WO1996022881A1 - Electrical feedthroughs for ceramic circuit board support substrates - Google Patents

Electrical feedthroughs for ceramic circuit board support substrates Download PDF

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Publication number
WO1996022881A1
WO1996022881A1 PCT/US1996/000316 US9600316W WO9622881A1 WO 1996022881 A1 WO1996022881 A1 WO 1996022881A1 US 9600316 W US9600316 W US 9600316W WO 9622881 A1 WO9622881 A1 WO 9622881A1
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WO
WIPO (PCT)
Prior art keywords
weight
glass
substrate
oxide
copper
Prior art date
Application number
PCT/US1996/000316
Other languages
French (fr)
Inventor
Thomas Peter Azzaro
Barry Jay Thaler
Edward James Conlon
Ananda Hosakere Kumar
Original Assignee
Sarnoff Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sarnoff Corporation filed Critical Sarnoff Corporation
Priority to DE69628548T priority Critical patent/DE69628548T2/en
Priority to CA002211542A priority patent/CA2211542C/en
Priority to KR1019970705050A priority patent/KR100295695B1/en
Priority to EP96903415A priority patent/EP0812258B1/en
Priority to JP52288196A priority patent/JP3267299B2/en
Publication of WO1996022881A1 publication Critical patent/WO1996022881A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
    • C03C3/085—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/097—Glass compositions containing silica with 40% to 90% silica, by weight containing phosphorus, niobium or tantalum
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/04—Frit compositions, i.e. in a powdered or comminuted form containing zinc
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/08—Frit compositions, i.e. in a powdered or comminuted form containing phosphorus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5384—Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09581—Applying an insulating coating on the walls of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1147—Sealing or impregnating, e.g. of pores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1438—Treating holes after another process, e.g. coating holes after coating the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1056—Perforating lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

Definitions

  • This invention relates to a method of making electrical feedthroughs in thermally conductive support substrates used to impart mechanical strength to ceramic multilayer printed circuit boards. More particularly, this invention relates to a method of making electrical feedthroughs in ceramic multilayer printed circuit board support substrates that is compatible with mass production techniques.
  • Ceramic multilayer printed circuit boards have been used for many years for circuits for electrical apparatus, such as mainframe computers. Such printed circuit boards are made by casting glass and/or ceramic powders together with an organic binder into tapes, called green tapes. A metal circuit can be patterned onto the green tape by screen printing for example. Vias are formed in each green tape layer that are filled with a conductive material to connect the circuits of the various layers electrically. The green tape layers are then aligned and stacked, pressed together, and fired to burn off organic residues and sinter the glass, thereby forming a fired ceramic multilayer circuit board.
  • low firing temperature glasses have been deposited on support substrates made of metal or ceramic to which the glasses will adhere.
  • the support substrate can be of a thermally conductive material such as nickel, kovar, a ferrous nickel/ cobalt manganese alloy, Invar®, a ferronickel alloy, low carbon steel, or Cu/kovar/Cu, Cu/Mo/Cu or Cu/Invar®/Cu composites and the like, as well as thermally conductive ceramics such as aluminum nitride, silicon carbide, diamond and the like. These substrates impart added strength to the composite.
  • a bonding glass such as described in US Patent 5,277,724 to
  • the bonding glass can reduce shrinkage of the green tape with respect to the metal substrate in at least the two lateral dimensions. Thus all of the shrinkage occurs in the thickness dimension only. This in turn reduces problems of alignment of the circuit patterns in the ceramic layers and the via holes in the metal substrate after firing.
  • the present process for forming electrical feedthroughs in support substrates for double sided printed circuit board substrates comprises providing dielectric insulation in the feedthroughs.
  • a via hole is opened in the support substrate core material, as by drilling, the substrate via hole is plated with nickel, one or more dielectric materials such as glass is deposited in the via hole.
  • a conductive metal is deposited to fill the via hole inside the dielectric ring.
  • the dielectric material and the center conductive metal must be able to withstand several firings at temperatures up to at least 900°C without melting or flowing.
  • Fig. 1 is a flow chart of the preferred process for filling via holes in a printed circuit board support substrate in accordance with the process of the invention.
  • Fig. 2 is a thermal coefficient of expansion plot of a glass suitable for use as a dielectric in the present process.
  • Fig. 3 is a differential thermal analysis (DTA) plot of a glass suitable for use as a dielectric in the present process.
  • DTA differential thermal analysis
  • Figs. 4A and 4B illustrate the steps of forming a glass dielectric layer in a via hole.
  • Fig. 5 is a cross sectional partial view of a printed circuit board support substrate having a filled via hole filled in accordance with the method of the invention.
  • the preferred support substrate for use herein is a Cu/Mo/Cu metal composite substrate commercially available from the Climax Metals
  • via openings can be formed in the support substrate using a laser or mechanical drilling equipment that can drill small diameter holes, e.g., about 13-40 mils in diameter or less.
  • the mechanically drilled openings are then deburred, as by rubbing the edges with a soft stone, whereby via openings having sharp corners are eliminated.
  • the thicker the substrate material the more difficulty may be encountered in drilling the openings.
  • Thirteen mil diameter holes can also be readily drilled using a NdrYAG laser at 15-30 watts with 0.6 msec pulse lengths.
  • a minimum hole diameter of 7 mils for a 20 mil thick support substrate can be made readily. If the thickness of the support substrate is higher, the minimum hole diameter that can be made may be larger; for example, for a 40 mil thick support substrate, the minimum hole diameter that can be readily made is 8 mils.
  • the drilled holes are next deburred and nickel plated. This step seals the core material of the support substrate and can be accomplished by conventional nickel electroplating methods.
  • the nickel is then oxidized, as by heating in air at temperatures about 820°C.
  • the nickel oxide layer which exhibits a resistance of 10 ⁇ - 10 ohms, constitutes the first ring of dielectric material in the via hole.
  • An insulating dielectric layer, as of a glass, is then deposited in the via hole to form an annular ring.
  • glass is a fragile material that can crack during multiple firings, it is preferred that two or more layers of glass be sequentially deposited in the openings so that if a defect, such as a pore, forms in one layer, it will not extend through the entire glass layer, to cause a shorted feedthrough.
  • One particular glass composition having the following composition in percent by weight is particularly useful with the above nickel plated Cu/Mo/Cu composite metal substrate; ZnO 28.68 gO 5.92
  • This glass can be used as the dielectric insulator for the substrate via holes.
  • the same glass can also be used later in the process as a constituent of the thick film conductor via fill ink required for filling the center of each via hole with conductive metal, as further described below.
  • Another suitable glass composition for use with the preferred metal substrate has the following composition in percent by weight:
  • a preferred method of applying the glass composition from a standard glazing ink constituting the above glass is to apply vacuum after the screen printing to deposit one or more of the above glass layers.
  • a glazing ink comprises the finely divided glass and an organic vehicle.
  • Suitable organic vehicles are solutions of resin binders, such as cellulose derivatives, synthetic resins such as polyacrylates, polymethacrylates, polyesters, polyolefins and the like, in a suitable solvent.
  • the solvent can be pine oil, terpineol, butyl carbitol acetate, 2,2,4-trimethyl-l,3-pentanediol monoisobutyrate and the like.
  • the vehicles generally contain from about 5 to 25 percent by weight of the resin binder.
  • the glasses of the invention comprise those glasses having a thermal coefficient of expansion near that of the support substrate material, will wet nickel oxide and can be fired at a temperature up to about 1000°C.
  • Suitable glasses of the invcention include a glass comprising zinc oxide, about 28.68% by weight, magnesium oxide, about 5.92% by weight, barium oxide, about 6.21% by weight, aluminum oxide, about 15.36% by weight, and silicon oxide, about 43.82% by weight and a glass comprising magnesium oxide, about 29% by weight; aluminum oxide, about 22% by weight, silicon oxide, about 45% by weight and up to about 4% by weight of phosphorus oxide, boron oxide and zirconium oxide.
  • Fig. 4A illustrates a printed glass layer 20 over a via hole 22 in a metal substrate 24.
  • a vacuum is applied after the printing, beneath the metal substrate 24 in the direction of the arrow 25, sufficient to bring the glass ink layer 20 into the via hole 22, thereby forming an annular ring of the glass ink inside the via hole 22.
  • This glass layer is then dried.
  • the deposition and vacuum pull can be repeated to form multiple glass dielectric layers in the via hole 22. If both sides of the metal substrate 24 are to be used, the above sequence of steps is repeated on the opposite side of the metal substrate 24.
  • the support substrate is then fired to sinter the glass powder and form a composite fired glass insulator layer in the opening.
  • a thick via fill ink containing a conductive metal powder is then applied to the metal substrate, also using conventional screen printing techniques.
  • a suitable conductor thick film ink comprises a mixture of silver or other conductive metal powder, glass, and an organic vehicle as described above in proportions so as to form a print screenable thick film paste.
  • Thick film conductor via fill inks are made by mixing a finely divided conductive metal powder, with a preselected glass powder and an organic vehicle. Suitable conductive powders include silver, gold, copper, their mixtures, and alloys thereof with palladium and platinum and the like, or nickel.
  • the fired thick film conductive metal ink can comprise from about 50-90% by weight of metal and about 10-50% by weight of a glass.
  • the thick film conductor via fill ink composition is applied to the prepared printed circuit board support substrate so as to fill the glass insulated via holes and is then fired to remove organic materials and to sinter the metal powder to obtain the conductive, insulated feedthroughs.
  • Fig. 5 is a cross sectional view of the metal substrate 24 having dielectric insulated electrical feedthroughs therein.
  • the via hole 22 in the metal substrate 24 has a first layer 22 of nickel oxide dielectric, two dielectric glass layers 26, 28 and a conductive via fill layer 30 therein. Sufficient conductive via fill ink is applied so that the remainder of the via hole 22 is completely filled at the end of the process.
  • the support substrate as prepared above having conductive vias in via openings that are dielectrically insulated from the rest of the substrate, can then be used to prepare double sided multilayer printed circuit boards from the substrates of the invention in conventional manner.
  • the above process can be used to make a reproducible support substrate having a plurality of electrical feedthroughs therein that will not form short circuits between circuitry on both sides of the substrate.
  • the support substrate having electrical feedthroughs as prepared above can withstand several firings at temperatures used in making ceramic multilayer printed circuit boards without undermining the structural and electrical integrity of the feedthroughs.

Abstract

Electrical feedthroughs in printed circuit board support substrates (24) for use in making double sided ceramic multilayer printed circuit boards are made by insulating the feedthrough openings with a first layer of nickel oxide (22) and one or more layers of glass (26, 28), and then filling the remainder of the feedthroughs with a conductive metal via fill ink (30). After firing, the resultant structure provides insulated electrical feedthroughs through the support substrate (24).

Description

ELECTRICAL FEEDTHROUGHS FOR CERAMIC CIRCUIT BOARD
SUPPORT SUBSTRATES
This invention was made with U.S. Government support under Contract No. DAAB07-94-C-C009 awarded by the U.S. Department of the
Army. The Government has certain rights in this invention.
This invention relates to a method of making electrical feedthroughs in thermally conductive support substrates used to impart mechanical strength to ceramic multilayer printed circuit boards. More particularly, this invention relates to a method of making electrical feedthroughs in ceramic multilayer printed circuit board support substrates that is compatible with mass production techniques.
Ceramic multilayer printed circuit boards have been used for many years for circuits for electrical apparatus, such as mainframe computers. Such printed circuit boards are made by casting glass and/or ceramic powders together with an organic binder into tapes, called green tapes. A metal circuit can be patterned onto the green tape by screen printing for example. Vias are formed in each green tape layer that are filled with a conductive material to connect the circuits of the various layers electrically. The green tape layers are then aligned and stacked, pressed together, and fired to burn off organic residues and sinter the glass, thereby forming a fired ceramic multilayer circuit board.
Originally ceramics such as alumina were used to form the green tape layers, but these ceramics require high firing temperatures, up to 1500°C. This necessitated the use of refractory conductive metals, such as tungsten or molybdenum, to form the conductive circuit patterns because such metals could withstand high firing temperatures without melting. More recently, lower temperature materials have been used, such as devitrifying glasses that can be fired at lower temperatures of 1000°C or less. Multilayer circuit boards made of these glass or glass-ceramic materials can be used with lower melting point and higher conductivity metals, such as silver, gold or copper. However, these printed circuit boards have the disadvantage that they are not as strong as alumina circuit boards. Thus still more recently, low firing temperature glasses have been deposited on support substrates made of metal or ceramic to which the glasses will adhere. The support substrate can be of a thermally conductive material such as nickel, kovar, a ferrous nickel/ cobalt manganese alloy, Invar®, a ferronickel alloy, low carbon steel, or Cu/kovar/Cu, Cu/Mo/Cu or Cu/Invar®/Cu composites and the like, as well as thermally conductive ceramics such as aluminum nitride, silicon carbide, diamond and the like. These substrates impart added strength to the composite. A bonding glass, such as described in US Patent 5,277,724 to
Prabhu, adheres the ceramic substrate formed from the green tape layers to the substrate. In addition, if chosen correctly, the bonding glass can reduce shrinkage of the green tape with respect to the metal substrate in at least the two lateral dimensions. Thus all of the shrinkage occurs in the thickness dimension only. This in turn reduces problems of alignment of the circuit patterns in the ceramic layers and the via holes in the metal substrate after firing.
However, when it is desired to produce glass/ceramic multilayer ceramic circuit boards on both sides of the support substrate, the presence of the thermally and electrically conductive metal or ceramic core material between two circuit boards can cause short circuits. Thus the multilayer circuits on one side of the support substrate have been connected to the multilayer circuits on the other side of the support substrate by means of circuit traces or lines that extend around the periphery of the circuit board rather than through the support substrate. However, such peripheral traces are subject to damage or breakage during handling and assembly of the circuit boards into a module, for example, and in some cases the traces would have to be too long for an acceptable design. Such designs also increase wiring lengths and decrease interconnection density. Thus an improved method of permitting electrical connection between two ceramic multilayer circuit boards on both sides of a support substrate would be highly desirable.
The present process for forming electrical feedthroughs in support substrates for double sided printed circuit board substrates comprises providing dielectric insulation in the feedthroughs. Typically a via hole is opened in the support substrate core material, as by drilling, the substrate via hole is plated with nickel, one or more dielectric materials such as glass is deposited in the via hole. Lastly a conductive metal is deposited to fill the via hole inside the dielectric ring. The dielectric material and the center conductive metal must be able to withstand several firings at temperatures up to at least 900°C without melting or flowing.
The teachings of the invention can be readily understood by considering the following detailed description in conjunction with the accompanying drawing, in which:
Fig. 1 is a flow chart of the preferred process for filling via holes in a printed circuit board support substrate in accordance with the process of the invention. Fig. 2 is a thermal coefficient of expansion plot of a glass suitable for use as a dielectric in the present process.
Fig. 3 is a differential thermal analysis (DTA) plot of a glass suitable for use as a dielectric in the present process.
Figs. 4A and 4B illustrate the steps of forming a glass dielectric layer in a via hole.
Fig. 5 is a cross sectional partial view of a printed circuit board support substrate having a filled via hole filled in accordance with the method of the invention.
The preferred support substrate for use herein is a Cu/Mo/Cu metal composite substrate commercially available from the Climax Metals
Company, although other materials can be substituted, as described hereinabove.
Referring to Fig. 1, which is a flow chart of a suitable process for making the electrical feedthroughs in a printed circuit board support substrate in accordance with the invention, in a first step of the present process, via openings can be formed in the support substrate using a laser or mechanical drilling equipment that can drill small diameter holes, e.g., about 13-40 mils in diameter or less. The mechanically drilled openings are then deburred, as by rubbing the edges with a soft stone, whereby via openings having sharp corners are eliminated. The thicker the substrate material, the more difficulty may be encountered in drilling the openings. Thirteen mil diameter holes can also be readily drilled using a NdrYAG laser at 15-30 watts with 0.6 msec pulse lengths. A minimum hole diameter of 7 mils for a 20 mil thick support substrate can be made readily. If the thickness of the support substrate is higher, the minimum hole diameter that can be made may be larger; for example, for a 40 mil thick support substrate, the minimum hole diameter that can be readily made is 8 mils.
The drilled holes are next deburred and nickel plated. This step seals the core material of the support substrate and can be accomplished by conventional nickel electroplating methods. The nickel is then oxidized, as by heating in air at temperatures about 820°C. The nickel oxide layer, which exhibits a resistance of 10^ - 10 ohms, constitutes the first ring of dielectric material in the via hole. An insulating dielectric layer, as of a glass, is then deposited in the via hole to form an annular ring. Since glass is a fragile material that can crack during multiple firings, it is preferred that two or more layers of glass be sequentially deposited in the openings so that if a defect, such as a pore, forms in one layer, it will not extend through the entire glass layer, to cause a shorted feedthrough.
The glasses suitable for use in the present invention, using Cu/Mo Cu metal composite substrates, must have a thermal coefficient of expansion matched to the Cu/Mo/Cu substrate; must have good adhesion to nickel oxide, must be able to wet nickel oxide; and must be able to be fired at temperatures required to form the desired ceramic multilayer circuit board.
One particular glass composition having the following composition in percent by weight is particularly useful with the above nickel plated Cu/Mo/Cu composite metal substrate; ZnO 28.68 gO 5.92
BaO 6.21
AI2O3 15.36
Siθ2 43.82 This glass has a thermal coefficient of expansion plot as shown in
Fig. 2 and a DTA plot as shown in Fig. 3. This glass can be used as the dielectric insulator for the substrate via holes. The same glass can also be used later in the process as a constituent of the thick film conductor via fill ink required for filling the center of each via hole with conductive metal, as further described below.
Another suitable glass composition for use with the preferred metal substrate has the following composition in percent by weight:
MgO 29.0
Al O3 22.0 Siθ2 45.0
P2O5 1.5
B2O3 1.0
Figure imgf000006_0001
A preferred method of applying the glass composition from a standard glazing ink constituting the above glass is to apply vacuum after the screen printing to deposit one or more of the above glass layers. Such a glazing ink comprises the finely divided glass and an organic vehicle. Suitable organic vehicles are solutions of resin binders, such as cellulose derivatives, synthetic resins such as polyacrylates, polymethacrylates, polyesters, polyolefins and the like, in a suitable solvent. The solvent can be pine oil, terpineol, butyl carbitol acetate, 2,2,4-trimethyl-l,3-pentanediol monoisobutyrate and the like. The vehicles generally contain from about 5 to 25 percent by weight of the resin binder.
Thus the glasses of the invention comprise those glasses having a thermal coefficient of expansion near that of the support substrate material, will wet nickel oxide and can be fired at a temperature up to about 1000°C. Suitable glasses of the invcention include a glass comprising zinc oxide, about 28.68% by weight, magnesium oxide, about 5.92% by weight, barium oxide, about 6.21% by weight, aluminum oxide, about 15.36% by weight, and silicon oxide, about 43.82% by weight and a glass comprising magnesium oxide, about 29% by weight; aluminum oxide, about 22% by weight, silicon oxide, about 45% by weight and up to about 4% by weight of phosphorus oxide, boron oxide and zirconium oxide.
Fig. 4A illustrates a printed glass layer 20 over a via hole 22 in a metal substrate 24.
A vacuum is applied after the printing, beneath the metal substrate 24 in the direction of the arrow 25, sufficient to bring the glass ink layer 20 into the via hole 22, thereby forming an annular ring of the glass ink inside the via hole 22. This glass layer is then dried. The deposition and vacuum pull can be repeated to form multiple glass dielectric layers in the via hole 22. If both sides of the metal substrate 24 are to be used, the above sequence of steps is repeated on the opposite side of the metal substrate 24.
The support substrate is then fired to sinter the glass powder and form a composite fired glass insulator layer in the opening.
A thick via fill ink containing a conductive metal powder is then applied to the metal substrate, also using conventional screen printing techniques. For example, a suitable conductor thick film ink comprises a mixture of silver or other conductive metal powder, glass, and an organic vehicle as described above in proportions so as to form a print screenable thick film paste.
Thick film conductor via fill inks are made by mixing a finely divided conductive metal powder, with a preselected glass powder and an organic vehicle. Suitable conductive powders include silver, gold, copper, their mixtures, and alloys thereof with palladium and platinum and the like, or nickel. The fired thick film conductive metal ink can comprise from about 50-90% by weight of metal and about 10-50% by weight of a glass.
The thick film conductor via fill ink composition is applied to the prepared printed circuit board support substrate so as to fill the glass insulated via holes and is then fired to remove organic materials and to sinter the metal powder to obtain the conductive, insulated feedthroughs.
Fig. 5 is a cross sectional view of the metal substrate 24 having dielectric insulated electrical feedthroughs therein. The via hole 22 in the metal substrate 24 has a first layer 22 of nickel oxide dielectric, two dielectric glass layers 26, 28 and a conductive via fill layer 30 therein. Sufficient conductive via fill ink is applied so that the remainder of the via hole 22 is completely filled at the end of the process.
The support substrate as prepared above, having conductive vias in via openings that are dielectrically insulated from the rest of the substrate, can then be used to prepare double sided multilayer printed circuit boards from the substrates of the invention in conventional manner.
The above process can be used to make a reproducible support substrate having a plurality of electrical feedthroughs therein that will not form short circuits between circuitry on both sides of the substrate. The support substrate having electrical feedthroughs as prepared above can withstand several firings at temperatures used in making ceramic multilayer printed circuit boards without undermining the structural and electrical integrity of the feedthroughs.
Although the present process and electrical feedthroughs have been described in terms of specific embodiments, one skilled in the art can readily substitute other materials and reaction conditions for the glass layers and conductors described hereinabove. Thus the scope of the present invention is only meant to be limited by the appended claims.

Claims

We Claim:
1. A fired printed circuit board support substrate having a conductive via that is dielectrically isolated from the support substrate by a glass dielectric layer in the via.
2. The substrate of claim 1 wherein the support substrate is a conductive metal selected from the group consisting of a ferronickel alloy, kovar, and composites of Cu/a ferronickel alloy/Cu, Cu/Mo/Cu and Cu/kovar/Cu.
3. The substrate of claim 2 wherein the glass dielectric layer is selected from the group consisting of a glass having a coefficient of expansion matched to the conductive metal substrate.
4. The substrate of claim 3 wherein the glass dielectric layer is selected from the group consisting of a glass comprising zinc oxide, about 28.68% by weight, magnesium oxide, about 5.92% by weight, barium oxide, about 6.21% by weight, aluminum oxide, about 15.36% by weight and silicon oxide, about 43.82% by weight and a glass comprising magnesium oxide, about 29% by weight, aluminum oxide, about 22% by weight, silicon oxide, about 45% by weight and up to about 5% by weight of oxides of phosphorus, boron and zirconium.
5. A fired printed circuit board support substrate having a via hole containing the following sequential layers: a first nickel oxide dielectric layer; one or more glass dielectric layers over the nickel oxide layer; and a conductive material comprising a mixture of conductive metal and of a glass that fills the via.
6. The substrate of claim 5 wherein the support substrate material comprises a nickel plated composite selected from the group consisting of copper/molybdenum/copper, copper/kovar/copper, copper/a ferronickel alloy/copper, Invar and Kovar.
7. The substrate of claim 5 wherein the conductive metal is selected from the group consisting of silver, copper and gold.
8. The substrate of claim 5 wherein the glass dielectric layer has a thermal coefficient of expansion near that of the support substrate material, will wet nickel oxide and can be fired at a temperature up to about 1000°C.
9. The substrate of claim 8 wherein the glass dielectric layer is selected from the group consisting of a glass comprising zinc oxide, about 28.68% by weight, magnesium oxide, about 5.92% by weight, barium oxide, about 6.21% by weight, aluminum oxide, about 15.36% by weight and silicon oxide, about 43.82% by weight and a glass comprising magnesium oxide, about 29% by weight, aluminum oxide, about 22% by weight, silicon oxide, about 45% by weight and up to about 5% by weight of oxides of phosphorus, boron and zirconium.
10. A process for making electrical feedthroughs in a printed circuit board support substrate for use in making double sided ceramic multilayer circuit boards comprising: a) forming via holes in the substrate; b) forming an electrically insulating layer in the via holes, c) applying a thick film conductor ink containing a metal powder and a glass in an organic vehicle to fill the via holes and d) firing the substrate to remove organic materials and to sinter the metal and glass powders in the via holes.
11. The process of claim 10 wherein the insulating layer has a thermal coefficient of expansion closely matched to the substrate.
12. The substrate of claim 11 wherein the insulating layer is selected from the group consisting of a glass comprising zinc oxide, about 28.68% by weight, magnesium oxide, about 5.92% by weight, barium oxide, about 6.21% by weight, aluminum oxide, about 15.36% by weight and silicon oxide, about 43.82% by weight and a glass comprising magnesium oxide, about 29% by weight, aluminum oxide, about 22% by weight, silicon oxide, about 45% by weight and up to about 5% by weight of oxides of phosphorus, boron and zirconium.
13. The process of claim 11 wherein the substrate is selected from the group consisting of Invar, Kovar, copper/Kovar/copper composite, A copper/ ferronickel alloy/copper composite, and a copper/molybdenum/copper composite.
PCT/US1996/000316 1995-01-27 1996-01-29 Electrical feedthroughs for ceramic circuit board support substrates WO1996022881A1 (en)

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CA002211542A CA2211542C (en) 1995-01-27 1996-01-29 Electrical feedthroughs for ceramic circuit board support substrates
KR1019970705050A KR100295695B1 (en) 1995-01-27 1996-01-29 Electrical Feedthroughs for Ceramic Circuit Board Supporting Boards
EP96903415A EP0812258B1 (en) 1995-01-27 1996-01-29 Electrical feedthroughs for ceramic circuit board support substrates
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