WO1995033332A3 - Imaging devices, systems and methods - Google Patents

Imaging devices, systems and methods Download PDF

Info

Publication number
WO1995033332A3
WO1995033332A3 PCT/EP1995/002056 EP9502056W WO9533332A3 WO 1995033332 A3 WO1995033332 A3 WO 1995033332A3 EP 9502056 W EP9502056 W EP 9502056W WO 9533332 A3 WO9533332 A3 WO 9533332A3
Authority
WO
WIPO (PCT)
Prior art keywords
pixel
charge
values
imaging
detected
Prior art date
Application number
PCT/EP1995/002056
Other languages
French (fr)
Other versions
WO1995033332A2 (en
Inventor
Risto Olavi Orava
Jouni Ilari Pyyhtia
Tom Gunnar Schulman
Miltiadis Evangelos Sarakinos
Konstantinos Evange Spartiotis
Original Assignee
Simage Oy
Risto Olavi Orava
Jouni Ilari Pyyhtia
Tom Gunnar Schulman
Miltiadis Evangelos Sarakinos
Konstantinos Evange Spartiotis
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB9410973A external-priority patent/GB2289979A/en
Priority claimed from GB9502419A external-priority patent/GB2289981A/en
Priority to DK95921784T priority Critical patent/DK0763302T3/en
Priority to DE69505375T priority patent/DE69505375T2/en
Priority to EP95921784A priority patent/EP0763302B1/en
Priority to CA002191100A priority patent/CA2191100C/en
Application filed by Simage Oy, Risto Olavi Orava, Jouni Ilari Pyyhtia, Tom Gunnar Schulman, Miltiadis Evangelos Sarakinos, Konstantinos Evange Spartiotis filed Critical Simage Oy
Priority to JP50032296A priority patent/JP3897357B2/en
Priority to AU26720/95A priority patent/AU691926B2/en
Publication of WO1995033332A2 publication Critical patent/WO1995033332A2/en
Publication of WO1995033332A3 publication Critical patent/WO1995033332A3/en
Priority to FI964728A priority patent/FI114841B/en
Priority to NO19965104A priority patent/NO320777B1/en
Priority to HK98116002A priority patent/HK1014819A1/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01TMEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/29Measurement performed on radiation beams, e.g. position or section of the beam; Measurement of spatial distribution of radiation
    • G01T1/2914Measurement of spatial distribution of radiation
    • G01T1/2921Static instruments for imaging the distribution of radioactivity in one or two dimensions; Radio-isotope cameras
    • G01T1/2928Static instruments for imaging the distribution of radioactivity in one or two dimensions; Radio-isotope cameras using solid state detectors
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01TMEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16Measuring radiation intensity
    • G01T1/24Measuring radiation intensity with semiconductor detectors
    • G01T1/247Detector read-out circuitry
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01TMEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/29Measurement performed on radiation beams, e.g. position or section of the beam; Measurement of spatial distribution of radiation
    • G01T1/2914Measurement of spatial distribution of radiation
    • G01T1/2964Scanners
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14665Imagers using a photoconductor layer
    • H01L27/14676X-ray, gamma-ray or corpuscular radiation imagers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/148Charge coupled imagers
    • H01L27/14831Area CCD imagers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/48Increasing resolution by shifting the sensor relative to the scene
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/71Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
    • H04N25/74Circuitry for scanning or addressing the pixel array
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00Details of television systems
    • H04N5/30Transforming light or analogous information into electric information
    • H04N5/32Transforming X-rays
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00Details of television systems
    • H04N5/30Transforming light or analogous information into electric information
    • H04N5/32Transforming X-rays
    • H04N5/321Transforming X-rays with video transmission of fluoroscopic images
    • H04N5/325Image enhancement, e.g. by subtraction techniques using polyenergetic X-rays

Abstract

An imaging device comprises a semiconductor substrate including an array of pixel cells. Each pixel cell comprising an individually addressable pixel circuit for accumulating charge resulting from radiation incident on a pixel detector. The pixel circuit and the pixel detector can either be implemented on a single substrate, or on two substrates bonded together. The charge storage device can be a transistor, for example one of a pair of FET transistors connected as a cascade amplification stage. An imaging plane can be made up of one imaging device or a plurality of imaging devices tiled to form a mosaic. The imaging devices may be configured as a slot for certain applications, the slit or slot being scanned over the imaging plane. Control electronics can include addressing logic for addressing individual pixel circuits for reading accumulated charge from the pixel circuits. Imaging optimization can be achieved by determining maximum and minimum charge values for pixels for display, assigning extreme grey scale or color values to the maximum and minimum charge values and allocating grey scale or color values to an individual pixel according to a sliding scale between the extreme values. Scattered radiation can be detected and discarded by comparing the detected pixel value to a threshold value related to a minimum detected charge value expected for directly incident radiation and discarding detected pixel values less than said threshold value.
PCT/EP1995/002056 1994-06-01 1995-05-29 Imaging devices, systems and methods WO1995033332A2 (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
AU26720/95A AU691926B2 (en) 1994-06-01 1995-05-29 Imaging devices, systems and methods
JP50032296A JP3897357B2 (en) 1994-06-01 1995-05-29 Imaging device, imaging system, and imaging method
DE69505375T DE69505375T2 (en) 1994-06-01 1995-05-29 DEVICE, SYSTEM AND METHOD FOR TAKING PICTURES
EP95921784A EP0763302B1 (en) 1994-06-01 1995-05-29 Imaging devices, systems and methods
CA002191100A CA2191100C (en) 1994-06-01 1995-05-29 Imaging devices, systems and methods
DK95921784T DK0763302T3 (en) 1994-06-01 1995-05-29 Devices, systems and methods of imaging
FI964728A FI114841B (en) 1994-06-01 1996-11-27 Imaging equipment, systems and methods
NO19965104A NO320777B1 (en) 1994-06-01 1996-11-29 Imaging device and system, and their use
HK98116002A HK1014819A1 (en) 1994-06-01 1998-12-28 Imaging devices systems and methods

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
GB9410973A GB2289979A (en) 1994-06-01 1994-06-01 Imaging devices systems and methods
GB9410973.3 1994-06-01
GB9421289A GB2289980A (en) 1994-06-01 1994-10-21 Imaging devices systems and methods
GB9421289.1 1994-10-21
GB9502419A GB2289981A (en) 1994-06-01 1995-02-08 Imaging devices systems and methods
GB9502419.6 1995-02-08
GB9508294.7 1995-04-24
GB9508294A GB2289983B (en) 1994-06-01 1995-04-24 Imaging devices,systems and methods

Publications (2)

Publication Number Publication Date
WO1995033332A2 WO1995033332A2 (en) 1995-12-07
WO1995033332A3 true WO1995033332A3 (en) 1996-01-18

Family

ID=27451167

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP1995/002056 WO1995033332A2 (en) 1994-06-01 1995-05-29 Imaging devices, systems and methods

Country Status (17)

Country Link
US (5) US5812191A (en)
EP (1) EP0763302B1 (en)
JP (1) JP3897357B2 (en)
CN (1) CN1132408C (en)
AT (2) ATE288170T1 (en)
AU (1) AU691926B2 (en)
CA (1) CA2191100C (en)
DE (2) DE69533967T2 (en)
DK (1) DK0763302T3 (en)
ES (1) ES2123991T3 (en)
FI (1) FI114841B (en)
GB (1) GB2289983B (en)
HK (1) HK1014819A1 (en)
IL (1) IL113921A (en)
NO (1) NO320777B1 (en)
NZ (1) NZ287868A (en)
WO (1) WO1995033332A2 (en)

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