WO1993026142A1 - Three-dimensional printed circuit board, electronic circuit package using this board, and method for manufacturing this board - Google Patents
Three-dimensional printed circuit board, electronic circuit package using this board, and method for manufacturing this board Download PDFInfo
- Publication number
- WO1993026142A1 WO1993026142A1 PCT/JP1993/000756 JP9300756W WO9326142A1 WO 1993026142 A1 WO1993026142 A1 WO 1993026142A1 JP 9300756 W JP9300756 W JP 9300756W WO 9326142 A1 WO9326142 A1 WO 9326142A1
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- WIPO (PCT)
- Prior art keywords
- board
- copper foil
- layer
- substrate
- insulating layer
- Prior art date
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
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- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
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- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10477—Inverted
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
- Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
- Y10T29/49172—Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material
Definitions
- the present invention relates to a solid-state printing substrate used for mounting electronic components and a method of manufacturing the same, particularly using a metal-based substrate. About the body printing board and its manufacturing method.
- the inventor of the present invention is able to implement high-density mounting, and has a special feature for shielding electromagnetic waves.
- An electronic circuit that has good heat dissipation characteristics. Road knockage has been disclosed.
- This electronic circuit package is formed by bending or narrowing a metal base substrate and forming it into a soup plate shape. It is a thing. It is placed on another wiring board with the metal base board side as the upper side and the opening side as the lower side, and this wiring board is joined with this wiring board. As a result, unnecessary radiation leaking from the inside of the electronic circuit package is reduced, and heat is also radiated well. Become so .
- This electronic circuit package consists of a single-layered wiring conductor formed on a metal plate via an insulating layer, so that a large number of electronic circuit packages are required. It is not possible to handle the case where electronic components are mounted and high-density wiring is required. Because it is a metal-based substrate, it is not possible to simply use the thru-hole plating technology to form a multi-layer substrate. Also, because of the shallow aperture in shape, the outer size of this electronic circuit package is smaller than its effective inner dimensions. It is easy to grow. Therefore, when this electronic circuit package is mounted on another board, extra space is required and high-density mounting is required. This makes it more difficult.
- Typical packages on which the electronic components are mounted include QFP (Quad Flat Platform) and DIP (Dual Inline Pakae). acke) and the like are conventionally known.
- a lead frame ij is used as a chip carrier used for these packages.
- the number of electronic components has increased, and the number of pins has increased.
- outer leads In the case of outer leads at this time, they must have a shape that protrudes individually to the outside of the cage, and the positional accuracy during mounting. To maintain this, the pitch cannot be made narrower than a certain point.
- Even with regard to the inner lead if the pitch is narrowed, it is difficult to form a stable part up to the part adjacent to the electronic component. It is difficult. For this reason, it is difficult to further reduce the size of the package itself.
- a wiring board for mounting electronic components using a metal plate as a supporting substrate is described.
- a plate that has been formed into a metal thin film by the ion-technical sedimentation method has been disclosed.
- the metal thin film is bent together with the supporting board and the organic insulation layer, and is processed into a desired shape.
- special equipment such as sputtering and vapor deposition is used because the formation of the conductor layer is based on the ion engineering method. There is a problem that it is necessary and is not easy to implement.
- the present invention has been made in view of the above problems.
- the purpose of the present invention is to provide a vertical printing board for mounting electronic components, which has a heat radiation property, an electromagnetic shielding property, and a high density distribution. Wires are available, and are used in multi-chip compatible nozzle packages that can carry a large number of electronic components. There is no useless space, the pitch of the lead can be narrowed, and a small and highly reliable stand-up printing board and its We are to provide a manufacturing method.
- the present inventors have used a general copper foil as a conductor layer, and have made a thermoplastic plastic having a high elongation rate.
- the copper foil and the metal plate are laminated via the insulating layer made of the imid without using a bonding agent, and the copper foil layer is further laminated with a thermoplastic polyimid.
- a standing printing board for mounting electronic components which has electromagnetic shielding properties and heat dissipation properties, has a high mounting efficiency, and has been completed.
- the stencil printing substrate of the present invention is:
- a metal base substrate on which a copper foil layer and a metal plate are laminated via a first insulating layer and which have been subjected to circuit processing, use the metal base described above.
- a vertical printing base plate that is formed into a shape with a bent part by bending or squeezing the base plate.
- the metal-based substrate has a plurality of copper foil layers and a second insulation layer that isolates each of the plurality of copper foil layers.
- a multi-layer structure composed of a copper foil layer of the above and the second wear layer described above,
- At least two of the plurality of copper foil layers are electrically connected to each other,
- the contact surface of the first insulating layer with the copper foil layer and the contact surface of the first insulating layer with the metal plate are at least heat-plastic.
- the second insulating layer is at least composed of thermoplastic plastic polyimide
- the area of the opening and the area of the bottom formed by the bending or squeezing are almost the same, and the copper foil A lead part that is a part of the layer and that is a connection part with another circuit board, the leading end of the lead part is separated from the leading end of the collar
- it is characterized in that it is formed in the aforementioned section.
- the stereoscopic printing substrate of the present invention has a multi-layer structure, and a metal plate is arranged on the back side, so that it is possible to mount components with high density. It has heat dissipation properties and electromagnetic shielding properties. Since the substrate printing substrate has a deep drawing structure, the area required when the substrate is mounted on another substrate can be reduced. In addition, an inner lead (wiring conductor) formed in the bottom surface of the vertical printing substrate should be mounted near the electronic components to be mounted. Therefore, the bonding wire can be shortened when mounting the electronic components. Due to these facts, the small size in the package form is smaller than the lead frame used for the conventional chip carriers. Molding and high speed can also be achieved. In addition, a lead portion used for connection with another substrate is formed on a metal plate via an insulating layer. Therefore, even if the pitch of the outer lead is narrowed, there is no problem in terms of strength.
- a metal plate having a thickness of about 0.05 to 2. O mm is used, but it is preferable. 0.1-1.5 mm thick aluminum, copper alloy such as nickel silver, copper, copper clad invers, stainless steel , Iron, gay steel, electrolytically oxidized aluminum, and the like can be used. If the thickness of the metal plate is thinner than 0.05 mm, the flatness of the surface will be reduced after the final mechanical processing, and wiring will be required when mounting electronic components. The workability of the bonding is reduced. If the metal plate is thicker than 2.0 mm, simple bending will not be disturbed, but machine processing will be required when deep drawing is performed. It becomes difficult.
- thermoplastic polyimide used in the present invention examples include LARC-TPI, a product of Mitsui Toatsu Chemicals, Inc. New TPI, New Upimol manufactured by Ube Industries, U.S.P. Commercial products such as Sixef-33, GE Ultem, and Amoco Torlon are available.
- thermoplastic polymer obtained by reacting diamin with tetracarboxylate dianhydride as follows is used. You can do it.
- diamins include 3,3'-diaminobenzophenone and 1,3-bis (3-aminophenol) benzen.
- tetracarboxylate dihydrate examples include, for example, ethylentratracarbonate dihydrate and cyclopentene dihydrate.
- thermoplastic polyimide can be obtained.
- the thermoplastic chain thus obtained has an imid structure in the main chain and has a glass transition temperature (T) of 160. e C or higher and 350 ° C or lower, and the elongation at break measured by the method specified in JIS (Japanese Industrial Standards)-C2318 More than 30% is what is optimally used in the present invention.
- T glass transition temperature
- the glass transition temperature is below 160 ° C, the heat generated during mounting of components including the gold (Au) wire bonding process can be reduced. This is not desirable because the reliability of the device is reduced.
- the glass transfer temperature is higher than 350 ° C, the bonding strength between the metal plate and the copper foil is reduced, which is not preferable.
- thermoplastic polyimide if the elongation rate of the thermoplastic polyimide is lower than 30%, which is lower than 30%, especially when bending or squeezing, etc. Separation of the genus from the polyimide and the occurrence of cracks in the isolated layer They are raw and not good.
- thermo-plastic polyimide resin or a thermosetting resin such as epoxy phenol or bis-male-imide is used as the insulating layer.
- Thermoplastics such as curable resin and polyamide imid, polysulfone, polyparanoic acid, polyphenylene sulfide, etc. It is also possible to use those in combination with a sex resin or the like.
- both sides of the heat resistant finome for example, polyimid, polyamidoimid, aramid, polyetherketone, etc.
- a sheet-like material obtained by coating with dodecanoic acid varnish and heating to imidize can be used as an insulating layer.
- thermoplastic plastic varnish was obtained by casting or coating and drying the same as the film forming method. Film-like materials can also be used as insulation layers.
- the above-mentioned metal plate and the back of the copper foil are coated with the above-mentioned polyimidic acid varnish or the thermoplastic thermoplastic polyimide.
- the insulating layer may be formed by laying the fabric, heating and drying it to form a laminated layer.
- inorganic filler to the insulating layer within the range that does not hinder the mechanical workability such as bending and squeezing for the purpose of further improving the heat dissipation. It doesn't matter.
- Inorganic fillers include phenol, silicon, silicon carbide, aluminum nitride, aluminum nitride, and nitrogen nitride.
- the copper foil commercially available electrolytic copper foil, rolled copper foil, and the like, which can be easily obtained at relatively low cost, are used.
- a method of joining a metal plate, an insulating layer, and a copper foil layer to each other there are a heat roll method and a heat press method.
- the copper foil layer and the insulating layer have a multi-layer structure, but such a multi-layer structure is formed.
- the build-up method is a method of sequentially stacking an insulating layer and a copper foil layer on a metal plate.
- a sheet is formed by laminating only an insulating layer and a copper foil layer, and the copper foil layer is exposed on both sides. This is a method of joining this sheet to a metal plate through a different insulation layer from the sheet described above. By these methods, a multi-layer structure is realized.
- the through hole for connecting the layers is formed with a laser beam from an excimer laser or a laser beam. It is formed by etching with the re-solution.
- excimer lasers adjusting the laser power will erode the copper foil layer in areas that you do not want to remove.
- excimer lasers examples include, for example, those of the KrF type.
- the alcohol solution is required to have an alcohol solution such as, for example, hydroxyadium, sodium hydroxide, etc.
- the hydrazine compound is added to this according to You may.
- the method of electrically connecting the copper foil layers through the through-holes is commonly used in the normal method of manufacturing a printed wiring board.
- metal paste, solder, conductive paste, etc. can be used.
- the squeezing and bending machine processing can be performed by press processing using a normal mold.
- resin coating is applied to the surface of the mold, or if the shape of the pattern matches the shape of the pattern. It was in but it may also be set only a concave shape in gold 3 ⁇ 4 type.
- an insulating layer having an elongation ratio of 30% or more is provided, deep drawing and bending with a small radius of curvature are used. However, it does not require processing such as heat treatment or swelling of the insulating layer with a solvent or the like.
- the shape after processing is a collar formed around the opening surface of the vertical printing base plate.
- the leading end of the lead portion is formed so as to be separated from the end of the collar by 50 mm or more.
- the lead portion is a part of the copper foil layer and extends to the collar portion for the purpose of connection with another circuit board. And.
- the leading end of the lead portion and the end of the brim are within 50 yum, when mounting this stand-up printing board on another board, the Haneda The lead section and the back side caused by Short circuit with the metal plate is more likely to occur, which is not preferable.
- the shape of the brim can be selected as appropriate, it is desirable that the shape be a U-shape because of its flexibility.
- the connection reliability is improved, and the insulation layer and the wiring conductor (copper foil) are prevented from being damaged.
- the radius of curvature was set to 1.0 mm.
- the radius of curvature of the inner side of the corner portion forming the bottom portion of the vertical printing substrate is set to 0.1 to 10 mm. I want to do that.
- the radius of curvature was set to 1.0 mm.
- the organic resin for sealing silicone resin, epoxy resin, bismaleimide, etc. Resins can be used singly or in combination.
- an inorganic filler can be mixed into the sealing resin and used.
- a sealing method it is possible to appropriately use injection, potting, transfer-further molding, press molding, or the like. .
- FIG. 1A is a cross-sectional view showing the configuration of a stereoscopic printing board according to an embodiment of the present invention.
- FIG. 1B is a perspective view of the standing printing substrate of FIG. 1A.
- FIG. 2A is a schematic cross-sectional view showing the structure of an electronic circuit package obtained by mounting electronic components on the stereoscopic printing board of FIG. 1A. It is a diagram.
- FIG. 2B is a perspective view showing a state in which the electronic circuit package of FIG. 2A is mounted on a wiring board.
- FIG. 2C is a cross-sectional view showing a state in which the electronic circuit package of FIG. 2A is mounted on a wiring board.
- FIG. 3 is a diagram illustrating a process of manufacturing a three-dimensional printed circuit board by a build-up method.
- FIG. 4 is a diagram for explaining a manufacturing process of a three-dimensional printed circuit board by a bonding method.
- FIG. 5 is a schematic cross-sectional view showing an example in which connections between layers are made by wire bonding.
- FIG. 6 is a schematic cross-sectional view showing an example in which the connection between layers is performed by plating.
- FIG. 7A is a schematic cross-sectional view showing an example of a configuration in which an insulating layer at a place where an electronic component is mounted is removed.
- FIG. 7B is a schematic cross-sectional view showing an example in which electronic parts are mounted on the three-dimensional printing substrate of FIG. 7A.
- FIG. 8A is a schematic cross-sectional view showing an example in which a flat cable is extended for connection with another substrate.
- FIG. 8B is a perspective view showing a state where a connector is attached to a tip of the flat cable portion.
- FIG. 9 is a plan view showing an example in which a plurality of three-dimensional printing boards are continuously provided on the same frame.
- FIG. 2 is a schematic cross-sectional view showing the configuration of the device.
- FIG. 10B is a schematic cross-sectional view showing a configuration of an electronic circuit package sealed with an organic resin.
- FIG. 10C is a schematic cross-sectional view showing the structure of an electronic circuit package sealed with an organic resin.
- FIGS. 1A and 1B A three-dimensional printing substrate of one embodiment of the present invention is shown in FIGS. 1A and 1B.
- This three-dimensional printed circuit board 100 has two copper foil layers (wiring conductors) that have been subjected to circuit processing.
- the metal plate 101 On the metal plate 101, the first insulating layer 102, the first wiring conductor 103, the second insulating layer 104, and the second wiring conductor 105 have a multi-layer structure. After the circuit pattern is formed, it is bent or squeezed to form a box with an open surface 180, and the solid mark is formed.
- the printed circuit board 100 is used.
- a brim portion 107 used for a connection portion with another wiring board is formed.
- the first wiring conductor 103 is formed as a plurality of parallel wiring patterns 110, and the wiring pattern 110 is a solid mark. It extends toward the periphery from the center of the printed circuit board 100, and extends in the opposite direction.
- the first insulating layer 102 is provided on the entire opening face 180 side of the metal plate 101.
- the first wiring conductor 103 and the second wiring conductor 105 are electrically connected to each other at a plating part 108. That is, at the connection between the first wiring conductor 103 and the second wiring conductor 105, the second insulating layer 104 is removed, and that part is removed. A plating part 108 is formed in each part.
- a method of forming a multi-layer circuit by using the insulating layers 102 and 104 and the conductor layers 103 and 105 will be described later. In this case, a 0.2 mm thick copper plate was used as the metal plate 101.
- Each of the insulating layers 102 and 104 is made of a heat-resistant material having an elongation of 30% and a glass transition temperature of 180 ° C from LARK-TPI manufactured by Mitsui Toatsu Chemicals. Plastic polyimide was used. The thickness of each of the insulating layers 102 and 104 was 15 ⁇ m.
- Each of the wiring conductors 103 and 105 was made of a rolled copper foil with a thickness of 18 / zm.
- the elongation rate is based on the elongation at break measured by the method specified in JIS (Japanese Industrial Standards)-C2318. It is represented.
- the electronic circuit package 130 shown in FIG. 2A has a chip part 120 and a bear chip 121 mounted on the above-described three-dimensional printed circuit board 100. It is what you do.
- the chip part 120 is of the surface mounting type, and the bottom terminal and the lead terminal 122 extend almost horizontally.
- Lead terminals 1 2 2 are connected to the second wiring It is painted on the surface of body 105.
- the bearing 12 1 is connected to the second wiring board 105 by a bonding wire 123.
- the outer periphery of the package has to be installed without installing a lead terminal. However, there is a terminal that has become the terminal part as it is.
- the electronic component When mounting such an electronic component, the electronic component is placed at a desired position on the substrate 100, and the package is mounted.
- the terminals on the outer periphery of the page and the wiring conductors of the vertical printing substrate 100 may be directly soldered.
- the mounting substrate 100 which is the mounting substrate, is a multi-layered structure, the wiring density is reduced. O Higher-density mounting is possible o
- the wiring board 140 here includes the electronic circuit package 130 of the present embodiment and the HIC (Hybrid IC) or the LSI (Large Module). cale Integration), the board on which the other electronic components are mounted.
- a wiring conductor 141 which is a circuit pattern, is formed in advance.
- the electronic circuit package 130 has an opening surface facing the wiring board 140.
- the wiring conductors 14 1 on the wiring board 14 0 The wiring pattern 110 formed on the flange portion 107 is mounted on the wiring substrate 140 by being soldered. . That is, the wiring pattern 110 and the wiring conductor 141 are connected to each other via the solder part 181.
- the electronic circuit package 130 is connected to the wiring board 1 such that the wiring pattern 110 faces the wiring conductor 141. This can be done by placing it on a 40 and heating it using a normal reflow furnace. In order to enhance the electromagnetic shielding effect, it is desired that no gap is formed between the collar portion 107 and the wiring board 140. No.
- the substrate printing substrate 100 is provided with first and second insulating layers 102, 104, and first and second wiring conductors 103, 105. After that, these insulating layers 102, 104, and the wiring conductors 103, 105 are all bent into the metal plate 101. It is manufactured by subjecting it to a squeezing process to obtain the desired shape. Circuit formation has already been completed before bending or squeezing. First, a method of forming a circuit pattern having a multi-layer structure of each of the insulating layers 102 and 104 and each of the wiring conductors 103 and 105 is described. This is explained. First, the vinylore-up method will be described with reference to FIG.
- the build-up method is based on a wiring conductor consisting of an insulating layer and copper foil. This is a method of laminating layers one by one and providing only the number of layers of the wiring conductor, and successively laminating and joining them on a metal plate.
- a structure in which a first insulating layer 102 and a first wiring conductor 103 are joined on a metal plate 101 is provided.
- the first wiring conductor 103 is formed in a circuit by a known method, and forms a circuit turn.
- the second insulation layer 104 and the second wiring conductor 105 are joined to each other or (b ) Alternatively, as shown in (c), the second insulation layer 104 and the copper foil layer 151 are connected to each other.
- the copper foil layer 15 1 is in a state before the circuit processing of the second wiring conductor 105 is performed, and the entire upper surface of the second insulating layer 104 is provided. It is installed in The second wiring conductor 105 shown in (a) has already been subjected to circuit processing.
- first and second wiring conductors 103, 105 are connected to each other at a position where they should be connected to each other. Is a hole 152 penetrating between 104 and the copper foil layer 151 [in the case of (c)], or is it not [[b ))]. In case a), a hole 152 is provided at the position of the mutual connection between the wiring conductors 103 and 105.
- the heat press is an inert gas It is carried out under the condition of a temperature of 200 ° C in an atmosphere or in the air. At the position of the inter-layer connection, a hole 152 is already opened, and since the first wiring conductor 103 is exposed at the bottom of the hole 152, the hole 152 is exposed.
- the conductive paste 153 is filled with the conductive paste and the paste is dried and solidified, thereby establishing the connection between layers (h). If you want to have a multi-layered structure, you can repeat this operation.
- the hole 152 may be filled with Haneda Vest and heated at the mouth of the reef to form a Haneda layer.
- the metal plate 101 side under an inert gas atmosphere or under a condition of a temperature of 200 ° C. under a vacuum is shown in FIG.
- the state shown in (d) that is, the first wiring A body obtained by stacking a second insulating layer 104 and a copper foil layer 151 on a body 103 is obtained.
- the second wiring conductor 105 is formed by processing the copper foil layer 151 (f).
- the hole for the connection between the layers is not opened in the second insulating layer 104.
- a hole 152 is formed in the second insulating layer 104 at the position of the inter-layer connection.
- the inter-layer connection may be completed in the same manner.
- the inert gas atmosphere at a temperature of 200 ° C or a heat press under vacuum is used.
- the state shown in Fig. (E) i.e., the first state
- a second conductive layer 104 and a copper foil layer 151 are sequentially stacked on the wiring conductor 103 of FIG.
- a hole 152 was already opened at the position of the connection between the layers.
- the circuit processing is performed on the copper foil layer 151, as described in (g) above, and thereafter, the inter-layer connection is completed in the same manner. Just do it.
- first and second copper foil layers 16 1 and 16 2 are formed on both sides of the second insulating layer 104 (a).
- the holes 16 are inserted through the copper foil layers 16 1, 16 2 and the second insulating layer 104.
- Form 3 (b).
- a snare hole is applied to the hole 16 3
- the metal layer 16 4 is shorted to the hole 16 so that the copper foil layers 16 1 and 16 2 are short-circuited.
- first and second wiring conductors 103 and 105 are formed (d).
- a heat press is performed under an inert gas atmosphere or under a vacuum, and the heat is applied through the first insulating layer 102.
- the metal plate 101 is joined to the metal plate 101 on the second insulating layer 104 side.
- a multilayer structure has been completed (e). In this case, the connection between the layers is formed by thru-hole plating.
- the excimer laser has, for example, the Kr / F system (wavelengths of 2448 nm and 4866 nm).
- the Kr / F system wavelengths of 2448 nm and 4866 nm.
- laser no.
- the copper foil layer If holes are to be made in the three-layered sandwich construction of the edge layer and the copper foil layer, a good hole should be made in one of the copper foil layers and the insulation layer. It is also possible to make adjustments so that holes and recesses are not formed in the other copper foil layer.
- a polyimide-based material is used as the insulation layer, it is possible to perform etching processing with a phenol solution. .
- etching processing with a phenol solution.
- many holes can be drilled at the same time, which is efficient.
- a resist layer etc. should be provided on the surface prior to etching. You should leave it.
- the copper foil layer or the wiring conductor formed by the copper foil is not etched, so that the insulation layer is not etched. It is possible to make holes only in the holes.
- the jetting liquid a known composition, that is, an alcoholic solution such as calcium hydroxide, hydroxy chromium hydroxide, etc., is used. Can be used. If necessary, a hydrazine compound may be added to this.
- the desired shape is obtained by performing bending and squeezing machine processing. Then, the substrate printing substrate 100 is completed. Next, the mechanical processing will be explained.
- machine processing is performed by press processing using a normal mold. At this time, it is necessary to apply heat or to swell each of the insulating layers 102 and 104 with the solvent. No need.
- the area of the bottom surface of the vertical printing substrate 100 and the area of the opening are made substantially equal to each other.
- the radius of curvature of the inside of the corner portion of the corner portion of the bottom portion of the vertical printing substrate 100 was set to 1.0 mm.
- the shape of the flange portion 107 is U-shaped, and the radius of curvature inside the U-shaped portion is set to 1.0 mm.
- the difference in height between the flanges 107 on the four sides of the standing printing substrate 100 that is, the surface accuracy of the opening surface, that is, the height of the opening surface
- the length was set to 0.5 mm or less so that the connection to the wiring board 140 was ensured.
- the turn accuracy of the turn surface that is, the difference between the height of the concave and convex portions is less than 0.5 mm. In this way, it is possible to support high-density implementation of electronic components. It is easy for a person skilled in the art to bend or squeeze with the surface accuracy of the degree described above.
- the one shown in Fig. 5 is the one in which the connection between layers was made by the wire bonding method instead of the plating.
- a through hole 152 is formed in the second insulating layer 104, and a first wiring conductor 103 is exposed at the bottom of the through hole 153. .
- the second wiring conductor 105 is patterned so as to surround the perimeter of the hole 152, and the first and the second wiring conductors 105 are patterned.
- the two wiring conductors 103 and 105 are formed with a bonding wire passing through the hole 152. Are connected to each other by an external device 170. When using the bonding wire, perform the machining after the mechanical processing.
- the wiring conductor extending to the collar portion 107 is the first wiring conductor.
- the conductor 103 was the one on the metal plate 101 side.
- the wiring conductor extending to the section 107 is not limited to this.
- the second wiring conductor 105 that is, the wiring conductor on the upper layer side extends to the collar portion 107. It has an extended configuration.
- the first and second wiring conductors 103 and 105 are formed, so that the first wiring conductor 1 is formed at the collar 107.
- the removal process of the second insulating layer 104 is indispensable.
- the wiring conductor in the uppermost layer here, the second wiring conductor 105 is exposed, so that this wiring conductor has a brim. In the case of extending to 107, the step of removing the insulating layer is not necessary.
- each of the insulating portions is located at a portion (exposed portion 109) of the bottom of the vertical printing substrate.
- the layers 102 and 104 and the respective wire conductors 103 and 105 have been removed, and the metal plate 101 has been exposed.
- the vertical printing substrate 100 B is equipped with a power element having a relatively large amount of generated heat, and is excellent in quality. It is suitable when heat radiation characteristics are required.
- the power element 122 A is connected to the metal plate 1 at the exposed part 109 by using a solder, a silver paste, or the like. 0 Directly mounted on 1.
- the first and second insulating layers 102 and 104 and the first wiring conductor 103 are formed by:
- the structure extends from the periphery of the metal plate 101, that is, from the periphery of the metal plate 101, to the outside of the main body of the vertical printing substrate.
- a portion extending from the periphery of the metal plate 101 constitutes a flat cable 190.
- the connector 191 is attached to the front end of the flat cap cap 190 so that the connector 191 is attached.
- the three-dimensional printed circuit board 100C can be electrically connected to another print substrate. Incidentally, in FIG.
- the bearer chip 121B has removed the second insulating layer 104 to expose the first wiring conductor 103. And is directly mounted on the first wiring conductor 103. By mounting the chip 121B in this manner, the second insulating layer 104 does not exist as compared with the one shown in FIG. 1B. As a result, the heat dissipation characteristics of the chip 12 1 B force are improved.
- FIG. 9 What is shown in FIG. 9 is one in which a plurality of standing printing substrates 200 are continuously provided on the same frame 201. .
- the configuration of the individual substrate printing substrate 200 is the same as that of the substrate printing substrate 100 in the above-described embodiment. H
- each of the standing printing substrates 200 is connected to the frame 201 at the four corner portions on the side of the portion 207, for example. It has been formed.
- the frame 201 is equivalent to the multi-layer metal base substrate in each of the above-described embodiments, and the circuit turn is formed. It is.
- pin insertion holes 210 are formed at both ends in the width direction of the frame 201 so as to correspond to the respective three-dimensional printing boards 200. The pin insertion hole 210 is used for positioning when mounting electronic components on the vertical printing substrate 200.
- a flat plate-shaped frame 201 For a flat plate-shaped frame 201, use a progressive-type mold to continuously perform lance forming, squeezing, and bending. As a result, the three-dimensional printing substrate 200 is sequentially formed.
- the standing printing substrate 200 By constructing the standing printing substrate 200 in this way, compared to the case of the stand-alone printing substrate as a single product, the standing printing substrate can be mounted on the substrate. The mounting of electronic components can be performed efficiently, and mounting using a normal mounting machine becomes possible.
- the bonding wire 12 3 is most susceptible to failures such as poor conductivity due to oxidation. Only by using the potting method with the sealing resin 17 1 Resin sealing has been performed.
- the entire electronic circuit contained in the electronic circuit package is made by the injection method or the transfer method.
- the resin is sealed with an organic resin for sealing 172 by the form method. Accordingly, except for the brim portion 107, the wiring conductors 103, 105 are also covered with the organic resin for sealing 172.
- the amount of shrinkage during hardening is small for the part of the bonding wire 123 that is strongly weak.
- the second sealing organic resin, 174, which is superior in weather resistance, etc., is sealed by the injection method or the transfer molding method. .
- the entire electronic circuit contained in the electronic circuit package is sealed with resin.
- the hardening and shrinkage of the resin is used for the bonding wire 12 and 23, and the shrinkage at the time of sealing is caused by the shrinkage at the time of sealing. This prevents the breaking of the wiring 1 23 from occurring.
- the embodiment of the present invention has been described centering on the case where the wiring conductor layer (copper foil layer) is two layers, but the present invention has been described. Is not limited to this. Three layers of copper foil or It is also possible to have a multi-layered structure. Further, the shape of the cubic printing substrate is not limited to a substantially hexahedral shape, and may be, for example, a cylindrical shape.
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/185,897 US5639990A (en) | 1992-06-05 | 1993-06-04 | Solid printed substrate and electronic circuit package using the same |
KR1019940700378A KR100260347B1 (ko) | 1992-06-05 | 1993-06-04 | 입체인쇄기판, 이것을 사용한 전자회로패키지 및 인쇄기판의 제조방법 |
DE69329542T DE69329542T2 (de) | 1992-06-05 | 1993-06-04 | Dreidimensionale leiterplatte, elektronische bauelementanordnung unter verwendung dieser leiterplatte und herstellungsverfahren zu dieser leiterplatte |
EP93913482A EP0598914B1 (en) | 1992-06-05 | 1993-06-04 | Three-dimensional printed circuit board, electronic circuit package using this board, and method for manufacturing this board |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4/145618 | 1992-06-05 | ||
JP14561992 | 1992-06-05 | ||
JP4/145619 | 1992-06-05 | ||
JP14561792 | 1992-06-05 | ||
JP4/145617 | 1992-06-05 | ||
JP14561892 | 1992-06-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1993026142A1 true WO1993026142A1 (en) | 1993-12-23 |
Family
ID=27319025
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP1993/000756 WO1993026142A1 (en) | 1992-06-05 | 1993-06-04 | Three-dimensional printed circuit board, electronic circuit package using this board, and method for manufacturing this board |
Country Status (6)
Country | Link |
---|---|
US (1) | US5639990A (ja) |
EP (1) | EP0598914B1 (ja) |
KR (1) | KR100260347B1 (ja) |
DE (1) | DE69329542T2 (ja) |
TW (1) | TW256984B (ja) |
WO (1) | WO1993026142A1 (ja) |
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Publication number | Publication date |
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EP0598914A1 (en) | 1994-06-01 |
TW256984B (ja) | 1995-09-11 |
EP0598914A4 (en) | 1994-11-23 |
US5639990A (en) | 1997-06-17 |
DE69329542T2 (de) | 2001-02-08 |
EP0598914B1 (en) | 2000-10-11 |
DE69329542D1 (de) | 2000-11-16 |
KR100260347B1 (ko) | 2000-07-01 |
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