200
Figure imgf000005_0001
and D < 15 . m. To mount the laser chip 4, the laser chip is initially soldered to the undersurface of a metal bridge 9. The bridge 9 has a pair of integral depending legs 10 which rest on an upper surface of the substrate 1 with the laser chip 4 suspended in the slot 3. This locates the laser chip 4 in the vertical direction by controlling the extent to which the laser chip 4 is received in the slot 3. Furthermore, it is easier for a micromanipulator to hold the bridge 9 than the laser chip itself. Optimum alignment of the laser chip 4 with the optical waveguides 5, 6 is achieved using an optical method by monitoring the power transmitted along the waveguides while the activated laser chip is moved along the slot 3. Once the optimum position has been found, corresponding to maximum power coupling with the waveguides 5, 6, the laser chip 4 and the legs 10 of the bridge 9 are soldered to the substrate 1.
There are a number of advantages in providing two optical waveguides 5,6. In general, the spectral performance of conventional laser chips needs to be improved and this can be achieved by monitoring the las*er output from the facet 8 while the main laser output is generated from the facet 7. In addition, this access to both facets could be used in a combined transmitter/receiver or simply to monitor the output power.
A transverse lower connection 11 to the laser chip 4 extends along the base of the slot 3 (Figure 2) . One of the advantages of providing an elongate slot 3 is that a number of laser chips could be mounted side by side. This is shown in Figure 2 where additional laser chips 12, 13 are provided in alignment with optical waveguides 14, 15; 16, 17 respectively, each pair having a similar form to the optical waveguides 5, 6. In Figure 3, bridges corresponding to the bridge 9 and supporting the laser chips 12, 13 have been omitted.
The advantage of lithium niobate is that it can be used to form electro-optic components which would be incorporated into areas of the substrate adjacent the slot 3 with suitable connections being made with the optical waveguides.
Figures 3 to 5 illustrate a second example in which a silicon substrate 18 is used. One of the advantages of silicon is that it can be very accurately etched using its anisotropic etching properties to produce grooves with depths accurate to 1 micron and with accurately determined included angles. In the example shown in Figures 3 to 5, initially a flat bottomed channel 19 is formed having a generally U-shaped cross-section with sloping sides by etching the 111 faces of the crystal. Subsequently a pair of parallel V-shaped grooves 20 are etched parallel with the channel 19 and on either side of the channel 19. A V-shaped groove 21 is etched at right angles to the channel 19 and grooves 20, having a depth approximately equal to half the diameter of a monomode optical fibre 22 which is subsequently to be mounted in the groove.
A photodiode 23 is bonded (eg. soldered) to the sloping surface of the channel 19 facing the optical fibre 22.
A second silicon substrate or chip 24 is provided which corresponds to the bridge 9 in the previous example. The chip 24 has two pairs of depending, V-shaped ridges 25 and a "central depending ridge 26. The included angle of each ridge 25 is substantially the same as the included angle of the V-shaped grooves 20 in the substrate 18.
A laser diode 27 is bonded to the ridge 26. The substrate 24 is then mounted on the substrate 18 with each pair of ridges 25 being received in the corresponding groove 20 and straddling the groove 21. The depth of the grooves 20 and the height of the ridge 26 are chosen such that when the substrate 24 is mounted on the substrate 18, the laser diode 27 is accurately located and aligned with an optical fibre 22 in the groove 21 (Figure 4) .
The provision of the grooves 20 and complementary ridges 25 assists in accurately positioning the laser diode 27 in two directions and this should be contrasted with the previous example in which the bridge 9 permits a certain degree of movement transverse to the slot 3.
A-. feature of this example is that the position of the laser diode 27 with respect to the optical fibre 22 can be adjusted in the direction of the grooves 20 to obtain maximum power coupling into the optical fibre. In addition, the separation of the end of the optical fibre 22 from the laser diode 27 can also be altered by sliding the fibre within the groove 21. Once the correct relative positions have been found, the upper and lower silicon substrates 18, 24 are bonded together in such a way that the laser diode attachment to the upper silicon chip 24 is unaffected. In addition, the optical fibre 22 is bonded into the groove 21. Bonding may be achieved using soldering or any other known technique.
The photodiode 23 may be used for a variety of purposes similar to those outlined in the previous example for monitoring laser emission from the facet of the laser diode 27 opposite to the optical fibre 22. in a modification of this example (not shown) the upper substrate 24 may include a further depending ridge which clamps the optical fibre 22 into the groove 21.

Claims

1. A method of mounting a component on a substrate, the method comprising mounting the component on a support; positioning the support on the substrate, wherein at least one of the support and the substrate includes locator means such that the support is located in at least one direction relatively to the substrate; and securing the component to the substrate.
2. A method according to claim 1, further comprising prior to the positioning step, providing the locator means by forming complementary locating portions in the support and the substrate.
3. A method according to claim 2, wherein the substrate and support comprise single crystals, the method further comprising anisotropically etching the substrate and support to produce the complementary locating portions.
4. A method according to any of claims 1 to 3, wherein the securing step comprises securing the support to the substrate.
5. A method of mounting a component to a substrate according to any preceding claim, wherein the component is mounted on a bridge shaped support.
6. In combination: a component secured to a substrate, the combination further comprising a support to which the component is mounted, at least one of the support and the substrate including locator means for locating the support in at least one direction relatively to the substrate.
7. A combination according to claim 6, wherein the locator means locates the support in two directions relatively to the substrate.
8. A combination according to claim 7, wherein the support and the substrate have complementary locating positions constituting the locator means.
9. A combination according to claim 8, wherein the locating portions comprise complementary ridges and recesses.
10. A combination according to claim 9, wherein the locating portions comprise complementary V-shaped ridges and V-shaped recesses.
11. A combination according to any of claims 7 to 10, wherein the component comprises an optical component.
12. A component according to claim 11, wherein the component comprises a laser chip or an optical sensor chip.
13. A combination according to any of claims 7 to 12, wherein one or both of the substrate and support comprise a single crystal.
14. A combination according to claim 13, wherein one or both of the substrate and support comprise silicon÷
15. A combination according to any of claims 7 to 14, wherein the support is a bridge-like structured
PCT/GB1986/000627 1985-10-16 1986-10-16 Mounting a component to a substrate WO1987002518A1 (en)

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
GB8525461 1985-10-16
GB8525459 1985-10-16
GB858525460A GB8525460D0 (en) 1985-10-16 1985-10-16 Movable member mounting
GB8525462 1985-10-16
GB858525458A GB8525458D0 (en) 1985-10-16 1985-10-16 Positioning optical components & waveguides
GB858525462A GB8525462D0 (en) 1985-10-16 1985-10-16 Radiation deflector assembly
GB8525460 1985-10-16
GB8525458 1985-10-16
GB858525459A GB8525459D0 (en) 1985-10-16 1985-10-16 Mounting component to substrate
GB858525461A GB8525461D0 (en) 1985-10-16 1985-10-16 Wavelength selection device
GB858526189A GB8526189D0 (en) 1985-10-23 1985-10-23 Fabry-perot interferometer
GB8526189 1985-10-23

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PCT/GB1986/000626 WO1987002474A1 (en) 1985-10-16 1986-10-16 Positioning optical components and waveguides
PCT/GB1986/000629 WO1987002476A1 (en) 1985-10-16 1986-10-16 Wavelength selection device and method
PCT/GB1986/000631 WO1987002470A1 (en) 1985-10-16 1986-10-16 Fabry-perot interferometer
PCT/GB1986/000630 WO1987002475A1 (en) 1985-10-16 1986-10-16 Radiation deflector assembly
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PCT/GB1986/000626 WO1987002474A1 (en) 1985-10-16 1986-10-16 Positioning optical components and waveguides
PCT/GB1986/000629 WO1987002476A1 (en) 1985-10-16 1986-10-16 Wavelength selection device and method
PCT/GB1986/000631 WO1987002470A1 (en) 1985-10-16 1986-10-16 Fabry-perot interferometer
PCT/GB1986/000630 WO1987002475A1 (en) 1985-10-16 1986-10-16 Radiation deflector assembly

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EP (6) EP0226296B1 (en)
JP (5) JPH077149B2 (en)
AT (6) ATE61487T1 (en)
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US4846930A (en) 1989-07-11
EP0219358A1 (en) 1987-04-22
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US4871244A (en) 1989-10-03
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WO1987002472A1 (en) 1987-04-23
EP0219357A1 (en) 1987-04-22
JPS63501383A (en) 1988-05-26
DE3689537D1 (en) 1994-02-24
JPS63501384A (en) 1988-05-26
ATE61487T1 (en) 1991-03-15
EP0226296B1 (en) 1992-11-04
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SG892G (en) 1992-03-20
DE3667335D1 (en) 1990-01-11
ATE50864T1 (en) 1990-03-15
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WO1987002474A1 (en) 1987-04-23
EP0219356A1 (en) 1987-04-22
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WO1987002470A1 (en) 1987-04-23
EP0223414A1 (en) 1987-05-27
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JPS63501600A (en) 1988-06-16
JP2514343B2 (en) 1996-07-10
EP0219357B1 (en) 1989-12-27
ES2012346B3 (en) 1990-03-16
ATE49064T1 (en) 1990-01-15
US4825262A (en) 1989-04-25
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US4896936A (en) 1990-01-30
US4867532A (en) 1989-09-19
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ES2013599B3 (en) 1990-05-16
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WO1987002475A1 (en) 1987-04-23
EP0223414B1 (en) 1994-01-12

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