WO1994015344A1 - Water-based polymer thick film conductive ink - Google Patents
Water-based polymer thick film conductive ink Download PDFInfo
- Publication number
- WO1994015344A1 WO1994015344A1 PCT/US1993/012036 US9312036W WO9415344A1 WO 1994015344 A1 WO1994015344 A1 WO 1994015344A1 US 9312036 W US9312036 W US 9312036W WO 9415344 A1 WO9415344 A1 WO 9415344A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- composition
- polymer
- water
- conductive
- weight
- Prior art date
Links
Classifications
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/02—Details
- A61N1/04—Electrodes
- A61N1/0404—Electrodes for external use
- A61N1/0472—Structure-related aspects
- A61N1/0492—Patch electrodes
- A61N1/0496—Patch electrodes characterised by using specific chemical compositions, e.g. hydrogel compositions, adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- This invention relates generally to aqueous polymer thick film conductive compositions containing conductive metal, carbon or graphite particles.
- the compositions are particularly useful for screening into electrical circuits and for formulation into human contact electrodes.
- water-based conductive polymer thick film formulations have typically exhibited poor rheology, poor adhesion and poor flexibility when printed and cured on polyester or polycarbonate films. They also have not offered the relatively low electrical resistance that is achievable with solvent based formulas.
- This invention relates to the use of water soluble thermoplastic polymers in a water-based polymer thick film-forming compositions to impart smooth, easily spreadable coating qualities to the formulation.
- the present invention relates to an aqueous conductive polymer thick film-forming composition
- an aqueous conductive polymer thick film-forming composition comprising (preferably consisting essentially of) : (a) a water soluble thermoplastic polymer in an amount of between about 0.25% and about 20% by weight;
- a polymer dispersion in water in an amount of between about 10% and about 70% by weight;
- a glycol dr ing-retarder agent(s) in an amount of between about 2% and about 20% by weight;
- an electrically conductive amount of conductive particles selected from the group consisting of conductive metal (preferably silver flake) , carbon, and graphite particles, and combinations thereof, with the proviso that the amount of said metal particles does not exceed 90 % by weight and the amount of said carbon or graphite particles does not exceed 40% by weight; and
- water in a solvent effective amount each of said amounts being based upon the total weight of said composition.
- an aqueous conductive polymer thick film-forming film composition which provides excellent film properties, such as resistivity and printability, during use.
- the compositions provide a distinct advantage from an environmental standpoint since they are water-based.
- These compositions are useful as highly printable conductive inks utilizing screen printing or other conventional printing method. These inks are of such highly printable quality that lines and spaces 15 mils wide can be clearly printed. This highly printable quality is important in order to effectively print the intricate circuitry patterns often demanded by the electronics industry in high performance applications such as, for example, in the preparation of touch pad circuitry.
- thermoplastic water soluble polymers examples include polyethyloxyazoline, polyvinyl pyrrolidone. polyvinyl alcohol, polyacrylamide, polyglycols and polyacrylic acid.
- suitable polymer dispersions in water include polyurethane, acrylic, polyester and vinyl resin polymers.
- glycol drying retarding agent(s) employed in the present invention is to slow down the drying process so as to permit manipulation of the polymer thick film, such as by silk screening, before it has a chance to dry.
- glycol type drying retarding agents include: diethylene glycol ethyl ether acetate; diethylene glycol butyl ether acetate; ethylene glycol butyl ether acetate; diethylene glycol monoethyl ether; ethylene glycol monoethyl ether; dipropylene glycol methyl ether; tripropylene glycol methyl ether; dibutyl phthalate; diocyl phthalate; diocyl phthalate; tributyl phosphate; 1,3 butylene glycol; propylene glycol and ethylene glycol. These agents may be used singularly or in combination with each other.
- Any conductive metal particle may be used in the composition of this invention such as copper, gold, nickel, silver alloys, silver plated metals and silver. Silver is the preferred conductive particle for most uses. Alternatively, carbon black or graphite may also be used, alone or in combination with metal particles.
- the average particle size of the metal or carbon or graphite particle can vary over a wide range but, is preferably in the range of from about 1 micron to about 50 microns, more preferably from about 2 microns to about 20 microns. If the average particle size of the metal particles is less than about 1 micron, the electrical properties may be adversely affected. In other words, if the metal particles are too fine, the resistivity of the composition may be too high. If the average particle size of the metal particles is above about 50 microns, then the composition will be too difficult to apply to the substrate. For example, the composition will tend to clog up during a silk screening process or the like.
- the viscosity of the final conductive composition of this invention for screen printing is preferable from about 8,000 to about 25,000 centipoises at 30°C (Brookfield RVT Spindle ⁇ 6 at 20 rpm) in order to be screen printable.
- compositions of this invention may be applied to substrates by a variety of techniques, such as silk screening, spraying or brushing. Once the conductive polymer thick film has been applied to the substrates it is cured at between about 93°C and 135°C for a time sufficient to complete curing with good adhesion.
- the conductive compositions of the present invention may be applied to conventional rigid or flexible substrates. Whether the substrate is flexible or rigid in nature, the substrate may or may not have to be pre-treated or pre-coated with any other substance before applying the present composition.
- the properties of the film-forming composition were as follows: Electrical resistivity 19 milliohms/sq. ⁇ 1.0 mil Printability Very good
- the properties of the film-forming composition were as follows:
- the properties of the film-forming composition were as follows:
- BYK020 is a defoamer available from BYK Chemie USA, 524 South Cherry Street, Wallingford, CT 06492.
- PVP K-30 is a polyvinyl pyrrolidone polymer, soluble in H 2 0, available from GAF
- Witco "Bubble Breaker 748" is a defoamer available from Witco Organics Division, 3230 Brookfield Street, Houston, TX 77045.
- Triton CF-10 is a surfactant available from Union Carbide, 39 Old Ridgebury Road,
- "XC-72" is a carbon powder available from Cabot Corporation, 125 High Street, Boston, MA 02110.
- the "adhesion” test refers to the percentage change in resistance after applying Scotch tape to a test pattern of the ink and then removing the tape and remeasuring the resistivity.
- the "flexibility” test measures the percentage change after creasing the test pattern which was silk screened for each example.
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6515224A JPH08506206A (en) | 1992-12-28 | 1993-12-10 | Water-based polymer thick film conductive ink |
AU57476/94A AU5747694A (en) | 1992-12-28 | 1993-12-10 | Water-based polymer thick film conductive ink |
EP94903585A EP0676082B1 (en) | 1992-12-28 | 1993-12-10 | Water-based polymer thick film conductive ink |
DE69321366T DE69321366T2 (en) | 1992-12-28 | 1993-12-10 | AQUEOUS POLYMER THICK FILM INK |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/997,374 US5286415A (en) | 1992-12-28 | 1992-12-28 | Water-based polymer thick film conductive ink |
US997,374 | 1992-12-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1994015344A1 true WO1994015344A1 (en) | 1994-07-07 |
Family
ID=25543949
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1993/012036 WO1994015344A1 (en) | 1992-12-28 | 1993-12-10 | Water-based polymer thick film conductive ink |
Country Status (7)
Country | Link |
---|---|
US (2) | US5286415A (en) |
EP (1) | EP0676082B1 (en) |
JP (1) | JPH08506206A (en) |
AU (1) | AU5747694A (en) |
DE (1) | DE69321366T2 (en) |
SG (1) | SG42946A1 (en) |
WO (1) | WO1994015344A1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0742253A2 (en) * | 1995-05-05 | 1996-11-13 | E.I. Du Pont De Nemours And Company | Water-based silver-silver chloride compositions |
WO2002062532A1 (en) * | 2001-02-08 | 2002-08-15 | 3M Innovative Properties Company | Antistatic coating containing graphite for backings of abrasive sheets |
GB2384489A (en) * | 2002-01-25 | 2003-07-30 | Murata Manufacturing Co | Photoreactive resin composition |
WO2023280538A1 (en) * | 2021-07-05 | 2023-01-12 | Henkel Ag & Co. Kgaa | A water absorbing, electrically conductive composition and use of it as a sensor for erosion and/or corrosion monitoring |
Families Citing this family (76)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5494610A (en) * | 1992-06-29 | 1996-02-27 | Lovell; Walter C. | Apparatus and method for providing medium temperature conductive-resistant articles |
JP2716361B2 (en) * | 1994-02-16 | 1998-02-18 | 株式会社アドバンス | Printed electrodes for living body |
US5473006A (en) * | 1994-04-11 | 1995-12-05 | Westvaco Corporation | Polyvinyl alcohol-modified rosin-based emulsion polymers |
US5492653A (en) * | 1994-11-07 | 1996-02-20 | Heraeus Incorporated | Aqueous silver composition |
EP0865614A1 (en) * | 1995-12-05 | 1998-09-23 | Bisson, michel | Contactless electronic transponder with printed loop antenna circuit |
US5756008A (en) * | 1996-08-14 | 1998-05-26 | E. I. Du Pont De Nemours And Company | Water cleanable silver composition |
US5851438A (en) * | 1997-08-29 | 1998-12-22 | E. I. Du Pont De Nemours And Company | Thick film compositions for making medical electrodes |
FR2768256B1 (en) * | 1997-09-10 | 2001-01-19 | Inside Technologies | METHOD FOR RECORDING A BINARY WORD USING ELECTRICALLY ERASABLE PROGRAMMABLE AND MEMORY CELLS |
JPH11130794A (en) | 1997-10-23 | 1999-05-18 | Ajinomoto Co Inc | Purification of aspartame derivative |
US5855820A (en) * | 1997-11-13 | 1999-01-05 | E. I. Du Pont De Nemours And Company | Water based thick film conductive compositions |
NL1008460C2 (en) * | 1998-03-03 | 1999-09-06 | Acheson Colloiden B V | Conductive ink or paint. |
US6576336B1 (en) * | 1998-09-11 | 2003-06-10 | Unitech Corporation, Llc | Electrically conductive and electromagnetic radiation absorptive coating compositions and the like |
US7282260B2 (en) * | 1998-09-11 | 2007-10-16 | Unitech, Llc | Electrically conductive and electromagnetic radiation absorptive coating compositions and the like |
US6652777B2 (en) | 2000-02-28 | 2003-11-25 | Amesbury Group, Inc. | Method and apparatus for EMI shielding |
FR2812119B1 (en) * | 2000-07-24 | 2002-12-13 | Commissariat Energie Atomique | CONDUCTIVE COMPOSITE MATERIAL AND ELECTRODE FOR FUEL CELL USING THE THERMO-COMPRESSED MATERIAL |
FR2812120B1 (en) * | 2000-07-24 | 2006-11-03 | Commissariat Energie Atomique | CONDUCTIVE COMPOSITE MATERIAL AND ELECTRODE FOR FUEL CELL USING THE MATERIAL |
DE10038730A1 (en) * | 2000-08-01 | 2002-02-28 | Burd Lifror Systems Gmbh | Production of an electrical heating layer comprises applying a coating composition containing a dispersion of a synthetic polymer in a dispersant, a dissolved dispersion resin in a dispersant and graphite on a substrate, then drying |
US20030056413A1 (en) | 2001-08-24 | 2003-03-27 | Wiemer James A. | Display system |
US6410637B1 (en) * | 2000-11-28 | 2002-06-25 | Xerox Corporation | Water-based composition for coating a donor member |
US6824857B2 (en) | 2001-04-02 | 2004-11-30 | Nashua Corporation | Circuit elements having an embedded conductive trace and methods of manufacture |
JP4659256B2 (en) * | 2001-04-17 | 2011-03-30 | キヤノン株式会社 | Metal composition for manufacturing electron-emitting device, and method for manufacturing electron-emitting device using the same |
US8178188B2 (en) * | 2001-04-20 | 2012-05-15 | Panasonic Corporation | Base layer for manufacturing an electronic component by an etching process |
US6855367B2 (en) * | 2001-04-20 | 2005-02-15 | Atsushita Electric Industrial Co., Ltd. | Method of producing electronic parts, and member for production thereof |
US6815642B2 (en) | 2001-12-19 | 2004-11-09 | Delphi Technologies, Inc. | Apparatus and method for heating a steering wheel |
DE10209835A1 (en) * | 2002-03-06 | 2003-10-16 | Bosch Gmbh Robert | Water soluble paste and its use |
US6866799B2 (en) | 2002-05-09 | 2005-03-15 | Anuvu, Inc. | Water-soluble electrically conductive composition, modifications, and applications thereof |
EP1383364A3 (en) * | 2002-05-23 | 2006-01-04 | Nashua Corporation | Circuit elements having an ink receptive coating and a conductive trace and methods of manufacture |
DE60314138T2 (en) | 2002-06-14 | 2008-01-24 | Hyperion Catalysis International, Inc., Cambridge | ELECTROPROOF COLORS AND COAT FIBRILLO BASE COATINGS |
JP4240961B2 (en) * | 2002-09-04 | 2009-03-18 | チッソ株式会社 | Modified conductive polymer film and method for producing the same |
US6866378B2 (en) * | 2002-10-28 | 2005-03-15 | Hewlett-Packard Development Company, L.P. | Conductive additives for use in printing processes employing radiational drying |
DE10302149A1 (en) * | 2003-01-21 | 2005-08-25 | Siemens Ag | Use of conductive carbon black / graphite blends for the production of low-cost electronics |
US20040178391A1 (en) * | 2003-01-29 | 2004-09-16 | Conaghan Brian F. | High conductivity inks with low minimum curing temperatures |
US7211205B2 (en) * | 2003-01-29 | 2007-05-01 | Parelec, Inc. | High conductivity inks with improved adhesion |
US7141185B2 (en) * | 2003-01-29 | 2006-11-28 | Parelec, Inc. | High conductivity inks with low minimum curing temperatures |
JP4568276B2 (en) * | 2003-07-07 | 2010-10-27 | エーブリー デニソン コーポレイション | RFID device with variable characteristics |
US7264752B2 (en) * | 2003-08-29 | 2007-09-04 | Xerox Corporation | Conductive coatings for corona generating devices |
US7422789B2 (en) * | 2003-10-27 | 2008-09-09 | Polyone Corporation | Cathodic protection coatings containing carbonaceous conductive media |
US8617745B2 (en) * | 2004-02-06 | 2013-12-31 | A123 Systems Llc | Lithium secondary cell with high charge and discharge rate capability and low impedance growth |
KR101273100B1 (en) | 2004-02-06 | 2013-06-13 | 에이일이삼 시스템즈 인코포레이티드 | Lithium secondary cell with high charge and discharge rate capability |
KR20060004158A (en) * | 2004-07-08 | 2006-01-12 | 박철용 | Aqueous conductive polymer composition with ptc of resistivity and preparation therof |
JP4009623B2 (en) * | 2004-08-16 | 2007-11-21 | 埼玉日本電気株式会社 | Wet detection seal, mobile phone and electronic device using the same |
US7520600B2 (en) * | 2004-11-01 | 2009-04-21 | Basf Corporation | Fast-drying, radiofrequency-activatable inkjet inks and methods and systems for their use |
US7341680B2 (en) * | 2005-03-02 | 2008-03-11 | Hewlett-Packard Development Company, L.P. | Printable composition with nanostructures of first and second types |
JP2008546157A (en) * | 2005-06-09 | 2008-12-18 | ナショナル スターチ アンド ケミカル カンパニー | Water based printable electrical conductor |
TWI345804B (en) | 2005-08-17 | 2011-07-21 | Lg Chemical Ltd | Patterning method using coatings containing ionic components |
TWI400718B (en) * | 2005-08-24 | 2013-07-01 | A M Ramp & Co Gmbh | Process for producing articles having an electrically conductive coating |
US7154283B1 (en) | 2006-02-22 | 2006-12-26 | Avery Dennison Corporation | Method of determining performance of RFID devices |
WO2007111996A2 (en) * | 2006-03-24 | 2007-10-04 | Clemson University | Conducting polymer ink |
KR100768706B1 (en) | 2006-06-08 | 2007-10-19 | 삼성전기주식회사 | Metal ink composition for ink-jet |
US8709288B2 (en) * | 2006-09-08 | 2014-04-29 | Sun Chemical Corporation | High conductive water-based silver ink |
CN101595534B (en) * | 2006-12-22 | 2012-07-18 | 汉高股份两合公司 | Waterborne conductive compositions |
US7785496B1 (en) | 2007-01-26 | 2010-08-31 | Clemson University Research Foundation | Electrochromic inks including conducting polymer colloidal nanocomposites, devices including the electrochromic inks and methods of forming same |
DE102007013276A1 (en) | 2007-03-16 | 2008-09-18 | Evonik Degussa Gmbh | Aqueous printing ink composition, useful to produce electrically functional structures and product e.g. heatable cushions and back windows, comprises electrically conductive polymer in an aqueous dispersion, graphite, soot and a solvent |
DE102007027473A1 (en) | 2007-06-14 | 2008-12-18 | Manroland Ag | Technically produced functional components |
US8241657B2 (en) | 2007-12-04 | 2012-08-14 | Boston Scientific Scimed, Inc. | Biodisintegrable medical devices |
WO2010065503A2 (en) | 2008-12-01 | 2010-06-10 | University Of Massachusetts Lowell | Conductive formulations for use in electrical, electronic and rf applications |
GB2467533A (en) * | 2009-02-04 | 2010-08-11 | Rebecca Lynn Pilditch | Conductive ink for use on the living human body |
DE102009011553B4 (en) | 2009-03-06 | 2013-05-23 | Carl Freudenberg Kg | Process for producing a material insulated from electric current and insulated material produced thereby |
DE102009014378A1 (en) | 2009-03-23 | 2010-10-07 | E-Pinc Gmbh | Electrically conductive ink composition, useful e.g. in mass printing method, comprises electrically non-conductive polymer, polymerizable material, siccative, carbon component comprising graphite and/or carbon black and optionally solvent |
WO2011066028A2 (en) | 2009-09-08 | 2011-06-03 | University Of Massachusetts Lowell | Wireless passive radio-frequency strain and displacement sensors |
CN101649137B (en) * | 2009-09-17 | 2011-11-09 | 王宝林 | Gel ink with high stability |
US9209464B2 (en) * | 2009-09-24 | 2015-12-08 | Corning Incorporated | Current collectors having textured coating |
CN102034877A (en) * | 2009-09-30 | 2011-04-27 | 比亚迪股份有限公司 | Conductive paste for solar cell and preparation method thereof |
US8687346B2 (en) | 2010-05-27 | 2014-04-01 | Corning Incorporated | Multi-layered electrode for ultracapacitors |
US8840687B2 (en) | 2010-08-23 | 2014-09-23 | Corning Incorporated | Dual-layer method of fabricating ultracapacitor current collectors |
JP5310957B2 (en) * | 2011-03-08 | 2013-10-09 | Dic株式会社 | Conductive water-based ink for inkjet recording |
US8871116B2 (en) | 2011-09-30 | 2014-10-28 | Corning Incorporated | Hydrochloric acid washing of carbon and graphite for making conductive ink for ultracapacitors |
CN104837905A (en) | 2012-12-14 | 2015-08-12 | E.I.内穆尔杜邦公司 | Conductive metal composition |
RU2515507C1 (en) * | 2012-12-24 | 2014-05-10 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Белгородский государственный технологический университет им. В.Г. Шухова" | Resistive composite |
JP5935820B2 (en) * | 2013-04-19 | 2016-06-15 | 東洋インキScホールディングス株式会社 | Conductive composition, current collector with base layer for power storage device, electrode for power storage device, and power storage device |
KR101436525B1 (en) * | 2013-06-28 | 2014-09-02 | 코오롱글로텍주식회사 | Ink for screen printing |
CN103421301B (en) * | 2013-08-09 | 2015-11-11 | 中纺新材料科技有限公司 | A kind of Environment-friendlycarbon carbon polyurethane group conductive film |
EP3551110A4 (en) | 2016-12-12 | 2020-06-03 | Neuronoff, Inc. | Electrode curable and moldable to contours of a target in bodily tissue and methods of manufacturing and placement and dispensers therefor |
EP3385342B1 (en) * | 2017-04-03 | 2020-03-25 | Nano and Advanced Materials Institute Limited | Water-based conductive ink for rapid prototype in writable electronics |
EP3442309B1 (en) | 2017-08-07 | 2021-06-30 | Benecke-Kaliko AG | Method for the production of an electrically conductive textile surface element |
KR102160542B1 (en) * | 2019-12-05 | 2020-09-28 | (주)태일잉크화학 | Ink composition for screen printing |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4510275A (en) * | 1981-07-21 | 1985-04-09 | Nippon Paint Co., Ltd. | Novel aqueous coating composition |
US4853285A (en) * | 1983-12-27 | 1989-08-01 | Nippon Paint Co., Ltd. | Corrosion resistant, coated metal laminate, its preparation and coating materials |
US5137542A (en) * | 1990-08-08 | 1992-08-11 | Minnesota Mining And Manufacturing Company | Abrasive printed with an electrically conductive ink |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4011388A (en) * | 1974-07-02 | 1977-03-08 | E. I. Du Pont De Nemours And Company | Process for preparing emulsions by polymerization of aqueous monomer-polymer dispersions |
US4156047A (en) * | 1976-08-18 | 1979-05-22 | E. I. Du Pont De Nemours And Company | Water-soluble films from polyvinyl alcohol compositions |
DE3544337A1 (en) * | 1985-12-14 | 1987-06-19 | Hoechst Ag | POLYMERISAT DISPERSIONS, METHOD FOR THE PRODUCTION THEREOF AND THEIR USE AS BINDERS |
-
1992
- 1992-12-28 US US07/997,374 patent/US5286415A/en not_active Expired - Lifetime
-
1993
- 1993-12-03 US US08/160,767 patent/US5389403A/en not_active Expired - Fee Related
- 1993-12-10 DE DE69321366T patent/DE69321366T2/en not_active Expired - Fee Related
- 1993-12-10 WO PCT/US1993/012036 patent/WO1994015344A1/en active IP Right Grant
- 1993-12-10 EP EP94903585A patent/EP0676082B1/en not_active Expired - Lifetime
- 1993-12-10 AU AU57476/94A patent/AU5747694A/en not_active Abandoned
- 1993-12-10 JP JP6515224A patent/JPH08506206A/en active Pending
- 1993-12-10 SG SG1996001263A patent/SG42946A1/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4510275A (en) * | 1981-07-21 | 1985-04-09 | Nippon Paint Co., Ltd. | Novel aqueous coating composition |
US4853285A (en) * | 1983-12-27 | 1989-08-01 | Nippon Paint Co., Ltd. | Corrosion resistant, coated metal laminate, its preparation and coating materials |
US5137542A (en) * | 1990-08-08 | 1992-08-11 | Minnesota Mining And Manufacturing Company | Abrasive printed with an electrically conductive ink |
Non-Patent Citations (1)
Title |
---|
See also references of EP0676082A4 * |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0742253A2 (en) * | 1995-05-05 | 1996-11-13 | E.I. Du Pont De Nemours And Company | Water-based silver-silver chloride compositions |
EP0742253A3 (en) * | 1995-05-05 | 1997-12-10 | E.I. Du Pont De Nemours And Company | Water-based silver-silver chloride compositions |
WO2002062532A1 (en) * | 2001-02-08 | 2002-08-15 | 3M Innovative Properties Company | Antistatic coating containing graphite for backings of abrasive sheets |
US7294667B2 (en) | 2001-02-08 | 2007-11-13 | 3M Innovative Properties Company | Coated abrasive articles containing graphite |
GB2384489A (en) * | 2002-01-25 | 2003-07-30 | Murata Manufacturing Co | Photoreactive resin composition |
GB2384489B (en) * | 2002-01-25 | 2004-04-07 | Murata Manufacturing Co | Photoreactive resin composition and method of manufacturing circuit board and ceramic multilayer substate using the resin composition |
US6790596B2 (en) | 2002-01-25 | 2004-09-14 | Murata Manufacturing Co., Ltd | Photoreactive resin composition and method of manufacturing circuit board and ceramic multilayer substrate using the resin composition |
WO2023280538A1 (en) * | 2021-07-05 | 2023-01-12 | Henkel Ag & Co. Kgaa | A water absorbing, electrically conductive composition and use of it as a sensor for erosion and/or corrosion monitoring |
Also Published As
Publication number | Publication date |
---|---|
US5389403A (en) | 1995-02-14 |
DE69321366T2 (en) | 1999-06-02 |
SG42946A1 (en) | 1997-10-17 |
US5286415A (en) | 1994-02-15 |
EP0676082A1 (en) | 1995-10-11 |
EP0676082B1 (en) | 1998-09-30 |
DE69321366D1 (en) | 1998-11-05 |
EP0676082A4 (en) | 1995-08-23 |
JPH08506206A (en) | 1996-07-02 |
AU5747694A (en) | 1994-07-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0676082B1 (en) | Water-based polymer thick film conductive ink | |
US5855820A (en) | Water based thick film conductive compositions | |
EP0784326B1 (en) | Flexible thick film conductor composition | |
EP3216029B1 (en) | Stretchable polymer thick film compositions for thermoplastic substrates and wearables electronics | |
EP0169060B1 (en) | Solderable conductive compositions, their use as coatings on substrates, and compositions useful in forming them | |
KR930000776B1 (en) | Conductive compositions and preparation thereof | |
EP2350176B1 (en) | High conductivity polymer thick film silver conductor composition for use in rfid and other applications | |
JP2009176728A (en) | Conductive paste used for membrane touch switch | |
JP2010047649A (en) | Conductive ink and conductive circuit formed by screen printing using the same | |
JP3459203B2 (en) | Conductive ink or conductive paint, method for producing the same, and writing implement filled with conductive ink | |
EP2481060B1 (en) | Polymer thick film silver electrode composition for use as a plating link | |
US5622547A (en) | Vehicle system for thick film inks | |
JP2008106121A (en) | Conductive ink, conductive circuit and noncontact medium | |
KR20120009612A (en) | Liquid for improving conductivity and process of forming conductive pattern using thereof by gravure printing method | |
JPH09255900A (en) | Thermosetting type carbon-based electroconductive coating material | |
JP2008106119A (en) | Conductive ink, conductive circuit and noncontact medium | |
JPS61200179A (en) | Conductive coating composition | |
HU196232B (en) | Electronic conducting paste for contacting plastic carriers |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AU BB BG BR BY CA CZ FI HU JP KP KR KZ LK MG MN MW NO NZ PL RO RU SD SK UA VN |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): AT BE CH DE DK ES FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN ML MR NE SN TD TG |
|
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 1994903585 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 1994903585 Country of ref document: EP |
|
NENP | Non-entry into the national phase |
Ref country code: CA |
|
WWG | Wipo information: grant in national office |
Ref document number: 1994903585 Country of ref document: EP |