WO1998028108A1 - Manufacture of porous polishing pad - Google Patents

Manufacture of porous polishing pad Download PDF

Info

Publication number
WO1998028108A1
WO1998028108A1 PCT/SG1996/000020 SG9600020W WO9828108A1 WO 1998028108 A1 WO1998028108 A1 WO 1998028108A1 SG 9600020 W SG9600020 W SG 9600020W WO 9828108 A1 WO9828108 A1 WO 9828108A1
Authority
WO
WIPO (PCT)
Prior art keywords
polishing pad
manufacture
pad
filings
porous
Prior art date
Application number
PCT/SG1996/000020
Other languages
French (fr)
Inventor
Kazunori Tani
Original Assignee
Unique Technology International Private Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unique Technology International Private Limited filed Critical Unique Technology International Private Limited
Priority to PCT/SG1996/000020 priority Critical patent/WO1998028108A1/en
Publication of WO1998028108A1 publication Critical patent/WO1998028108A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D15/00—Hand tools or other devices for non-rotary grinding, polishing, or stropping
    • B24D15/04—Hand tools or other devices for non-rotary grinding, polishing, or stropping resilient; with resiliently-mounted operative surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/22—Rubbers synthetic or natural
    • B24D3/26—Rubbers synthetic or natural for porous or cellular structure

Definitions

  • This invention relates to the manufacture of a porous polishing pad to yield a super mirror polished surface, that is both planar and scratch-free.
  • Polishing pad is used in several industries, such as in the manufacture of magnetic disk substrate and silicon wafer fabrication, where a smooth planar surface must be produced.
  • Stock removal rate during polishing is proportional to pressure, velocity, time and abrasive grain size.
  • the circumferential speed is higher, so is the removal rate. This is aggravated by the ready supply of abrasive near the circumference of the work piece.
  • the work piece invariably, becomes non-planar; this is normally overcome by polishing the workpiece in planetary motions.
  • a polishing pad must ideally be planar, rigid and durable and the surface must be porous and capable of holding the abrasive; as the workpiece is being rotated and moved in orbits, the polishing pad discharges the abrasive slurry.
  • the problem with the current polyurethane foam is that the pocket-type pore's size and shape are not consistent and they are easily plugged up; once this occurs, the polishing efficiency is low and the foam surface has to be dressed periodically.
  • the polyurethane material also changes its elasticity as it ages; the abrasive slurry is, therefore, not effectively discharged and the resultant non-uniform distribution of the abrasive over the polishing surface is not desirable.
  • the polyurethane foam surface is ground flat with a belt grinder; however, the ground surface is invariably wavy and, therefore, not desired.
  • a porous polishing pad comprising of implanting the metallic or polymeric filings onto the adhesive layer of a backing cloth in an electric field, roll coating of the pad polymer and after curing, etch away the metallic filings with acid or dissolve the polymeric filings with a solvent/acid to yield a porous polishing pad, which has consistent pore size, shape, orientation, density and pattern, and a flat surface that can maintain constant polishing conditions and, hence, able to produce a super mirror-polished surface, which is both planar and scratch-free.
  • This polishing pad with controllable pore size, shape, orientation, density and pattern allows uniform distribution of abrasives across the polishing surface and hence able to give a super mirror-polished surface to the workpiece.
  • Figure 1 shows the set up for the manufacturing of the new polishing pad.
  • Figure 2 shows the porous polishing pad with different pore sizes, shapes, orientation, density and patterns. Description of the invention:
  • Figure 1 shows one embodiment of the present invention.
  • a backing cloth 1 is coated with an adhesive 2.
  • One means of preferred coating is known as roll coating 3.
  • Metallic filings 4 are dispersed on the backing cloth in an electrostatic field E. They are dispersed evenly by mutual repulsion, but aligned longitudinally to the electric field.
  • another set of roll coating 5 apply a layer of pad polymer 6 onto the implanted filings.
  • the coating roller surface can be plain or patterned; a plain roller will coat a uniform layer of the pad polymer onto the implanted filings; a patterned roller will apply the polymer according to the pattern of the roller surface.
  • the thickness of the pad polymer is controlled by metering the roller gap;
  • Many pad polymers can be used, such as polyurethane, polyamide, ultra high molecular weight polyethene and so on.
  • the polymer pad is subjected to an acid, which etches away the metal filings and produces a uniform strip of porous pad; the pore size and shape can be controlled by the filing size and shape, while the pore orientation can be controlled by the inclination of the backing cloth with respect to the electric field direction.
  • an electromagnetic field B perpendicular to the electric field can be applied and the orientation of the plate-like filings in the x-z plane can be controlled; a porous polymer with rectangular pores in different patterns can then be manufactured.
  • the pore density can be controlled by both the electrostatic field strength E and the backing cloth feed speed, F.
  • Figure 2 shows some examples of the porous polishing pad with different pore sizes, shapes, orientation and patterns.
  • the patterned porous pad is desirable because the polishing debris can be discharged during polishing, and prevents scratching the newly polished surface.
  • the filings 4 are made of another polymer, such as cellulose acetate for example.
  • the polymeric filings are longitudinally aligned with the field and implanted on the adhesive. By roll coating the pad polymer, just as is described above and, thereafter, dissolving away the polymeric filings with a solvent, such as acetone for example or an acid, a porous polymer pad is also obtained.
  • a solvent such as acetone for example or an acid
  • a plastic film such as polyethene and so on, can be used instead of a backing cloth.
  • the tape is coated with an adhesive by roll coating, implanted with metallic or polymeric filings and the pad polymer is coated onto the implanted filings, the filings are then etched or dissolved to produce a porous polishing pad; the plastic film is then peeled off and a new backing cloth is adhered to the polishing pad to give it strength.
  • the pad polymer 6 can be applied onto the implanted filings by other printing methods, such as screen printing for example, either uniformly or patterned, instead of roll coating as described earlier.

Abstract

A new method for manufacturing a porous polishing pad by implanting metallic or polymeric filings as pore former on a backing cloth/film inside an electric and/or magnetic field, coating the pad polymer onto the implanted filings and, thereafter, etc away or dissolve the pore former; the pores of the porous polymer can be controlled by the filing size and shape. The pore orientation, density and pattern can also be controlled. This porous polishing pad has consistent pore size, shape, orientation and density, and a flat surface; the pad polymer can be coated in different patterns. This new polishing pad is able to maintain constant polishing conditions and hence, produces a planar and super mirror-polished surface.

Description

Title: Manufacture of Porous Polishing Pad
Technical field:
This invention relates to the manufacture of a porous polishing pad to yield a super mirror polished surface, that is both planar and scratch-free.
Background:
Polishing pad is used in several industries, such as in the manufacture of magnetic disk substrate and silicon wafer fabrication, where a smooth planar surface must be produced.
Stock removal rate during polishing is proportional to pressure, velocity, time and abrasive grain size. The circumferential speed is higher, so is the removal rate. This is aggravated by the ready supply of abrasive near the circumference of the work piece. The work piece, invariably, becomes non-planar; this is normally overcome by polishing the workpiece in planetary motions.
A polishing pad must ideally be planar, rigid and durable and the surface must be porous and capable of holding the abrasive; as the workpiece is being rotated and moved in orbits, the polishing pad discharges the abrasive slurry. The problem with the current polyurethane foam is that the pocket-type pore's size and shape are not consistent and they are easily plugged up; once this occurs, the polishing efficiency is low and the foam surface has to be dressed periodically. The polyurethane material also changes its elasticity as it ages; the abrasive slurry is, therefore, not effectively discharged and the resultant non-uniform distribution of the abrasive over the polishing surface is not desirable. After manufacturing, the polyurethane foam surface is ground flat with a belt grinder; however, the ground surface is invariably wavy and, therefore, not desired. Object of invention:
It is the primary object of the invention to provide a new method for manufacturing a porous polishing pad, which has consistent pore sizes, shape, orientation and density, and a flat surface so as both to maintain constant polishing conditions and to give a super mirror-polished surface, which is both planar and scratch-free.
It is another object to improve on the yield of the polishing process and yet another to select both a durable and an elastic material.
Summary of the invention:
The manufacture of a porous polishing pad comprising of implanting the metallic or polymeric filings onto the adhesive layer of a backing cloth in an electric field, roll coating of the pad polymer and after curing, etch away the metallic filings with acid or dissolve the polymeric filings with a solvent/acid to yield a porous polishing pad, which has consistent pore size, shape, orientation, density and pattern, and a flat surface that can maintain constant polishing conditions and, hence, able to produce a super mirror-polished surface, which is both planar and scratch-free.
This polishing pad with controllable pore size, shape, orientation, density and pattern allows uniform distribution of abrasives across the polishing surface and hence able to give a super mirror-polished surface to the workpiece.
Brief description of the figures:
The accompanying drawings constitute a part of the description of the invention, illustrate and serve to explain the principles of the invention. It is understood, however, that the drawings are for purposes of illustration only, and not as a definition of the limits of the invention for which reference should be made to the claims at the end of this description:
Figure 1 shows the set up for the manufacturing of the new polishing pad.
Figure 2 shows the porous polishing pad with different pore sizes, shapes, orientation, density and patterns. Description of the invention:
Figure 1 shows one embodiment of the present invention. A backing cloth 1 is coated with an adhesive 2. One means of preferred coating is known as roll coating 3. Metallic filings 4 are dispersed on the backing cloth in an electrostatic field E. They are dispersed evenly by mutual repulsion, but aligned longitudinally to the electric field. At the other end, another set of roll coating 5 apply a layer of pad polymer 6 onto the implanted filings. The coating roller surface can be plain or patterned; a plain roller will coat a uniform layer of the pad polymer onto the implanted filings; a patterned roller will apply the polymer according to the pattern of the roller surface. The thickness of the pad polymer is controlled by metering the roller gap; Many pad polymers can be used, such as polyurethane, polyamide, ultra high molecular weight polyethene and so on. After curing, the polymer pad is subjected to an acid, which etches away the metal filings and produces a uniform strip of porous pad; the pore size and shape can be controlled by the filing size and shape, while the pore orientation can be controlled by the inclination of the backing cloth with respect to the electric field direction. When the filings are plate-like, an electromagnetic field B perpendicular to the electric field can be applied and the orientation of the plate-like filings in the x-z plane can be controlled; a porous polymer with rectangular pores in different patterns can then be manufactured. The pore density can be controlled by both the electrostatic field strength E and the backing cloth feed speed, F. When a patterned roller is used to apply the pad polymer onto the backing cloth, the resultant porous pad with the polymer in any pattern can be produced.
Figure 2 shows some examples of the porous polishing pad with different pore sizes, shapes, orientation and patterns. The patterned porous pad is desirable because the polishing debris can be discharged during polishing, and prevents scratching the newly polished surface. In another embodiment; instead of metallic filings, the filings 4 are made of another polymer, such as cellulose acetate for example. In the electric field, the polymeric filings are longitudinally aligned with the field and implanted on the adhesive. By roll coating the pad polymer, just as is described above and, thereafter, dissolving away the polymeric filings with a solvent, such as acetone for example or an acid, a porous polymer pad is also obtained.
In another embodiment, instead of a backing cloth, a plastic film, such as polyethene and so on, can be used. The tape is coated with an adhesive by roll coating, implanted with metallic or polymeric filings and the pad polymer is coated onto the implanted filings, the filings are then etched or dissolved to produce a porous polishing pad; the plastic film is then peeled off and a new backing cloth is adhered to the polishing pad to give it strength.
In another embodiment, the pad polymer 6 can be applied onto the implanted filings by other printing methods, such as screen printing for example, either uniformly or patterned, instead of roll coating as described earlier.
While only a few embodiments of the present invention have been described and illustrated, it will now be apparent to those skilled in the art that other modifications, improvements and variations can be made to the manufacturing process of the present invention without departing from the scope or spirit of this invention.

Claims

Claims:
1. The manufacture of a porous polishing pad comprising of implanting the metallic or polymeric filings onto the adhesive layer of a backing cloth in an electric field, roll coating the pad polymer and after curing, etch away the metallic filings or dissolve the polymeric filings with a solvent/acid to yield a porous polishing pad, which has consistent pore size, shape, orientation, density and pattern, and a flat surface that can maintain constant polishing conditions and, hence, able to produce a super mirror- polished surface, which is both planar and scratch-free,
2. The manufacture of a porous polishing pad as claimed in 1, wherein the pore sizes and shapes can be controlled by the filings as pore former,
3. The manufacture of a porous polishing pad as claimed in 1, wherein the pore density can be controlled by both the strength of the electrostatic field and the backing cloth feed speed,
4. The manufacture of a porous polishing pad as claimed in 1, wherein the pore orientation can be controlled by the inclination of the backing cloth with respect to the electrostatic field direction,
5. The manufacture of a porous polishing pad as claimed in 1, wherein the rectangular pore pattern can be controlled by the magnetic field direction on the plate-like metallic filings as pore former,
6. The manufacture of a porous polishing pad as claimed in 1, wherein the pad polymer in any pattern can be coated, the uncoated regions allow the polishing debris to be discharged and this enables a scratch-free mirror-polished surface to be produced,
SUBSTITUTE SHEET (RULE 26}
7. The manufacture of a porous polishing pad as claimed in 1, wherein the backing cloth may be a plastic film, which is peeled off after manufacture of the porous polymer and replaced with a new backing cloth to give it strength.
8. The manufacture of a porous polishing pad as claimed in 1, wherein the pad polymer can also be applied by printing method, such as screen printing for example.
PCT/SG1996/000020 1996-12-20 1996-12-20 Manufacture of porous polishing pad WO1998028108A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/SG1996/000020 WO1998028108A1 (en) 1996-12-20 1996-12-20 Manufacture of porous polishing pad

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SG1996/000020 WO1998028108A1 (en) 1996-12-20 1996-12-20 Manufacture of porous polishing pad

Publications (1)

Publication Number Publication Date
WO1998028108A1 true WO1998028108A1 (en) 1998-07-02

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SG1996/000020 WO1998028108A1 (en) 1996-12-20 1996-12-20 Manufacture of porous polishing pad

Country Status (1)

Country Link
WO (1) WO1998028108A1 (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001098027A1 (en) * 2000-06-19 2001-12-27 Struers A/S A multi-zone grinding and/or polishing sheet
WO2005000526A1 (en) * 2003-06-17 2005-01-06 Cabot Microelectronics Corporation Polishing pad with oriented pore structure
US6896593B2 (en) 2002-05-23 2005-05-24 Cabot Microelectronic Corporation Microporous polishing pads
US7267607B2 (en) 2002-10-28 2007-09-11 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US7311862B2 (en) 2002-10-28 2007-12-25 Cabot Microelectronics Corporation Method for manufacturing microporous CMP materials having controlled pore size
US7435165B2 (en) 2002-10-28 2008-10-14 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US8075372B2 (en) 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
CN112045556A (en) * 2015-10-16 2020-12-08 应用材料公司 Method and apparatus for forming advanced polishing pads using additive manufacturing processes
US11446788B2 (en) 2014-10-17 2022-09-20 Applied Materials, Inc. Precursor formulations for polishing pads produced by an additive manufacturing process
US11724362B2 (en) 2014-10-17 2023-08-15 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US11772229B2 (en) 2016-01-19 2023-10-03 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US11958162B2 (en) 2014-10-17 2024-04-16 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE827938A (en) * 1974-07-17 1975-07-31 SANDING DEVICE
GB2115322A (en) * 1982-03-02 1983-09-07 Nippon Tenshashi Kk Manufacturing a polishing element
EP0280657A2 (en) * 1987-02-27 1988-08-31 Abrasive Technology N.A., Inc. Flexible abrasives
EP0291480A2 (en) * 1987-05-15 1988-11-17 Sandvik Aktiebolag Tool plate for abrasive surface smoothing
GB2223966A (en) * 1988-05-27 1990-04-25 D K Holdings Limited Making flexible abrasive member
US5100506A (en) * 1990-12-04 1992-03-31 Grace Manufacturing Inc. Chemically machined sheet metal cutting tools and method
EP0597723A1 (en) * 1992-11-13 1994-05-18 De Beers Industrial Diamond Division (Proprietary) Limited Abrasive device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE827938A (en) * 1974-07-17 1975-07-31 SANDING DEVICE
GB2115322A (en) * 1982-03-02 1983-09-07 Nippon Tenshashi Kk Manufacturing a polishing element
EP0280657A2 (en) * 1987-02-27 1988-08-31 Abrasive Technology N.A., Inc. Flexible abrasives
EP0291480A2 (en) * 1987-05-15 1988-11-17 Sandvik Aktiebolag Tool plate for abrasive surface smoothing
GB2223966A (en) * 1988-05-27 1990-04-25 D K Holdings Limited Making flexible abrasive member
US5100506A (en) * 1990-12-04 1992-03-31 Grace Manufacturing Inc. Chemically machined sheet metal cutting tools and method
EP0597723A1 (en) * 1992-11-13 1994-05-18 De Beers Industrial Diamond Division (Proprietary) Limited Abrasive device

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7004823B2 (en) 2000-06-19 2006-02-28 Struers A/S Multi-zone grinding and/or polishing sheet
WO2001098027A1 (en) * 2000-06-19 2001-12-27 Struers A/S A multi-zone grinding and/or polishing sheet
US6896593B2 (en) 2002-05-23 2005-05-24 Cabot Microelectronic Corporation Microporous polishing pads
US6899598B2 (en) 2002-05-23 2005-05-31 Cabot Microelectronics Corporation Microporous polishing pads
US6913517B2 (en) 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
US6935931B2 (en) 2002-05-23 2005-08-30 Cabot Microelectronics Corporation Microporous polishing pads
US7267607B2 (en) 2002-10-28 2007-09-11 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US7311862B2 (en) 2002-10-28 2007-12-25 Cabot Microelectronics Corporation Method for manufacturing microporous CMP materials having controlled pore size
US7435165B2 (en) 2002-10-28 2008-10-14 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US6998166B2 (en) 2003-06-17 2006-02-14 Cabot Microelectronics Corporation Polishing pad with oriented pore structure
WO2005000526A1 (en) * 2003-06-17 2005-01-06 Cabot Microelectronics Corporation Polishing pad with oriented pore structure
US8075372B2 (en) 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
US11446788B2 (en) 2014-10-17 2022-09-20 Applied Materials, Inc. Precursor formulations for polishing pads produced by an additive manufacturing process
US11724362B2 (en) 2014-10-17 2023-08-15 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US11958162B2 (en) 2014-10-17 2024-04-16 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
CN112045556A (en) * 2015-10-16 2020-12-08 应用材料公司 Method and apparatus for forming advanced polishing pads using additive manufacturing processes
CN112045556B (en) * 2015-10-16 2022-06-28 应用材料公司 Method and apparatus for forming advanced polishing pads using additive manufacturing processes
US11772229B2 (en) 2016-01-19 2023-10-03 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process

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