WO1998008366A1 - Protective shield of emc-type - Google Patents

Protective shield of emc-type Download PDF

Info

Publication number
WO1998008366A1
WO1998008366A1 PCT/SE1997/001371 SE9701371W WO9808366A1 WO 1998008366 A1 WO1998008366 A1 WO 1998008366A1 SE 9701371 W SE9701371 W SE 9701371W WO 9808366 A1 WO9808366 A1 WO 9808366A1
Authority
WO
WIPO (PCT)
Prior art keywords
frame
lid
protective shield
side walls
circuit board
Prior art date
Application number
PCT/SE1997/001371
Other languages
French (fr)
Inventor
Lars-Anders Olofsson
Sven-Erik Bjerksell
Original Assignee
Telefonaktiebolaget Lm Ericsson (Publ)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget Lm Ericsson (Publ) filed Critical Telefonaktiebolaget Lm Ericsson (Publ)
Priority to AU38746/97A priority Critical patent/AU3874697A/en
Priority to EP97935965A priority patent/EP0920790B1/en
Priority to JP10510659A priority patent/JP2000516403A/en
Priority to CA002263769A priority patent/CA2263769A1/en
Priority to DE69731301T priority patent/DE69731301D1/en
Publication of WO1998008366A1 publication Critical patent/WO1998008366A1/en
Priority to HK00101453A priority patent/HK1022591A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Definitions

  • the present invention relates to a surface-mounted protective shield for omponents on e.g. a circuit board.
  • the screening of components on circuit boards is becoming more import-ant, especially in the case when the signal speed approaches the Gbit region. It is well known that radiation from certain components at high frequencies can cause interference with communications e.g. telecommunication. This phenomenon is called RFI, radio frequency interference.
  • the interfering circuits can either be shielded with closed boxes or the sensitive components can be shielded with closed boxes in order to prevent interference.
  • the protective shield comprises a number of contact springs and a lid.
  • the contact springs are arranged around the component and are in electrical contact with the circuit board.
  • the contact springs are in general U-shaped.
  • the lid comprises a flat surface with side walls along all the edges so that the lid is similar to an open box. The size of this box is adapted to the contact springs on the circuit board.
  • the sides are intended to be inserted into the U-shaped contact springs so that a protective shield is formed.
  • a contact spring which can be used to connect a protective shield to a circuit board.
  • This contact spring has a different appearance compared to the above mentioned contact springs, which means that the contact between lid .and contact spring is ensured and that the shielding increases.
  • circuit boards where certain components produce much electromagnetic radiation the placement of these components must be chosen with great care so that the radiation shall not cause operational problems.
  • the minimum size of the circuit bo.ard is limited to how near each other the transmitter and receiver can be placed without causing operational disturbances.
  • the present invention intends to solve above said problems through a surface- mounted protective shield, a so-called EMC -shield, being arranged over sensitive or disturbing components on a circuit board.
  • the EMC-shield is in its most simple embodiment a frame with an associated lid arranged around at least one component on the circuit board. The frame is attached so that it is in electrical contact with the circuit board.
  • the lid is adapted to the shape and size of the frame in order to obtain an EMC -protection which is as effective as possible.
  • the frame which can have any possible shape, e.g. circular, tri.angul.ar and rectangu- lar, is optimized in size to precisely surround the component or components which are to be shielded.
  • the frame which can be made of some electrically conductive material or a material which is coated with an electrically conductive material, can have a flange at its end facing towards the circuit board. This flange can align the frame when it is fastened to the circuit board with the help of e.g. soldering, welding or gluing.
  • a joint material which is placed at the intended position on the circuit board next to the component which is to be shielded and with a shape corresponding to the contour of the frame, causes a frame which is not too greatly mispositioned to be displaced to the right position with the help of the surface tension of the joint material.
  • the lid which comprises a flat surface with walls arranged around all its sides, has its shape and size adapted to the frame so that the lid is either slipped onto the outside of the frame or placed inside it.
  • An advantage of the present invention is that the protective shield t.akes up minimal space and that it does not leak radiation through the frame.
  • Another advantage of the present invention is that the fastening is simplified in that the frame is formed of a unit which cannot tip over.
  • Yet another advantage of the present invention is that with a flange on the frame it can adjust itself to the right position.
  • Yet another advantage of the present invention is that the mounting on an assembly line is simplified .and that simpler "pick and place” robots can be used.
  • Figure 1 shows in perspective an example of .an embodiment of .an EMC- protection according to the invention arranged on a substrate.
  • Figure 2 shows a partial cross section of the EMC-protection in Figure 1.
  • Figure 3 shows a partial cross section of another example of an embodiment of the EMC -protection.
  • Figure 4 shows a partial cross section of yet another example of an embodiment of the EMC-protection.
  • Figure 5 shows a partial cross section of yet another example of an embodi- ment of the EMC -protection.
  • FIG 1 shows .an embodiment of a protective shield of the EMC-type 1 according to the invention.
  • the protective shield 1 in this Figure is mounted on a substrate 30.
  • the protective shield comprises a frame 10 and a lid 20.
  • the frame 10 can be fastened to the substrate 30 with the help of gluing, welding or soldering.
  • On the inside of the walls of the frame 10 there are a number of contact elements 11. These contact elements 11 in this embodiment are shaped as tension prongs.
  • the outer dimensions of the lid 20 are adapted to the inner dimensions of the frame 10 according to Figure 2. When the lid 20 is forced down into the frame 10, the side walls 21 of the lid 20 are gripped between the walls of the frame 10 and the tension prongs.
  • the component 40 which one desires to shield, is placed inside the frame 10.
  • Said tension prongs can also be arr.anged on the outside of the frame 10.
  • the inner dimensions of the lid 20 are in this case adapted to the shape and size of the outer dimensions of the frame 10 so that the side walls 21 of the lid 20 are clamped between the tension prongs and the outside of the frame 10.
  • a variant for contacting the lid 20 to the frame 10 is that the outer dimension of the frame 10 is precisely adapted to the inner dimension of the lid 20 so that these de- tails are mechanically held together and are in electrical contact with each other by the lid 20 being slipped over the frame 10 and contacting it by press-fitting. It is natur-aHy also conceivable that the outer dimension of the lid 20 is adapted according to the inner dimension of the frame 10 so that the lid 20 fits inside the frame 10 so that said electrical contact and mechanical holding between these parts is again formed by press-fitting, see Figure 3. Instead of using tension prongs or press-fitting for forming electrical contact between the frame 10 .and the lid 20, a number of other embodiments can be conceivably used.
  • the fr.ame 10 just like e «arlier is fastened to the substrate 30 in a suitable way.
  • the lid 20 is dimensioned to either fit inside the frame 10 or be threaded over the frame 10. If the lid 20 is intended to fit into the frame 10, then on the outside of the side walls 21 of the lid 20 there could be arranged a number of contact means in the shape of ribs and on the inside of the frame 10 there could be arranged corresponding ribs.
  • the ribs of the lid 20 and the ribs of the frame 10 snap into each other in order in this way to form the mechanical and electrical contact between the lid 20 .and the frame 10, see Figure 5.
  • the frame 10 has a number of bulges 15 in the form of e.g. hemispheres which .are adapted to corresponding spheres on the side walls 21 of the lid. If there are a number of bulges 25 arranged on the side walls 21 of the lid 20, then there are corresponding depressions 15 .arr.anged on the fr.ame 10. If on the side walls 21 of the lid 20 there are arranged a number of depressions 25, then there are corresponding bulges 15 arranged on the frame 10.
  • the lid 20 can either be adapted to be slipped over the frame 10 or to fit inside it, the depressions or bulges 25 on the side walls 21 fitting into the corresponding bulges or depressions 15 on the frame 10, see Figure 5. This embodiment plus the one with ribs .are especially suitable in the case of small dimensions of the protective shield.
  • the lid 20 is arranged with a number of tongues 24 along the side wall 21. These tongues 24 are bent in towards the center of the lid 20 when the lid 20 is to be slipped over the frame 10 and bent out from the center of the lid 20 when the lid 20 is to fit into the frame 10, see Figure 4.
  • the tongues can also at their free ends be bent in towards the side wall 21.
  • a flange 12 at the end which is to be connected to the circuit board.
  • the flange 12 can be directed in towards the center of the frame 10 as in Figure 3, or out from the center of the frame 10 as in Figure 4.
  • the flange 12 means that the frame 10 can self-adjust to the right position with the help of the surface-tensioning of the fastening material 50. If the frame 10 is incorrectly placed in relation to a soldering material arranged on the circuit board 30, the frame 10 can move itself to the center of said soldering material when this begins to melt.
  • the material in the EMC-protection can be manufactured in some electrically conductive material with magnetic qualities.
  • the walls of the frame 10 can be somewhat bent 12 at the bottom close to the substrate 30 to which the frame 10 is fastened.
  • the bending of the walls close to the substrate can either be in towards the frame 10 or out from the same.

Abstract

The present invention relates to a protective shield (1) of EMC-type, for e.g. electrical components (40) on a circuit board (30). The protective shield (1) comprises a frame (10) with associated lid (20), where said frame (10) at the end facing towards the circuit board (30) comprises a flange (12). The frame is arranged to be fastened to the circuit board (30) by means of gluing, welding or soldering. The frame (10) is intended to surround at least one component (40) so that electrical contact is formed between said circuit board (30) and said frame (10) and between said frame (10) and said lid (20).

Description

PROTECTIVE SHIELD OF EMC-TYPE
Technical field
The present invention relates to a surface-mounted protective shield for omponents on e.g. a circuit board.
State of the art
The screening of components on circuit boards is becoming more import-ant, especially in the case when the signal speed approaches the Gbit region. It is well known that radiation from certain components at high frequencies can cause interference with communications e.g. telecommunication. This phenomenon is called RFI, radio frequency interference. The interfering circuits can either be shielded with closed boxes or the sensitive components can be shielded with closed boxes in order to prevent interference.
In GB 2 226 187 there is described a miniature protective shield for electronic components arranged on a circuit board. The protective shield comprises a number of contact springs and a lid. The contact springs are arranged around the component and are in electrical contact with the circuit board. The contact springs are in general U-shaped. The lid comprises a flat surface with side walls along all the edges so that the lid is similar to an open box. The size of this box is adapted to the contact springs on the circuit board. The sides are intended to be inserted into the U-shaped contact springs so that a protective shield is formed.
In WO 95/28074 a contact spring is described which can be used to connect a protective shield to a circuit board. This contact spring has a different appearance compared to the above mentioned contact springs, which means that the contact between lid .and contact spring is ensured and that the shielding increases.
The problem of the above contact springs is that they are quite complicated to arrange around the component on the circuit bo-ard. This solution is, furthermore, not completely optimal, both with regard to space requirements and the degree of protection.
Disclosure of the invention On circuit boards where certain components produce much electromagnetic radiation, the placement of these components must be chosen with great care so that the radiation shall not cause operational problems. On e.g. a single-sided circuit board, where both a transmitter and a receiver are placed, the minimum size of the circuit bo.ard is limited to how near each other the transmitter and receiver can be placed without causing operational disturbances.
A problem which occurs when different products tend towards smaller and smaller dimensions is that the screening between sensitive components must be increased.
Another problem is that known protective shields take up too much room and .are complicated and time-consuming to place on the circuit board, either because they should be mounted in holes in the circuit board or because they should be held fixed during the soldering operation. The above mentioned problems often require hand assembly.
The present invention intends to solve above said problems through a surface- mounted protective shield, a so-called EMC -shield, being arranged over sensitive or disturbing components on a circuit board. The EMC-shield is in its most simple embodiment a frame with an associated lid arranged around at least one component on the circuit board. The frame is attached so that it is in electrical contact with the circuit board. The lid is adapted to the shape and size of the frame in order to obtain an EMC -protection which is as effective as possible.
The frame, which can have any possible shape, e.g. circular, tri.angul.ar and rectangu- lar, is optimized in size to precisely surround the component or components which are to be shielded. The frame, which can be made of some electrically conductive material or a material which is coated with an electrically conductive material, can have a flange at its end facing towards the circuit board. This flange can align the frame when it is fastened to the circuit board with the help of e.g. soldering, welding or gluing. A joint material, which is placed at the intended position on the circuit board next to the component which is to be shielded and with a shape corresponding to the contour of the frame, causes a frame which is not too greatly mispositioned to be displaced to the right position with the help of the surface tension of the joint material. The lid, which comprises a flat surface with walls arranged around all its sides, has its shape and size adapted to the frame so that the lid is either slipped onto the outside of the frame or placed inside it.
An advantage of the present invention is that the protective shield t.akes up minimal space and that it does not leak radiation through the frame.
Another advantage of the present invention is that the fastening is simplified in that the frame is formed of a unit which cannot tip over.
Yet another advantage of the present invention is that with a flange on the frame it can adjust itself to the right position.
Yet another advantage of the present invention is that the mounting on an assembly line is simplified .and that simpler "pick and place" robots can be used.
The invention will now be described more closely with the help of preferred embo- diments and with reference to the appended drawings.
Description of the Figures
Figure 1 shows in perspective an example of .an embodiment of .an EMC- protection according to the invention arranged on a substrate. Figure 2 shows a partial cross section of the EMC-protection in Figure 1.
Figure 3 shows a partial cross section of another example of an embodiment of the EMC -protection. Figure 4 shows a partial cross section of yet another example of an embodiment of the EMC-protection. Figure 5 shows a partial cross section of yet another example of an embodi- ment of the EMC -protection.
Preferred embodiments
Figure 1 shows .an embodiment of a protective shield of the EMC-type 1 according to the invention. The protective shield 1 in this Figure is mounted on a substrate 30. The protective shield comprises a frame 10 and a lid 20. The frame 10 can be fastened to the substrate 30 with the help of gluing, welding or soldering. On the inside of the walls of the frame 10 there are a number of contact elements 11. These contact elements 11 in this embodiment are shaped as tension prongs. The outer dimensions of the lid 20 are adapted to the inner dimensions of the frame 10 according to Figure 2. When the lid 20 is forced down into the frame 10, the side walls 21 of the lid 20 are gripped between the walls of the frame 10 and the tension prongs. The component 40, which one desires to shield, is placed inside the frame 10. Said tension prongs can also be arr.anged on the outside of the frame 10. The inner dimensions of the lid 20 are in this case adapted to the shape and size of the outer dimensions of the frame 10 so that the side walls 21 of the lid 20 are clamped between the tension prongs and the outside of the frame 10.
A variant for contacting the lid 20 to the frame 10 is that the outer dimension of the frame 10 is precisely adapted to the inner dimension of the lid 20 so that these de- tails are mechanically held together and are in electrical contact with each other by the lid 20 being slipped over the frame 10 and contacting it by press-fitting. It is natur-aHy also conceivable that the outer dimension of the lid 20 is adapted according to the inner dimension of the frame 10 so that the lid 20 fits inside the frame 10 so that said electrical contact and mechanical holding between these parts is again formed by press-fitting, see Figure 3. Instead of using tension prongs or press-fitting for forming electrical contact between the frame 10 .and the lid 20, a number of other embodiments can be conceivably used. One variant could be that the fr.ame 10 just like e«arlier is fastened to the substrate 30 in a suitable way. The lid 20 is dimensioned to either fit inside the frame 10 or be threaded over the frame 10. If the lid 20 is intended to fit into the frame 10, then on the outside of the side walls 21 of the lid 20 there could be arranged a number of contact means in the shape of ribs and on the inside of the frame 10 there could be arranged corresponding ribs. The ribs of the lid 20 and the ribs of the frame 10 snap into each other in order in this way to form the mechanical and electrical contact between the lid 20 .and the frame 10, see Figure 5.
Yet another variant can be that the frame 10 has a number of bulges 15 in the form of e.g. hemispheres which .are adapted to corresponding spheres on the side walls 21 of the lid. If there are a number of bulges 25 arranged on the side walls 21 of the lid 20, then there are corresponding depressions 15 .arr.anged on the fr.ame 10. If on the side walls 21 of the lid 20 there are arranged a number of depressions 25, then there are corresponding bulges 15 arranged on the frame 10. The lid 20 can either be adapted to be slipped over the frame 10 or to fit inside it, the depressions or bulges 25 on the side walls 21 fitting into the corresponding bulges or depressions 15 on the frame 10, see Figure 5. This embodiment plus the one with ribs .are especially suitable in the case of small dimensions of the protective shield.
Yet another variant for contacting the lid 20 to the frame 10 is that the lid 20 is arranged with a number of tongues 24 along the side wall 21. These tongues 24 are bent in towards the center of the lid 20 when the lid 20 is to be slipped over the frame 10 and bent out from the center of the lid 20 when the lid 20 is to fit into the frame 10, see Figure 4. The tongues can also at their free ends be bent in towards the side wall 21.
On the frame 10 there can be arranged a flange 12 at the end which is to be connected to the circuit board. The flange 12 can be directed in towards the center of the frame 10 as in Figure 3, or out from the center of the frame 10 as in Figure 4. The flange 12 means that the frame 10 can self-adjust to the right position with the help of the surface-tensioning of the fastening material 50. If the frame 10 is incorrectly placed in relation to a soldering material arranged on the circuit board 30, the frame 10 can move itself to the center of said soldering material when this begins to melt.
In order to achieve as good a shielding bandwidth as possible, the material in the EMC-protection can be manufactured in some electrically conductive material with magnetic qualities.
The walls of the frame 10 can be somewhat bent 12 at the bottom close to the substrate 30 to which the frame 10 is fastened. The bending of the walls close to the substrate can either be in towards the frame 10 or out from the same.
The invention is naturally not limited to the embodiments described above and shown in the drawings, but can be modified within the scope of the accompanying claims.

Claims

Claims
1. Protective shield (1) of EMC-type for e.g. electrical components (40) on a circuit board (30), where the protective shield (1) comprises a frame (10) with associated lid (20), characterized in that said frame (10) at its end facing towards the circuit board (30) comprises a flange (12) arranged to be fastened to the circuit board (30) by means of gluing, welding or soldering, that said frame (10) is intended to surround at least one component (40), wherein electrical contact is formed between said circuit board (30) and said frame (10) and between said frame (10) and said lid (20).
2. Protective shield (1) according to Claim 1, characterized in that the lid (20) comprises side walls (21) which are arranged to contact the frame (10) in such a way that the side walls (21) of the lid are held fast between the inner side of the frame (10) and a number of tension prongs (11) arranged on the inside of the frame (10).
3. Protective shield (1) according to Claim 1 , characterized in that the lid (20) comprises side walls (21) which are arranged to contact the frame (10) in such a way that the side walls (21) of the lid .are held fast between the outside of the frame (10) and a number of tension prongs (11) arranged on the outside of the frame (10).
4. Protective shield (1) according to Claim 1, characterized in that the lid (20) comprises side walls (21) of which the outer dimensions are adapted to the inner dimensions of the frame (10) so that these parts .are held together mechanically and are in electrical contact with each other.
5. Protective shield (1) according to Claim 1, characterized in that the lid (20) comprises side walls (21) of which the inner dimensions are adapted to the outer dimensions of the frame (10) so that these parts are held together mechanically and are in electrical contact with each other.
6. Protective shield (1) according to Claim 4 or 5, characterized in that on the side walls (21) of the lid (10) there are arranged a number of ribs adapted to corresponding ribs arranged on the frame (10).
7. Protective shield (1) according to Claim 4 or 5, characterized in that the frame (10) comprises a number of bulges (15) adapted in shape and size to corresponding depressions (25) arranged on the side walls (21) of the lid (20).
8. Protective shield (1) according to Claim 4 or 5, characterized in that the frame (10) comprises a number of depressions (15) adapted in shape and size to corresponding bulges (25) arranged on the side walls (21) of the lid (20).
9. Protective shield (1) according to Claim 4, characterized in that the lid (20) comprises a number of tongues (24) arranged along the side walls (21) and directed out from the center of the lid (20).
10. Protective shield (1) according to Claim 5, characterized in that the lid (20) comprises a number of tongues (24) .arranged along the side walls (21) and directed in towards the center of the lid (20).
1 1. Protective shield (1) according to Claim 9 or 10, characterized in that the tongues (24) at their free ends are bent in towards the side walls (21).
12. Protective shield according to Claim 11, characterized in that the flange (12) is directed in towards the center of the frame (10).
13. Protective shield according to Claim 11 , characterized in that the flange (12) is directed out from the center of the frame (10).
PCT/SE1997/001371 1996-08-22 1997-08-20 Protective shield of emc-type WO1998008366A1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
AU38746/97A AU3874697A (en) 1996-08-22 1997-08-20 Protective shield of emc-type
EP97935965A EP0920790B1 (en) 1996-08-22 1997-08-20 Protective shield of emc-type
JP10510659A JP2000516403A (en) 1996-08-22 1997-08-20 EMC type protection shield
CA002263769A CA2263769A1 (en) 1996-08-22 1997-08-20 Protective shield of emc-type
DE69731301T DE69731301D1 (en) 1996-08-22 1997-08-20 EMC PROTECTION
HK00101453A HK1022591A1 (en) 1996-08-22 2000-03-08 Protective shield of emc-type

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9603048A SE507255C2 (en) 1996-08-22 1996-08-22 Screen Protectors
SE9603048-1 1996-08-22

Publications (1)

Publication Number Publication Date
WO1998008366A1 true WO1998008366A1 (en) 1998-02-26

Family

ID=20403621

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SE1997/001371 WO1998008366A1 (en) 1996-08-22 1997-08-20 Protective shield of emc-type

Country Status (12)

Country Link
US (1) US6166918A (en)
EP (1) EP0920790B1 (en)
JP (1) JP2000516403A (en)
KR (1) KR20000068148A (en)
CN (1) CN1097425C (en)
AU (1) AU3874697A (en)
CA (1) CA2263769A1 (en)
DE (1) DE69731301D1 (en)
HK (1) HK1022591A1 (en)
SE (1) SE507255C2 (en)
TW (1) TW374976B (en)
WO (1) WO1998008366A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1121006A2 (en) * 2000-01-24 2001-08-01 Alps Electric Co., Ltd. Transmitter-receiver unit that ensures mounting of cover
US8364267B2 (en) 2008-01-28 2013-01-29 Boston Scientific Neuromodulation Corporation Fixation of implantable pulse generators
EP2774465A4 (en) * 2011-10-31 2015-09-09 Thomson Licensing Shielding structure for electronic device

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002094689A (en) * 2000-06-07 2002-03-29 Sony Computer Entertainment Inc Program execution system, program execution device, relay device, and recording medium
US6445583B1 (en) * 2001-01-26 2002-09-03 Laird Technologies, Inc. Snap in heat sink shielding lid
US6377475B1 (en) * 2001-02-26 2002-04-23 Gore Enterprise Holdings, Inc. Removable electromagnetic interference shield
US6744640B2 (en) 2002-04-10 2004-06-01 Gore Enterprise Holdings, Inc. Board-level EMI shield with enhanced thermal dissipation
US6787695B2 (en) * 2002-06-25 2004-09-07 Motorola, Inc Ergonomic shield for assembly to and disassembly from a substrate
US7005573B2 (en) 2003-02-13 2006-02-28 Parker-Hannifin Corporation Composite EMI shield
US7326862B2 (en) * 2003-02-13 2008-02-05 Parker-Hannifin Corporation Combination metal and plastic EMI shield
US7262369B1 (en) 2006-03-09 2007-08-28 Laird Technologies, Inc. Combined board level EMI shielding and thermal management
US7463496B2 (en) * 2006-03-09 2008-12-09 Laird Technologies, Inc. Low-profile board level EMI shielding and thermal management apparatus and spring clips for use therewith
US7317618B2 (en) * 2006-03-09 2008-01-08 Laird Technologies, Inc. Combined board level shielding and thermal management
US7623360B2 (en) * 2006-03-09 2009-11-24 Laird Technologies, Inc. EMI shielding and thermal management assemblies including frames and covers with multi-position latching
US7501587B2 (en) * 2007-04-16 2009-03-10 Laird Technologies, Inc. Mounting clips for use with electromagnetic interference shielding and methods of using the same
TW200946013A (en) * 2008-04-25 2009-11-01 Chi Mei Comm Systems Inc Shielding can structure
CN101573024B (en) * 2008-05-04 2011-06-08 莱尔德电子材料(深圳)有限公司 Shielding device
US8477499B2 (en) 2009-06-05 2013-07-02 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
US7965514B2 (en) 2009-06-05 2011-06-21 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
KR101676672B1 (en) * 2009-10-26 2016-11-16 삼성전자주식회사 Fixing device for shield can
US8213180B2 (en) * 2010-01-21 2012-07-03 Broadcom Corporation Electromagnetic interference shield with integrated heat sink
US8462519B2 (en) * 2010-05-17 2013-06-11 ETL Systems Ltd. Method of shielding a circuit board, circuit board, electromagnetic shield and method of manufacturing same
US20140218851A1 (en) * 2013-02-01 2014-08-07 Microsoft Corporation Shield Can
KR102279365B1 (en) * 2014-09-02 2021-07-21 삼성전자주식회사 Shield Can located on Printed Circuit Board
JP6361556B2 (en) * 2015-04-06 2018-07-25 株式会社デンソー Electronic control unit
WO2017087136A1 (en) * 2015-11-20 2017-05-26 Laird Technologies, Inc. Board level shield including an integrated heat sink
US10446309B2 (en) 2016-04-20 2019-10-15 Vishay Dale Electronics, Llc Shielded inductor and method of manufacturing

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4754101A (en) * 1986-10-23 1988-06-28 Instrument Specialties Co., Inc. Electromagnetic shield for printed circuit board
US5053924A (en) * 1990-03-30 1991-10-01 Motorola, Inc. Electromagnetic shield for electrical circuit
US5150282A (en) * 1990-12-14 1992-09-22 Fujitsu Limited Electromagnetic shielding structure of high-frequency circuit arrangements
US5354951A (en) * 1993-03-15 1994-10-11 Leader Tech, Inc. Circuit board component shielding enclosure and assembly
US5506374A (en) * 1992-04-27 1996-04-09 Kabushiki Kaisha Toshiba Shield cover member for electrically insulating a storage unit

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4890199A (en) * 1988-11-04 1989-12-26 Motorola, Inc. Miniature shield with opposing cantilever spring fingers
US4977483A (en) * 1989-05-25 1990-12-11 Perretta Louis A Electronic component storage album
US5014160A (en) * 1989-07-05 1991-05-07 Digital Equipment Corporation EMI/RFI shielding method and apparatus
US5043848A (en) * 1990-02-01 1991-08-27 Cryptec, Inc. Shielded printed circuit board
US5383098A (en) * 1991-09-19 1995-01-17 Motorola, Inc. Shield assembly
JP2501638Y2 (en) * 1991-11-25 1996-06-19 船井電機株式会社 Shield board for PCB mounting
US5175395A (en) * 1991-11-27 1992-12-29 Rockwell International Corporation Electromagnetic shield
SE503484C2 (en) * 1994-04-11 1996-06-24 Ericsson Telefon Ab L M CAT'S WHISKER
US5495399A (en) * 1994-07-05 1996-02-27 Motorola, Inc. Shield with detachable grasp support member
US5559676A (en) * 1995-06-07 1996-09-24 Gessaman; Martin J. Self-contained drop-in component

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4754101A (en) * 1986-10-23 1988-06-28 Instrument Specialties Co., Inc. Electromagnetic shield for printed circuit board
US5053924A (en) * 1990-03-30 1991-10-01 Motorola, Inc. Electromagnetic shield for electrical circuit
US5150282A (en) * 1990-12-14 1992-09-22 Fujitsu Limited Electromagnetic shielding structure of high-frequency circuit arrangements
US5506374A (en) * 1992-04-27 1996-04-09 Kabushiki Kaisha Toshiba Shield cover member for electrically insulating a storage unit
US5354951A (en) * 1993-03-15 1994-10-11 Leader Tech, Inc. Circuit board component shielding enclosure and assembly

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1121006A2 (en) * 2000-01-24 2001-08-01 Alps Electric Co., Ltd. Transmitter-receiver unit that ensures mounting of cover
EP1121006A3 (en) * 2000-01-24 2003-05-21 Alps Electric Co., Ltd. Transmitter-receiver unit that ensures mounting of cover
US8364267B2 (en) 2008-01-28 2013-01-29 Boston Scientific Neuromodulation Corporation Fixation of implantable pulse generators
EP2774465A4 (en) * 2011-10-31 2015-09-09 Thomson Licensing Shielding structure for electronic device

Also Published As

Publication number Publication date
SE9603048L (en) 1998-02-23
KR20000068148A (en) 2000-11-25
AU3874697A (en) 1998-03-06
SE9603048D0 (en) 1996-08-22
EP0920790A1 (en) 1999-06-09
TW374976B (en) 1999-11-21
CA2263769A1 (en) 1998-02-26
CN1228245A (en) 1999-09-08
US6166918A (en) 2000-12-26
HK1022591A1 (en) 2000-08-11
CN1097425C (en) 2002-12-25
EP0920790B1 (en) 2004-10-20
JP2000516403A (en) 2000-12-05
DE69731301D1 (en) 2004-11-25
SE507255C2 (en) 1998-05-04

Similar Documents

Publication Publication Date Title
US6166918A (en) Protective shield for electrical components
US7135643B2 (en) EMI shield including a lossy medium
KR100337283B1 (en) 2-component electromagnetic radiation shielding device mounted on a printed circuit board
US5175395A (en) Electromagnetic shield
US4829432A (en) Apparatus for shielding an electrical circuit from electromagnetic interference
US5365410A (en) Electromagnetic compatibility enclosure
US5748449A (en) Electrical enclosure for radio
US6194655B1 (en) Circuit board component shielding enclosure and assembly having opposing covers interfitted with upper and lower portions of enclosure
EP0681424A2 (en) Shielded circuit module
US20030218873A1 (en) Structure for fastening a component
US4622527A (en) Isolation of RF signals in a RF shield aperture
US5520554A (en) Cable connection and shielding device
WO1994014218A9 (en) 'clip plate' bulkhead mounting for emi filters
EP0701769A1 (en) Insulator means for suppressing interference radiation in an electric field
EP1643824B1 (en) Tuner assembly
EP0539132B1 (en) EMC-enclosure
KR100622238B1 (en) A mobile communication terminal with holding apparatus for contact
JPH07202465A (en) High frequency appliance
JP3597326B2 (en) High frequency device and electronic device using the same
EP0674476A2 (en) Shielding device
JPH05259683A (en) High frequency electronic apparatus
JP2009099794A (en) Electronic circuit unit
WO2006053639A1 (en) An electromagnetic shield for shielding electrical components on a printed circuit board
KR19990029419U (en) Interchannel Interference Signals and Undesired Isolators in Multichannel Systems
JP2005032672A (en) Electromagnetic relay

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 97197325.3

Country of ref document: CN

AK Designated states

Kind code of ref document: A1

Designated state(s): AL AM AT AU AZ BA BB BG BR BY CA CH CN CU CZ DE DK EE ES FI GB GE GH HU IL IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MD MG MK MN MW MX NO NZ PL PT RO RU SD SE SG SI SK TJ TM TR TT UA UG UZ VN YU AM AZ BY KG KZ MD RU TJ TM

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GH KE LS MW SD SZ UG ZW AT BE CH DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 1997935965

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 1019997001222

Country of ref document: KR

ENP Entry into the national phase

Ref document number: 2263769

Country of ref document: CA

Ref document number: 2263769

Country of ref document: CA

Kind code of ref document: A

Ref document number: 1998 510659

Country of ref document: JP

Kind code of ref document: A

WWP Wipo information: published in national office

Ref document number: 1997935965

Country of ref document: EP

REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

WWP Wipo information: published in national office

Ref document number: 1019997001222

Country of ref document: KR

WWG Wipo information: grant in national office

Ref document number: 1997935965

Country of ref document: EP

WWR Wipo information: refused in national office

Ref document number: 1019997001222

Country of ref document: KR