WO1991019297A1 - Method of manufacturing an electrical device - Google Patents
Method of manufacturing an electrical device Download PDFInfo
- Publication number
- WO1991019297A1 WO1991019297A1 PCT/SE1991/000375 SE9100375W WO9119297A1 WO 1991019297 A1 WO1991019297 A1 WO 1991019297A1 SE 9100375 W SE9100375 W SE 9100375W WO 9119297 A1 WO9119297 A1 WO 9119297A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- mixture
- polymer material
- electrodes
- electrically conductive
- polymer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
Landscapes
- Dispersion Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Electromagnetism (AREA)
- Thermistors And Varistors (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Noodles (AREA)
- Fuses (AREA)
- Battery Electrode And Active Subsutance (AREA)
Abstract
An electrical device, especially an overcurrent protective device, with a polymer composition arranged between two electrodes comprising a polymer material and an electrically conductive powdered material, distributed in the polymer material, is manufactured by mixing the polymer material in thermoplastic state and in powdered state with a grain size of less than 100 νm, and of less than 40 νm in at least 50 % of the material, in solid, dry state with the electrically conductive powdered material in a grain size of less than 100 νm into a mixture in which the polymer material constitutes at least 30 per cent and the electrically conductive powdered material at least 20 per cent of the total volume of these materials, and by subjecting the mixture together with the electrodes to a pressing and a heating to a temperature at which the polymer material melts at least on the surface of the grains while forming a permanently coherent body of the mixture and while fixing the electrodes to the coherent body.
Description
Method of manufacturing an electrical device
The present invention relates to a method of manufacturing an electrical device, particularly an overcurrent protective device, comprising a body, provided with two parallel sur¬ faces, of an electrically conductive polymer composition with a resistivity of at most 100 mΩ cm and two electrodes arranged in contact with the parallel surfaces, the polymer composition comprising a polymer material and an electri¬ cally conductive powdered material distributed in the poly¬ mer material.
One type of such an electrical device in the form of an overcurrent protective device is a PTC element (Positive Temperature Coefficient) , that is, an element whose resistivity has a positive temperature coefficient. The resistance of a PTC element of the above kind is low, for example a few hundredths Ω, in the normal working range of the element which may extend to, for example, 80°C and increases slightly with the temperature. If the temperature of the element exceeds this value, for example because of overcurrent, the resistance increases more rapidly, and upon exceeding a certain critical temperature, the element suddenly changes from a low-resistance to a high-resistance state in which the resistance may amount to 10 kΩ and more .
Another type of such an electrical device in the form of an overcurrent protective device is a thermal overload relay.
When manufacturing the body of electrically conductive polymer composition for an electrical device of the described kind with hitherto used methods, the used polymer material, if it is a thermoplastic resin, for example polyethylene, is melted and mixed (compounded) with the conductive powdered material which normally consists of carbon in some form or of a metallic material or of a mixture of carbon and a metallic material. This technique involves a number of limitations. Thus, to introduce the
conductive material, the polymer material must have a relatively low viscosity and even if this is the case, it may be impossible to intermix the desired, sufficiently high contents of carbon. The powerful processing during the compounding operation also entails a risk that the conductive material is crushed or otherwise influenced so as to undergo undesirable changes. After the compounding, the produced mixture is subjected to a processing in connection with it being formed by extrusion, compression moulding, or in some other way, which entails a risk of an undesired anisotropy arising in the material in the formed product. The processes described may lead to problems in achieving reproducible properties in the manufactured, finished body.
After the forming of the body of polymer composition, the body is provided with electrodes according to applied technique. The electrodes usually consist of metal foils and are applied by being pressed onto the body while being heated.
According to the present invention, the mentioned limita¬ tions connected with prior art technique are eliminated and a considerable simplification of the manufacture of the electrical device is obtained.
Thus, the invention makes possible the use of polymer material with a considerably higher viscosity than what has previously been possible. It provides a considerably greater freedom of choice as regards types and contents of conductive materials. The conductive material is not sub¬ jected to any processing with undesired consequences. No forming, entailing a risk of anisotropy, occurs. The electrodes may be applied without having to carry out a separate operating step. A particularly important advantage is that the method makes it possible to obtain devices with very low transition resistance between electrode and polymer composition.
According to the invention, the favourable results are obtained by mixing the polymer material in thermoplastic state and in powdered form with a grain size of below 100 μm, and of below 40 μm in at least 50% of the material, in solid, dry state with the electrically conductive powdered material in a grain size of below 100 μm into a mixture in which the polymer material constitutes at least 30 per cent and the electrically conductive powdered material at least 20 per cent of the total volume of these materials and by subjecting the mixture together with the electrodes to a pressing and a heating to a temperature at which the polymer material melts at least on the surface of the grains while forming a permanently coherent body of the mixture and while fixing the electrodes to the coherent body. The grains of the polymer material then entirely lose their identity.
According to a favourable embodiment of the invention, which provides a particularly good reproducibility in the manu¬ factured device, the mixture of polymer material and elec¬ trically conductive powdered material is subjected to a pressing operation at room temperature or other temperature which is considerably lower than the temperature at which the polymer material melts while forming a preformed body, before the mixture in the form of the preformed body together with .the electrodes is subjected to the pressing and the heating for forming the permanently coherent body and for fixing the electrodes.
As electrodes there are preferably used prefabricated plates of a powdered metallic material, which have a porous struc¬ ture on the side facing the mixture and are impermeable to the polymer material so that they prevent penetration of the polymer material to the side facing away from the mixture. When using electrodes of this kind, the electrodes are effectively secured to the conductive polymer composition without the polymer material providing any insulating or any possibly slightly conductive coating on the outside of the electrodes. The polymer material penetrates, in its ther-
moplastic state, into the pores of the electrodes without penetrating the electrodes. Plates which are completely porous from the beginning may be made impermeable to the penetration of polymer material by being provided on the outside with a metallic coating, for example electro- lytically. It is also possible to make the outside tight by causing a superficial layer on the porous electrodes to melt and solidify, for example by using laser technique, the electrodes otherwise being maintained unchanged in their porous state. Another way of maintaining a porous surface structure towards the side facing the mixture and making the plates tight against the penetration of polymer material is to sinter the plates, normally in reducing atmosphere, at a temperature necessary therefor, which is considerably lower than the melting temperature for the used metallic electrode material, and, after the sintering, to grind or otherwise mechanically treat the outside of the plate. However, it is possible to use electrodes of a type different from that described above. Thus, for example, the electrode material in powdered state may be applied in the form of layers on the surfaces of the conductive polymer composition, before it is subjected to pressing and heating for forming the permanently coherent body and for fixing the electrodes. Also in such a case, measures are preferably taken for ensuring that the electrodes are tight against the pene¬ tration of polymer material, for example by providing them with a tight coating of metallic material on that side facing away from the mixture.
The metallic material in the electrodes may advantageously consist of nickel or copper but also other metallic materials in the form of pure metal or metal alloy with sufficient electric conductivity may be used. A suitable grain size of the metallic material is 0.5 μm - 20 μm and a suitable thickness of an electrode 100-1000 μm. If the electrodes are provided with a metallic coating, for example electrolytically, the coating may advantageously consist of copper which provides a well scattered electrical conduction
in the lateral direction within the electrode in question, irrespective of the material on which the electrode is otherwise based. The tight surface layer on an otherwise porous electrode may advantageously have a thickness which amounts to 3-30% of the thickness of the entire electrode.
According to an advantageous embodiment of the invention, a crosslinkable linear polymer is used as polymer material in the manufacture of the device. If the crosslinking ability of the polymer material is utilized, the crosslinking is carried out after the mixture of the polymer material and the conductive material together with the electrodes has been subjected to the pressing and the heating for forming the permanently coherent body and for fixing the electrodes. By crosslinking polymer material, a greater mechanical and thermal stability of the manufactured device may be achieved.
The polymer material preferably consists of a polyolefin, such as polyethylene, polypropylene, polybutene, or a copolymer of ethylene and propylene. Specially preferred is HD polyethylene. However, it is possible to use other liner polymers which may be made sufficiently fine-grained and be mixed in dry state with the conductive material and be transferred into thermoplastic state when the mixture is subjected to pressing and heating for forming a permanently coherent body of the polymer composition and for fixing the electrodes. Examples of such other linear polymers are polyamide, polethylene terephthalate, polybutene terephthalate and polyoxymethylene.
The polymer material preferably has a crystallinity of at least 5%.
The grain size of the polymer material is preferably 5-100 μm, of which at least 50% of the material has a grain size smaller than 40 μm.
As examples of suitable electrically conductive materials in the polymer composition may be mentioned carbon in the form of conductive carbon powders such as carbon black, metallic materials such as, for example, nickel, tungsten, molybdenum, cobalt, copper, silver, aluminium and brass, borides such as, for example, ZrB2 and iB2, nitrides such as, for example, ZrN and TiN, oxides such as, for example, V2O3 and TiO, carbides such as, for example, TaC, WC and ZrC, as well as mixtures of two or more of the exemplified materials such as, for example, a mixture of soot and nickel. The grain size of the conductive carbon powders such as carbon black is usually 0.01-0.10 μm, the grain size of metallic material preferably 0.5-100 μm and the grain size of borides, nitrides, oxides, and carbides preferably 0.01-100 μm. Preferably, at least part of the electrically conductive powdered material has a grain size which is smaller than the cross section of the pores of the electrode, so that at least that part of the powdered material can accompany the polymer material when it penetrates into the pores of the electrode.
The polymer material suitably constitutes 30-80 per cent and the electrically conductive powdered material 20-70 per cent of the total volume of these materials in the polymer composition built up of the mixture. If the electrically conductive material consists of a mixture of carbon and metallic material, there are preferred a content of polymer material of 65-80 per cent and a content of electrically conductive powdered material of 20-35 per cent of the total volume of these materials in devices with a pronounced PTC effect. Of the electrically conductive powdered material, the carbon preferably constitutes 5-75 per cent by volume and the metallic material 25-95 per cent by volume.
The invention will be explained in greater detail by describing a number of examples.
Example 1
75 parts by volume HD polyethylene (NB 6081 from PLAST-LABOR S.A., Bulle, Switzerland) with a melting index (MI 190/2) of 40 g/10 min, a density of 0.960 g/cm3 and a grain size of 5- 90 μm, thereof a grain size of 24-36 μm in more than 50% of the material, is mixed with 13 parts by volume nickel powder with a grain size of less than 7 μm and with 12 parts by volume carbon black of type N550 (ASTM) with a grain size of 0.040-0.048 μm into a mixture in the form of a polymer composition. The mixture is pressed at room temperature and a pressure of 70 MPa in a forming tool with a cylindrical cavity and one or two movable cylindrical dies into a preformed round plate with a diameter of 25 mm and a height of 1.5 mm.
In the same forming tool there are prepared two electrodes in the form of plates with a thickness of 0.6 mm by pressing of nickel powder with a grain size of 4-7 μm. The pressing is carried out at room temperature and a pressure of 70 MPa. The plates are porous with through-going pores. Each plate is electrolytically provided on one side with a 20 μm thick layer of copper which, for one thing, eliminates the presence of through-going pores by the layer being tight, and, for another, provides a radially scattered surface layer of high conductivity.
The plate of the polymer composition with one of the nickel electrode plates on each flat side is again placed in the forming tool with the copper layers facing outwards, whereupon the stack of the three plates is first pressed at room temperature and a pressure of 70 MPa and then at 150°C without changing the pressure. The polymer composition then forms a permanently coherent body, to which the electrodes are mechanically secured in an effective manner with a low transition resistance between electrode and polymer com¬ position by the polymer composition having penetrated into the pores of the electrodes or at least the polymer material
and the part of the electrically conductive powdered mat¬ erial having a grain size which is smaller than the pores of the electrode. The polymer composition has a resistivity of less than 50 mΩ cm. The manufactured device is excellently suited for use as PTC element.
Example 2
A device is manufactured in the manner stated in Example 1 with the difference that the copper layers on the outside of the electrodes are not applied until the stack of the plates of the polymer composition and of the nickel electrodes has been pressed at room temperature into a coherent body. After application of the copper layers on the outside of the electrodes, the coherent body is subjected to a pressing at a pressure of 70 MPa and a temperature of 150°C.
Example 3
A device is manufactured in the manner described in Example with the difference that the electrode plates pressed at room temperature, instead of being provided with tight copper layers on the outside, are subjected to a sintering in hydrogen gas atmosphere at about 400°C for four hours followed by a grinding of the side facing away from the polymer composition using 320 mesh wet grinding paper. The grinding entails a deformation of the surface layer so that this becomes tight. This resuls in electrode plates with a porous surface structure on the side facing the polymer composition but without through-going pores. They will therefore become impermeable to polymer material during the hot pressing.
Example 4
A device is manufactured in the manner described in Example 1 with the difference that the porous electrodes, instead of being provided on the outside with a copper layer, are made
tight there by melting down the surface layer to a depth of about 50 μm and causing it to solidify by the use of laser. The device is excellently suited for use as PTC element.
Example 5
•a
i A device is manufactured in any of the ways described in
Examples 1-4. After the last pressing with heat treatment, the polymer composition is subjected to a crosslinking by electron-irradiating the device in its entirety until the crosslinking degree of the polymer material amounts to 80% . The polymer composition has a resistivity of less than 50 mΩ cm. The device is excellently suited for use as PTC element.
Example 6
Electrodes are manufacturd in a manner described in Example 1, Example 3 or Example 4. The electrodes are placed together with the polymer composition described in Example 1 in the form of a powder, that is, without preforming, in the cavity of a forming tool of the kind described in Example 1 with the electrodes on either side of the polymer composition and with the tight layers (Examples 1 and 4) facing outwards. The polymer composition and the electrodes are subjected to a pressing with a pressure of 70 MPa at a temperature of 150°C. The polymer composition has a resistivity of. less than 50 mΩ cm. The device is excellently suited for use as PTC element .
Example 7
A device is manufactured in any of the ways described in Examples 1-6 but with the difference that, instead of polyethylene mentioned there, there is used an LD poly¬ ethylene (HX 1681 from PLAST-LABOR S.A.) with a melting index of 70 g/10 min, a density of 0.916 g/cm3 and a grain size of 5-35 μm, thereof a grain size of 10-14 μm in more
than 50% of the material. The polymer composition has a resistivity of less than 50 mΩ cm. The produced device is excellently suited for use as a PTC element.
Example 8
A device is manufactured in any of the ways described in Example 1, 2, 3, 4 or 6, with the difference that instead of polyethylene mentioned there, there is used polypropylene (PB 0580 from PLAST-LABOR S.A.) with a melting index (MI 230/5) of 100 g/10 min, a density of 0.905 g/cm3, and a grain size of 5-90 μm, thereof a grain size of 24-36 μm in more than 50% of the material and the difference that the hot pressing is carried out at 170°C.
Example 9
A device is manufactured in any of the ways described in Examples 1-8, with the difference that instead of the electrically conductive powdered materials in the form of 13 parts by volume nickel powder and 12 parts by volume carbon black mentioned there, there are used 50 parts by volume ZrN with a grain size of less than 45 μm. The polymer composition has a resistivity of less than 50 mΩ cm.
Example 10
A device is manufactured in the manner described in Example 9, with the difference that instead of ZrN there is used TiN with a grain size of less than 6-10 μm. The polymer composition has a resistivity of less than 35 mΩ cm.
Exa ple 11
A device is manufactured in any of the ways described in Examples 1-8, with the difference that instead of the electrically conductive powdered materials in the form of 13 parts by volume nickel powder and 12 parts by volume carbon
black mentioned there, there are used 13 parts by volume of the same carbon black and 52 parts by volume TiN with a grain size of 6-10 μm. The polymer composition has a resistivity of less than 35 Ωm cm.
Example 12
A device is manufactured in the manner described in Example 10, with the difference that instead of TiN there is used ZrB2 with a grain size of less than 45 μm. The polymer composition has a resistivity of less than 30 mΩ cm.
Example 13
A device is manufactured in the manner described in Example 9, with the difference that instead of ZrN there is used TiB2 with a grain size of less than 45 μm.
Example 14
A device is manufactured in any of the ways described in Examples 1-8, but with the difference that instead of the electrically conductive powdered materials mentioned there in the form of 13 parts by volume nickel powder and 12 parts by volume carbon black, there is used 120 parts by volume soot of the same kind as in Example 1.
Example 15
A device is manufactured in any of the ways described in Examples 1-8, with the difference that instead of the electrically conductive powdered materials mentioned there in the form of 13 parts by volume nickel powder and 12 parts by volume carbon black, there is used 60 parts by volume nickel powder of the same kind as in Example 1.
In all of the cases mentioned in Examples 1-15, the grains of the polymer material entirely lose their identity.
Claims
1. A method of manufacturing an electrical device, especially an overcurrent protective device, comprising a body, provided with two parallel surfaces, of an electrically conductive polymer composition with a resistivity of at most 100 mΩ cm and two electrodes arranged in contact with the parallel surfaces, the polymer composition comprising a polymer material and an electrically conductive powdered material distributed in the polymer material, characterized in that the polymer material in thermoplastic state and in powdered stated with a grain size of less than 100 μm, and of less than 40 μm in at least 50% of the material, is mixed in solid, dry state with the electrically conductive powdered material in a grain size of less than 100 μm into a mixture in which the polymer material constitutes at least 30 per cent and the electrically conductive powdered material at least 20 per cent of the total volume of these material, and that the mixture together with the electrodes is subjected to a pressing and a heating to a temperature at which the polymer material melts at least on the surface of the grains while forming a permanently coherent body of the mixture and while fixing the electrodes to the coherent body.
2. A method according to claim 1, characterized in that the mixture is subjected to a pressing at room temperature or another temperature which is considerably lower than the temperature at which the polymer material melts, while for¬ ming a preformed body, before the mixture in the form of the preformed body together with the electrodes is subjected to the pressing and the heating for forming the permanently co¬ herent body and for fixing the electrodes.
3. A method according to claim 1 or 2, characterized in that as electrodes there are used prefabricated plates of a powdered metallic material which have a porous structure on the side facing the mixture and are tight against the pene- tration of polymer material to the side facing away from the mixture.
4. A method according to claim 3, characterized in that the plates are tight on that side facing away from the mixture by being provided on said side with a tight coating of a metallic material.
5. A method according to claim 3, characterized in that the plates are tight on that side facing away from the mixture by being arranged on said side with a melted and solidified surface layer of the powdered metallic material in the plates.
6. A method according to claim 3, characterized in that the plates are impermeable to the penetration of polymer material by through-going pores being removed by sintering of the plates and a subsequent mechanical treatment of that side facing away from the mixture.
7. A method according to any of claims 1-6, characterized in that as polymer material there is used a crosslinkable linear polymer and that the polymer material is crosslinked after the mixture together with the elec¬ trodes has been subjected to the pressing and the heating for forming the permanently coherent body and for fixing the electrodes.
8. A method according to any of claims 1-7, characterized in that as polymer material there is used a polyolefin.
9. A method according to claim 8, characterized in that as polymer material there is used polyethylene.
10. A method according to any of claims 1-9, characterized in that the polymer material constitutes 30-80 per cent and the electrically conductive powdered material 20-70 per cent of the total volume of these materials in the mixture.
11. A method according to any of claims 1-10, characterized in that the polymer material constitutes 65-80 per cent and the electrically conductive powdered material 20-35 per cent of the total volume of these materials in the mixture.
12. A method according to any of claims 1-11, characterized in that as electrically conductive powdered material there is used carbon in the form of carbon black.
13. A method according to any of claims 1-11, characterized in that as electrically conductive powdered material in the mixture there is used a metallic material.
14. A method according to any of claims 1-11, characterized in that as electrically conductive powdered material in the mixture there is used a mixture of carbon in the form of carbon black and a metallic material.
15. A method according to any of claim 13 and 14, characterized in that the metallic material consists of nickel.
16. A method according to claim 14, characterized in that the carbon constitutes 5-75 per cent and the metallic material 25-95 per cent of the total volume of these materials in the mixture thereof.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE69131787T DE69131787T2 (en) | 1990-06-05 | 1991-05-28 | METHOD FOR PRODUCING AN ELECTRICAL DEVICE |
EP91910990A EP0533760B1 (en) | 1990-06-05 | 1991-05-28 | Method of manufacturing an electrical device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9001990-2 | 1990-06-05 | ||
SE9001990A SE468026B (en) | 1990-06-05 | 1990-06-05 | SET TO MAKE AN ELECTRIC DEVICE |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1991019297A1 true WO1991019297A1 (en) | 1991-12-12 |
Family
ID=20379667
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/SE1991/000375 WO1991019297A1 (en) | 1990-06-05 | 1991-05-28 | Method of manufacturing an electrical device |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0533760B1 (en) |
JP (1) | JP2836959B2 (en) |
AT (1) | ATE186793T1 (en) |
DE (1) | DE69131787T2 (en) |
SE (1) | SE468026B (en) |
WO (1) | WO1991019297A1 (en) |
Cited By (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0576836A2 (en) * | 1992-06-29 | 1994-01-05 | Abb Research Ltd. | Current limiting element |
GB2277526A (en) * | 1993-04-05 | 1994-11-02 | Alps Electric Co Ltd | Electroconductive paste for forming a solderable coating film |
EP0640995A1 (en) * | 1993-08-25 | 1995-03-01 | Abb Research Ltd. | Electrical resistor and application of this resistor in a current limiter |
WO1995019626A1 (en) * | 1994-01-17 | 1995-07-20 | Hydor S.R.L. | Heat-sensitive resistive compound and method for producing it and using it |
EP0696036A1 (en) | 1994-08-01 | 1996-02-07 | Abb Research Ltd. | Process for the preparation of a PTC resistance and resistance obtained therefrom |
DE19520869A1 (en) * | 1995-06-08 | 1996-12-12 | Abb Research Ltd | PTC resistor |
EP0758131A2 (en) * | 1995-07-25 | 1997-02-12 | TDK Corporation | Organic PTC thermistor |
US5614881A (en) * | 1995-08-11 | 1997-03-25 | General Electric Company | Current limiting device |
DE19534442A1 (en) * | 1995-09-16 | 1997-03-27 | Abb Research Ltd | Over-current protection device for 11 to 17 kV networks |
DE19548741A1 (en) * | 1995-12-23 | 1997-06-26 | Abb Research Ltd | Process for the production of a material for PTC resistors |
DE19800470A1 (en) * | 1998-01-09 | 1999-07-15 | Abb Research Ltd | Resistor element for current limiting purposes especially during short-circuits |
US5929744A (en) * | 1997-02-18 | 1999-07-27 | General Electric Company | Current limiting device with at least one flexible electrode |
US5977861A (en) * | 1997-03-05 | 1999-11-02 | General Electric Company | Current limiting device with grooved electrode structure |
US6124780A (en) * | 1998-05-20 | 2000-09-26 | General Electric Company | Current limiting device and materials for a current limiting device |
US6133820A (en) * | 1998-08-12 | 2000-10-17 | General Electric Company | Current limiting device having a web structure |
DE19915525A1 (en) * | 1999-04-07 | 2000-11-02 | Bosch Gmbh Robert | Temperature sensor with at least one conductor track and method for producing a temperature sensor |
US6191681B1 (en) | 1997-07-21 | 2001-02-20 | General Electric Company | Current limiting device with electrically conductive composite and method of manufacturing the electrically conductive composite |
US6290879B1 (en) | 1998-05-20 | 2001-09-18 | General Electric Company | Current limiting device and materials for a current limiting device |
US6323751B1 (en) | 1999-11-19 | 2001-11-27 | General Electric Company | Current limiter device with an electrically conductive composite material and method of manufacturing |
US6373372B1 (en) | 1997-11-24 | 2002-04-16 | General Electric Company | Current limiting device with conductive composite material and method of manufacturing the conductive composite material and the current limiting device |
WO2002079302A1 (en) * | 2001-03-28 | 2002-10-10 | Perplas Ltd | Composite obtainable by sintering an inorganic material with one or more polymers |
US6535103B1 (en) | 1997-03-04 | 2003-03-18 | General Electric Company | Current limiting arrangement and method |
US10890498B2 (en) | 2015-07-10 | 2021-01-12 | Universite De Bretagne Sud | Sensor for a physical feature, preferably comprising a multilayer structure |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107230511B (en) * | 2016-03-24 | 2019-09-03 | 上海利韬电子有限公司 | Conductive polymer compositions, electric device and preparation method thereof |
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WO1989000755A1 (en) * | 1986-01-14 | 1989-01-26 | Raychem Corporation | Conductive polymer composition |
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1990
- 1990-06-05 SE SE9001990A patent/SE468026B/en not_active IP Right Cessation
-
1991
- 1991-05-28 JP JP3510583A patent/JP2836959B2/en not_active Expired - Fee Related
- 1991-05-28 WO PCT/SE1991/000375 patent/WO1991019297A1/en active IP Right Grant
- 1991-05-28 DE DE69131787T patent/DE69131787T2/en not_active Expired - Fee Related
- 1991-05-28 AT AT91910990T patent/ATE186793T1/en not_active IP Right Cessation
- 1991-05-28 EP EP91910990A patent/EP0533760B1/en not_active Expired - Lifetime
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Also Published As
Publication number | Publication date |
---|---|
SE9001990D0 (en) | 1990-06-05 |
SE468026B (en) | 1992-10-19 |
DE69131787T2 (en) | 2000-06-21 |
SE9001990L (en) | 1991-12-06 |
EP0533760A1 (en) | 1993-03-31 |
EP0533760B1 (en) | 1999-11-17 |
ATE186793T1 (en) | 1999-12-15 |
DE69131787D1 (en) | 1999-12-23 |
JP2836959B2 (en) | 1998-12-14 |
JPH05508055A (en) | 1993-11-11 |
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