WO1996023397A1 - Printed circuit board and heat sink arrangement - Google Patents
Printed circuit board and heat sink arrangement Download PDFInfo
- Publication number
- WO1996023397A1 WO1996023397A1 PCT/CA1996/000028 CA9600028W WO9623397A1 WO 1996023397 A1 WO1996023397 A1 WO 1996023397A1 CA 9600028 W CA9600028 W CA 9600028W WO 9623397 A1 WO9623397 A1 WO 9623397A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat sink
- circuit board
- printed circuit
- heat
- conductive material
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/0949—Pad close to a hole, not surrounding the hole
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0969—Apertured conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8522512A JP2908881B2 (en) | 1995-01-25 | 1996-01-19 | Method of making an assembly of a printed circuit board structure and a heat sink structure and an assembly of a printed circuit board structure and a heat sink structure |
EP96900483A EP0807372A1 (en) | 1995-01-25 | 1996-01-19 | Printed circuit board and heat sink arrangement |
AU44283/96A AU697409B2 (en) | 1995-01-25 | 1996-01-19 | Printed circuit board and heat sink arrangement |
MXPA/A/1997/005577A MXPA97005577A (en) | 1995-01-25 | 1997-07-23 | Installation of printed and terminated circuit panel |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA2,141,091 | 1995-01-25 | ||
CA2141091 | 1995-01-25 | ||
US51627195A | 1995-08-17 | 1995-08-17 | |
US08/516,271 | 1995-08-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1996023397A1 true WO1996023397A1 (en) | 1996-08-01 |
Family
ID=25677755
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CA1996/000028 WO1996023397A1 (en) | 1995-01-25 | 1996-01-19 | Printed circuit board and heat sink arrangement |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0807372A1 (en) |
JP (1) | JP2908881B2 (en) |
KR (1) | KR19980701642A (en) |
CN (1) | CN1114338C (en) |
AU (1) | AU697409B2 (en) |
WO (1) | WO1996023397A1 (en) |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0854666A2 (en) * | 1997-01-20 | 1998-07-22 | Robert Bosch Gmbh | Control device comprising at least two housing parts |
EP0922299A1 (en) * | 1997-06-30 | 1999-06-16 | Sun Microsystems, Inc. | Post mounted heat sink method and apparatus |
WO2001006821A1 (en) * | 1999-07-15 | 2001-01-25 | Incep Technologies, Inc. | Encapsulated packaging in between 2 pcbs |
EP1109432A1 (en) * | 1999-12-17 | 2001-06-20 | Pace Micro Technology Ltd | Heat dissipation in electrical apparatus |
US6356448B1 (en) | 1999-11-02 | 2002-03-12 | Inceptechnologies, Inc. | Inter-circuit encapsulated packaging for power delivery |
US6452113B2 (en) | 1999-07-15 | 2002-09-17 | Incep Technologies, Inc. | Apparatus for providing power to a microprocessor with integrated thermal and EMI management |
US6618268B2 (en) | 1999-07-15 | 2003-09-09 | Incep Technologies, Inc. | Apparatus for delivering power to high performance electronic assemblies |
WO2003075626A1 (en) * | 2002-03-07 | 2003-09-12 | Siemens Aktiengesellschaft | Heat dissipating device for dissipating heat generated by an electrical component |
US6741480B2 (en) | 1999-07-15 | 2004-05-25 | Incep Technologies, Inc. | Integrated power delivery with flex circuit interconnection for high density power circuits for integrated circuits and systems |
US6801431B2 (en) | 1999-07-15 | 2004-10-05 | Incep Technologies, Inc. | Integrated power delivery and cooling system for high power microprocessors |
EP1638384A1 (en) * | 2004-09-20 | 2006-03-22 | Danaher Motion Stockholm AB | Circuit arrangement for cooling of surface mounted semi-conductors |
EP1916884A1 (en) | 2006-10-27 | 2008-04-30 | Agie Sa | Circuit board unit and method for production thereof |
EP1783833A3 (en) * | 2005-11-04 | 2009-01-21 | GrafTech International Holdings Inc. | Heat Spreaders with Vias |
US7573717B2 (en) | 2005-11-04 | 2009-08-11 | Graftech International Holdings Inc. | Cycling LED heat spreader |
WO2010006924A1 (en) * | 2008-07-15 | 2010-01-21 | Continental Automotive Gmbh | Motor control device of a vehicle |
DE102008039921A1 (en) * | 2008-08-27 | 2010-03-04 | Continental Automotive Gmbh | Electronic device e.g. electronic guiding device, for use in vehicle, has free space formed between discrete element and component side of board, where openings of printed circuit board and free space are filled with adhesive mass |
US7881072B2 (en) | 1999-07-15 | 2011-02-01 | Molex Incorporated | System and method for processor power delivery and thermal management |
US11046151B2 (en) | 2014-10-21 | 2021-06-29 | Webasto SE | Heating device with integrated temperature sensor |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4078400B2 (en) * | 2003-03-19 | 2008-04-23 | テクトロニクス・インターナショナル・セールス・ゲーエムベーハー | Heat dissipation system for electronic devices |
US7889502B1 (en) * | 2005-11-04 | 2011-02-15 | Graftech International Holdings Inc. | Heat spreading circuit assembly |
US20090165302A1 (en) * | 2007-12-31 | 2009-07-02 | Slaton David S | Method of forming a heatsink |
CN101505579B (en) * | 2008-02-05 | 2012-01-11 | 台达电子工业股份有限公司 | Heat radiation module and support member thereof |
CN101873784B (en) * | 2009-04-27 | 2012-08-08 | 台达电子工业股份有限公司 | Heat dispersion module of electronic element and assembling method thereof |
CN101965121A (en) * | 2010-10-09 | 2011-02-02 | 肖方一 | Method for preparing heat conduction structure of heating element, and heat conduction structure |
DE102012206980A1 (en) * | 2012-04-26 | 2013-10-31 | Robert Bosch Gmbh | Device for positioning a printed circuit board |
US9036352B2 (en) * | 2012-11-30 | 2015-05-19 | Ge Aviation Systems, Llc | Phase change heat sink for transient thermal management |
JP2017199819A (en) * | 2016-04-28 | 2017-11-02 | 日立オートモティブシステムズ株式会社 | Electronic control apparatus |
KR102580830B1 (en) * | 2016-07-13 | 2023-09-20 | 삼성전기주식회사 | Printed circuit board |
KR102573804B1 (en) * | 2018-12-18 | 2023-09-01 | 현대자동차주식회사 | Integrated control unit vehicle and method for controlling the same |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0130279A2 (en) * | 1983-03-25 | 1985-01-09 | Mitsubishi Denki Kabushiki Kaisha | Heat radiator assembly for cooling electronic parts |
EP0232098A1 (en) * | 1986-01-24 | 1987-08-12 | BRITISH TELECOMMUNICATIONS public limited company | Heat sink for an electronic component |
US4849856A (en) * | 1988-07-13 | 1989-07-18 | International Business Machines Corp. | Electronic package with improved heat sink |
US4914551A (en) * | 1988-07-13 | 1990-04-03 | International Business Machines Corporation | Electronic package with heat spreader member |
DE4106185A1 (en) * | 1991-02-27 | 1992-09-03 | Standard Elektrik Lorenz Ag | Electronic component or circuit cooler - has thermal container which is formed by thin-wall, enclosed, rubber-like sleeve |
US5467251A (en) * | 1993-10-08 | 1995-11-14 | Northern Telecom Limited | Printed circuit boards and heat sink structures |
-
1996
- 1996-01-19 AU AU44283/96A patent/AU697409B2/en not_active Ceased
- 1996-01-19 CN CN96191600A patent/CN1114338C/en not_active Expired - Fee Related
- 1996-01-19 WO PCT/CA1996/000028 patent/WO1996023397A1/en not_active Application Discontinuation
- 1996-01-19 JP JP8522512A patent/JP2908881B2/en not_active Expired - Fee Related
- 1996-01-19 EP EP96900483A patent/EP0807372A1/en not_active Withdrawn
- 1996-01-19 KR KR1019970705036A patent/KR19980701642A/en not_active Application Discontinuation
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0130279A2 (en) * | 1983-03-25 | 1985-01-09 | Mitsubishi Denki Kabushiki Kaisha | Heat radiator assembly for cooling electronic parts |
EP0232098A1 (en) * | 1986-01-24 | 1987-08-12 | BRITISH TELECOMMUNICATIONS public limited company | Heat sink for an electronic component |
US4849856A (en) * | 1988-07-13 | 1989-07-18 | International Business Machines Corp. | Electronic package with improved heat sink |
US4914551A (en) * | 1988-07-13 | 1990-04-03 | International Business Machines Corporation | Electronic package with heat spreader member |
DE4106185A1 (en) * | 1991-02-27 | 1992-09-03 | Standard Elektrik Lorenz Ag | Electronic component or circuit cooler - has thermal container which is formed by thin-wall, enclosed, rubber-like sleeve |
US5467251A (en) * | 1993-10-08 | 1995-11-14 | Northern Telecom Limited | Printed circuit boards and heat sink structures |
Non-Patent Citations (1)
Title |
---|
"heat dissipation from ic chips through module package", IBM TECHNICAL DISCLOSURE BULLETIN, vol. 19, no. 11, April 1977 (1977-04-01), pages 4165-4166, XP002001149 * |
Cited By (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0854666A3 (en) * | 1997-01-20 | 1999-02-10 | Robert Bosch Gmbh | Control device comprising at least two housing parts |
EP0854666A2 (en) * | 1997-01-20 | 1998-07-22 | Robert Bosch Gmbh | Control device comprising at least two housing parts |
EP0922299A1 (en) * | 1997-06-30 | 1999-06-16 | Sun Microsystems, Inc. | Post mounted heat sink method and apparatus |
EP0922299A4 (en) * | 1997-06-30 | 2005-08-10 | Sun Microsystems Inc | Post mounted heat sink method and apparatus |
US6801431B2 (en) | 1999-07-15 | 2004-10-05 | Incep Technologies, Inc. | Integrated power delivery and cooling system for high power microprocessors |
WO2001006821A1 (en) * | 1999-07-15 | 2001-01-25 | Incep Technologies, Inc. | Encapsulated packaging in between 2 pcbs |
US7881072B2 (en) | 1999-07-15 | 2011-02-01 | Molex Incorporated | System and method for processor power delivery and thermal management |
US6304450B1 (en) | 1999-07-15 | 2001-10-16 | Incep Technologies, Inc. | Inter-circuit encapsulated packaging |
US6452113B2 (en) | 1999-07-15 | 2002-09-17 | Incep Technologies, Inc. | Apparatus for providing power to a microprocessor with integrated thermal and EMI management |
US7245507B2 (en) | 1999-07-15 | 2007-07-17 | Dibene Ii Joseph T | Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management |
US6618268B2 (en) | 1999-07-15 | 2003-09-09 | Incep Technologies, Inc. | Apparatus for delivering power to high performance electronic assemblies |
US6741480B2 (en) | 1999-07-15 | 2004-05-25 | Incep Technologies, Inc. | Integrated power delivery with flex circuit interconnection for high density power circuits for integrated circuits and systems |
US6356448B1 (en) | 1999-11-02 | 2002-03-12 | Inceptechnologies, Inc. | Inter-circuit encapsulated packaging for power delivery |
US6498726B2 (en) | 1999-12-17 | 2002-12-24 | Pace Micro Technology Plc | Heat dissipation in electrical apparatus |
EP1109432A1 (en) * | 1999-12-17 | 2001-06-20 | Pace Micro Technology Ltd | Heat dissipation in electrical apparatus |
DE10210041B4 (en) * | 2002-03-07 | 2009-04-16 | Continental Automotive Gmbh | A heat dissipation device for dissipating heat generated by an electrical component and methods of manufacturing such a heat dissipation device |
WO2003075626A1 (en) * | 2002-03-07 | 2003-09-12 | Siemens Aktiengesellschaft | Heat dissipating device for dissipating heat generated by an electrical component |
EP1638384A1 (en) * | 2004-09-20 | 2006-03-22 | Danaher Motion Stockholm AB | Circuit arrangement for cooling of surface mounted semi-conductors |
US7573717B2 (en) | 2005-11-04 | 2009-08-11 | Graftech International Holdings Inc. | Cycling LED heat spreader |
EP1783833A3 (en) * | 2005-11-04 | 2009-01-21 | GrafTech International Holdings Inc. | Heat Spreaders with Vias |
EP1916884A1 (en) | 2006-10-27 | 2008-04-30 | Agie Sa | Circuit board unit and method for production thereof |
US7948758B2 (en) | 2006-10-27 | 2011-05-24 | Agie Charmilles Sa | Circuit board unit and method for production thereof |
WO2010006924A1 (en) * | 2008-07-15 | 2010-01-21 | Continental Automotive Gmbh | Motor control device of a vehicle |
DE102008039921A1 (en) * | 2008-08-27 | 2010-03-04 | Continental Automotive Gmbh | Electronic device e.g. electronic guiding device, for use in vehicle, has free space formed between discrete element and component side of board, where openings of printed circuit board and free space are filled with adhesive mass |
DE102008039921B4 (en) * | 2008-08-27 | 2021-06-10 | Vitesco Technologies GmbH | Method of manufacturing an electronic device with a discrete component |
US11046151B2 (en) | 2014-10-21 | 2021-06-29 | Webasto SE | Heating device with integrated temperature sensor |
Also Published As
Publication number | Publication date |
---|---|
CN1114338C (en) | 2003-07-09 |
KR19980701642A (en) | 1998-06-25 |
AU697409B2 (en) | 1998-10-08 |
JPH10502773A (en) | 1998-03-10 |
CN1169235A (en) | 1997-12-31 |
EP0807372A1 (en) | 1997-11-19 |
MX9705577A (en) | 1997-11-29 |
AU4428396A (en) | 1996-08-14 |
JP2908881B2 (en) | 1999-06-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
AU697409B2 (en) | Printed circuit board and heat sink arrangement | |
US5646826A (en) | Printed circuit board and heat sink arrangement | |
US5768104A (en) | Cooling approach for high power integrated circuits mounted on printed circuit boards | |
JP3126174B2 (en) | Flexible interconnect module | |
US8223497B2 (en) | Thermal bridge extensions for a module-chassis interface | |
US5917700A (en) | Heat sink and attachment process for electronic components | |
US20030011997A1 (en) | Electronic assembly with solderable heat sink and methods of manufacture | |
EP1638384A1 (en) | Circuit arrangement for cooling of surface mounted semi-conductors | |
AU2776192A (en) | Plated compliant lead | |
JPH05145208A (en) | Circuit unit | |
RU98111997A (en) | THREE-DIMENSIONAL ELECTRONIC MODULE, METHOD FOR ITS MANUFACTURE AND REPAIR | |
US4768352A (en) | Cooling structure for integrated circuits | |
JPH11509033A (en) | Separable electrical connector assembly having a planar array of conductive protrusions | |
DE19722357C1 (en) | Control unit | |
US6512678B2 (en) | Distributed load board stiffener | |
CA2166945A1 (en) | Printed circuit board and heat sink arrangement | |
US6285553B1 (en) | Mounting structure for an LSI | |
MXPA97005577A (en) | Installation of printed and terminated circuit panel | |
KR100630013B1 (en) | Solder-free pcb assembly | |
JP2007142294A (en) | Heat sink device, separating jig, and electronic device equipped with the heat sink device | |
EP1875786B1 (en) | Method and system of heat conductor | |
RU2105441C1 (en) | Electronic unit | |
JPH06260573A (en) | Assembly structure of semiconductor package and cooling fin | |
EP3996480B1 (en) | Conductive thermal management architecture for electronic devices | |
SU1051750A1 (en) | Radioelectronic unit |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 96191600.1 Country of ref document: CN |
|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AU CN JP KR MX |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): AT BE CH DE DK ES FR GB GR IE IT LU MC NL PT SE |
|
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 1996900483 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: PA/a/1997/005577 Country of ref document: MX |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1019970705036 Country of ref document: KR |
|
WWP | Wipo information: published in national office |
Ref document number: 1996900483 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 1019970705036 Country of ref document: KR |
|
WWR | Wipo information: refused in national office |
Ref document number: 1019970705036 Country of ref document: KR |
|
WWW | Wipo information: withdrawn in national office |
Ref document number: 1996900483 Country of ref document: EP |