WO1997024709A2 - End-wall frame for led alphanumeric display - Google Patents
End-wall frame for led alphanumeric display Download PDFInfo
- Publication number
- WO1997024709A2 WO1997024709A2 PCT/US1996/019792 US9619792W WO9724709A2 WO 1997024709 A2 WO1997024709 A2 WO 1997024709A2 US 9619792 W US9619792 W US 9619792W WO 9724709 A2 WO9724709 A2 WO 9724709A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wall
- display
- circuit board
- wall frame
- set forth
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP96942960A EP0870419B1 (en) | 1995-12-27 | 1996-12-17 | End-wall frame for led alphanumeric display |
DE69604827T DE69604827T2 (en) | 1995-12-27 | 1996-12-17 | HEADWALL FRAME FOR AN ALPHANUMERIC LED DISPLAY |
JP52434897A JP3280986B2 (en) | 1995-12-27 | 1996-12-17 | End wall frame for light emitting diode alphanumeric display |
KR1019980704930A KR19990076805A (en) | 1995-12-27 | 1996-12-17 | End wall frame for LED alphanumeric display |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US57953695A | 1995-12-27 | 1995-12-27 | |
US08/579,536 | 1995-12-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO1997024709A2 true WO1997024709A2 (en) | 1997-07-10 |
WO1997024709A3 WO1997024709A3 (en) | 1997-10-09 |
Family
ID=24317312
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1996/019792 WO1997024709A2 (en) | 1995-12-27 | 1996-12-17 | End-wall frame for led alphanumeric display |
Country Status (6)
Country | Link |
---|---|
US (1) | US5923536A (en) |
EP (1) | EP0870419B1 (en) |
JP (1) | JP3280986B2 (en) |
KR (1) | KR19990076805A (en) |
DE (1) | DE69604827T2 (en) |
WO (1) | WO1997024709A2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6087195A (en) | 1998-10-15 | 2000-07-11 | Handy & Harman | Method and system for manufacturing lamp tiles |
US10801716B1 (en) | 2020-02-21 | 2020-10-13 | Elemental LED, Inc. | Apparatus and method for making encapsulated linear lighting with opaque ends |
US10753596B1 (en) * | 2020-02-21 | 2020-08-25 | Elemental LED, Inc. | Apparatus and method for making encapsulated linear lighting of arbitrary length |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3781584A (en) * | 1972-03-13 | 1973-12-25 | Litronix Inc | Solid state alphanumeric indicator and lead frame |
DE3048185A1 (en) * | 1980-12-19 | 1982-07-29 | Siemens Ag | Casing for electronic component group - has mould for cast insulated components, as two-side open frame, closed by wall with inner shoulder |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4556276A (en) * | 1983-05-06 | 1985-12-03 | At&T Bell Laboratories | Solder beams leads |
-
1996
- 1996-12-17 KR KR1019980704930A patent/KR19990076805A/en not_active Application Discontinuation
- 1996-12-17 EP EP96942960A patent/EP0870419B1/en not_active Expired - Lifetime
- 1996-12-17 WO PCT/US1996/019792 patent/WO1997024709A2/en not_active Application Discontinuation
- 1996-12-17 JP JP52434897A patent/JP3280986B2/en not_active Expired - Fee Related
- 1996-12-17 DE DE69604827T patent/DE69604827T2/en not_active Expired - Fee Related
-
1997
- 1997-08-08 US US08/907,750 patent/US5923536A/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3781584A (en) * | 1972-03-13 | 1973-12-25 | Litronix Inc | Solid state alphanumeric indicator and lead frame |
DE3048185A1 (en) * | 1980-12-19 | 1982-07-29 | Siemens Ag | Casing for electronic component group - has mould for cast insulated components, as two-side open frame, closed by wall with inner shoulder |
Also Published As
Publication number | Publication date |
---|---|
JP3280986B2 (en) | 2002-05-13 |
EP0870419B1 (en) | 1999-10-20 |
EP0870419A2 (en) | 1998-10-14 |
DE69604827T2 (en) | 2000-04-27 |
WO1997024709A3 (en) | 1997-10-09 |
US5923536A (en) | 1999-07-13 |
KR19990076805A (en) | 1999-10-15 |
JP2000503132A (en) | 2000-03-14 |
DE69604827D1 (en) | 1999-11-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4250347A (en) | Method of encapsulating microelectronic elements | |
US5265184A (en) | Molded waveguide and method for making same | |
US5011256A (en) | Package for an opto-electronic component | |
CA2062415A1 (en) | Molded optical package utilizing leadframe technology | |
EP0825649A3 (en) | Method of protecting during transportation or packaging the lead pins and guide pins of semiconductor devices | |
KR100229757B1 (en) | Multi-component electronic device and method for making them | |
US4586607A (en) | Flexible strip of encapsulated contact members | |
JPH03155995A (en) | Ic module and ic card using the same | |
EP0110518A2 (en) | Method and apparatus for lead frame and semiconductor device encapsulation | |
EP0870419B1 (en) | End-wall frame for led alphanumeric display | |
EP0661564B1 (en) | Optical device module and method of manufacture | |
EP0479127A3 (en) | Semiconductor device sealed with mold resin | |
US5689137A (en) | Method for transfer molding standard electronic packages and apparatus formed thereby | |
US3672046A (en) | The method of making an electrical component | |
JP4185501B2 (en) | Injection cast molding apparatus for sealing semiconductor elements and method of use | |
SE9503499D0 (en) | Fanout for multi-fiber cable | |
US7265453B2 (en) | Semiconductor component having dummy segments with trapped corner air | |
US5429697A (en) | Method of sealing a module | |
US20030142921A1 (en) | Method of aligning optical fibers in an array member | |
DE69828163T2 (en) | DEVICE FOR FORMING PLASTIC PACKAGING | |
KR930004237B1 (en) | Semiconductor component manufacturing process, device and assembly station | |
US10099411B2 (en) | Method and apparatus for simultaneously encapsulating semiconductor dies with layered lead frame strips | |
GB2151041A (en) | Optical cable joint | |
US20030167633A1 (en) | Method and apparatus for reducing deformation of encapsulant in semiconductor device encapsulation by stencil printing | |
US5911598A (en) | Electrical connector with protective gel |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A2 Designated state(s): JP KR SG |
|
AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): AT BE CH DE DK ES FI FR GB GR IE IT LU MC NL PT SE |
|
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
AK | Designated states |
Kind code of ref document: A3 Designated state(s): JP KR SG |
|
AL | Designated countries for regional patents |
Kind code of ref document: A3 Designated state(s): AT BE CH DE DK ES FI FR GB GR IE IT LU MC NL PT SE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1019980704930 Country of ref document: KR |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1996942960 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 1996942960 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 1019980704930 Country of ref document: KR |
|
WWG | Wipo information: grant in national office |
Ref document number: 1996942960 Country of ref document: EP |
|
WWR | Wipo information: refused in national office |
Ref document number: 1019980704930 Country of ref document: KR |