WO1996011495A1 - Wafer heating chuck with dual zone backplane heating and segmented clamping member - Google Patents
Wafer heating chuck with dual zone backplane heating and segmented clamping member Download PDFInfo
- Publication number
- WO1996011495A1 WO1996011495A1 PCT/US1994/013615 US9413615W WO9611495A1 WO 1996011495 A1 WO1996011495 A1 WO 1996011495A1 US 9413615 W US9413615 W US 9413615W WO 9611495 A1 WO9611495 A1 WO 9611495A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- backplane
- heater
- wafer
- clamping
- annular
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960702981A KR100312670B1 (en) | 1994-10-07 | 1994-11-29 | Wafer heating chuck with double zone backplane heating and individual fixed members |
JP51255096A JP3485326B2 (en) | 1994-10-07 | 1994-11-29 | Wafer heating chuck with dual zone backplane heating and segmented clamping members |
AU12948/95A AU1294895A (en) | 1994-10-07 | 1994-11-29 | Wafer heating chuck with dual zone backplane heating and segmented clamping member |
EP95904144A EP0733267B1 (en) | 1994-10-07 | 1994-11-29 | Wafer heating chuck with dual zone backplane heating and segmented clamping member |
DE69428603T DE69428603T2 (en) | 1994-10-07 | 1994-11-29 | HEATING SUBSTRATE HOLDER FOR A SEMICONDUCTOR DISC WITH TWO-ZONE REAR WALL HEATING AND SEGMENTED CLAMPING ELEMENT |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/319,884 | 1994-10-07 | ||
US08/319,884 US5595241A (en) | 1994-10-07 | 1994-10-07 | Wafer heating chuck with dual zone backplane heating and segmented clamping member |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1996011495A1 true WO1996011495A1 (en) | 1996-04-18 |
Family
ID=23244014
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1994/013615 WO1996011495A1 (en) | 1994-10-07 | 1994-11-29 | Wafer heating chuck with dual zone backplane heating and segmented clamping member |
Country Status (9)
Country | Link |
---|---|
US (1) | US5595241A (en) |
EP (1) | EP0733267B1 (en) |
JP (1) | JP3485326B2 (en) |
KR (1) | KR100312670B1 (en) |
AU (1) | AU1294895A (en) |
CA (1) | CA2176362A1 (en) |
DE (1) | DE69428603T2 (en) |
TW (1) | TW280939B (en) |
WO (1) | WO1996011495A1 (en) |
Cited By (4)
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---|---|---|---|---|
WO1998005060A1 (en) * | 1996-07-31 | 1998-02-05 | The Board Of Trustees Of The Leland Stanford Junior University | Multizone bake/chill thermal cycling module |
DE19822000A1 (en) * | 1998-05-15 | 1999-11-25 | Siemens Ag | Holder for testing IC wafer |
KR100748372B1 (en) * | 1999-08-03 | 2007-08-10 | 어플라이드 머티어리얼스, 인코포레이티드 | A method and apparatus for thermal control of a semiconductor substrate |
WO2015126819A1 (en) * | 2014-02-21 | 2015-08-27 | Varian Semiconductor Equipment Associates, Inc. | Platen support structure |
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US5562947A (en) * | 1994-11-09 | 1996-10-08 | Sony Corporation | Method and apparatus for isolating a susceptor heating element from a chemical vapor deposition environment |
US5679404A (en) * | 1995-06-07 | 1997-10-21 | Saint-Gobain/Norton Industrial Ceramics Corporation | Method for depositing a substance with temperature control |
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US5844205A (en) * | 1996-04-19 | 1998-12-01 | Applied Komatsu Technology, Inc. | Heated substrate support structure |
US5892203A (en) * | 1996-05-29 | 1999-04-06 | International Business Machines Corporation | Apparatus for making laminated integrated circuit devices |
US5811762A (en) * | 1996-09-25 | 1998-09-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Heater assembly with dual temperature control for use in PVD/CVD system |
JPH10135315A (en) * | 1996-10-29 | 1998-05-22 | Tokyo Electron Ltd | Sample holder temp. controller and testing apparatus |
US6035101A (en) * | 1997-02-12 | 2000-03-07 | Applied Materials, Inc. | High temperature multi-layered alloy heater assembly and related methods |
US6529362B2 (en) | 1997-03-06 | 2003-03-04 | Applied Materials Inc. | Monocrystalline ceramic electrostatic chuck |
US6762396B2 (en) | 1997-05-06 | 2004-07-13 | Thermoceramix, Llc | Deposited resistive coatings |
US6082297A (en) * | 1997-09-12 | 2000-07-04 | Novellus Sytems, Inc. | Encapsulated thermofoil heater apparatus and associated methods |
US5991312A (en) * | 1997-11-03 | 1999-11-23 | Carrier Access Corporation | Telecommunications multiplexer |
US6183562B1 (en) * | 1997-12-23 | 2001-02-06 | Sony Corporation Of Japan | Thermal protection system for a chemical vapor deposition machine |
US6018616A (en) * | 1998-02-23 | 2000-01-25 | Applied Materials, Inc. | Thermal cycling module and process using radiant heat |
US6072163A (en) * | 1998-03-05 | 2000-06-06 | Fsi International Inc. | Combination bake/chill apparatus incorporating low thermal mass, thermally conductive bakeplate |
US6147334A (en) * | 1998-06-30 | 2000-11-14 | Marchi Associates, Inc. | Laminated paddle heater and brazing process |
US6108491A (en) * | 1998-10-30 | 2000-08-22 | Applied Materials, Inc. | Dual surface reflector |
JP4317608B2 (en) * | 1999-01-18 | 2009-08-19 | 東京エレクトロン株式会社 | Deposition equipment |
US6583638B2 (en) * | 1999-01-26 | 2003-06-24 | Trio-Tech International | Temperature-controlled semiconductor wafer chuck system |
JP2000243542A (en) * | 1999-02-24 | 2000-09-08 | Nhk Spring Co Ltd | Heater unit and manufacture thereof |
JP2000277237A (en) * | 1999-03-24 | 2000-10-06 | Komatsu Ltd | Base board temperature control plate and controlling device fitted with the same |
US6373679B1 (en) | 1999-07-02 | 2002-04-16 | Cypress Semiconductor Corp. | Electrostatic or mechanical chuck assembly conferring improved temperature uniformity onto workpieces held thereby, workpiece processing technology and/or apparatus containing the same, and method(s) for holding and/or processing a workpiece with the same |
JP4209057B2 (en) | 1999-12-01 | 2009-01-14 | 東京エレクトロン株式会社 | Ceramic heater, substrate processing apparatus and substrate processing method using the same |
US6328807B1 (en) * | 1999-12-14 | 2001-12-11 | Corning Incorporated | Chuck heater for improved planar deposition process |
US6472643B1 (en) | 2000-03-07 | 2002-10-29 | Silicon Valley Group, Inc. | Substrate thermal management system |
US6414276B1 (en) * | 2000-03-07 | 2002-07-02 | Silicon Valley Group, Inc. | Method for substrate thermal management |
US6476362B1 (en) | 2000-09-12 | 2002-11-05 | Applied Materials, Inc. | Lamp array for thermal processing chamber |
CN100493267C (en) | 2000-11-29 | 2009-05-27 | 萨莫希雷梅克斯公司 | Resistive heaters and uses thereof |
DE10127223A1 (en) * | 2001-05-22 | 2003-01-23 | Ego Elektro Geraetebau Gmbh | Heating device for filter elements of a particle filter and particle filter |
US6529686B2 (en) * | 2001-06-06 | 2003-03-04 | Fsi International, Inc. | Heating member for combination heating and chilling apparatus, and methods |
US6897411B2 (en) * | 2002-02-11 | 2005-05-24 | Applied Materials, Inc. | Heated substrate support |
DE10216786C5 (en) * | 2002-04-15 | 2009-10-15 | Ers Electronic Gmbh | Method and apparatus for conditioning semiconductor wafers and / or hybrids |
JP2004055722A (en) * | 2002-07-18 | 2004-02-19 | Renesas Technology Corp | Cleaning equipment, cleaning method of substrate and method for manufacturing semiconductor device |
US6918965B2 (en) * | 2002-08-28 | 2005-07-19 | Micron Technology, Inc. | Single substrate annealing of magnetoresistive structure |
US20040226513A1 (en) * | 2003-05-12 | 2004-11-18 | Applied Materials, Inc. | Chamber for uniform heating of large area substrates |
US20040244949A1 (en) * | 2003-05-30 | 2004-12-09 | Tokyo Electron Limited | Temperature controlled shield ring |
US6991003B2 (en) * | 2003-07-28 | 2006-01-31 | M.Braun, Inc. | System and method for automatically purifying solvents |
EP1738251A2 (en) * | 2004-04-16 | 2007-01-03 | Cascade Basic Research Corp. | Modelling relationships within an on-line connectivity universe |
US20060130764A1 (en) * | 2004-12-16 | 2006-06-22 | Jusung Engineering Co., Ltd. | Susceptor for apparatus fabricating thin film |
US7429718B2 (en) * | 2005-08-02 | 2008-09-30 | Applied Materials, Inc. | Heating and cooling of substrate support |
US7652227B2 (en) * | 2006-05-18 | 2010-01-26 | Applied Materials, Inc. | Heating and cooling plate for a vacuum chamber |
JP5272485B2 (en) * | 2008-04-08 | 2013-08-28 | 住友電気工業株式会社 | Substrate support member |
US20090272728A1 (en) * | 2008-05-01 | 2009-11-05 | Thermoceramix Inc. | Cooking appliances using heater coatings |
KR101691044B1 (en) * | 2009-02-04 | 2016-12-29 | 맷슨 테크놀로지, 인크. | Electrostatic chuck system and process for radially tuning the temperature profile across the surface of a substrate |
TWM392431U (en) * | 2010-02-04 | 2010-11-11 | Epistar Corp | Systems for epitaxial growth |
NL2006913A (en) * | 2010-07-16 | 2012-01-17 | Asml Netherlands Bv | Lithographic apparatus and method. |
US20130008602A1 (en) * | 2011-07-07 | 2013-01-10 | Lam Research Ag | Apparatus for treating a wafer-shaped article |
JP6106659B2 (en) * | 2012-03-07 | 2017-04-05 | 日本特殊陶業株式会社 | Conveying device and ceramic member |
US20140151360A1 (en) * | 2012-11-30 | 2014-06-05 | Wd Media, Inc. | Heater assembly for disk processing system |
JP6080571B2 (en) * | 2013-01-31 | 2017-02-15 | 東京エレクトロン株式会社 | Mounting table and plasma processing apparatus |
CN105408993A (en) | 2013-08-06 | 2016-03-16 | 应用材料公司 | Locally heated multi-zone substrate support |
JP2016063033A (en) * | 2014-09-17 | 2016-04-25 | 株式会社日立国際電気 | Substrate processing device, method of manufacturing semiconductor device, and recording medium |
US10008399B2 (en) | 2015-05-19 | 2018-06-26 | Applied Materials, Inc. | Electrostatic puck assembly with metal bonded backing plate for high temperature processes |
US10249526B2 (en) * | 2016-03-04 | 2019-04-02 | Applied Materials, Inc. | Substrate support assembly for high temperature processes |
US11011355B2 (en) * | 2017-05-12 | 2021-05-18 | Lam Research Corporation | Temperature-tuned substrate support for substrate processing systems |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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EP0452779A2 (en) * | 1990-04-20 | 1991-10-23 | Applied Materials, Inc. | Physical vapor deposition clamping mechanism |
US5267607A (en) * | 1991-05-28 | 1993-12-07 | Tokyo Electron Limited | Substrate processing apparatus |
US5294778A (en) * | 1991-09-11 | 1994-03-15 | Lam Research Corporation | CVD platen heater system utilizing concentric electric heating elements |
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-
1994
- 1994-10-07 US US08/319,884 patent/US5595241A/en not_active Expired - Lifetime
- 1994-11-29 CA CA002176362A patent/CA2176362A1/en not_active Abandoned
- 1994-11-29 WO PCT/US1994/013615 patent/WO1996011495A1/en active IP Right Grant
- 1994-11-29 JP JP51255096A patent/JP3485326B2/en not_active Expired - Lifetime
- 1994-11-29 AU AU12948/95A patent/AU1294895A/en not_active Abandoned
- 1994-11-29 KR KR1019960702981A patent/KR100312670B1/en not_active IP Right Cessation
- 1994-11-29 EP EP95904144A patent/EP0733267B1/en not_active Expired - Lifetime
- 1994-11-29 DE DE69428603T patent/DE69428603T2/en not_active Expired - Lifetime
-
1995
- 1995-01-11 TW TW084100221A patent/TW280939B/en not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0452779A2 (en) * | 1990-04-20 | 1991-10-23 | Applied Materials, Inc. | Physical vapor deposition clamping mechanism |
US5267607A (en) * | 1991-05-28 | 1993-12-07 | Tokyo Electron Limited | Substrate processing apparatus |
US5294778A (en) * | 1991-09-11 | 1994-03-15 | Lam Research Corporation | CVD platen heater system utilizing concentric electric heating elements |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998005060A1 (en) * | 1996-07-31 | 1998-02-05 | The Board Of Trustees Of The Leland Stanford Junior University | Multizone bake/chill thermal cycling module |
DE19822000A1 (en) * | 1998-05-15 | 1999-11-25 | Siemens Ag | Holder for testing IC wafer |
DE19822000C2 (en) * | 1998-05-15 | 2002-04-18 | Infineon Technologies Ag | Test methods for integrated circuits on a wafer |
KR100748372B1 (en) * | 1999-08-03 | 2007-08-10 | 어플라이드 머티어리얼스, 인코포레이티드 | A method and apparatus for thermal control of a semiconductor substrate |
WO2015126819A1 (en) * | 2014-02-21 | 2015-08-27 | Varian Semiconductor Equipment Associates, Inc. | Platen support structure |
US10032601B2 (en) | 2014-02-21 | 2018-07-24 | Varian Semiconductor Equipment Associates, Inc. | Platen support structure |
Also Published As
Publication number | Publication date |
---|---|
CA2176362A1 (en) | 1996-04-18 |
DE69428603D1 (en) | 2001-11-15 |
EP0733267A1 (en) | 1996-09-25 |
JP3485326B2 (en) | 2004-01-13 |
EP0733267B1 (en) | 2001-10-10 |
TW280939B (en) | 1996-07-11 |
DE69428603T2 (en) | 2002-07-11 |
US5595241A (en) | 1997-01-21 |
JPH09506480A (en) | 1997-06-24 |
KR100312670B1 (en) | 2002-04-06 |
AU1294895A (en) | 1996-05-02 |
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