WO1997046061A1 - Method of forming raised metallic contacts on electrical circuits - Google Patents
Method of forming raised metallic contacts on electrical circuits Download PDFInfo
- Publication number
- WO1997046061A1 WO1997046061A1 PCT/US1997/008011 US9708011W WO9746061A1 WO 1997046061 A1 WO1997046061 A1 WO 1997046061A1 US 9708011 W US9708011 W US 9708011W WO 9746061 A1 WO9746061 A1 WO 9746061A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- conductive layer
- dielectric material
- layer
- base substrate
- copper
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3473—Plating of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/977—Thinning or removal of substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP97923639A EP0843955B1 (en) | 1996-05-29 | 1997-05-08 | Method of forming raised metallic contacts on electrical circuits |
KR1019980700518A KR100304317B1 (en) | 1996-05-29 | 1997-05-08 | Method of forming raised metallic contacts on electrical circuits |
DE69728234T DE69728234T2 (en) | 1996-05-29 | 1997-05-08 | METHOD FOR PRODUCING INCREASED METALLIC CONTACTS ON ELECTRICAL CIRCUITS |
AU29400/97A AU2940097A (en) | 1996-05-29 | 1997-05-08 | Method of forming raised metallic contacts on electrical circuits |
JP54247797A JP3759754B2 (en) | 1996-05-29 | 1997-05-08 | How to make raised metal contacts on electrical circuits |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/655,017 | 1996-05-29 | ||
US08/655,017 US5747358A (en) | 1996-05-29 | 1996-05-29 | Method of forming raised metallic contacts on electrical circuits |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1997046061A1 true WO1997046061A1 (en) | 1997-12-04 |
Family
ID=24627163
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1997/008011 WO1997046061A1 (en) | 1996-05-29 | 1997-05-08 | Method of forming raised metallic contacts on electrical circuits |
Country Status (7)
Country | Link |
---|---|
US (2) | US5747358A (en) |
EP (1) | EP0843955B1 (en) |
JP (1) | JP3759754B2 (en) |
KR (2) | KR100279036B1 (en) |
AU (1) | AU2940097A (en) |
DE (1) | DE69728234T2 (en) |
WO (1) | WO1997046061A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8505199B2 (en) | 2007-08-15 | 2013-08-13 | Tessera, Inc. | Method of fabricating an interconnection element having conductive posts |
Families Citing this family (60)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6482013B2 (en) | 1993-11-16 | 2002-11-19 | Formfactor, Inc. | Microelectronic spring contact element and electronic component having a plurality of spring contact elements |
US7073254B2 (en) | 1993-11-16 | 2006-07-11 | Formfactor, Inc. | Method for mounting a plurality of spring contact elements |
US7579269B2 (en) * | 1993-11-16 | 2009-08-25 | Formfactor, Inc. | Microelectronic spring contact elements |
US6727580B1 (en) | 1993-11-16 | 2004-04-27 | Formfactor, Inc. | Microelectronic spring contact elements |
US8033838B2 (en) | 1996-02-21 | 2011-10-11 | Formfactor, Inc. | Microelectronic contact structure |
US5918153A (en) * | 1996-09-18 | 1999-06-29 | Sandia Corporation | High density electronic circuit and process for making |
US6809421B1 (en) | 1996-12-02 | 2004-10-26 | Kabushiki Kaisha Toshiba | Multichip semiconductor device, chip therefor and method of formation thereof |
US6520778B1 (en) | 1997-02-18 | 2003-02-18 | Formfactor, Inc. | Microelectronic contact structures, and methods of making same |
US6246548B1 (en) | 1997-03-24 | 2001-06-12 | Maxtor Corporation | Mechanically formed standoffs in a circuit interconnect |
US6040239A (en) * | 1997-08-22 | 2000-03-21 | Micron Technology, Inc. | Non-oxidizing touch contact interconnect for semiconductor test systems and method of fabrication |
JP3080047B2 (en) * | 1997-11-07 | 2000-08-21 | 日本電気株式会社 | Bump structure and bump structure forming method |
US6807734B2 (en) * | 1998-02-13 | 2004-10-26 | Formfactor, Inc. | Microelectronic contact structures, and methods of making same |
JP3553791B2 (en) * | 1998-04-03 | 2004-08-11 | 株式会社ルネサステクノロジ | CONNECTION DEVICE AND ITS MANUFACTURING METHOD, INSPECTION DEVICE, AND SEMICONDUCTOR ELEMENT MANUFACTURING METHOD |
US6299456B1 (en) * | 1998-04-10 | 2001-10-09 | Micron Technology, Inc. | Interposer with contact structures for electrical testing |
US6278185B1 (en) * | 1998-05-27 | 2001-08-21 | Intel Corporation | Semi-additive process (SAP) architecture for organic leadless grid array packages |
US6998711B1 (en) * | 1998-08-14 | 2006-02-14 | Micron Technology, Inc. | Method of forming a micro solder ball for use in C4 bonding process |
US6136689A (en) * | 1998-08-14 | 2000-10-24 | Micron Technology, Inc. | Method of forming a micro solder ball for use in C4 bonding process |
US6255126B1 (en) * | 1998-12-02 | 2001-07-03 | Formfactor, Inc. | Lithographic contact elements |
KR20070087060A (en) * | 1998-12-02 | 2007-08-27 | 폼팩터, 인크. | Method of making an electrical contact structure |
US6672875B1 (en) | 1998-12-02 | 2004-01-06 | Formfactor, Inc. | Spring interconnect structures |
US6491968B1 (en) | 1998-12-02 | 2002-12-10 | Formfactor, Inc. | Methods for making spring interconnect structures |
US6268015B1 (en) | 1998-12-02 | 2001-07-31 | Formfactor | Method of making and using lithographic contact springs |
US6181569B1 (en) * | 1999-06-07 | 2001-01-30 | Kishore K. Chakravorty | Low cost chip size package and method of fabricating the same |
US6569604B1 (en) * | 1999-06-30 | 2003-05-27 | International Business Machines Corporation | Blind via formation in a photoimageable dielectric material |
JP2001053438A (en) * | 1999-08-16 | 2001-02-23 | Sony Corp | Method for manufacturing multi-layer printed wiring board |
DE10007414B4 (en) * | 2000-02-18 | 2006-07-06 | eupec Europäische Gesellschaft für Leistungshalbleiter mbH & Co. KG | Process for the through-plating of a substrate for power semiconductor modules by solder and substrate produced by the method |
US6548224B1 (en) * | 2000-03-07 | 2003-04-15 | Kulicke & Soffa Holdings, Inc. | Wiring substrate features having controlled sidewall profiles |
US6878396B2 (en) * | 2000-04-10 | 2005-04-12 | Micron Technology, Inc. | Micro C-4 semiconductor die and method for depositing connection sites thereon |
JP2002026515A (en) * | 2000-07-07 | 2002-01-25 | Toshiba Corp | Printed wiring board and its manufacturing method |
US6498381B2 (en) * | 2001-02-22 | 2002-12-24 | Tru-Si Technologies, Inc. | Semiconductor structures having multiple conductive layers in an opening, and methods for fabricating same |
US6574863B2 (en) * | 2001-04-20 | 2003-06-10 | Phoenix Precision Technology Corporation | Thin core substrate for fabricating a build-up circuit board |
KR20020087328A (en) * | 2001-05-15 | 2002-11-22 | 조수제 | The fabrication of mandrel for electroforming |
JP2003023067A (en) * | 2001-07-09 | 2003-01-24 | Tokyo Electron Ltd | Formation method for via metal layer and via metal layer formed substrate |
US6759311B2 (en) | 2001-10-31 | 2004-07-06 | Formfactor, Inc. | Fan out of interconnect elements attached to semiconductor wafer |
US6599778B2 (en) * | 2001-12-19 | 2003-07-29 | International Business Machines Corporation | Chip and wafer integration process using vertical connections |
TW583395B (en) * | 2002-03-13 | 2004-04-11 | Scs Hightech Inc | Method for producing micro probe tips |
US20050142739A1 (en) * | 2002-05-07 | 2005-06-30 | Microfabrica Inc. | Probe arrays and method for making |
US20060234042A1 (en) * | 2002-09-05 | 2006-10-19 | Rui Yang | Etched dielectric film in microfluidic devices |
US20040258885A1 (en) * | 2002-09-05 | 2004-12-23 | Kreutter Nathan P. | Etched dielectric film in microfluidic devices |
US10416192B2 (en) | 2003-02-04 | 2019-09-17 | Microfabrica Inc. | Cantilever microprobes for contacting electronic components |
US8328564B2 (en) * | 2003-06-13 | 2012-12-11 | Molex Incoporated | Electrical connector solder terminal |
JP3990347B2 (en) * | 2003-12-04 | 2007-10-10 | ローム株式会社 | Semiconductor chip, manufacturing method thereof, and semiconductor device |
JP2007517410A (en) * | 2003-12-30 | 2007-06-28 | スリーエム イノベイティブ プロパティズ カンパニー | Pattern circuit and manufacturing method thereof |
US7012017B2 (en) * | 2004-01-29 | 2006-03-14 | 3M Innovative Properties Company | Partially etched dielectric film with conductive features |
JP2006119024A (en) * | 2004-10-22 | 2006-05-11 | Tokyo Electron Ltd | Probe and its manufacturing method |
JP4619223B2 (en) * | 2004-12-16 | 2011-01-26 | 新光電気工業株式会社 | Semiconductor package and manufacturing method thereof |
WO2006080073A1 (en) * | 2005-01-27 | 2006-08-03 | Matsushita Electric Industrial Co., Ltd. | Multi-layer circuit substrate manufacturing method and multi-layer circuit substrate |
US20070023387A1 (en) * | 2005-07-28 | 2007-02-01 | Litton Systems, Inc. | Printed circuit board interconnection and method |
TWI397972B (en) * | 2005-08-26 | 2013-06-01 | Hitachi Ltd | Semiconductor device manufacturing method |
KR100796206B1 (en) * | 2007-02-12 | 2008-01-24 | 주식회사 유니테스트 | Method for manufacturing bump of probe card |
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US8276269B2 (en) | 2008-06-20 | 2012-10-02 | Intel Corporation | Dual epoxy dielectric and photosensitive solder mask coatings, and processes of making same |
TWI411368B (en) * | 2009-12-22 | 2013-10-01 | Unimicron Technology Corp | Method for fabricating wiring structure of wiring board |
DE102013203799A1 (en) * | 2013-03-06 | 2014-09-11 | Robert Bosch Gmbh | Battery cell housing with integrated electronics |
US9105288B1 (en) * | 2014-03-11 | 2015-08-11 | Magnecomp Corporation | Formed electrical contact pad for use in a dual stage actuated suspension |
US10448517B2 (en) * | 2016-11-04 | 2019-10-15 | Jabil Inc. | Method and apparatus for flexible circuit cable attachment |
US11018024B2 (en) * | 2018-08-02 | 2021-05-25 | Nxp Usa, Inc. | Method of fabricating embedded traces |
US11262383B1 (en) | 2018-09-26 | 2022-03-01 | Microfabrica Inc. | Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making |
CN116326219B (en) * | 2020-10-02 | 2024-03-26 | 塞林克公司 | Forming a connection with a flexible interconnect circuit |
CN116325377A (en) | 2020-10-02 | 2023-06-23 | 塞林克公司 | Method and system for connecting flexible interconnect circuits |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3319317A (en) * | 1963-12-23 | 1967-05-16 | Ibm | Method of making a multilayered laminated circuit board |
US5072520A (en) * | 1990-10-23 | 1991-12-17 | Rogers Corporation | Method of manufacturing an interconnect device having coplanar contact bumps |
US5197184A (en) * | 1990-09-11 | 1993-03-30 | Hughes Aircraft Company | Method of forming three-dimensional circuitry |
US5326412A (en) * | 1992-12-22 | 1994-07-05 | Hughes Aircraft Company | Method for electrodepositing corrosion barrier on isolated circuitry |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4125310A (en) * | 1975-12-01 | 1978-11-14 | Hughes Aircraft Co | Electrical connector assembly utilizing wafers for connecting electrical cables |
US4453795A (en) * | 1975-12-01 | 1984-06-12 | Hughes Aircraft Company | Cable-to-cable/component electrical pressure wafer connector assembly |
US4116517A (en) * | 1976-04-15 | 1978-09-26 | International Telephone And Telegraph Corporation | Flexible printed circuit and electrical connection therefor |
US4717066A (en) * | 1986-02-24 | 1988-01-05 | American Telephone And Telegraph Company, At&T Bell Laboratories | Method of bonding conductors to semiconductor devices |
US4764485A (en) * | 1987-01-05 | 1988-08-16 | General Electric Company | Method for producing via holes in polymer dielectrics |
US4963225A (en) * | 1989-10-20 | 1990-10-16 | Tektronix, Inc. | Method of fabricating a contact device |
US5211577A (en) * | 1992-10-06 | 1993-05-18 | Hughes Aircraft Company | Pressure-actuated gold dot connector |
US5492863A (en) * | 1994-10-19 | 1996-02-20 | Motorola, Inc. | Method for forming conductive bumps on a semiconductor device |
-
1996
- 1996-05-29 US US08/655,017 patent/US5747358A/en not_active Expired - Lifetime
- 1996-11-08 US US08/744,842 patent/US5786270A/en not_active Expired - Lifetime
-
1997
- 1997-05-08 DE DE69728234T patent/DE69728234T2/en not_active Expired - Lifetime
- 1997-05-08 WO PCT/US1997/008011 patent/WO1997046061A1/en active IP Right Grant
- 1997-05-08 AU AU29400/97A patent/AU2940097A/en not_active Abandoned
- 1997-05-08 JP JP54247797A patent/JP3759754B2/en not_active Expired - Lifetime
- 1997-05-08 KR KR1019980700519A patent/KR100279036B1/en not_active IP Right Cessation
- 1997-05-08 EP EP97923639A patent/EP0843955B1/en not_active Expired - Lifetime
- 1997-05-08 KR KR1019980700518A patent/KR100304317B1/en not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3319317A (en) * | 1963-12-23 | 1967-05-16 | Ibm | Method of making a multilayered laminated circuit board |
US5197184A (en) * | 1990-09-11 | 1993-03-30 | Hughes Aircraft Company | Method of forming three-dimensional circuitry |
US5072520A (en) * | 1990-10-23 | 1991-12-17 | Rogers Corporation | Method of manufacturing an interconnect device having coplanar contact bumps |
US5326412A (en) * | 1992-12-22 | 1994-07-05 | Hughes Aircraft Company | Method for electrodepositing corrosion barrier on isolated circuitry |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8505199B2 (en) | 2007-08-15 | 2013-08-13 | Tessera, Inc. | Method of fabricating an interconnection element having conductive posts |
US9282640B2 (en) | 2007-08-15 | 2016-03-08 | Tessera, Inc. | Interconnection element with posts formed by plating |
Also Published As
Publication number | Publication date |
---|---|
AU2940097A (en) | 1998-01-05 |
JP3759754B2 (en) | 2006-03-29 |
KR19990035858A (en) | 1999-05-25 |
DE69728234T2 (en) | 2005-03-10 |
EP0843955B1 (en) | 2004-03-24 |
US5786270A (en) | 1998-07-28 |
DE69728234D1 (en) | 2004-04-29 |
US5747358A (en) | 1998-05-05 |
KR100279036B1 (en) | 2001-02-01 |
JPH11509990A (en) | 1999-08-31 |
KR100304317B1 (en) | 2001-11-02 |
EP0843955A1 (en) | 1998-05-27 |
KR19990035857A (en) | 1999-05-25 |
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