WO1998002905A3 - Wafer spin dryer and method of drying a wafer - Google Patents

Wafer spin dryer and method of drying a wafer Download PDF

Info

Publication number
WO1998002905A3
WO1998002905A3 PCT/US1997/011725 US9711725W WO9802905A3 WO 1998002905 A3 WO1998002905 A3 WO 1998002905A3 US 9711725 W US9711725 W US 9711725W WO 9802905 A3 WO9802905 A3 WO 9802905A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
spin dryer
rinse water
active side
drying
Prior art date
Application number
PCT/US1997/011725
Other languages
French (fr)
Other versions
WO1998002905A2 (en
Inventor
Oliver David Jones
Original Assignee
Oliver Design Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oliver Design Inc filed Critical Oliver Design Inc
Priority to AU36517/97A priority Critical patent/AU3651797A/en
Publication of WO1998002905A2 publication Critical patent/WO1998002905A2/en
Publication of WO1998002905A3 publication Critical patent/WO1998002905A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Abstract

In a spin dryer for semiconductor wafers, the wafer is held beneath a platen with its active side (i.e., the side containing the components or circuitry) facing upward. One or more nozzles spray rinse water on the top surface of the wafer and the wafer is rotated to remove the excess rinse water, thereby drying the wafer. A splash guard adjacent the edge of the wafer insures that the excess rinse water thrown off by the spinning wafer is deflected downward where it cannot again come into contact with the active side of the wafer. The platen is rotated dry at the same time, with no rinse water being splashed back onto the active side of the wafer. The spin dryer also includes a separate section which cleans and dries the end-effector of the robot which inserts the wafer into the spin dryer while the wafer is being dried.
PCT/US1997/011725 1996-07-15 1997-07-15 Wafer spin dryer and method of drying a wafer WO1998002905A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU36517/97A AU3651797A (en) 1996-07-15 1997-07-15 Wafer spin dryer and method of drying a wafer

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/680,739 US5778554A (en) 1996-07-15 1996-07-15 Wafer spin dryer and method of drying a wafer
US680,739 1996-07-15

Publications (2)

Publication Number Publication Date
WO1998002905A2 WO1998002905A2 (en) 1998-01-22
WO1998002905A3 true WO1998002905A3 (en) 1998-05-07

Family

ID=24732318

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1997/011725 WO1998002905A2 (en) 1996-07-15 1997-07-15 Wafer spin dryer and method of drying a wafer

Country Status (3)

Country Link
US (4) US5778554A (en)
AU (1) AU3651797A (en)
WO (1) WO1998002905A2 (en)

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CN107003669B (en) 2014-12-16 2023-01-31 伊莱克斯公司 Experience-based road sign for robotic cleaning devices
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Also Published As

Publication number Publication date
US5778554A (en) 1998-07-14
US6213136B1 (en) 2001-04-10
WO1998002905A2 (en) 1998-01-22
US6024107A (en) 2000-02-15
US6012470A (en) 2000-01-11
AU3651797A (en) 1998-02-09

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