WO1996019911A3 - Process for preparing an insulated multilayer structure - Google Patents
Process for preparing an insulated multilayer structure Download PDFInfo
- Publication number
- WO1996019911A3 WO1996019911A3 PCT/US1995/016366 US9516366W WO9619911A3 WO 1996019911 A3 WO1996019911 A3 WO 1996019911A3 US 9516366 W US9516366 W US 9516366W WO 9619911 A3 WO9619911 A3 WO 9619911A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- preparing
- peak temperature
- multilayer structure
- contacted
- oxygen
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C8/02—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/0072—Heat treatment
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/52—Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/89—Coating or impregnation for obtaining at least two superposed coatings having different compositions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4867—Applying pastes or inks, e.g. screen printing
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N1/00—Electrostatic generators or motors using a solid moving electrostatic charge carrier
- H02N1/002—Electrostatic motors
- H02N1/004—Electrostatic motors in which a body is moved along a path due to interaction with an electric field travelling along the path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K3/00—Details of windings
- H02K3/04—Windings characterised by the conductor shape, form or construction, e.g. with bar conductors
- H02K3/26—Windings characterised by the conductor shape, form or construction, e.g. with bar conductors consisting of printed conductors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP95944334A EP0871565A4 (en) | 1994-12-16 | 1995-12-14 | Process for preparing an insulated multilayer structure |
AU46407/96A AU4640796A (en) | 1994-12-16 | 1995-12-14 | Process for preparing an insulated multilayer structure |
JP51990996A JPH10510954A (en) | 1994-12-16 | 1995-12-14 | Method for preparing an insulated multilayer structure |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/358,203 US5716713A (en) | 1994-12-16 | 1994-12-16 | Stacked planar transformer |
US08/358,203 | 1994-12-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO1996019911A2 WO1996019911A2 (en) | 1996-06-27 |
WO1996019911A3 true WO1996019911A3 (en) | 1996-08-29 |
Family
ID=23408689
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1995/016366 WO1996019911A2 (en) | 1994-12-16 | 1995-12-14 | Process for preparing an insulated multilayer structure |
Country Status (6)
Country | Link |
---|---|
US (1) | US5716713A (en) |
EP (1) | EP0871565A4 (en) |
JP (1) | JPH10510954A (en) |
AU (1) | AU4640796A (en) |
CA (1) | CA2207305A1 (en) |
WO (1) | WO1996019911A2 (en) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6911887B1 (en) * | 1994-09-12 | 2005-06-28 | Matsushita Electric Industrial Co., Ltd. | Inductor and method for producing the same |
US6033764A (en) * | 1994-12-16 | 2000-03-07 | Zecal Corp. | Bumped substrate assembly |
US6099974A (en) * | 1997-07-16 | 2000-08-08 | Thermal Spray Technologies, Inc. | Coating that enables soldering to non-solderable surfaces |
US6164522A (en) * | 1998-06-29 | 2000-12-26 | Delphi Technologies, Inc. | Method of manufacturing a thick film circuit with constrained adhesive spreading |
US6054914A (en) * | 1998-07-06 | 2000-04-25 | Midcom, Inc. | Multi-layer transformer having electrical connection in a magnetic core |
US6198374B1 (en) | 1999-04-01 | 2001-03-06 | Midcom, Inc. | Multi-layer transformer apparatus and method |
US7152291B2 (en) | 2002-04-15 | 2006-12-26 | Avx Corporation | Method for forming plated terminations |
US7167074B2 (en) * | 2005-01-12 | 2007-01-23 | Medtronic, Inc. | Integrated planar flyback transformer |
US8159825B1 (en) | 2006-08-25 | 2012-04-17 | Hypres Inc. | Method for fabrication of electrical contacts to superconducting circuits |
US8093983B2 (en) * | 2006-08-28 | 2012-01-10 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Narrowbody coil isolator |
US8385043B2 (en) * | 2006-08-28 | 2013-02-26 | Avago Technologies ECBU IP (Singapoare) Pte. Ltd. | Galvanic isolator |
US7948067B2 (en) * | 2009-06-30 | 2011-05-24 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Coil transducer isolator packages |
US20080278275A1 (en) * | 2007-05-10 | 2008-11-13 | Fouquet Julie E | Miniature Transformers Adapted for use in Galvanic Isolators and the Like |
US7791900B2 (en) * | 2006-08-28 | 2010-09-07 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Galvanic isolator |
US8427844B2 (en) * | 2006-08-28 | 2013-04-23 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Widebody coil isolators |
US7852186B2 (en) * | 2006-08-28 | 2010-12-14 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Coil transducer with reduced arcing and improved high voltage breakdown performance characteristics |
US8061017B2 (en) * | 2006-08-28 | 2011-11-22 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Methods of making coil transducers |
US9019057B2 (en) * | 2006-08-28 | 2015-04-28 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Galvanic isolators and coil transducers |
US9105391B2 (en) * | 2006-08-28 | 2015-08-11 | Avago Technologies General Ip (Singapore) Pte. Ltd. | High voltage hold-off coil transducer |
JP4900019B2 (en) * | 2007-04-19 | 2012-03-21 | 富士電機株式会社 | Insulation transformer and power converter |
US8069559B2 (en) * | 2007-08-24 | 2011-12-06 | World Properties, Inc. | Method of assembling an insulated metal substrate |
US8258911B2 (en) | 2008-03-31 | 2012-09-04 | Avago Technologies ECBU IP (Singapor) Pte. Ltd. | Compact power transformer components, devices, systems and methods |
JP5798034B2 (en) * | 2008-09-21 | 2015-10-21 | ウェイン・ステイト・ユニバーシティ | Genus-WideChlamydial Peptide Vaccine Antigen |
KR101673727B1 (en) * | 2010-03-05 | 2016-11-07 | 가부시키가이샤 무라타 세이사쿠쇼 | Ceramic electronic component and method for producing ceramic electronic component |
EP2936513B1 (en) * | 2012-12-19 | 2017-02-15 | Telefonaktiebolaget LM Ericsson (publ) | Planar transformer |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5058799A (en) * | 1986-07-24 | 1991-10-22 | Zsamboky Kalman F | Metallized ceramic substrate and method therefor |
US5100714A (en) * | 1986-07-24 | 1992-03-31 | Ceramic Packaging, Inc. | Metallized ceramic substrate and method therefor |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59995A (en) * | 1982-06-16 | 1984-01-06 | 富士通株式会社 | Method of producing copper conductor multilayer structure |
US4732780A (en) * | 1985-09-26 | 1988-03-22 | General Electric Company | Method of making hermetic feedthrough in ceramic substrate |
US4795512A (en) * | 1986-02-26 | 1989-01-03 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing a multilayer ceramic body |
JPS63128791A (en) * | 1986-11-12 | 1988-06-01 | インタ−ナショナル・ビジネス・マシ−ンズ・コ−ポレ−ション | Manufacture of high density multilayer glass-ceramic structure with metal conductor |
US4861646A (en) * | 1987-08-13 | 1989-08-29 | Ceramics Process Systems Corp. | Co-fired metal-ceramic package |
JPH0728128B2 (en) * | 1988-03-11 | 1995-03-29 | 松下電器産業株式会社 | Ceramic multilayer wiring board and manufacturing method thereof |
JPH0258396A (en) * | 1988-08-24 | 1990-02-27 | Matsushita Electric Ind Co Ltd | Manufacture of thick film multilayer substrate |
FR2643364B1 (en) * | 1989-02-22 | 1993-08-13 | Air Liquide | PROCESS FOR PREPARING CERAMIC-METAL MULTILAYER COMPONENTS AND APPARATUS FOR IMPLEMENTING SAME |
JPH07502B2 (en) * | 1989-03-01 | 1995-01-11 | 同和鉱業株式会社 | Metallization method for non-oxide ceramics |
JPH0377360A (en) * | 1989-08-18 | 1991-04-02 | Mitsubishi Electric Corp | Semiconductor device |
US5010314A (en) * | 1990-03-30 | 1991-04-23 | Multisource Technology Corp. | Low-profile planar transformer for use in off-line switching power supplies |
-
1994
- 1994-12-16 US US08/358,203 patent/US5716713A/en not_active Expired - Fee Related
-
1995
- 1995-12-14 CA CA 2207305 patent/CA2207305A1/en not_active Abandoned
- 1995-12-14 JP JP51990996A patent/JPH10510954A/en active Pending
- 1995-12-14 EP EP95944334A patent/EP0871565A4/en not_active Withdrawn
- 1995-12-14 WO PCT/US1995/016366 patent/WO1996019911A2/en not_active Application Discontinuation
- 1995-12-14 AU AU46407/96A patent/AU4640796A/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5058799A (en) * | 1986-07-24 | 1991-10-22 | Zsamboky Kalman F | Metallized ceramic substrate and method therefor |
US5100714A (en) * | 1986-07-24 | 1992-03-31 | Ceramic Packaging, Inc. | Metallized ceramic substrate and method therefor |
Also Published As
Publication number | Publication date |
---|---|
US5716713A (en) | 1998-02-10 |
EP0871565A4 (en) | 1999-06-02 |
CA2207305A1 (en) | 1996-06-27 |
JPH10510954A (en) | 1998-10-20 |
WO1996019911A2 (en) | 1996-06-27 |
AU4640796A (en) | 1996-07-10 |
EP0871565A2 (en) | 1998-10-21 |
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