WO1997035177A1 - Determining characteristic parameters by polarised light - Google Patents
Determining characteristic parameters by polarised light Download PDFInfo
- Publication number
- WO1997035177A1 WO1997035177A1 PCT/AU1997/000181 AU9700181W WO9735177A1 WO 1997035177 A1 WO1997035177 A1 WO 1997035177A1 AU 9700181 W AU9700181 W AU 9700181W WO 9735177 A1 WO9735177 A1 WO 9735177A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light
- polarisation
- directing
- monitoring
- processing
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/21—Polarisation-affecting properties
- G01N21/211—Ellipsometry
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
- G01B11/0641—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of polarization
- G01B11/065—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of polarization using one or more discrete wavelengths
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/21—Polarisation-affecting properties
- G01N2021/216—Polarisation-affecting properties using circular polarised light
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/21—Polarisation-affecting properties
- G01N2021/217—Measuring depolarisation or comparing polarised and depolarised parts of light
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/06—Illumination; Optics
- G01N2201/061—Sources
- G01N2201/06113—Coherent sources; lasers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/12—Circuits of general importance; Signal processing
- G01N2201/123—Conversion circuit
Definitions
- THIS INVENTION relates to a method and apparatus for in-situ determination
- a beam of polarised light is directed onto a changing surface.
- the beam interacts with the surface which results in a change in the
- a suitable light source usually a laser
- a pola ⁇ ser to produce
- polarisation is obtained by a polarisation analyser followed by a photodetector
- the polarisation analyser is commonly a rotating pola ⁇ ser and the
- photodetector is commonly a photomultiplier.
- Reflection ellipsometry is used for the study of surfaces and thin films.
- the technique can be used to determine the parameters of surface growth (eg. Oxidation, deposition, adsorption, diffusion, etc) or surface removal (eg.
- ellipsometry involves the measurement of tan ⁇ , the change
- the refractive index of the substrate the wavelength of light used, the
- polariser is at angle A ⁇ .
- Another approach is to provide multiple ellipsometers with identical set-
- the present invention resides in a method of in-
- the present invention resides in a
- the step of analysing light reflected from the material may further include the step of directing the reflected light through a rotating analyser or
- means may suitably be performed in a computer using ellipsometric equations.
- deposition rate can also be calculated.
- the material is
- the material can be identified.
- the surface temperature can also be calculated
- the method may further include the step of for example performing a
- the obtained periodicity may suitably be calculated by curve fitting
- the step of directing light of known polarisation at the material may
- each beam may be at a
- the present invention resides in an apparatus
- Figure 1 is schematic of an apparatus for determining and/or monitoring
- Figure 2 shows a periodic nature of polarisation state with surface layer thickness
- Figure 3 shows determination of real time etch rate according to the
- Figures 4, 5 and 6 show determination of etch endpoint detection
- FIG. 1 there is shown an apparatus for determining
- the apparatus comprises a source of
- coherent light 1 which in this case is a laser.
- the source 1 is Helium Neon laser, model LGR 7631 A from Siemens.
- the source 1 is Helium Neon laser, model LGR 7631 A from Siemens.
- the state of polarisation of the incident beam 3 is determined by fixed
- the incident beam 3 may be linearly polarised, elliptically
- fixed polariser 5 may be incorporated in the laser 1 so that a separate element
- the incident beam impinges upon the semiconductor wafer 6 at an
- the rotating polariser 7 rotates at a known frequency determined by the
- the polariser has two speeds, fast (3 Hz) and slow (1 .5 Hz). Although a rotating polariser is
- polariser adjacent the source may rotate and the polariser adjacent the detector
- This arrangement may be fixed. This arrangement may have advantage in a multiple beam
- a laser line interference filter 9 filters certain optical noise from the
- a detector 1 1 produces an analog signal 12 proportional to the intensity of light incident on the detector 1 1 .
- the detector 1 1 is
- the detector 1 1 is a Hammamatsu photomultiplier and the power supply 1 3 is a high voltage
- the signal 12 is converted from analog to digital in a PCL718 A/D
- the digital signal 1 5 is processed in a computer 16.
- Input optical window 20 and exit optical window 21 are mounted.
- the wafer 6 has a polysilicon layer on top of a Si0 2
- Polysilicon has a refractive index N 2 of 3.6 and Si0 2 has a refractive
- the laser is adjusted for a wavelength ⁇ of 632.8 nm and an incident angle of 70° at the surface of the polysilicon layer. Phases shift ⁇
- N refractive index
- the inventor has found that the polarisation state of the reflected laser light various periodically with the change in thickness of the surface layer of
- Figure 2 shows the periodic nature of ⁇ and ⁇ for the
- the apparatus described above is used to monitor the polarisation state
- the resultant plot is periodic with the period equals to the time it takes
- E r is the etch rate
- T c is the characteristic thickness
- P is the time
- the function of the wavelength is less for
- the etch rate can be displayed as a plot of etch rate versus plasma
- the plasma chamber pressure was 200mT, the gas flow was SF 5 at 20 seem and
- the periodicities can be any periodicities of the periodicities of the individual components.
- the periodicities can be any periodicities of the periodicities of the individual components.
- the periodicities can be any periodicities of the periodicities of the individual components.
- End point can be determined by monitoring the differential change in
- End point can also be determined by directly monitoring the polarisation
- Figure 5 shows a plot of polarisation state ( in this case ⁇ is
- Figure 6 shows a plot of polarisation state ⁇ against time.
- the method can also be applied to the measurement of the surface
- the characteristic thickness is a function of refractive index which is temperature dependent.
- method and apparatus can be extended to multiple beam systems. This may be useful if monitoring of a large wafer is to occur at a number of points across the
- each light source may be incident at the material at a different angle
- the invention conceives that the technique can be applied to at least the following situations:
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU20186/97A AU2018697A (en) | 1996-03-19 | 1997-03-19 | Determining characteristic parameters by polarised light |
KR1019980707424A KR20000064701A (en) | 1996-03-19 | 1997-03-19 | Characteristic Parameter Determination by Polarization |
JP53298597A JP2001519891A (en) | 1996-03-19 | 1997-03-19 | Measurement of characteristic parameters by polarization |
IL12628997A IL126289A0 (en) | 1996-03-19 | 1997-03-19 | Determining characteristic parameters by polarised light |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AUPN8752 | 1996-03-19 | ||
AUPN8752A AUPN875296A0 (en) | 1996-03-19 | 1996-03-19 | Method and apparatus for monitoring materials processing |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1997035177A1 true WO1997035177A1 (en) | 1997-09-25 |
Family
ID=3793065
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/AU1997/000181 WO1997035177A1 (en) | 1996-03-19 | 1997-03-19 | Determining characteristic parameters by polarised light |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP2001519891A (en) |
KR (1) | KR20000064701A (en) |
CN (1) | CN1219236A (en) |
AU (1) | AUPN875296A0 (en) |
IL (1) | IL126289A0 (en) |
WO (1) | WO1997035177A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999008068A1 (en) * | 1997-08-11 | 1999-02-18 | Robert Bosch Gmbh | Ellipsometer measuring instrument |
WO2001090687A2 (en) * | 2000-05-19 | 2001-11-29 | Therma-Wave, Inc. | Monitoring temperature and sample characteristics using rotating compensator ellipsometer |
KR100808274B1 (en) * | 2000-05-26 | 2008-02-29 | 쏘시에떼 드 프로딕시옹 에 드 리쉐르슈 아쁠리께 | Method and apparatus for ellipsometric metrology for a sample contained in a chamber or the like |
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KR100688980B1 (en) * | 2005-07-01 | 2007-03-08 | 삼성전자주식회사 | Apparatus for monitoring plasma and method of monitoring plasma |
CN102507040B (en) * | 2011-11-10 | 2013-08-21 | 复旦大学 | Thin film temperature measurement method based on ellipsometer |
CN102519364B (en) * | 2011-11-30 | 2014-10-15 | 上海华力微电子有限公司 | Optical detection method and computer-aided system for plasma etching structure |
FR2994264B1 (en) * | 2012-08-02 | 2014-09-12 | Centre Nat Rech Scient | PROCESS FOR ANALYZING THE CRYSTALLINE STRUCTURE OF A POLY-CRYSTALLINE SEMICONDUCTOR MATERIAL |
EP2703773B1 (en) * | 2012-08-28 | 2014-12-24 | Texmag GmbH Vertriebsgesellschaft | Sensor for detecting a moving strip |
CN103076287B (en) * | 2013-01-25 | 2015-05-13 | 中国人民解放军陆军军官学院 | Method for detecting damage of first wall of tokamak fusion reactor with polarized light |
CN103486974B (en) * | 2013-09-23 | 2016-04-13 | 中国科学院微电子研究所 | A kind of Spectroscopic Ellipsometry measurement mechanism and method |
CN103759661B (en) * | 2013-11-04 | 2016-06-29 | 北京理工大学 | A kind of device for measuring film thickness and refractive index in medium |
BR112016015649A2 (en) * | 2014-03-07 | 2017-08-08 | Halliburton Energy Services Inc | OPTICAL COMPUTING DEVICE AND METHOD FOR DETERMINING A CHARACTERISTIC OF A SAMPLE |
CN105136679B (en) * | 2015-09-02 | 2017-12-26 | 北京航玻新材料技术有限公司 | A kind of optical material surface method for evaluating quality and its application based on ellipsometer |
CN105445191B (en) * | 2015-11-30 | 2018-08-24 | 中国科学院长春应用化学研究所 | Multichannel in situ measurement atmosphere pond |
CN113281268B (en) * | 2021-05-31 | 2022-08-16 | 华中科技大学 | Data analysis method and system for rotating polarization device spectrum ellipsometer |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3985447A (en) * | 1975-08-29 | 1976-10-12 | Bell Telephone Laboratories, Incorporated | Measurement of thin films by polarized light |
FR2491234A1 (en) * | 1980-09-29 | 1982-04-02 | Labo Electronique Physique | Real time ellipsometer for analysing film on substrate - uses microprocessor to calculate fourier coefficients for function generated by photomultiplier output processing circuit |
US4762414A (en) * | 1985-04-23 | 1988-08-09 | Cselt-Centro Studi E Laboratori Telecomunicazioni S.P.A. | Static interferometric ellipsometer |
US4850711A (en) * | 1986-06-13 | 1989-07-25 | Nippon Kokan Kabushiki Kaisha | Film thickness-measuring apparatus using linearly polarized light |
US5526117A (en) * | 1993-01-14 | 1996-06-11 | Sentech Instruments Gmbh | Method for the determination of characteristic values of transparent layers with the aid of ellipsometry |
-
1996
- 1996-03-19 AU AUPN8752A patent/AUPN875296A0/en not_active Abandoned
-
1997
- 1997-03-19 CN CN97194713.9A patent/CN1219236A/en active Pending
- 1997-03-19 KR KR1019980707424A patent/KR20000064701A/en not_active Application Discontinuation
- 1997-03-19 IL IL12628997A patent/IL126289A0/en unknown
- 1997-03-19 JP JP53298597A patent/JP2001519891A/en active Pending
- 1997-03-19 WO PCT/AU1997/000181 patent/WO1997035177A1/en not_active Application Discontinuation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3985447A (en) * | 1975-08-29 | 1976-10-12 | Bell Telephone Laboratories, Incorporated | Measurement of thin films by polarized light |
FR2491234A1 (en) * | 1980-09-29 | 1982-04-02 | Labo Electronique Physique | Real time ellipsometer for analysing film on substrate - uses microprocessor to calculate fourier coefficients for function generated by photomultiplier output processing circuit |
US4762414A (en) * | 1985-04-23 | 1988-08-09 | Cselt-Centro Studi E Laboratori Telecomunicazioni S.P.A. | Static interferometric ellipsometer |
US4850711A (en) * | 1986-06-13 | 1989-07-25 | Nippon Kokan Kabushiki Kaisha | Film thickness-measuring apparatus using linearly polarized light |
US5526117A (en) * | 1993-01-14 | 1996-06-11 | Sentech Instruments Gmbh | Method for the determination of characteristic values of transparent layers with the aid of ellipsometry |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999008068A1 (en) * | 1997-08-11 | 1999-02-18 | Robert Bosch Gmbh | Ellipsometer measuring instrument |
US7088448B1 (en) | 1997-08-11 | 2006-08-08 | Robert Bosch Gmbh | Ellipsometer measurement apparatus |
WO2001090687A2 (en) * | 2000-05-19 | 2001-11-29 | Therma-Wave, Inc. | Monitoring temperature and sample characteristics using rotating compensator ellipsometer |
WO2001090687A3 (en) * | 2000-05-19 | 2002-04-04 | Therma Wave Inc | Monitoring temperature and sample characteristics using rotating compensator ellipsometer |
US6583875B1 (en) | 2000-05-19 | 2003-06-24 | Therma-Wave, Inc. | Monitoring temperature and sample characteristics using a rotating compensator ellipsometer |
US6894781B2 (en) | 2000-05-19 | 2005-05-17 | Therma-Wave, Inc. | Monitoring temperature and sample characteristics using a rotating compensator ellipsometer |
KR100808274B1 (en) * | 2000-05-26 | 2008-02-29 | 쏘시에떼 드 프로딕시옹 에 드 리쉐르슈 아쁠리께 | Method and apparatus for ellipsometric metrology for a sample contained in a chamber or the like |
Also Published As
Publication number | Publication date |
---|---|
IL126289A0 (en) | 1999-05-09 |
AUPN875296A0 (en) | 1996-04-18 |
CN1219236A (en) | 1999-06-09 |
JP2001519891A (en) | 2001-10-23 |
KR20000064701A (en) | 2000-11-06 |
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