WO1996008749A3 - Method of producing a three-dimensional component or group of components - Google Patents
Method of producing a three-dimensional component or group of components Download PDFInfo
- Publication number
- WO1996008749A3 WO1996008749A3 PCT/DE1995/001151 DE9501151W WO9608749A3 WO 1996008749 A3 WO1996008749 A3 WO 1996008749A3 DE 9501151 W DE9501151 W DE 9501151W WO 9608749 A3 WO9608749 A3 WO 9608749A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- features
- layers
- galvanic
- dimensional
- production
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 5
- 238000004519 manufacturing process Methods 0.000 abstract 3
- 239000002184 metal Substances 0.000 abstract 3
- 229920002120 photoresistant polymer Polymers 0.000 abstract 3
- 238000001357 Galvanic etching Methods 0.000 abstract 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 230000010354 integration Effects 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/10—Inductors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
- F15C—FLUID-CIRCUIT ELEMENTS PREDOMINANTLY USED FOR COMPUTING OR CONTROL PURPOSES
- F15C5/00—Manufacture of fluid circuit elements; Manufacture of assemblages of such elements integrated circuits
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0086—Printed inductances on semiconductor substrate
Abstract
The invention concerns a method of producing a three-dimensional component or group of components, particularly on surfaces of already processed semiconductor chips. The production of three-dimensional features on chip surfaces is based on the stucturing of thick photosensitive resists and subsequent formation of the surface features by galvanic etching. Prior art methods merely use a thick photoresist and interposed galvanic starting layers to form three-dimensional features. The production of complex features is only possible with considerable difficulty owing to the low stability of the photoresist. The method proposed for the production of three-dimensional features uses, in addition to the galvanic etching of e.g. UV-structured photoresist layers with build-on metal films (16), etching using metal auxiliary films which are later removed again (sacrificial layers) (13). These metal auxiliary films lying in the resist layers are also used, in multi-layer features, as galvanic starting layers for additional build-on levels. The three-dimensional features which can be made by the method described enable, for example, e.g. coils and transformers to be manufactured, in a form in which they could not be manufactured previously, for integration on chip surfaces.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DEP4432725.0 | 1994-09-14 | ||
DE19944432725 DE4432725C1 (en) | 1994-09-14 | 1994-09-14 | Forming three-dimensional components on surface of semiconductor chips etc. |
Publications (2)
Publication Number | Publication Date |
---|---|
WO1996008749A2 WO1996008749A2 (en) | 1996-03-21 |
WO1996008749A3 true WO1996008749A3 (en) | 1996-07-25 |
Family
ID=6528199
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE1995/001151 WO1996008749A2 (en) | 1994-09-14 | 1995-08-23 | Method of producing a three-dimensional component or group of components |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE4432725C1 (en) |
WO (1) | WO1996008749A2 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19523915A1 (en) * | 1995-06-30 | 1997-01-02 | Bosch Gmbh Robert | Microvalve and method for manufacturing a microvalve |
WO2000062314A1 (en) * | 1999-04-14 | 2000-10-19 | Takashi Nishi | Microsolenoid coil and its manufacturing method |
US6625372B1 (en) * | 1999-11-15 | 2003-09-23 | Axsun Technologies, Inc. | Mounting and alignment structures for optical components |
DE19955975A1 (en) | 1999-11-19 | 2001-05-23 | Inst Mikrotechnik Mainz Gmbh | Lithographic process for the production of micro components |
US6763575B2 (en) * | 2001-06-11 | 2004-07-20 | Oak-Mitsui Inc. | Printed circuit boards having integrated inductor cores |
US6852454B2 (en) * | 2002-06-18 | 2005-02-08 | Freescale Semiconductor, Inc. | Multi-tiered lithographic template and method of formation and use |
DE10302771B4 (en) * | 2003-01-24 | 2006-07-27 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | System and method for manufacturing microcomponents |
US6977223B2 (en) * | 2003-03-07 | 2005-12-20 | Massachusetts Institute Of Technology | Three dimensional microfabrication |
DE102006058068B4 (en) | 2006-12-07 | 2018-04-05 | Infineon Technologies Ag | Semiconductor component with semiconductor chip and passive coil component and method for its production |
JP6302613B1 (en) * | 2017-03-01 | 2018-03-28 | ナノコイル株式会社 | Manufacturing method of nano coil type GSR sensor element |
AU2018273352B2 (en) | 2017-05-22 | 2023-07-27 | Howmedica Osteonics Corp. | Device for in-situ fabrication process monitoring and feedback control of an electron beam additive manufacturing process |
US11117195B2 (en) | 2018-07-19 | 2021-09-14 | The University Of Liverpool | System and process for in-process electron beam profile and location analyses |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5190637A (en) * | 1992-04-24 | 1993-03-02 | Wisconsin Alumni Research Foundation | Formation of microstructures by multiple level deep X-ray lithography with sacrificial metal layers |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5258097A (en) * | 1992-11-12 | 1993-11-02 | Ford Motor Company | Dry-release method for sacrificial layer microstructure fabrication |
-
1994
- 1994-09-14 DE DE19944432725 patent/DE4432725C1/en not_active Expired - Fee Related
-
1995
- 1995-08-23 WO PCT/DE1995/001151 patent/WO1996008749A2/en active Application Filing
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5190637A (en) * | 1992-04-24 | 1993-03-02 | Wisconsin Alumni Research Foundation | Formation of microstructures by multiple level deep X-ray lithography with sacrificial metal layers |
Non-Patent Citations (1)
Title |
---|
JURISCH R: "IDENTIFIKATION: KONTAKTLOS VIA HOCHFREQUENZ", ELEKTRONIK, vol. 42, no. 9, 4 May 1993 (1993-05-04), pages 86 - 90, 92, XP000362956 * |
Also Published As
Publication number | Publication date |
---|---|
DE4432725C1 (en) | 1996-01-11 |
WO1996008749A2 (en) | 1996-03-21 |
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