WO1998032099A1 - Chipkarte - Google Patents
Chipkarte Download PDFInfo
- Publication number
- WO1998032099A1 WO1998032099A1 PCT/DE1998/000033 DE9800033W WO9832099A1 WO 1998032099 A1 WO1998032099 A1 WO 1998032099A1 DE 9800033 W DE9800033 W DE 9800033W WO 9832099 A1 WO9832099 A1 WO 9832099A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- module carrier
- chip card
- carrier
- module
- card according
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Credit Cards Or The Like (AREA)
- Near-Field Transmission Systems (AREA)
- Photoreceptors In Electrophotography (AREA)
- Dry Shavers And Clippers (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10533503A JP2000509538A (ja) | 1997-01-15 | 1998-01-07 | チップカード |
AT98904010T ATE206835T1 (de) | 1997-01-15 | 1998-01-07 | Chipkarte |
EP98904010A EP0951691B1 (de) | 1997-01-15 | 1998-01-07 | Chipkarte |
DE59801682T DE59801682D1 (de) | 1997-01-15 | 1998-01-07 | Chipkarte |
US09/354,131 US6375083B2 (en) | 1997-01-15 | 1999-07-15 | Smart card |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19701167.5 | 1997-01-15 | ||
DE19701167A DE19701167A1 (de) | 1997-01-15 | 1997-01-15 | Chipkarte |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/354,131 Continuation US6375083B2 (en) | 1997-01-15 | 1999-07-15 | Smart card |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1998032099A1 true WO1998032099A1 (de) | 1998-07-23 |
Family
ID=7817441
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE1998/000033 WO1998032099A1 (de) | 1997-01-15 | 1998-01-07 | Chipkarte |
Country Status (9)
Country | Link |
---|---|
US (1) | US6375083B2 (de) |
EP (1) | EP0951691B1 (de) |
JP (1) | JP2000509538A (de) |
KR (1) | KR20000070160A (de) |
CN (1) | CN1241145C (de) |
AT (1) | ATE206835T1 (de) |
DE (2) | DE19701167A1 (de) |
IN (1) | IN192329B (de) |
WO (1) | WO1998032099A1 (de) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1117068A1 (de) * | 1998-08-31 | 2001-07-18 | C. Media Co. Ltd. | Kontaktlose ic-träger und system unter verwendung derselben |
WO2001076949A2 (de) * | 2000-04-07 | 2001-10-18 | Melzer Maschinenbau Gmbh | Verfahren und vorrichtung zum herstellen von datenträgern mit integriertem transponder |
US6497371B2 (en) * | 1999-07-07 | 2002-12-24 | Ask S.A. | Contactless access ticket and method for making same |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
PL180818B1 (pl) * | 1994-12-29 | 2001-04-30 | Bio Technology General Corp | Sposób wytwarzania insuliny ludzkiej, oraz polipeptyd hybrydowy |
FR2769390B1 (fr) * | 1997-10-08 | 2003-02-14 | Gemplus Card Int | Procede de fabrication de cartes a puce aptes a assurer un fonctionnement a contact et sans contact, et de cartes a puce sans contact |
IL122250A (en) * | 1997-11-19 | 2003-07-31 | On Track Innovations Ltd | Smart card amenable to assembly using two manufacturing stages and a method of manufacture thereof |
US8538801B2 (en) | 1999-02-19 | 2013-09-17 | Exxonmobile Research & Engineering Company | System and method for processing financial transactions |
EP1031940A1 (de) * | 1999-02-24 | 2000-08-30 | Sihl GmbH | Anordnung enthaltend eine Vielzahl elektronischer Schaltungen |
DE19939347C1 (de) * | 1999-08-19 | 2001-02-15 | Orga Kartensysteme Gmbh | Verfahren zur Herstellung einer Chipkarte und nach dem Verfahren hergestellte Chipkarte |
EP1125247B1 (de) * | 1999-08-31 | 2008-01-09 | Nxp B.V. | Datenträger mit integriertem schaltkreis und übertragungsspule |
US7974921B1 (en) * | 1999-12-05 | 2011-07-05 | Moosa Eisa Al Amri | Bank cheque system with cheques having magnetized strips and/or storage chips |
DE10014620A1 (de) * | 2000-03-24 | 2001-09-27 | Andreas Plettner | Verfahren zur Herstellung eines Trägerbandes mit einer Vielzahl von elektrischen Einheiten, jeweils aufweisend einen Chip und Kontaktelemente |
KR100746742B1 (ko) | 2001-02-03 | 2007-08-06 | 삼성전자주식회사 | 리더 코일 안테나 및 이를 이용한 비접촉 카드 인증 시스템 |
DE10122414A1 (de) * | 2001-05-09 | 2002-11-14 | Giesecke & Devrient Gmbh | Durchkontaktierung von flexiblen Leiterplatten |
KR20010099429A (ko) * | 2001-09-27 | 2001-11-09 | 김경현 | 신분증위조방지시스템 |
DE10151941A1 (de) * | 2001-10-22 | 2003-01-02 | Infineon Technologies Ag | Chipmodul und Chipkarte oder Speicherkarte |
US6774470B2 (en) * | 2001-12-28 | 2004-08-10 | Dai Nippon Printing Co., Ltd. | Non-contact data carrier and method of fabricating the same |
KR100407451B1 (ko) * | 2002-03-04 | 2003-11-28 | 주식회사 티오디 | 알에프 발급기를 갖는 카드 발급기 |
JP4110380B2 (ja) * | 2002-09-05 | 2008-07-02 | 富士ゼロックス株式会社 | 表示記録媒体及び情報書き込み装置 |
US8322624B2 (en) * | 2007-04-10 | 2012-12-04 | Feinics Amatech Teoranta | Smart card with switchable matching antenna |
US7926728B2 (en) * | 2007-10-31 | 2011-04-19 | Infineon Technologies Ag | Integrated circuit device including a contactless integrated circuit inlay |
DE102009022136A1 (de) | 2009-05-20 | 2010-11-25 | Prüftechnik Dieter Busch AG | Vorrichtung und Verfahren für induktive Messungen |
US8366009B2 (en) | 2010-08-12 | 2013-02-05 | Féinics Amatech Teoranta | Coupling in and to RFID smart cards |
US8474726B2 (en) | 2010-08-12 | 2013-07-02 | Feinics Amatech Teoranta | RFID antenna modules and increasing coupling |
US9195932B2 (en) | 2010-08-12 | 2015-11-24 | Féinics Amatech Teoranta | Booster antenna configurations and methods |
US9033250B2 (en) | 2010-08-12 | 2015-05-19 | Féinics Amatech Teoranta | Dual interface smart cards, and methods of manufacturing |
US8789762B2 (en) | 2010-08-12 | 2014-07-29 | Feinics Amatech Teoranta | RFID antenna modules and methods of making |
US9112272B2 (en) | 2010-08-12 | 2015-08-18 | Feinics Amatech Teoranta | Antenna modules for dual interface smart cards, booster antenna configurations, and methods |
US8991712B2 (en) | 2010-08-12 | 2015-03-31 | Féinics Amatech Teoranta | Coupling in and to RFID smart cards |
JP5904356B2 (ja) * | 2011-09-12 | 2016-04-13 | 日立化成株式会社 | Rfidタグ及び自動認識システム |
US8649820B2 (en) | 2011-11-07 | 2014-02-11 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
US8936199B2 (en) | 2012-04-13 | 2015-01-20 | Blackberry Limited | UICC apparatus and related methods |
USD703208S1 (en) | 2012-04-13 | 2014-04-22 | Blackberry Limited | UICC apparatus |
USD701864S1 (en) * | 2012-04-23 | 2014-04-01 | Blackberry Limited | UICC apparatus |
DE102015222364A1 (de) * | 2015-11-12 | 2017-05-18 | Bundesdruckerei Gmbh | Wert- oder Sicherheitsdokument aus einem Faserverbundwerkstoff und Verfahren zum Herstellen des Wert- oder Sicherheitsdokuments |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4431605A1 (de) * | 1994-09-05 | 1996-03-07 | Siemens Ag | Chipkartenmodul für kontaktlose Chipkarten und Verfahren zu seiner Herstellung |
WO1996007985A1 (en) * | 1994-09-09 | 1996-03-14 | International Business Machines Corporation | Radio frequency circuit and memory in thin flexible package |
DE4437721A1 (de) * | 1994-10-21 | 1996-04-25 | Giesecke & Devrient Gmbh | Kontaktloses elektronisches Modul |
JPH08202844A (ja) * | 1995-01-25 | 1996-08-09 | Nippon Retsuku Kk | 電子機器及びその製造方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS5514709A (en) | 1978-07-18 | 1980-02-01 | Toshiba Corp | Facsimile device |
US4857893A (en) * | 1986-07-18 | 1989-08-15 | Bi Inc. | Single chip transponder device |
FR2641102B1 (de) * | 1988-12-27 | 1991-02-22 | Ebauchesfabrik Eta Ag | |
DE4034225C2 (de) * | 1990-10-26 | 1994-01-27 | Reinhard Jurisch | Datenträger für Identifikationssysteme |
FR2674052A1 (fr) | 1991-03-15 | 1992-09-18 | Philips Composants | Carte a microcircuit. |
JPH04321190A (ja) * | 1991-04-22 | 1992-11-11 | Mitsubishi Electric Corp | 非接触型携帯記憶装置のアンテナ回路 |
DE4220194C2 (de) * | 1992-06-19 | 1996-02-22 | Herbert Stowasser | Vorrichtung und Verfahren zur Herstellung eines Transponders, wobei Wickeldraht einer Spule mit den Anschlußflächen eines elektronischen Bauelementes (Chip) verbunden wird |
JP2709223B2 (ja) | 1992-01-30 | 1998-02-04 | 三菱電機株式会社 | 非接触形携帯記憶装置 |
DE69220029T2 (de) * | 1992-02-05 | 1997-09-18 | Texas Instruments Inc | Verfahren zur Herstellung eines flachen, flexiblen Antennenkerns für einen Chip-Transponder, eingebaut in einer Karte oder ähnlichem Objekt und ein derart hergestellter Antennenkern |
US5255430A (en) * | 1992-10-08 | 1993-10-26 | Atmel Corporation | Method of assembling a module for a smart card |
DE4311493C2 (de) * | 1993-04-07 | 2000-04-06 | Amatech Advanced Micromechanic | IC-Kartenmodul zur Herstellung einer IC-Karte |
JPH07146922A (ja) | 1993-09-28 | 1995-06-06 | Dainippon Printing Co Ltd | 非接触型icモジュール、非接触型icカードおよびその製造方法 |
DE4403753C1 (de) * | 1994-02-08 | 1995-07-20 | Angewandte Digital Elektronik | Kombinierte Chipkarte |
DE4410732C2 (de) | 1994-03-28 | 1997-05-07 | Amatech Gmbh & Co Kg | Verfahren zur Anordnung einer zumindest einen Chip und eine Drahtspule aufweisenden Transpondereinheit auf einem Substrat sowie Chipkarte mit entsprechend angeordneter Transpondereinheit |
DE9406390U1 (de) * | 1994-04-16 | 1994-06-23 | Karakas Gmbh | Gyros-Gerät |
DE4443980C2 (de) * | 1994-12-11 | 1997-07-17 | Angewandte Digital Elektronik | Verfahren zur Herstellung von Chipkarten und Chipkarte hergestellt nach diesem Verfahren |
JPH08216570A (ja) | 1995-02-09 | 1996-08-27 | Hitachi Chem Co Ltd | Icカード |
DE19527359A1 (de) * | 1995-07-26 | 1997-02-13 | Giesecke & Devrient Gmbh | Schaltungseinheit und Verfahren zur Herstellung einer Schaltungseinheit |
-
1997
- 1997-01-15 DE DE19701167A patent/DE19701167A1/de not_active Ceased
-
1998
- 1998-01-07 JP JP10533503A patent/JP2000509538A/ja active Pending
- 1998-01-07 EP EP98904010A patent/EP0951691B1/de not_active Expired - Lifetime
- 1998-01-07 AT AT98904010T patent/ATE206835T1/de active
- 1998-01-07 DE DE59801682T patent/DE59801682D1/de not_active Expired - Lifetime
- 1998-01-07 CN CNB988018551A patent/CN1241145C/zh not_active Expired - Lifetime
- 1998-01-07 WO PCT/DE1998/000033 patent/WO1998032099A1/de not_active Application Discontinuation
- 1998-01-07 KR KR1019997006386A patent/KR20000070160A/ko not_active Application Discontinuation
- 1998-01-14 IN IN64CA1998 patent/IN192329B/en unknown
-
1999
- 1999-07-15 US US09/354,131 patent/US6375083B2/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4431605A1 (de) * | 1994-09-05 | 1996-03-07 | Siemens Ag | Chipkartenmodul für kontaktlose Chipkarten und Verfahren zu seiner Herstellung |
WO1996007985A1 (en) * | 1994-09-09 | 1996-03-14 | International Business Machines Corporation | Radio frequency circuit and memory in thin flexible package |
DE4437721A1 (de) * | 1994-10-21 | 1996-04-25 | Giesecke & Devrient Gmbh | Kontaktloses elektronisches Modul |
JPH08202844A (ja) * | 1995-01-25 | 1996-08-09 | Nippon Retsuku Kk | 電子機器及びその製造方法 |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 096, no. 012 26 December 1996 (1996-12-26) * |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1117068A1 (de) * | 1998-08-31 | 2001-07-18 | C. Media Co. Ltd. | Kontaktlose ic-träger und system unter verwendung derselben |
EP1117068B1 (de) * | 1998-08-31 | 2007-10-17 | C. Media Co. Ltd. | Kontaktloses Lese-/Schreibgerät |
US6497371B2 (en) * | 1999-07-07 | 2002-12-24 | Ask S.A. | Contactless access ticket and method for making same |
WO2001076949A2 (de) * | 2000-04-07 | 2001-10-18 | Melzer Maschinenbau Gmbh | Verfahren und vorrichtung zum herstellen von datenträgern mit integriertem transponder |
WO2001076949A3 (de) * | 2000-04-07 | 2002-06-20 | Melzer Maschinenbau Gmbh | Verfahren und vorrichtung zum herstellen von datenträgern mit integriertem transponder |
KR100826358B1 (ko) * | 2000-04-07 | 2008-05-02 | 멜쩌 마쉬넨바우 게엠바하 | 집적 트랜스폰더가 장착된 데이터 반송자의 생산 방법 및장치 |
US7431784B2 (en) | 2000-04-07 | 2008-10-07 | Melzer Maschinenbau Gmbh | Method and apparatus for producing data carriers equipped with an integrated transponder |
Also Published As
Publication number | Publication date |
---|---|
IN192329B (de) | 2004-04-10 |
US20010011685A1 (en) | 2001-08-09 |
DE19701167A1 (de) | 1998-07-23 |
EP0951691A1 (de) | 1999-10-27 |
CN1243585A (zh) | 2000-02-02 |
CN1241145C (zh) | 2006-02-08 |
DE59801682D1 (de) | 2001-11-15 |
ATE206835T1 (de) | 2001-10-15 |
EP0951691B1 (de) | 2001-10-10 |
JP2000509538A (ja) | 2000-07-25 |
US6375083B2 (en) | 2002-04-23 |
KR20000070160A (ko) | 2000-11-25 |
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