WO1993002221A3 - Manufacturing method of low melt metal fine particles - Google Patents

Manufacturing method of low melt metal fine particles Download PDF

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Publication number
WO1993002221A3
WO1993002221A3 PCT/US1992/005767 US9205767W WO9302221A3 WO 1993002221 A3 WO1993002221 A3 WO 1993002221A3 US 9205767 W US9205767 W US 9205767W WO 9302221 A3 WO9302221 A3 WO 9302221A3
Authority
WO
WIPO (PCT)
Prior art keywords
metal
low melting
organic solvent
point
manufacturing
Prior art date
Application number
PCT/US1992/005767
Other languages
French (fr)
Other versions
WO1993002221A2 (en
Inventor
Shinji Sugii
Hitoshi Ono
Original Assignee
Minnesota Mining & Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining & Mfg filed Critical Minnesota Mining & Mfg
Publication of WO1993002221A2 publication Critical patent/WO1993002221A2/en
Publication of WO1993002221A3 publication Critical patent/WO1993002221A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2/00—Processes or devices for granulating materials, e.g. fertilisers in general; Rendering particulate materials free flowing in general, e.g. making them hydrophobic
    • B01J2/003—Processes or devices for granulating materials, e.g. fertilisers in general; Rendering particulate materials free flowing in general, e.g. making them hydrophobic followed by coating of the granules
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2/00—Processes or devices for granulating materials, e.g. fertilisers in general; Rendering particulate materials free flowing in general, e.g. making them hydrophobic
    • B01J2/02—Processes or devices for granulating materials, e.g. fertilisers in general; Rendering particulate materials free flowing in general, e.g. making them hydrophobic by dividing the liquid material into drops, e.g. by spraying, and solidifying the drops
    • B01J2/06—Processes or devices for granulating materials, e.g. fertilisers in general; Rendering particulate materials free flowing in general, e.g. making them hydrophobic by dividing the liquid material into drops, e.g. by spraying, and solidifying the drops in a liquid medium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/02—Making metallic powder or suspensions thereof using physical processes
    • B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material

Abstract

A method for the production of a fine powder of a metal having the surface thereof not oxidized or negligibly oxidized by contact with oxygen in the ambient air and excelling in electroconductivity and durability and a method for the production of a composition containing the said fine metal powder are proposed. The fine metal powder is produced by introducing a low melting metal possessing a melting point in the range of from 47 °C to 321 °C into an inactive organic solvent possessed of a decomposition point or a boiling point higher than the melting point of the low melting metal and constantly heated to a temperature higher than the melting point of the low melting metal and lower than the boiling point of the inactive organic solvent and subjecting the metal to shear stirring thereby dispersing and mixing the low melting metal in the form of minute particles in the inactive organic solvent.
PCT/US1992/005767 1991-07-15 1992-07-09 Manufacturing method of low melt metal fine particles WO1993002221A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP20001391A JPH0533017A (en) 1991-07-15 1991-07-15 Preparation of low melting point metal fine particle and composition containing it
JP3/200013 1991-07-15

Publications (2)

Publication Number Publication Date
WO1993002221A2 WO1993002221A2 (en) 1993-02-04
WO1993002221A3 true WO1993002221A3 (en) 1993-03-18

Family

ID=16417350

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1992/005767 WO1993002221A2 (en) 1991-07-15 1992-07-09 Manufacturing method of low melt metal fine particles

Country Status (2)

Country Link
JP (1) JPH0533017A (en)
WO (1) WO1993002221A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020046627A1 (en) 1998-06-10 2002-04-25 Hitoshi Amita Solder powder, flux, solder paste, soldering method, soldered circuit board, and soldered joint product
DE19830057C1 (en) * 1998-06-29 2000-03-16 Juergen Schulze Method and device for the pressure-free production of soft solder powder
JP5813917B2 (en) * 2009-11-19 2015-11-17 Ｄｏｗａホールディングス株式会社 Solder powder manufacturing method
JP5878284B2 (en) * 2010-03-17 2016-03-08 Ｄｏｗａホールディングス株式会社 Method for producing metal or alloy nanoparticles
WO2012066664A1 (en) * 2010-11-18 2012-05-24 Ｄｏｗａホールディングス株式会社 Solder powder and process for producing solder powder
JP5807421B2 (en) * 2011-07-19 2015-11-10 三菱マテリアル株式会社 Detergent for solder powder and method for producing solder powder
EP2815821A1 (en) * 2013-06-17 2014-12-24 Heraeus Materials Technology GmbH & Co. KG Process and device for cleaning metal containing particles forming a powder by removing a compound attached to the particles
WO2021246483A1 (en) * 2020-06-05 2021-12-09 デクセリアルズ株式会社 Method for producing assembly, assembly, and electroconductive-particle-containing hot melt adhesive sheet
CN114496342B (en) * 2020-11-11 2023-03-24 北京梦之墨科技有限公司 Preparation method of low-melting-point metal particles, conductive paste and preparation method thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE677326A (en) * 1965-03-04 1966-09-05
US4042374A (en) * 1975-03-20 1977-08-16 Wisconsin Alumni Research Foundation Micron sized spherical droplets of metals and method
JPS55115344A (en) * 1979-02-28 1980-09-05 Hitachi Ltd Method of forming projected electrode
US4380518A (en) * 1982-01-04 1983-04-19 Western Electric Company, Inc. Method of producing solder spheres
EP0361109A1 (en) * 1988-09-09 1990-04-04 Mitsubishi Chemical Corporation Resin composition
JPH1010508A (en) * 1996-06-25 1998-01-16 Toshiba Corp Liquid crystal cell assembling device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE677326A (en) * 1965-03-04 1966-09-05
US4042374A (en) * 1975-03-20 1977-08-16 Wisconsin Alumni Research Foundation Micron sized spherical droplets of metals and method
JPS55115344A (en) * 1979-02-28 1980-09-05 Hitachi Ltd Method of forming projected electrode
US4380518A (en) * 1982-01-04 1983-04-19 Western Electric Company, Inc. Method of producing solder spheres
EP0361109A1 (en) * 1988-09-09 1990-04-04 Mitsubishi Chemical Corporation Resin composition
JPH1010508A (en) * 1996-06-25 1998-01-16 Toshiba Corp Liquid crystal cell assembling device

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 13, no. 184 (E-751)28 April 1989 & JP,A,10 10 508 ( NEC CORP ) 13 January 1989 *
PATENT ABSTRACTS OF JAPAN vol. 4, no. 165 (E-034)15 November 1980 & JP,A,55 115 344 ( HITACHI LTD ) 5 September 1980 *

Also Published As

Publication number Publication date
JPH0533017A (en) 1993-02-09
WO1993002221A2 (en) 1993-02-04

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