WO1990001782A1 - Low inductance decoupling capacitor - Google Patents
Low inductance decoupling capacitor Download PDFInfo
- Publication number
- WO1990001782A1 WO1990001782A1 PCT/US1989/003177 US8903177W WO9001782A1 WO 1990001782 A1 WO1990001782 A1 WO 1990001782A1 US 8903177 W US8903177 W US 8903177W WO 9001782 A1 WO9001782 A1 WO 9001782A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- capacitor
- conductor
- capacitive element
- skirt means
- conductors
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/642—Capacitive arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10515—Stacked components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
BR898907045A BR8907045A (en) | 1988-08-01 | 1989-07-24 | LOW INDUCTORY DISCONNECTION CAPACITORS |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US226,602 | 1988-08-01 | ||
US07/226,602 US4853826A (en) | 1988-08-01 | 1988-08-01 | Low inductance decoupling capacitor |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1990001782A1 true WO1990001782A1 (en) | 1990-02-22 |
Family
ID=22849594
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1989/003177 WO1990001782A1 (en) | 1988-08-01 | 1989-07-24 | Low inductance decoupling capacitor |
Country Status (5)
Country | Link |
---|---|
US (1) | US4853826A (en) |
EP (1) | EP0381745A4 (en) |
JP (1) | JPH03500835A (en) |
BR (1) | BR8907045A (en) |
WO (1) | WO1990001782A1 (en) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4916576A (en) * | 1989-02-27 | 1990-04-10 | Fmtt, Inc. | Matrix capacitor |
US5272590A (en) * | 1990-02-12 | 1993-12-21 | Hernandez Jorge M | Integrated circuit package having an internal cavity for incorporating decoupling capacitor |
US5309324A (en) * | 1991-11-26 | 1994-05-03 | Herandez Jorge M | Device for interconnecting integrated circuit packages to circuit boards |
US5422782A (en) * | 1992-11-24 | 1995-06-06 | Circuit Components Inc. | Multiple resonant frequency decoupling capacitor |
US5880925A (en) * | 1997-06-27 | 1999-03-09 | Avx Corporation | Surface mount multilayer capacitor |
US6159764A (en) * | 1997-07-02 | 2000-12-12 | Micron Technology, Inc. | Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages |
US6292350B1 (en) | 1997-11-10 | 2001-09-18 | Murata Manufacturing, Co., Ltd | Multilayer capacitor |
US6266228B1 (en) | 1997-11-10 | 2001-07-24 | Murata Manufacturing Co., Ltd | Multilayer capacitor |
US6266229B1 (en) | 1997-11-10 | 2001-07-24 | Murata Manufacturing Co., Ltd | Multilayer capacitor |
JP2991175B2 (en) | 1997-11-10 | 1999-12-20 | 株式会社村田製作所 | Multilayer capacitors |
US6549395B1 (en) | 1997-11-14 | 2003-04-15 | Murata Manufacturing Co., Ltd | Multilayer capacitor |
WO2000055875A1 (en) * | 1999-03-16 | 2000-09-21 | Maxwell Energy Products | Low inductance four terminal capacitor lead frame |
JP3476127B2 (en) | 1999-05-10 | 2003-12-10 | 株式会社村田製作所 | Multilayer capacitors |
JP3548821B2 (en) | 1999-05-10 | 2004-07-28 | 株式会社村田製作所 | Multilayer capacitor, and electronic device and high-frequency circuit using the same |
US6327134B1 (en) | 1999-10-18 | 2001-12-04 | Murata Manufacturing Co., Ltd. | Multi-layer capacitor, wiring board, and high-frequency circuit |
JP3489729B2 (en) | 1999-11-19 | 2004-01-26 | 株式会社村田製作所 | Multilayer capacitors, wiring boards, decoupling circuits, and high-frequency circuits |
US6404649B1 (en) * | 2000-03-03 | 2002-06-11 | Advanced Micro Devices, Inc. | Printed circuit board assembly with improved bypass decoupling for BGA packages |
US6418007B1 (en) * | 2000-08-28 | 2002-07-09 | Motorola, Inc. | Trimmable chip stub |
US6936917B2 (en) * | 2001-09-26 | 2005-08-30 | Molex Incorporated | Power delivery connector for integrated circuits utilizing integrated capacitors |
US7312402B2 (en) * | 2002-10-11 | 2007-12-25 | International Business Machines Corporation | Method and apparatus for providing improved loop inductance of decoupling capacitors |
US6950300B2 (en) * | 2003-05-06 | 2005-09-27 | Marvell World Trade Ltd. | Ultra low inductance multi layer ceramic capacitor |
USD668658S1 (en) * | 2011-11-15 | 2012-10-09 | Connectblue Ab | Module |
USD680119S1 (en) * | 2011-11-15 | 2013-04-16 | Connectblue Ab | Module |
USD692896S1 (en) * | 2011-11-15 | 2013-11-05 | Connectblue Ab | Module |
USD680545S1 (en) * | 2011-11-15 | 2013-04-23 | Connectblue Ab | Module |
USD668659S1 (en) * | 2011-11-15 | 2012-10-09 | Connectblue Ab | Module |
USD689053S1 (en) * | 2011-11-15 | 2013-09-03 | Connectblue Ab | Module |
US9510448B2 (en) | 2014-08-29 | 2016-11-29 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Maximizing surface area of surface mount contact pads of circuit board also having via contact pads |
US11621129B2 (en) | 2019-04-25 | 2023-04-04 | KYOCERA AVX Components Corporation | Low inductance component |
CN112164891B (en) * | 2020-08-31 | 2023-05-23 | 西安朗普达通信科技有限公司 | Cancellation decoupling chip |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3691289A (en) * | 1970-10-22 | 1972-09-12 | Minnesota Mining & Mfg | Packaging of semiconductor devices |
US4584627A (en) * | 1985-01-09 | 1986-04-22 | Rogers Corporation | Flat decoupling capacitor and method of manufacture thereof |
US4734818A (en) * | 1985-01-22 | 1988-03-29 | Rogers Corporation | Decoupling capacitor for surface mounted leadless chip carriers, surface mounted leaded chip carriers and Pin Grid Array packages |
-
1988
- 1988-08-01 US US07/226,602 patent/US4853826A/en not_active Expired - Fee Related
-
1989
- 1989-07-24 EP EP19890909642 patent/EP0381745A4/en not_active Withdrawn
- 1989-07-24 BR BR898907045A patent/BR8907045A/en unknown
- 1989-07-24 JP JP1509039A patent/JPH03500835A/en active Pending
- 1989-07-24 WO PCT/US1989/003177 patent/WO1990001782A1/en not_active Application Discontinuation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3691289A (en) * | 1970-10-22 | 1972-09-12 | Minnesota Mining & Mfg | Packaging of semiconductor devices |
US4584627A (en) * | 1985-01-09 | 1986-04-22 | Rogers Corporation | Flat decoupling capacitor and method of manufacture thereof |
US4734818A (en) * | 1985-01-22 | 1988-03-29 | Rogers Corporation | Decoupling capacitor for surface mounted leadless chip carriers, surface mounted leaded chip carriers and Pin Grid Array packages |
Also Published As
Publication number | Publication date |
---|---|
EP0381745A1 (en) | 1990-08-16 |
JPH03500835A (en) | 1991-02-21 |
BR8907045A (en) | 1991-01-02 |
EP0381745A4 (en) | 1991-01-30 |
US4853826A (en) | 1989-08-01 |
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