WO1996007300A3 - Manufacture of electronic devices comprising thin-film circuitry - Google Patents

Manufacture of electronic devices comprising thin-film circuitry Download PDF

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Publication number
WO1996007300A3
WO1996007300A3 PCT/IB1995/000559 IB9500559W WO9607300A3 WO 1996007300 A3 WO1996007300 A3 WO 1996007300A3 IB 9500559 W IB9500559 W IB 9500559W WO 9607300 A3 WO9607300 A3 WO 9607300A3
Authority
WO
WIPO (PCT)
Prior art keywords
links
tfts
thin
gateable
film
Prior art date
Application number
PCT/IB1995/000559
Other languages
French (fr)
Other versions
WO1996007300A2 (en
Inventor
Nigel David Young
Original Assignee
Philips Electronics Nv
Philips Norden Ab
Philips Electronics Uk Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronics Nv, Philips Norden Ab, Philips Electronics Uk Ltd filed Critical Philips Electronics Nv
Priority to JP50858196A priority Critical patent/JP4039639B2/en
Priority to EP95923522A priority patent/EP0724777B1/en
Priority to DE69513628T priority patent/DE69513628T2/en
Publication of WO1996007300A2 publication Critical patent/WO1996007300A2/en
Publication of WO1996007300A3 publication Critical patent/WO1996007300A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1237—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a different composition, shape, layout or thickness of the gate insulator in different devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136204—Arrangements to prevent high voltage or static electricity failures

Abstract

In the manufacture of liquid-crystal display devices and other large-area electronics devices, electrostatic discharge damage (ESD) of tracks and other thin-film circuit elements can result during ion implantation and/or during handling. This damage is avoided by connecting the thin-film circuitry in a charge leakage path with gateable TFT links (45). These links (45) are TFTs (45) with a common gate line (7) for applying a gate bias voltage to control current flow through the links, e.g. to turn off the TFTs (45) during testing of the device circuit. In accordance with the present invention the gateable links (45) in the leakage path are removed simultaneously by applying a sufficiently high gate bias (Vg2) to the common gate line (7) to break the links (45) by evaporating at least the channel regions (6) of the TFTs. A suitable thin-film structure is chosen for the TFTs (45) to facilitate evaporating their channel regions (6) in this manner. The TFTs (45) may have a very thin gate dielectric layer (8), and a channel region (6) which is narrowed in the area of overlap with the gate (7). An over-layer (44) may protect the device circuitry from debris resulting from blowing the links (45). This protective layer (44) may have windows (42) which expose the gateable links (45).
PCT/IB1995/000559 1994-08-20 1995-07-13 Manufacture of electronic devices comprising thin-film circuitry WO1996007300A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP50858196A JP4039639B2 (en) 1994-08-20 1995-07-13 Manufacture of electronic devices with thin film circuits
EP95923522A EP0724777B1 (en) 1994-08-20 1995-07-13 Manufacture of electronic devices comprising thin-film circuitry
DE69513628T DE69513628T2 (en) 1994-08-20 1995-07-13 MANUFACTURE OF ELECTRONIC ITEMS FROM THIN-LAYER CIRCUITS

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB9416899.4 1994-08-20
GB9416899A GB9416899D0 (en) 1994-08-20 1994-08-20 Manufacture of electronic devices comprising thin-film circuitry

Publications (2)

Publication Number Publication Date
WO1996007300A2 WO1996007300A2 (en) 1996-03-07
WO1996007300A3 true WO1996007300A3 (en) 1996-05-02

Family

ID=10760185

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB1995/000559 WO1996007300A2 (en) 1994-08-20 1995-07-13 Manufacture of electronic devices comprising thin-film circuitry

Country Status (7)

Country Link
US (1) US5798534A (en)
EP (1) EP0724777B1 (en)
JP (1) JP4039639B2 (en)
KR (1) KR100361395B1 (en)
DE (1) DE69513628T2 (en)
GB (1) GB9416899D0 (en)
WO (1) WO1996007300A2 (en)

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US5985690A (en) * 1995-01-30 1999-11-16 Nec Corporation Method of manufacturing contact image sensor
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JP3379896B2 (en) * 1997-11-14 2003-02-24 シャープ株式会社 Liquid crystal display device and inspection method thereof
FR2778497B1 (en) * 1998-05-07 2003-06-13 Sgs Thomson Microelectronics INTEGRATED CIRCUIT FUSE, CURRENT FOCUSING
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GB9825314D0 (en) * 1998-11-20 1999-01-13 Koninkl Philips Electronics Nv Active matrix liquid crystal display devices
KR100660813B1 (en) * 1999-12-31 2006-12-26 엘지.필립스 엘시디 주식회사 method for fabricating array substrate for x-ray detector
TWI236557B (en) * 2000-09-29 2005-07-21 Au Optronics Corp TFT LCD and method of making the same
GB0100733D0 (en) * 2001-01-11 2001-02-21 Koninkl Philips Electronics Nv A method of manufacturing an active matrix substrate
KR100466963B1 (en) * 2001-12-27 2005-01-24 엘지.필립스 엘시디 주식회사 Thin Film Transistor for Active Matrix type Organic Light Emitting Diode Device
TW560042B (en) * 2002-09-18 2003-11-01 Vanguard Int Semiconduct Corp ESD protection device
WO2004063799A1 (en) * 2002-12-03 2004-07-29 Quanta Display Inc. Method for manufacturing the thin film transistor array
TWI220313B (en) * 2003-07-30 2004-08-11 Au Optronics Corp Electrostatic discharge circuit
CN1324703C (en) * 2003-08-11 2007-07-04 友达光电股份有限公司 Static discharge protective circuit structure
US7119411B2 (en) * 2004-02-17 2006-10-10 Au Optronics Corp. Interconnect structure for TFT-array substrate and method for fabricating the same
TWI255959B (en) * 2004-02-23 2006-06-01 Toppoly Optoelectronics Corp Method of manufacturing thin film transistor array
WO2005119779A1 (en) * 2004-06-03 2005-12-15 Semiconductor Energy Laboratory Co., Ltd. Memory device and manufacturing method of the same
JP4671765B2 (en) * 2004-06-03 2011-04-20 株式会社半導体エネルギー研究所 Memory device and manufacturing method thereof
JP4884784B2 (en) 2005-01-28 2012-02-29 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device and semiconductor device
US7719872B2 (en) 2005-12-28 2010-05-18 Semiconductor Energy Laboratory Co., Ltd. Write-once nonvolatile memory with redundancy capability
US20080024427A1 (en) * 2006-07-26 2008-01-31 Prime View International Co., Ltd. Electronic ink display panel
KR20060093321A (en) * 2006-08-05 2006-08-24 박장용 Welding machine system that can set crater in wire feeder
WO2008041716A1 (en) 2006-10-04 2008-04-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
KR101441348B1 (en) 2006-10-24 2014-09-18 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device including storage device and method for driving the same
KR101416876B1 (en) 2006-11-17 2014-07-08 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for manufacturing the same
US7994607B2 (en) 2007-02-02 2011-08-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP5525694B2 (en) 2007-03-14 2014-06-18 株式会社半導体エネルギー研究所 Semiconductor device and manufacturing method of semiconductor device
US8217455B2 (en) * 2008-04-14 2012-07-10 International Business Machines Corporation Semiconductor-on-insulator device structures with a body-to-substrate connection for enhanced electrostatic discharge protection, and design structures for such semiconductor-on-insulator device structures
JP2010066331A (en) * 2008-09-09 2010-03-25 Fujifilm Corp Display apparatus
KR101586522B1 (en) * 2010-01-06 2016-01-18 가부시키가이샤 제이올레드 Active matrix substrate, display panel and inspection method thereof
CN102540524B (en) * 2010-12-30 2015-10-07 北京京东方光电科技有限公司 Prevent the method for electrostatic breakdown, the manufacture method of array base palte and display backboard
CN103123428B (en) * 2011-11-18 2017-05-17 上海中航光电子有限公司 Thin film transistor (TFT)-liquid crystal display (LCD) array substrate and production method thereof
CN102651547B (en) * 2012-01-12 2013-06-05 京东方科技集团股份有限公司 ESD (Electro-Static discharge) protection circuit and display device comprising same
CN102983134B (en) * 2012-12-13 2015-03-25 京东方科技集团股份有限公司 Display device and array substrate and fabrication method of array substrate
KR20180066937A (en) * 2016-12-09 2018-06-20 삼성디스플레이 주식회사 Display device

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EP0589519A2 (en) * 1992-09-24 1994-03-30 Philips Electronics Uk Limited Electronic device manufacture
EP0601652A2 (en) * 1992-12-11 1994-06-15 Philips Electronics Uk Limited Electronic device manufacture using ion implantation

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US4875130A (en) * 1988-07-06 1989-10-17 National Semiconductor Corporation ESD low resistance input structure
US5068748A (en) * 1989-10-20 1991-11-26 Hosiden Corporation Active matrix liquid crystal display device having improved electrostatic discharge protection
US5195010A (en) * 1990-01-23 1993-03-16 Thomson, S.A. Electrostatic discharge voltage protection circuit for a solid state instrument
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EP0601652A2 (en) * 1992-12-11 1994-06-15 Philips Electronics Uk Limited Electronic device manufacture using ion implantation

Also Published As

Publication number Publication date
JPH09504657A (en) 1997-05-06
DE69513628T2 (en) 2000-12-07
DE69513628D1 (en) 2000-01-05
US5798534A (en) 1998-08-25
KR100361395B1 (en) 2003-03-06
GB9416899D0 (en) 1994-10-12
EP0724777B1 (en) 1999-12-01
KR960705371A (en) 1996-10-09
EP0724777A1 (en) 1996-08-07
WO1996007300A2 (en) 1996-03-07
JP4039639B2 (en) 2008-01-30

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