WO1998018156A1 - Dispositif de traitement de substrats - Google Patents

Dispositif de traitement de substrats Download PDF

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Publication number
WO1998018156A1
WO1998018156A1 PCT/EP1997/005413 EP9705413W WO9818156A1 WO 1998018156 A1 WO1998018156 A1 WO 1998018156A1 EP 9705413 W EP9705413 W EP 9705413W WO 9818156 A1 WO9818156 A1 WO 9818156A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate holder
treatment fluid
substrates
container
area
Prior art date
Application number
PCT/EP1997/005413
Other languages
German (de)
English (en)
Inventor
John Oshinowo
Original Assignee
Steag Microtech Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Steag Microtech Gmbh filed Critical Steag Microtech Gmbh
Publication of WO1998018156A1 publication Critical patent/WO1998018156A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J19/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
    • B01J19/10—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing sonic or ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J19/26—Nozzle-type reactors, i.e. the distribution of the initial reactants within the reactor is effected by their introduction or injection through nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Definitions

  • the invention relates to a device for treating substrates in a container containing a treatment fluid, into which the treatment fluid flows from below, and the substrates are arranged on at least one substrate holder designed as a web.
  • Such devices are used in particular in the treatment of wafers and are known, for example, from DE 44 13 077 AI, DE 195 46 990.9 AI, which goes back to the applicant of the present patent, and also in the unpublished German patent applications DE 196 16 402.8, DE 196 15 969.5 or
  • JP 8-64572 A2 and US 5 370 142 devices for treating substrates are known, in which the treatment fluid is introduced via openings on holder elements which are provided for holding the substrates in the fluid container.
  • a device for wet cleaning of afer is also known, in which the afer are arranged in a cassette which is inserted into the fluid container.
  • Flow control devices in the form of plates projecting transversely into the fluid container are provided on the side walls of the fluid container in order to guide the treatment fluid introduced from above via a pipe and guided onto the container bottom into the cassette and thus to the wafers to be treated.
  • wafer treatment devices are known in which ultrasound is used to improve the treatment process in the fluid container.
  • the invention has for its object to provide a device in which the flow conditions in the container over the entire container cross-section and in particular also in the area of the substrate holder are as uniform as possible in order to be able to treat the substrates regardless of their position in the container and all substrate areas uniformly.
  • the object is achieved according to the invention in that guide elements are provided which guide the treatment fluid in or around the area of the substrate holder.
  • guide elements are provided which guide the treatment fluid in or around the area of the substrate holder.
  • the treatment fluid flowing into the container from below is guided with corresponding guide elements, for example guide plates, in the region of the substrate holder in such a way that even flow conditions also occur in these regions.
  • Another alternative or additional embodiment of the invention consists in providing in the area or in the vicinity of the substrate holder inlet nozzles in the tank bottom which introduce the treatment fluid into the tank area above the substrate holder. This results in even flow conditions in or above the substrate holder area.
  • the substrate holder has outlet openings.
  • the treatment fluid is introduced directly in the area of the substrate support onto the substrate holder and thereby additionally improves the flow conditions in the area and above the substrate holder.
  • At least one channel connected to a treatment fluid supply line is formed in the substrate holder.
  • the outlet openings are connected to the channel, so that uniform outflow and thus flow conditions in the container are ensured over the entire length of the substrate holder.
  • the channel cross-sectional area decreases from the supply point of the treatment fluid to the channel end of the substrate holder.
  • a conical tube is advantageously used as the channel.
  • the treatment fluid can be introduced into the substrate holder from the underside thereof. The treatment fluid is introduced into the substrate holder at one or more points or over the entire length of the substrate holder, and is guided upwards to the outlet openings via fluid guides.
  • the outlet openings are preferably holes, slots and / or nozzles depending on the type of treatment fluid, the type of substrate holder or the flow conditions, in order to match the flow conditions in the area of the substrate holder as evenly as possible to those in the other area of the container.
  • the substrate holder is a knife-like web, as is used in the publications mentioned at the beginning, edge regions of the substrates resting on the knife-like web.
  • the substrate holder in such a way that it has at least one holding region which is adapted to the edge shape of the substrates, as is shown and described, for example, in the unpublished DE 196 40 848.2, in particular also rectangular or square wafers in the fluid container to hold securely and reliably.
  • the knife-like webs usually have incisions evenly spaced along their length for holding the substrates at equidistant intervals.
  • the mounting areas matched to the edge shape of the substrates have equally spaced grooves in which the substrate edges lie.
  • outlet openings are provided between the regions of the substrate holder on which the edges of the substrates rest.
  • the substrate holders are preferably movable in the vertical direction in order to lower the substrates into the container and lift them out of the container.
  • the treatment fluid is preferably at least one chemical liquid, in particular a rinsing liquid.
  • at least one gas for example ozone, as the treatment fluid.
  • the ultrasound source should be arranged in the substrate holder in such a way that, in particular in the case of containers made of plastic, as far as possible no sound reaches the bottom wall in the vicinity of the ultrasound source and in order to prevent the floor from heating up.
  • the use of ultrasound sources supports and significantly shortens the cleaning process of the substrates during the rinsing process.
  • the substrate holder has, alternatively or also cumulatively, outlet openings for the treatment fluid, guide elements for the treatment fluid and / or ultrasound sources.
  • substrates is not only to be understood as wafers, but also a wide variety of objects, the surfaces of which must be treated and / or cleaned, so that the term substrates in particular includes semiconductor wafers, CD's, masks, LED display devices etc.
  • Figure 1 is a schematic representation of a substrate holder designed as a knife-like web with an integrated channel in a perspective view.
  • FIG. 2 shows a reduced, schematic cross section through the substrate holder shown in FIG. 1;
  • Fig. 3 is a schematic cross-sectional view of a
  • Substrate holder in which the treatment fluid is introduced into the substrate holder from below and is guided upward in the substrate holder to the outlet openings;
  • FIG. 4 shows a schematic cross-sectional illustration of an embodiment in which guide elements for the treatment fluid are provided around the substrate holder
  • FIG. 5 shows a schematic cross-sectional illustration of an embodiment in which the substrate holder has ultrasound sources in addition to outlet openings.
  • Fig. 1 shows a substrate holder 1, which is designed as a knife-like web is. 1 with its lower region in a shaft or in a trough 2 of the bottom 3 of a container 4, and thus in a position in which substrates 5 'for treatment are located in the container 4.
  • the substrates 5 are held parallel to one another on a knife-like edge 6 of the substrate holder 1.
  • the knife edge 6 can have notches which are evenly spaced from one another for receiving and for equidistantly holding the substrates 5.
  • a channel 8 extends in its longitudinal direction over its length.
  • the position, the width or the number of the slots 9, 10, 11 can be selected depending on the special circumstances in order to achieve optimal and, in particular, uniform flow conditions for the treatment fluid in the container 4 in the region of the substrate holder 1 and thereby the substrates 5 independently of them To be able to apply or flow around the treatment fluid evenly to the layer and its substrate areas.
  • FIG. 1 shows a schematic cross section shown in FIG. 2 through the substrate holder according to FIG. 1 showing a channel 8 which is conical in the longitudinal direction of the substrate holder 1 and which causes a uniform pressure, a uniform flow volume and a uniform flow over the entire length of the substrate holder 1 Flow velocity in the outlet openings 9, 10, 11 is guaranteed over the entire length of the substrate holder 1.
  • the treatment fluid is introduced into the substrate holder 1 via an arm 12, which can be moved up and down together with the substrate holder 1 in order to lift the substrates 5 into and out of the container 4.
  • the substrate holder 1 is again partially in one
  • the treatment fluid is introduced into the container 1 on the underside of the trough 2 and flows upwards on the one hand between a trough web 13 and the substrate holder 1 and on the other hand through at least one inlet opening 14 into the substrate holder 1 and becomes over fluid guides 15 provided in the interior of the substrate holder 1 are guided to outlet openings 9, 10, 11 in the upper region of the substrate holder 1, from which the treatment fluid then flows out in a corresponding manner, as described in connection with FIG. 1.
  • the substrate holder 1, shown schematically in cross section in FIG. 4, is also located in the trough 2 in the central region of the bottom 3 of the container 4, but has no channels or guides for the treatment fluid in its interior. Instead, are in the area of the substrate holder 1 guide elements 16 are provided which guide the treatment fluid flowing out of the bottom 3 of the container 4 and optionally also out of the trough 2 in the area of the substrate holder 1 such that it optimally also the area to be treated in the area of the substrate holder 1 itself Flows around substrates 5, whereby even flow conditions are created in the critical area of the substrate holder 1.
  • FIG. 5 shows an exemplary embodiment of the substrate holder according to the invention in a schematic cross-sectional view, in which the substrate holder 1 is essentially round and in turn is at least partially located in a correspondingly designed depression 2 on the bottom 3 of the container 4.
  • the substrate holder cross section there are two ultrasound sources 17, 18, between which a slot or channels 19 run or run, which connect the outlet openings 20 to a channel 21, through which, as in the case of the exemplary embodiment according to FIG. 1 and 2, the treatment fluid flows.
  • the area on which the substrates 3 rest on the substrate holder 1 is formed in the embodiment shown in FIG. 5 by two spaced apart webs 22, 23 through which the treatment fluid flowing out of the outlet openings 20 is guided.
  • the treatment fluid is a rinsing fluid
  • the treatment of the substrates with ultrasound or megasound contributes to an acceleration and improvement of the cleaning process.
  • the ultrasound source 17, 18 is arranged as far as possible in the central region of the container bottom 3, because this results in the sonication of the substrates 5 being most uniform.

Abstract

L'invention concerne un dispositif de traitement de substrats (5) placés dans un réservoir (4) contenant un fluide de traitement qui afflue par le bas. Les substrats (5) sont posés sur au moins un support (1). Si le support (1) est pourvu d'orifices d'évacuation (9, 10, 11), ce dispositif procure des conditions d'écoulement particulièrement uniformes du fluide dans l'ensemble du réservoir (4) et même dans la zone des supports (1), ce qui améliore et rend plus uniformes les traitements des substrats (5). Pour une répartition plus uniforme du flux dans le réservoir, on peut également prévoir avec avantage, en plus ou de façon alternative, des éléments de guidage destinés à guider le fluide de traitement à l'intérieur ou autour de la zone du support (1). Il est avantageux d'intégrer au moins une source d'ultrasons au support (1) notamment pour le nettoyage des substrats.
PCT/EP1997/005413 1996-10-24 1997-10-01 Dispositif de traitement de substrats WO1998018156A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19644254.0 1996-10-24
DE1996144254 DE19644254A1 (de) 1996-10-24 1996-10-24 Vorrichtung zum Behandeln von Substraten

Publications (1)

Publication Number Publication Date
WO1998018156A1 true WO1998018156A1 (fr) 1998-04-30

Family

ID=7809900

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP1997/005413 WO1998018156A1 (fr) 1996-10-24 1997-10-01 Dispositif de traitement de substrats

Country Status (3)

Country Link
DE (1) DE19644254A1 (fr)
TW (1) TW354266B (fr)
WO (1) WO1998018156A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130019904A1 (en) * 2011-07-20 2013-01-24 Illinois Tool Works Inc. Batch cleaning apparatus and method for batch cleaning printed circuit boards

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2159328A (en) * 1984-05-21 1985-11-27 Christopher Frank Mcconnell Vessel and apparatus for treating wafers with fluids
US5090432A (en) * 1990-10-16 1992-02-25 Verteq, Inc. Single wafer megasonic semiconductor wafer processing system
JPH06333903A (ja) * 1993-05-21 1994-12-02 Matsushita Electric Ind Co Ltd 半導体ウエハー洗浄槽
JPH0864571A (ja) * 1994-08-23 1996-03-08 Tokyo Electron Ltd 半導体処理システムにおける洗浄装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2653511B2 (ja) * 1989-03-30 1997-09-17 株式会社東芝 半導体装置の洗浄方法及びその洗浄装置
JP3194209B2 (ja) * 1992-11-10 2001-07-30 東京エレクトロン株式会社 洗浄処理装置
DE4413077C2 (de) * 1994-04-15 1997-02-06 Steag Micro Tech Gmbh Verfahren und Vorrichtung zur chemischen Behandlung von Substraten

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2159328A (en) * 1984-05-21 1985-11-27 Christopher Frank Mcconnell Vessel and apparatus for treating wafers with fluids
US5090432A (en) * 1990-10-16 1992-02-25 Verteq, Inc. Single wafer megasonic semiconductor wafer processing system
JPH06333903A (ja) * 1993-05-21 1994-12-02 Matsushita Electric Ind Co Ltd 半導体ウエハー洗浄槽
JPH0864571A (ja) * 1994-08-23 1996-03-08 Tokyo Electron Ltd 半導体処理システムにおける洗浄装置

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 95, no. 3 28 April 1995 (1995-04-28) *
PATENT ABSTRACTS OF JAPAN vol. 96, no. 7 31 July 1996 (1996-07-31) *

Also Published As

Publication number Publication date
TW354266B (en) 1999-03-11
DE19644254A1 (de) 1998-05-07

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