WO1998020718A1 - Heat sink-lead frame structure - Google Patents

Heat sink-lead frame structure Download PDF

Info

Publication number
WO1998020718A1
WO1998020718A1 PCT/US1997/019309 US9719309W WO9820718A1 WO 1998020718 A1 WO1998020718 A1 WO 1998020718A1 US 9719309 W US9719309 W US 9719309W WO 9820718 A1 WO9820718 A1 WO 9820718A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
lead frame
lead
leads
die
Prior art date
Application number
PCT/US1997/019309
Other languages
French (fr)
Inventor
Mohammed Kasem
Carl Shine
Original Assignee
Siliconix Incorporated
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siliconix Incorporated filed Critical Siliconix Incorporated
Priority to AU50876/98A priority Critical patent/AU5087698A/en
Publication of WO1998020718A1 publication Critical patent/WO1998020718A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Definitions

  • This invention relates to a unitary design of heat sink and lead frame structure for semiconductor applications .
  • a typical dual inline surface mount package 10 is shown in Fig. 1.
  • a device 10 includes a heat sink 12 which may, for example, be of copper, and a semiconductor die 14 mounted thereon.
  • Leads 16 are connected to the die 14 by means of conducting wires 18, and the die 14, conducting wires 18, and inner ends of the leads 16 are encapsulated in packaging material 20 as is well known.
  • the extended ends of the leads 16 are soldered to appropriate parts of a printed circuit board 22. It will be seen that a direct heat conduction path is provided from the die 14 inside the package 20 through the heat sink 12 to the board 22.
  • the structure can deal with a relatively large amount of power, and can also appropriately dissipate a relatively large amount of heat.
  • a surface mount package includes a unitary combination heat sink and lead frame, the heat sink having mounted thereon a semiconductor die and being mounted to a printed circuit board.
  • the heat sink and certain leads of the lead frame provide heat conduction paths from the die to the printed circuit board, for highly effective dissipation of heat.
  • Figs. 1, 2 and 3 are cross sectional views showing prior art devices
  • Fig. 4 is a plan view of the present inventive unitary heat sink-lead frame structure
  • Fig. 5 is a cross-sectional view of the inventive device
  • Fig. 6 is a cross-sectional view of the basic element used in achieving the invention of Fig. 4.
  • the heat sink-lead frame structure 30 is shown as having 16 leads 32, including four leads 32A which extend from the heat sink 34, and 12 leads 32B which in accordance with common practice have their inner ends spaced frame and not connected to the heat sink 34 (of course, all leads of the lead frame in this form are connected by tie bars 36 as is well known, which will later be cut away, resulting in the leads 32A not being connected to the heat sink 34 in any manner) .
  • the heat sink 34 is mounted directly to a printed circuit board 38, and has mounted thereon a semiconductor die.
  • the die 40 is connected by conducting wires 42 to the leads 32, and the extended ends of the leads 32 are soldered to the printed circuit board 38.
  • the die 40 has ground pads 54 connected by conducting wires 42 to the leads 32A which in turn extend from the heat sink 34, so that the leads 32A act as ground leads, meanwhile with other conducting wires connecting the die 40 and leads 32B so that those leads 32B are signal leads.
  • the die 40 and inner ends of the leads 32, along with the conductive wires 42, are housed in appropriate packaging material 44 (also noted in dotted line in Fig. 4) , and the tie bars 36 are cut away, all as is well known, in forming the final device 46, which includes heat sink 34 and leads 32A extending therefrom as a unitary, single piece structure.
  • the heat sink 34 acts as a heat path for the die 40, as do the individual leads 32A extending from the heat sink 34.
  • This structure overcomes problems of the prior devices by including additional heat conduction paths which provide good thermal conductivity, meanwhile with the structure being low cost and avoiding the problems of poor thermal conduction adhesive tape, or the interfacial resistance in the riveting approach described above.
  • the lead frame-heat sink structure 30 can with advantage be formed by the dual gauge copper structure 48 of Fig. 6, wherein the relatively thick portion 48A which will define the heat sink 34 has a thickness X between the arrows which is 50 mils, while the portions 48B which will define the leads 32 have a thickness indicated by Y between the arrows which is 15 mils.

Abstract

A surface mount package includes a unitary combination heat sink and lead frame, the heat sink (34) having mounted thereon a semiconductor die (40) and being mounted to a printed circuit board (38). The heat sink (34) and certain leads (32a) of the lead frame provide heat conduction paths from the die (40) to the printed circuit board (38), for highly efficient dissipation of heat.

Description

HEAT SINK- EAD FRAME STRUCTURE
FIELD OF THE INVENTION
This invention relates to a unitary design of heat sink and lead frame structure for semiconductor applications .
BACKGROUND OF THE INVENTION
A typical dual inline surface mount package 10 is shown in Fig. 1. Such a device 10 includes a heat sink 12 which may, for example, be of copper, and a semiconductor die 14 mounted thereon. Leads 16 are connected to the die 14 by means of conducting wires 18, and the die 14, conducting wires 18, and inner ends of the leads 16 are encapsulated in packaging material 20 as is well known. The extended ends of the leads 16 are soldered to appropriate parts of a printed circuit board 22. It will be seen that a direct heat conduction path is provided from the die 14 inside the package 20 through the heat sink 12 to the board 22. As a result, the structure can deal with a relatively large amount of power, and can also appropriately dissipate a relatively large amount of heat. However, in the interest of adding cooling capacity to the structure, additional heat conduction paths have been used. For example, with reference to Fig. 2, double-sided thermally conductive adhesive film on tape 24 is used to attach certain leads 16 to the heat sink 12. While this structure has some advantages, the adhesive tape 24 has poor thermal conduction characteristics, and is also relatively expensive . In Fig. 3, certain leads 16 are riveted directly to the heat sink 12 by means of rivets 26, providing leads 16 as additional paths for the dissipation of die heat to the printed circuit board 22. This device, however, provides a high level of interfacial resistance between the leads 16 and heat sink 12.
Also, this approach is expensive and has reliability problems .
SUMMARY OF THE INVENTION In accordance with the present invention, a surface mount package includes a unitary combination heat sink and lead frame, the heat sink having mounted thereon a semiconductor die and being mounted to a printed circuit board. The heat sink and certain leads of the lead frame provide heat conduction paths from the die to the printed circuit board, for highly effective dissipation of heat.
BRIEF DESCRIPTION OF THE DRAWINGS Figs. 1, 2 and 3 are cross sectional views showing prior art devices;
Fig. 4 is a plan view of the present inventive unitary heat sink-lead frame structure; Fig. 5 is a cross-sectional view of the inventive device; and
Fig. 6 is a cross-sectional view of the basic element used in achieving the invention of Fig. 4.
DESCRIPTION OF THE PREFERRED EMBODIMENT
With reference to Figs. 4 and 5, shown therein is an embodiment of the present invention. As shown in Fig. 4, a unitary structure, heat sink-lead frame 30, i.e., a single piece having no separate parts, is provided as the basis thereof. The heat sink-lead frame structure 30 is shown as having 16 leads 32, including four leads 32A which extend from the heat sink 34, and 12 leads 32B which in accordance with common practice have their inner ends spaced frame and not connected to the heat sink 34 (of course, all leads of the lead frame in this form are connected by tie bars 36 as is well known, which will later be cut away, resulting in the leads 32A not being connected to the heat sink 34 in any manner) .
With reference to Fig. 5, the heat sink 34 is mounted directly to a printed circuit board 38, and has mounted thereon a semiconductor die. The die 40 is connected by conducting wires 42 to the leads 32, and the extended ends of the leads 32 are soldered to the printed circuit board 38. In Fig. 5, the die 40 has ground pads 54 connected by conducting wires 42 to the leads 32A which in turn extend from the heat sink 34, so that the leads 32A act as ground leads, meanwhile with other conducting wires connecting the die 40 and leads 32B so that those leads 32B are signal leads.
The die 40 and inner ends of the leads 32, along with the conductive wires 42, are housed in appropriate packaging material 44 (also noted in dotted line in Fig. 4) , and the tie bars 36 are cut away, all as is well known, in forming the final device 46, which includes heat sink 34 and leads 32A extending therefrom as a unitary, single piece structure.
It will be seen that the heat sink 34 acts as a heat path for the die 40, as do the individual leads 32A extending from the heat sink 34.
This structure overcomes problems of the prior devices by including additional heat conduction paths which provide good thermal conductivity, meanwhile with the structure being low cost and avoiding the problems of poor thermal conduction adhesive tape, or the interfacial resistance in the riveting approach described above.
The lead frame-heat sink structure 30 can with advantage be formed by the dual gauge copper structure 48 of Fig. 6, wherein the relatively thick portion 48A which will define the heat sink 34 has a thickness X between the arrows which is 50 mils, while the portions 48B which will define the leads 32 have a thickness indicated by Y between the arrows which is 15 mils.

Claims

CLAIMSWhat we claim is:
1. A structure comprising a heat sink and a lead frame, the heat sink and lead frame being a unitary structure.
2. The structure of Claim 1 wherein the lead frame comprises at least one lead.
3. The structure of Claim 1 wherein the lead frame comprises a plurality of leads.
4. The structure of Claim 1 and further comprising a semiconductor die mounted on the heat sink.
5. The structure of Claim 1 wherein the heat sink-lead frame unitary structure is copper.
6. The structure of Claim 1 wherein the heat sink-lead frame unitary structure is a dual-gauge element .
7. A device comprising a heat sink and a lead extending therefrom, the heat sink and lead being a unitary structure .
8. The device of Claim 7 and further comprising a die mounted on the heat sink.
9. The device of Claim 8 and further comprising a conductive connector connecting the die and lead.
10. The device of Claim 9 and further comprising a printed circuit board on which the heat sink is mounted .
11. The device of Claim 10 and further comprising an encapsulating member on the die and from which the lead extends .
12. The device of Claim 7 wherein the heat sink- lead unitary structure is copper.
13. The device of Claim 7 wherein the heat sink- lead unitary structure is a dual-gauge element.
AMENDED CLAIMS
[received by the International Bureau on 10 April 1998 (10.04.98); original claims 1-13 replaced by amended claims 1-7 (2 pages)]
1. A structure comprising a semiconductor die, heat sink and a lead frame, said lead frame comprising a plurality of thermally and electrically conductive leads, at least two of said leads being thermally connected to said heat sink and electrically connected to said semiconductor die, the other's of said plurality of conductive leads being only electrically connected to said semiconductor die, the heat sink and the lead frame, including all of said leads, being a unitary structure.
2. The structure of Claim 1 wherein the heat sink-lead frame unitary structure is copper.
3. The structure of Claim 1 wherein the heat sink-lead frame unitary structure is a dual-gauge element .
4. The device of Claim 1 and further comprising a printed circuit board on which the heat sink is mounted.
5. The device of Claim 1 and further comprising an encapsulating member on the die and from which said leads extend.
6. The device of Claim 4 wherein the heat sink- lead unitary structure is copper.
7. The device of Claim 4 wherein the heat sink- lead unitary structure is a dual-gauge element.
PCT/US1997/019309 1996-11-06 1997-11-03 Heat sink-lead frame structure WO1998020718A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU50876/98A AU5087698A (en) 1996-11-06 1997-11-03 Heat sink-lead frame structure

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US74606496A 1996-11-06 1996-11-06
US08/746,064 1996-11-06

Publications (1)

Publication Number Publication Date
WO1998020718A1 true WO1998020718A1 (en) 1998-05-14

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PCT/US1997/019309 WO1998020718A1 (en) 1996-11-06 1997-11-03 Heat sink-lead frame structure

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AU (1) AU5087698A (en)
WO (1) WO1998020718A1 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999007023A1 (en) * 1997-07-29 1999-02-11 Osram Opto Semiconductors Gmbh & Co. Ohg Optoelectronic component
WO2005057672A2 (en) * 2003-12-09 2005-06-23 Gelcore, Llc Surface mount light emitting chip package
US7005311B2 (en) 1993-09-30 2006-02-28 Osram Gmbh Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof
JP2007184643A (en) * 2007-03-28 2007-07-19 Toshiba Electronic Engineering Corp Optical semiconductor package
JP2010287914A (en) * 2010-09-14 2010-12-24 Toshiba Electronic Engineering Corp Optical semiconductor package
US8097937B2 (en) 2001-04-10 2012-01-17 Osram Ag Leadframe and housing for radiation-emitting component, radiation-emitting component, and a method for producing the component
JP2014042079A (en) * 2013-12-02 2014-03-06 Toshiba Electronic Engineering Corp Optical semiconductor package
US9947612B2 (en) 2015-12-03 2018-04-17 Stmicroelectronics, Inc. Semiconductor device with frame having arms and related methods

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5289344A (en) * 1992-10-08 1994-02-22 Allegro Microsystems Inc. Integrated-circuit lead-frame package with failure-resistant ground-lead and heat-sink means

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5289344A (en) * 1992-10-08 1994-02-22 Allegro Microsystems Inc. Integrated-circuit lead-frame package with failure-resistant ground-lead and heat-sink means

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7005311B2 (en) 1993-09-30 2006-02-28 Osram Gmbh Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof
US7288831B2 (en) 1993-09-30 2007-10-30 Osram Gmbh Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof
US7102212B2 (en) 1993-09-30 2006-09-05 Osram Gmbh Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof
US7183632B2 (en) 1997-07-29 2007-02-27 Osram Gmbh Surface-mountable light-emitting diode structural element
EP1566846A2 (en) * 1997-07-29 2005-08-24 Osram Opto Semiconductors GmbH Optoelectronic device
WO1999007023A1 (en) * 1997-07-29 1999-02-11 Osram Opto Semiconductors Gmbh & Co. Ohg Optoelectronic component
US7102215B2 (en) 1997-07-29 2006-09-05 Osram Gmbh Surface-mountable light-emitting diode structural element
US6759733B2 (en) 1997-07-29 2004-07-06 Osram Opto Semiconductors Gmbh Optoelectric surface-mountable structural element
JP2009152639A (en) * 1997-07-29 2009-07-09 Osram Opto Semiconductors Gmbh Surface-mountable photoelectric element
EP1566846A3 (en) * 1997-07-29 2009-08-19 OSRAM Opto Semiconductors GmbH Optoelectronic device
US6469321B2 (en) 1997-07-29 2002-10-22 Osram Opto Semiconductors Gmbh & Co. Ohg Surface-mountable light-emitting diode structural element
US7508002B2 (en) 1997-07-29 2009-03-24 Osram Gmbh Surface-mountable light-emitting diode structural element
EP1378013B1 (en) * 2001-04-10 2015-09-30 OSRAM Opto Semiconductors GmbH Housing for a radiation-emitting component, radiation emitting component and method for producing the same
US8097937B2 (en) 2001-04-10 2012-01-17 Osram Ag Leadframe and housing for radiation-emitting component, radiation-emitting component, and a method for producing the component
WO2005057672A3 (en) * 2003-12-09 2006-04-06 Gelcore Llc Surface mount light emitting chip package
JP2007514320A (en) * 2003-12-09 2007-05-31 ゲルコアー リミテッド ライアビリティ カンパニー Surface mount light emitting chip package
KR101311635B1 (en) 2003-12-09 2013-09-26 젤코어 엘엘씨 Surface mount light emitting chip package
WO2005057672A2 (en) * 2003-12-09 2005-06-23 Gelcore, Llc Surface mount light emitting chip package
JP2007184643A (en) * 2007-03-28 2007-07-19 Toshiba Electronic Engineering Corp Optical semiconductor package
JP2010287914A (en) * 2010-09-14 2010-12-24 Toshiba Electronic Engineering Corp Optical semiconductor package
JP2014042079A (en) * 2013-12-02 2014-03-06 Toshiba Electronic Engineering Corp Optical semiconductor package
US9947612B2 (en) 2015-12-03 2018-04-17 Stmicroelectronics, Inc. Semiconductor device with frame having arms and related methods
US11004776B2 (en) 2015-12-03 2021-05-11 Stmicroelectronics, Inc. Semiconductor device with frame having arms and related methods
US11715677B2 (en) 2015-12-03 2023-08-01 Stmicroelectronics, Inc. Semiconductor device with frame having arms

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