WO1998035381A1 - Angled blade method of cutting i/o columns - Google Patents
Angled blade method of cutting i/o columns Download PDFInfo
- Publication number
- WO1998035381A1 WO1998035381A1 PCT/US1998/002070 US9802070W WO9835381A1 WO 1998035381 A1 WO1998035381 A1 WO 1998035381A1 US 9802070 W US9802070 W US 9802070W WO 9835381 A1 WO9835381 A1 WO 9835381A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- blade
- columns
- shear plate
- input
- cutting edge
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0473—Cutting and clinching the terminal ends of the leads after they are fitted on a circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/118—Post-treatment of the bump connector
- H01L2224/1183—Reworking, e.g. shaping
- H01L2224/1184—Reworking, e.g. shaping involving a mechanical process, e.g. planarising the bump connector
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S83/00—Cutting
- Y10S83/929—Particular nature of work or product
- Y10S83/942—Contact pin of electrical component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/04—Processes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/869—Means to drive or to guide tool
- Y10T83/8717—By deforming resilient tool or tool support
Definitions
- all of the input/output columns can be cut to a predetermined length.
- Such a cutting operation is performed to trim all of the input/output columns to the same length and thereby insure that the ends of all of the input/output columns make contact with their corresponding I/O pads on the printed circuit board.
- Fig. 4 is a microphotograph of the end of an input/output column which was cut as described above.
- Fig. 3A is an enlarged view of a portion of the apparatus in Fig. 2 which shows a cutting blade immediately before it cuts one of the input/output columns .
- the crater- like voids and burrs on the cut ends of the input/output columns 20b are eliminated because only the cutting edge 35a of the blade makes contact with the shear plate 33 and the acute angle ⁇ exists between the blade 35 and the shear plate 33. Due to that structure, the cutting edge 35a of the blade passes cleanly through the input/output columns 20b without any residue from the columns accumulating or smearing on the blade.
- the columns 20b were described as consisting essentially of an alloy of tin and lead. But as an alternative, the columns can also consist essentially of other materials as desired as, for example, copper.
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP19980904881 EP0965142B1 (en) | 1997-02-07 | 1998-02-04 | Angled blade method of cutting i/o columns |
JP53483898A JP3325584B2 (en) | 1997-02-07 | 1998-02-04 | Cutting method with angled blade for input / output column |
DE1998614053 DE69814053T2 (en) | 1997-02-07 | 1998-02-04 | METHOD FOR CUTTING DOWN POST COLUMNS BY USING AN INCLINED BLADE |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/797,015 US5918516A (en) | 1997-02-07 | 1997-02-07 | Method of forming I/O columns with open ends that are free of crater-like voids |
US08/797,015 | 1997-02-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1998035381A1 true WO1998035381A1 (en) | 1998-08-13 |
Family
ID=25169679
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1998/002070 WO1998035381A1 (en) | 1997-02-07 | 1998-02-04 | Angled blade method of cutting i/o columns |
Country Status (5)
Country | Link |
---|---|
US (1) | US5918516A (en) |
EP (1) | EP0965142B1 (en) |
JP (1) | JP3325584B2 (en) |
DE (1) | DE69814053T2 (en) |
WO (1) | WO1998035381A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6342731B1 (en) * | 1997-12-31 | 2002-01-29 | Micron Technology, Inc. | Vertically mountable semiconductor device, assembly, and methods |
JP3982610B2 (en) * | 2001-12-04 | 2007-09-26 | ローム株式会社 | Method and apparatus for separating loss synthetic resin from synthetic resin package in electronic component |
US20050183555A1 (en) * | 2004-02-20 | 2005-08-25 | Gabriel Santos | Battery nugget shaver |
US9283686B2 (en) * | 2010-01-22 | 2016-03-15 | Senju Metal Industry Co., Ltd. | Method for manufacturing solder column, apparatus for manufacturing solder column, and solder column |
TWI623401B (en) * | 2013-10-30 | 2018-05-11 | Chan Li Machinery Co Ltd | Composite blade set and cutting mechanism thereof |
JP6826194B2 (en) * | 2017-05-12 | 2021-02-03 | 株式会社Fuji | Parts insertion machine |
US10750737B2 (en) * | 2018-05-21 | 2020-08-25 | Brian K. Noël | Multi-use penetrable hunting blind apparatus |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4321738A (en) * | 1979-05-07 | 1982-03-30 | International Business Machines Corp. | Apparatus and method for rework dressing of a chip site |
EP0396484A2 (en) * | 1989-05-04 | 1990-11-07 | International Business Machines Corporation | Solder column connection |
US5324892A (en) * | 1992-08-07 | 1994-06-28 | International Business Machines Corporation | Method of fabricating an electronic interconnection |
US5454159A (en) * | 1994-02-18 | 1995-10-03 | Unisys Corporation | Method of manufacturing I/O terminals on I/O pads |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3232158A (en) * | 1963-08-14 | 1966-02-01 | Texas Instruments Inc | Extractor devices for semiconductor networks and the like |
US3307442A (en) * | 1965-07-15 | 1967-03-07 | Burroughs Corp | Electrical component lead-end shearing device |
DE2724143C2 (en) * | 1977-05-27 | 1983-06-09 | Alfred 8000 München Lemmer | Cutting device for cutting off the connecting wire ends of the components protruding from the bottom of a printed circuit board |
DE2823765A1 (en) * | 1977-06-14 | 1979-01-04 | Cotron Electronics Ltd | DEVICE FOR CUTTING PIPES |
JPS603523B2 (en) * | 1977-12-29 | 1985-01-29 | 三菱マテリアル株式会社 | Round blade tool for cutting lead wire |
US4167132A (en) * | 1978-02-13 | 1979-09-11 | Zontelli Gary R | Cutter ring for trimming printed circuit boards |
US4624160A (en) * | 1983-10-31 | 1986-11-25 | American Tech Manufacturing, Inc. | Method and apparatus for trimming the leads of electronic components |
US4911046A (en) * | 1989-03-16 | 1990-03-27 | Hughes Aircraft Company | Hybrid lead trim die |
-
1997
- 1997-02-07 US US08/797,015 patent/US5918516A/en not_active Expired - Lifetime
-
1998
- 1998-02-04 DE DE1998614053 patent/DE69814053T2/en not_active Expired - Fee Related
- 1998-02-04 JP JP53483898A patent/JP3325584B2/en not_active Expired - Fee Related
- 1998-02-04 EP EP19980904881 patent/EP0965142B1/en not_active Expired - Lifetime
- 1998-02-04 WO PCT/US1998/002070 patent/WO1998035381A1/en active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4321738A (en) * | 1979-05-07 | 1982-03-30 | International Business Machines Corp. | Apparatus and method for rework dressing of a chip site |
EP0396484A2 (en) * | 1989-05-04 | 1990-11-07 | International Business Machines Corporation | Solder column connection |
US5324892A (en) * | 1992-08-07 | 1994-06-28 | International Business Machines Corporation | Method of fabricating an electronic interconnection |
US5454159A (en) * | 1994-02-18 | 1995-10-03 | Unisys Corporation | Method of manufacturing I/O terminals on I/O pads |
Also Published As
Publication number | Publication date |
---|---|
EP0965142A1 (en) | 1999-12-22 |
JP3325584B2 (en) | 2002-09-17 |
DE69814053T2 (en) | 2004-03-18 |
DE69814053D1 (en) | 2003-06-05 |
US5918516A (en) | 1999-07-06 |
EP0965142B1 (en) | 2003-05-02 |
JP2000513150A (en) | 2000-10-03 |
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