WO1995032493A2 - Arrangement for connecting a drive circuit to a planar display or matrix printer and method for connecting a drive circuit to a planar display or matrix printer - Google Patents

Arrangement for connecting a drive circuit to a planar display or matrix printer and method for connecting a drive circuit to a planar display or matrix printer Download PDF

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Publication number
WO1995032493A2
WO1995032493A2 PCT/FI1995/000251 FI9500251W WO9532493A2 WO 1995032493 A2 WO1995032493 A2 WO 1995032493A2 FI 9500251 W FI9500251 W FI 9500251W WO 9532493 A2 WO9532493 A2 WO 9532493A2
Authority
WO
WIPO (PCT)
Prior art keywords
drive circuit
planar display
matrix printer
line conductors
mounting area
Prior art date
Application number
PCT/FI1995/000251
Other languages
French (fr)
Other versions
WO1995032493A3 (en
Inventor
Ahti Aintila
Original Assignee
Picopak Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Picopak Oy filed Critical Picopak Oy
Publication of WO1995032493A2 publication Critical patent/WO1995032493A2/en
Publication of WO1995032493A3 publication Critical patent/WO1995032493A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/22—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of impact or pressure on a printing material or impression-transfer material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Definitions

  • the present invention relates to an arrangement according to the preamble of claim 1 for connecting a drive circuit to a planar display or a matrix printer.
  • the invention also concerns a method for connecting a drive circuit to a planar display or a matrix printer.
  • the connections of electrical drive circuits are implemented using the Tape Automated Bonding method (TAB) for connecting the output lines of the drive circuit semiconductor elements to the edge conductor areas of a planar display.
  • TAB Tape Automated Bonding method
  • the drive circuits are mounted on a laminated tape acting as a flexible carrier vehicle, and the input lines of TAB-mounted drive circuits are chained with each other and connected to the rest of the display driver circuitry by means of an elongated circuit board.
  • TAB Tape Automated Bonding method
  • the goal of the invention is achieved by means of comple- menting the conventional drive components mounted on the TAB carrier vehicle with a chained conductor pattern of the input lines of the drive circuits.
  • connection arrangement according to the invention is characterized by what is stated in the characterizing part of claim 1.
  • method according to the invention is characterized by what is stated in the characterizing part of claim 2.
  • the invention offers significant benefits.
  • the chained connections can be implemented without the need for a separate circuit board.
  • each drive circuit can still be replaced individually when necessary.
  • the conductor pattern can be made using a coarser pitch than that normally dictated by the conductor spacing at the connections to the display device.
  • the arrange ⁇ ment can be implemented without the need for separate tooling specifically for each display device type.
  • Figure la illustrates the component side of a connection arrangement according to the invention
  • Figure lb illustrates the other side of the connection arrangement shown in Fig. la;
  • Figure 2 illustrates two adjacent sets of connection arrangements according to the invention ready for bonding to the edge of a low-resolution display device
  • Figure 3 illustrates two adjacent sets of connection arrangements according to the invention ready for bonding to the edge of a high-resolution display device.
  • the output line pattern 2 of a drive component for a display device starts from the drive component mounting area 1 made onto a thin, flexible, laminated carrier tape.
  • the output line pattern 2 is first tapered into a dense con ⁇ ductor pattern 3 and then flared into a sparse conductor pattern 4 so as to match the conductor pitch of the connection arrangement with the pitch of the display device conductor pattern.
  • the conductor pattern can simply be trimmed at the dense area 3 of the conductor pattern, whereby the connection arrangement achieves interfacing to the display device with a desired pitch of conductors.
  • supply lines to the mounting area 1 of the drive circuit are implemented by means of power supply lines 5, whose routing is chiefly arranged on the other side of the TAB carrier with respect to the conductor pattern illustrated in Fig. lb.
  • the TAB carrier is provided with conductor pattern 6, whose routing is chiefly arranged on the component side of the carrier vehicle as illustrated in Fig. la.
  • the control signal conductors 7 are taken to the opposite side of the carrier vehicle, and the required signals are taken to the component side of the carrier vehicle through contact pad vias 8 made on the component side of the carrier vehicle.
  • the arrangement shown in Figs, la and lb dispenses with the use of separate circuit boards when a number of drive circuits are chained to drive a planar display, for instance.
  • a suitable connection method for bonding the drive circuit to the component side of the connection arrangement is reflow solder bonding.
  • the tin-lead solder alloy is appropriately applied onto the carrier vehicle by electrolytic or electrochemical deposition requiring the entire conductor pattern to be electrically interconnected by means of thin conductor strips 9.
  • the interconnecting strips 9 Prior to the testing of the drive circuits, the interconnecting strips 9 must be galvanically separated from the conductor pattern proper. To accomplish this, the strips 9 may be grouped into arrays that can be cut off by means of a number of small punches.
  • connection arrangements of Fig. 1 are adjacently combined for interfacing to a low- resolution display, whereby the sparse conductor pattern 4 is used for connections.
  • the dense conductor pattern 3 is used for alternative needs, and to achieve a sufficiently dense interfacing conductor pitch, the conductors of the connection arrangements are partially superimposed.
  • the interfacing connections are implemented by superimposed soldering of the via areas 10 of the circuit input lines.
  • the output line conductors 2 of the drive module can be conductively glued or soldered to the edge contact areas of a planar display.
  • the other end of the chained input line conductor pattern is provided with a cable termination (not shown), whereby the display control processor can directly control the drive circuits placed on the mounting areas 1.

Abstract

The present invention relates to an arrangement on a flexible carrier vehicle for connecting a drive circuit to a planar display or matrix printer and a method for connecting said drive circuit to a planar display or matrix printer. The connection arrangement comprises a mounting area (1) for the drive circuit, output line conductors (2) terminating at said mounting area (1) and input line conductors (5, 6, 7) terminating at said mounting area (1). According to the invention, the connection arrangement includes chaining of the input line conductors (5, 6, 7) of the drive circuit for drive circuits operating in parallel.

Description

Arrangement for connecting a drive circuit to a planar display or matrix printer and method for connecting a drive circuit to a planar display or matrix printer
The present invention relates to an arrangement according to the preamble of claim 1 for connecting a drive circuit to a planar display or a matrix printer.
The invention also concerns a method for connecting a drive circuit to a planar display or a matrix printer.
Conventionally, in conjunction with 'planar displays such as liquid-crystal displays or electroluminescent displays, the connections of electrical drive circuits are implemented using the Tape Automated Bonding method (TAB) for connecting the output lines of the drive circuit semiconductor elements to the edge conductor areas of a planar display. The drive circuits are mounted on a laminated tape acting as a flexible carrier vehicle, and the input lines of TAB-mounted drive circuits are chained with each other and connected to the rest of the display driver circuitry by means of an elongated circuit board. Such an arrangement is costly to manufacture.
It is an object of the present invention to provide an entirely novel arrangement for connecting the input lines of TAB-mounted drive circuits to the driver electronics.
The goal of the invention is achieved by means of comple- menting the conventional drive components mounted on the TAB carrier vehicle with a chained conductor pattern of the input lines of the drive circuits.
More specifically, the connection arrangement according to the invention is characterized by what is stated in the characterizing part of claim 1. Furthermore, the method according to the invention is characterized by what is stated in the characterizing part of claim 2.
The invention offers significant benefits.
For instance, the chained connections can be implemented without the need for a separate circuit board. In spite of the omission of the conventional circuit board, each drive circuit can still be replaced individually when necessary. Owing to the interlaced pattern of the conductor runs, even at high conductor densities, the conductor pattern can be made using a coarser pitch than that normally dictated by the conductor spacing at the connections to the display device. Moreover, the arrange¬ ment can be implemented without the need for separate tooling specifically for each display device type.
The invention is next examined in greater detail with reference to attached drawings, in which:
Figure la illustrates the component side of a connection arrangement according to the invention;
Figure lb illustrates the other side of the connection arrangement shown in Fig. la;
• Figure 2 illustrates two adjacent sets of connection arrangements according to the invention ready for bonding to the edge of a low-resolution display device; and
Figure 3 illustrates two adjacent sets of connection arrangements according to the invention ready for bonding to the edge of a high-resolution display device.
With reference to Fig. la, the output line pattern 2 of a drive component for a display device (or a matrix printer) starts from the drive component mounting area 1 made onto a thin, flexible, laminated carrier tape. The output line pattern 2 is first tapered into a dense con¬ ductor pattern 3 and then flared into a sparse conductor pattern 4 so as to match the conductor pitch of the connection arrangement with the pitch of the display device conductor pattern. In the case that the display device requires a densely-pitched interfacing conductor pattern, the conductor pattern can simply be trimmed at the dense area 3 of the conductor pattern, whereby the connection arrangement achieves interfacing to the display device with a desired pitch of conductors.
With reference to Fig. lb, supply lines to the mounting area 1 of the drive circuit are implemented by means of power supply lines 5, whose routing is chiefly arranged on the other side of the TAB carrier with respect to the conductor pattern illustrated in Fig. lb. For the chaining of the data lines, the TAB carrier is provided with conductor pattern 6, whose routing is chiefly arranged on the component side of the carrier vehicle as illustrated in Fig. la. Correspondingly, the control signal conductors 7 are taken to the opposite side of the carrier vehicle, and the required signals are taken to the component side of the carrier vehicle through contact pad vias 8 made on the component side of the carrier vehicle.
The arrangement shown in Figs, la and lb dispenses with the use of separate circuit boards when a number of drive circuits are chained to drive a planar display, for instance. A suitable connection method for bonding the drive circuit to the component side of the connection arrangement is reflow solder bonding. In this method, the tin-lead solder alloy is appropriately applied onto the carrier vehicle by electrolytic or electrochemical deposition requiring the entire conductor pattern to be electrically interconnected by means of thin conductor strips 9. Prior to the testing of the drive circuits, the interconnecting strips 9 must be galvanically separated from the conductor pattern proper. To accomplish this, the strips 9 may be grouped into arrays that can be cut off by means of a number of small punches.
With reference to Fig. 2, two connection arrangements of Fig. 1 are adjacently combined for interfacing to a low- resolution display, whereby the sparse conductor pattern 4 is used for connections.
With reference to Fig. 3, the dense conductor pattern 3 is used for alternative needs, and to achieve a sufficiently dense interfacing conductor pitch, the conductors of the connection arrangements are partially superimposed. The interfacing connections are implemented by superimposed soldering of the via areas 10 of the circuit input lines. The output line conductors 2 of the drive module can be conductively glued or soldered to the edge contact areas of a planar display. The other end of the chained input line conductor pattern is provided with a cable termination (not shown), whereby the display control processor can directly control the drive circuits placed on the mounting areas 1.

Claims

Claims:
1. An arrangement on a flexible carrier vehicle for connecting a drive circuit to a planar display or matrix printer, said connection arrangement comprising
- a mounting area (1) for the drive circuit,
- output line conductors (2) terminating at said mounting area (1)
- input line conductors (5, 6, 7) terminating at said mounting area (1)
c h a r a c t e r i z e d in that
- besides said input line conductors (5, 6, 7), said connection arrangement includes chaining for drive circuits operating in parallel.
2. A method for connecting a drive circuit to a planar display or a matrix printer, in which method
- the drive circuit is placed on a mounting area (1),
- the control signals of the drive circuit are taken to the planar display device or matrix printer via output line conductors (2) , and
- the drive circuit is controlled by input line conductors (5, 6, 7) terminating at the mounting area (1) of said drive circuit,
c h a r a c t e r i z e d in that - the input line conductors (5, 6, 7) of the drive circuit are chained for drive circuits operating in parallel.
PCT/FI1995/000251 1994-05-19 1995-05-11 Arrangement for connecting a drive circuit to a planar display or matrix printer and method for connecting a drive circuit to a planar display or matrix printer WO1995032493A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI940289U FI1499U1 (en) 1994-05-19 1994-05-19 Copying arrangements are required for plans or matrices
FIU940289 1994-05-19

Publications (2)

Publication Number Publication Date
WO1995032493A2 true WO1995032493A2 (en) 1995-11-30
WO1995032493A3 WO1995032493A3 (en) 1995-12-28

Family

ID=8539611

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FI1995/000251 WO1995032493A2 (en) 1994-05-19 1995-05-11 Arrangement for connecting a drive circuit to a planar display or matrix printer and method for connecting a drive circuit to a planar display or matrix printer

Country Status (2)

Country Link
FI (1) FI1499U1 (en)
WO (1) WO1995032493A2 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2470518A1 (en) * 1979-11-23 1981-05-29 Thomson Csf CONNECTION METHOD, FOR MULTIPLEXING ELECTRONIC MICROCIRCUITS, AND WRITTEN READING HEAD AND DISPLAY PANEL USING THE SAME
US4288841A (en) * 1979-09-20 1981-09-08 Bell Telephone Laboratories, Incorporated Double cavity semiconductor chip carrier
US4958911A (en) * 1988-10-19 1990-09-25 Jonand, Inc. Liquid crystal display module having housing of C-shaped cross section
US4973951A (en) * 1989-03-09 1990-11-27 Stanley Electric Co., Ltd. Double-sided display apparatus
US5148595A (en) * 1990-04-27 1992-09-22 Synergy Computer Graphics Corporation Method of making laminated electrostatic printhead

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63106628A (en) * 1986-10-23 1988-05-11 Toshiba Corp Liquid crystal display device
JPH04173267A (en) * 1990-11-06 1992-06-19 Nec Niigata Ltd Led print head

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4288841A (en) * 1979-09-20 1981-09-08 Bell Telephone Laboratories, Incorporated Double cavity semiconductor chip carrier
FR2470518A1 (en) * 1979-11-23 1981-05-29 Thomson Csf CONNECTION METHOD, FOR MULTIPLEXING ELECTRONIC MICROCIRCUITS, AND WRITTEN READING HEAD AND DISPLAY PANEL USING THE SAME
US4958911A (en) * 1988-10-19 1990-09-25 Jonand, Inc. Liquid crystal display module having housing of C-shaped cross section
US4973951A (en) * 1989-03-09 1990-11-27 Stanley Electric Co., Ltd. Double-sided display apparatus
US5148595A (en) * 1990-04-27 1992-09-22 Synergy Computer Graphics Corporation Method of making laminated electrostatic printhead

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 012, no. 354 (P-761) & JP 63 106 628 A (TOSHIBA CORP) 11 May 1988 *
PATENT ABSTRACTS OF JAPAN vol. 016, no. 477 (M-1320) & JP 04 173 267 A (NEC NIIGATA LTD) 19 June 1992 *

Also Published As

Publication number Publication date
FI1499U1 (en) 1994-09-15
FIU940289U0 (en) 1994-05-19
WO1995032493A3 (en) 1995-12-28

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