WO1998021272A3 - Manufacture of composites of inorganic powder and polymer materials - Google Patents

Manufacture of composites of inorganic powder and polymer materials Download PDF

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Publication number
WO1998021272A3
WO1998021272A3 PCT/US1997/019104 US9719104W WO9821272A3 WO 1998021272 A3 WO1998021272 A3 WO 1998021272A3 US 9719104 W US9719104 W US 9719104W WO 9821272 A3 WO9821272 A3 WO 9821272A3
Authority
WO
WIPO (PCT)
Prior art keywords
mixtures
materials
polymer
inorganic
composites
Prior art date
Application number
PCT/US1997/019104
Other languages
French (fr)
Other versions
WO1998021272A2 (en
Inventor
Richard A Holl
Original Assignee
Richard A Holl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Richard A Holl filed Critical Richard A Holl
Publication of WO1998021272A2 publication Critical patent/WO1998021272A2/en
Publication of WO1998021272A3 publication Critical patent/WO1998021272A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B9/00—Making granules
    • B29B9/02—Making granules by dividing preformed material
    • B29B9/04—Making granules by dividing preformed material in the form of plates or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
    • B01F23/50—Mixing liquids with solids
    • B01F23/59—Mixing systems, i.e. flow charts or diagrams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
    • B01F35/80—Forming a predetermined ratio of the substances to be mixed
    • B01F35/83—Forming a predetermined ratio of the substances to be mixed by controlling the ratio of two or more flows, e.g. using flow sensing or flow controlling devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/16—Cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
    • B29C67/24—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 characterised by the choice of material
    • B29C67/242—Moulding mineral aggregates bonded with resin, e.g. resin concrete
    • B29C67/245—Moulding mineral aggregates bonded with resin, e.g. resin concrete for making articles of indefinite length
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C08J3/205—Compounding polymers with additives, e.g. colouring in the presence of a continuous liquid phase
    • C08J3/21—Compounding polymers with additives, e.g. colouring in the presence of a continuous liquid phase the polymer being premixed with a liquid phase
    • C08J3/215—Compounding polymers with additives, e.g. colouring in the presence of a continuous liquid phase the polymer being premixed with a liquid phase at least one additive being also premixed with a liquid phase
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Abstract

Composite materials comprising at least 70 volume % of particles of finely powdered inorganic material in a matrix of polymer material are made by forming separate mixtures of the components in respective liquid dispersion media, mixing the mixtures to produce thorough dispersion of the components together, dewatering the mixture and forming green articles therefrom. The green articles are heated and pressed to a temperature sufficient to melt the polymer and to a pressure sufficient to disperse the melted polymer into the interstices between the inorganic particles. Mixtures of different inorganic materials may be used to tailor the electrical and physical properties of the final materials. The inorganic materials may be obtained in finely divided form by precipitation or coprecipitation. The articles preferably comprise substrates for use in electronic circuits.
PCT/US1997/019104 1996-10-29 1997-10-24 Manufacture of composites of inorganic powder and polymer materials WO1998021272A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US73861296A 1996-10-29 1996-10-29
US08/738,612 1996-10-29

Publications (2)

Publication Number Publication Date
WO1998021272A2 WO1998021272A2 (en) 1998-05-22
WO1998021272A3 true WO1998021272A3 (en) 1998-10-15

Family

ID=24968736

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1997/019104 WO1998021272A2 (en) 1996-10-29 1997-10-24 Manufacture of composites of inorganic powder and polymer materials

Country Status (1)

Country Link
WO (1) WO1998021272A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19751542A1 (en) 1997-11-20 1999-07-29 Siemens Ag Plastics material with spherical silicon dioxide filler of specific particle size and having negative coefficient of thermal expansion
US6608760B2 (en) * 1998-05-04 2003-08-19 Tpl, Inc. Dielectric material including particulate filler
US20030187117A1 (en) * 2002-03-29 2003-10-02 Starkovich John A. Materials and method for improving dimensional stability of precision electronic optical photonic and spacecraft components and structures
DE102015000262A1 (en) * 2015-01-16 2016-07-21 Sandvik Tps Zweigniederlassung Der Sandvik Materials Technology Deutschland Gmbh Process for producing a thermoplastic granulate
RU2765969C1 (en) * 2021-03-29 2022-02-07 Федеральное государственное автономное образовательное учреждение высшего образования "Национальный исследовательский технологический университет "МИСиС" Hybrid composite material

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4335180A (en) * 1978-12-26 1982-06-15 Rogers Corporation Microwave circuit boards
US4849284A (en) * 1987-02-17 1989-07-18 Rogers Corporation Electrical substrate material
US4954481A (en) * 1988-12-29 1990-09-04 The United States Of America As Represented By The Secretary Of Commerce Superconductor-polymer composites
US5011872A (en) * 1987-12-21 1991-04-30 The Carborudum Company Thermally conductive ceramic/polymer composites
US5024871A (en) * 1990-02-21 1991-06-18 Rogers Corporation Ceramic filled fluoropolymetric composite material
US5182173A (en) * 1990-05-07 1993-01-26 Rogers Corporation Coated particles and method for making same
US5223568A (en) * 1987-05-14 1993-06-29 Rogers Corporation Process for forming hard shaped molded article of a cross-linked liquid polybutadiene or polyisoprene resin and a butadiene or isoprene containing solid polymer and resulting articles
US5312576A (en) * 1991-05-24 1994-05-17 Rogers Corporation Method for making particulate filled composite film
US5354611A (en) * 1990-02-21 1994-10-11 Rogers Corporation Dielectric composite
US5358775A (en) * 1993-07-29 1994-10-25 Rogers Corporation Fluoropolymeric electrical substrate material exhibiting low thermal coefficient of dielectric constant
US5374453A (en) * 1991-05-24 1994-12-20 Rogers Corporation Particulate filled composite film and method of making same
US5393604A (en) * 1988-01-28 1995-02-28 Mcdonnell Douglas Corporation Production of silica "green" tape and co-fired silica substrates therefrom
US5418056A (en) * 1989-11-24 1995-05-23 Mitsuboshi Belting Ltd. Polymer composite with dispersed fine grains and a method for manufacturing the same
US5506049A (en) * 1991-05-24 1996-04-09 Rogers Corporation Particulate filled composite film and method of making same

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4335180A (en) * 1978-12-26 1982-06-15 Rogers Corporation Microwave circuit boards
US4849284A (en) * 1987-02-17 1989-07-18 Rogers Corporation Electrical substrate material
US5223568A (en) * 1987-05-14 1993-06-29 Rogers Corporation Process for forming hard shaped molded article of a cross-linked liquid polybutadiene or polyisoprene resin and a butadiene or isoprene containing solid polymer and resulting articles
US5011872A (en) * 1987-12-21 1991-04-30 The Carborudum Company Thermally conductive ceramic/polymer composites
US5393604A (en) * 1988-01-28 1995-02-28 Mcdonnell Douglas Corporation Production of silica "green" tape and co-fired silica substrates therefrom
US4954481A (en) * 1988-12-29 1990-09-04 The United States Of America As Represented By The Secretary Of Commerce Superconductor-polymer composites
US5418056A (en) * 1989-11-24 1995-05-23 Mitsuboshi Belting Ltd. Polymer composite with dispersed fine grains and a method for manufacturing the same
US5024871A (en) * 1990-02-21 1991-06-18 Rogers Corporation Ceramic filled fluoropolymetric composite material
US5354611A (en) * 1990-02-21 1994-10-11 Rogers Corporation Dielectric composite
US5182173A (en) * 1990-05-07 1993-01-26 Rogers Corporation Coated particles and method for making same
US5374453A (en) * 1991-05-24 1994-12-20 Rogers Corporation Particulate filled composite film and method of making same
US5312576A (en) * 1991-05-24 1994-05-17 Rogers Corporation Method for making particulate filled composite film
US5506049A (en) * 1991-05-24 1996-04-09 Rogers Corporation Particulate filled composite film and method of making same
US5312576B1 (en) * 1991-05-24 2000-04-18 World Properties Inc Method for making particulate filled composite film
US5506049C1 (en) * 1991-05-24 2001-05-29 World Properties Inc Particulate filled composite film and method of making same
US5358775A (en) * 1993-07-29 1994-10-25 Rogers Corporation Fluoropolymeric electrical substrate material exhibiting low thermal coefficient of dielectric constant

Also Published As

Publication number Publication date
WO1998021272A2 (en) 1998-05-22

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