WO1998044769A1 - Moulded sockets for electronic component attachment - Google Patents
Moulded sockets for electronic component attachment Download PDFInfo
- Publication number
- WO1998044769A1 WO1998044769A1 PCT/GB1997/003558 GB9703558W WO9844769A1 WO 1998044769 A1 WO1998044769 A1 WO 1998044769A1 GB 9703558 W GB9703558 W GB 9703558W WO 9844769 A1 WO9844769 A1 WO 9844769A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- cavity
- substrate
- electronic component
- component
- electrical
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09181—Notches in edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/1059—Connections made by press-fit insertion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10651—Component having two leads, e.g. resistor, capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP54126698A JP2002515184A (en) | 1997-03-27 | 1997-12-31 | Molded socket for mounting electronic components |
EP97950344A EP0970594B1 (en) | 1997-03-27 | 1997-12-31 | Moulded sockets for electronic component attachment |
CA002284072A CA2284072A1 (en) | 1997-03-27 | 1997-12-31 | Three dimensional molded sockets for mechanical and electrical component attachment |
BR9714585-8A BR9714585A (en) | 1997-03-27 | 1997-12-31 | Molded fittings for fixing electronic component |
DE69709176T DE69709176T2 (en) | 1997-03-27 | 1997-12-31 | MOLDED VERSIONS FOR FIXING ELECTRONIC COMPONENTS |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/826,461 | 1997-03-27 | ||
US08/826,461 US5994648A (en) | 1997-03-27 | 1997-03-27 | Three-dimensional molded sockets for mechanical and electrical component attachment |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1998044769A1 true WO1998044769A1 (en) | 1998-10-08 |
Family
ID=25246602
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/GB1997/003558 WO1998044769A1 (en) | 1997-03-27 | 1997-12-31 | Moulded sockets for electronic component attachment |
Country Status (8)
Country | Link |
---|---|
US (1) | US5994648A (en) |
EP (1) | EP0970594B1 (en) |
JP (1) | JP2002515184A (en) |
CN (1) | CN1084585C (en) |
BR (1) | BR9714585A (en) |
CA (1) | CA2284072A1 (en) |
DE (1) | DE69709176T2 (en) |
WO (1) | WO1998044769A1 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1641328A2 (en) * | 2004-09-23 | 2006-03-29 | Walter Esser, Kunststoff-Spritzgiesserei GmbH & Co. KG | Part with electrically conductive paths |
WO2011113772A1 (en) * | 2010-03-16 | 2011-09-22 | Gemalto Sa | Electronic module having side contacts, device comprising same and method for manufacturing such a module |
US8049113B2 (en) * | 2007-05-18 | 2011-11-01 | Fukui Precision Component (Shenzhen) Co., Ltd. | Printed circuit boards |
WO2012120032A3 (en) * | 2011-03-09 | 2012-12-27 | Continental Automotive Gmbh | Assembly having a substrate, an smd component, and a lead frame part |
FR2983029A1 (en) * | 2011-11-21 | 2013-05-24 | Bosch Gmbh Robert | CIRCUIT FOR ELECTRONIC AND / OR ELECTRICAL COMPONENTS |
WO2015121532A1 (en) * | 2014-02-14 | 2015-08-20 | Nokia Corporation | A circuit board and associated apparatus and methods |
EP3547357A4 (en) * | 2016-11-28 | 2020-07-01 | Kyocera Corporation | Wiring board, electronic device, and electronic module |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3063709B2 (en) * | 1997-11-05 | 2000-07-12 | 日本電気株式会社 | Electronic component mounting structure, mounting substrate and electronic component mounting method |
US6239977B1 (en) * | 1999-05-17 | 2001-05-29 | 3Com Corporation | Technique for mounting electronic components on printed circuit boards |
US6867499B1 (en) * | 1999-09-30 | 2005-03-15 | Skyworks Solutions, Inc. | Semiconductor packaging |
WO2002023566A2 (en) * | 2000-09-18 | 2002-03-21 | Meder Electronic | A lead-less surface mount reed relay |
JP2002134875A (en) * | 2000-10-26 | 2002-05-10 | Murata Mfg Co Ltd | Module component, packaging structure of it, and electronic device |
JP3482183B2 (en) * | 2000-10-30 | 2003-12-22 | Tdk株式会社 | Electronic component mounting structure |
WO2003086034A1 (en) * | 2002-04-11 | 2003-10-16 | Koninklijke Philips Electronics N.V. | Electrically insulating body, and electronic device |
KR20050029247A (en) * | 2002-08-05 | 2005-03-24 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | An electronic product, a body and a method of manufacturing |
DE10302104A1 (en) * | 2003-01-21 | 2004-08-05 | Friwo Gerätebau Gmbh | Process for the production of circuit carriers with integrated passive components |
US7061076B2 (en) * | 2004-08-12 | 2006-06-13 | Honeywell International Inc. | Solderless component packaging and mounting |
DE102006009723A1 (en) * | 2006-03-02 | 2007-09-06 | Siemens Ag | Method of making and planar contacting an electronic device and device made accordingly |
JP4862641B2 (en) * | 2006-12-06 | 2012-01-25 | 株式会社デンソー | Multilayer substrate and method for manufacturing multilayer substrate |
US7479604B1 (en) * | 2007-09-27 | 2009-01-20 | Harris Corporation | Flexible appliance and related method for orthogonal, non-planar interconnections |
DE102007046493A1 (en) * | 2007-09-28 | 2009-04-09 | Continental Automotive Gmbh | Three-dimensional electronic circuit carrier structure, as well as circuit base carrier having the circuit carrier structure as a functional component and three-dimensional circuit arrangement consisting of at least two such three-dimensional circuit carrier structures |
KR100926619B1 (en) * | 2007-12-05 | 2009-11-11 | 삼성모바일디스플레이주식회사 | Printed Circuit Board with Multi Layer Ceramic Capacitor and Flat Panel Display Device Using the Same |
US11302617B2 (en) * | 2008-09-06 | 2022-04-12 | Broadpak Corporation | Scalable semiconductor interposer integration |
US20110030996A1 (en) * | 2009-08-05 | 2011-02-10 | Weibezahn Karl S | Circuit substrate for electronic device |
WO2011129130A1 (en) * | 2010-04-15 | 2011-10-20 | 古河電気工業株式会社 | Board and method for manufacturing board |
US9674938B2 (en) | 2010-11-03 | 2017-06-06 | 3M Innovative Properties Company | Flexible LED device for thermal management |
CN103190204B (en) * | 2010-11-03 | 2016-11-16 | 3M创新有限公司 | There is the flexible LED device of wire bond-tube core |
US9698563B2 (en) | 2010-11-03 | 2017-07-04 | 3M Innovative Properties Company | Flexible LED device and method of making |
JP5599328B2 (en) * | 2011-01-20 | 2014-10-01 | 三菱電機株式会社 | Connection mechanism between power semiconductor device and printed wiring board |
US9236547B2 (en) | 2011-08-17 | 2016-01-12 | 3M Innovative Properties Company | Two part flexible light emitting semiconductor device |
JP2013045796A (en) * | 2011-08-22 | 2013-03-04 | Yazaki Corp | Wiring substrate |
US20130258623A1 (en) * | 2012-03-29 | 2013-10-03 | Unimicron Technology Corporation | Package structure having embedded electronic element and fabrication method thereof |
US9155198B2 (en) * | 2012-05-17 | 2015-10-06 | Eagantu Ltd. | Electronic module allowing fine tuning after assembly |
US20140001622A1 (en) * | 2012-06-27 | 2014-01-02 | Infineon Technologies Ag | Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packages |
US20140055961A1 (en) * | 2012-08-23 | 2014-02-27 | Shayan Malek | Printed Circuit Boards with Recesses |
KR102105403B1 (en) * | 2013-11-28 | 2020-04-28 | 삼성전기주식회사 | Electronic components embedded substrate and method for manufacturing thereof |
JP6289063B2 (en) * | 2013-12-09 | 2018-03-07 | 三菱電機株式会社 | Electronic component mounting apparatus and semiconductor device including the same |
US10539585B2 (en) * | 2014-10-09 | 2020-01-21 | Continental Automotive Systems, Inc. | Arrangement and method for connecting an electrical component to a leadframe |
KR102380304B1 (en) * | 2015-01-23 | 2022-03-30 | 삼성전기주식회사 | A printed circuit board comprising embeded electronic component within and a method for manufacturing |
US10699992B2 (en) * | 2015-12-23 | 2020-06-30 | Intel Corporation | Reverse mounted gull wing electronic package |
JP7058089B2 (en) | 2017-07-25 | 2022-04-21 | タイコエレクトロニクスジャパン合同会社 | Board mounting structure |
CN109693012B (en) * | 2017-10-24 | 2020-12-18 | 泰科电子(上海)有限公司 | Positioning device |
WO2020153937A1 (en) * | 2019-01-22 | 2020-07-30 | Siemens Aktiengesellschaft | Integrated no-solder snap-fit electronic component bays for non-traditional pcbs and am structures |
EP3709777A1 (en) | 2019-03-11 | 2020-09-16 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Solder-free component carrier connection using an elastic element, and method |
US10980115B1 (en) * | 2020-06-05 | 2021-04-13 | Littelfuse, Inc. | Flexible harness assembly for surface mounted devices |
DE102020134205A1 (en) * | 2020-12-18 | 2022-06-23 | Te Connectivity Germany Gmbh | Electrical component, method for preparing an electrical component for a soldering step, and apparatus for preparing an electrical component for a soldering step |
DE102021119391A1 (en) | 2021-07-27 | 2023-02-02 | Infineon Technologies Ag | A SEMICONDUCTOR MODULE WITH FLEXIBLE LEADS FOR HEIGHT ADJUSTMENT |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3326968A1 (en) * | 1982-06-12 | 1985-02-14 | IVO Irion & Vosseler, Zählerfabrik GmbH & Co, 7730 Villingen-Schwenningen | Support member made of thermoplastic material having metallic conductors applied by hot embossing |
JPS62262447A (en) * | 1986-05-09 | 1987-11-14 | Matsushita Electronics Corp | Semiconductor package and mounting thereof |
JPS6474794A (en) * | 1987-09-17 | 1989-03-20 | Matsushita Electronics Corp | Method of mounting substrate of semiconductor device |
JPH0273687A (en) * | 1988-09-08 | 1990-03-13 | Nec Corp | Mounting structure of surface mounted parts |
DE9012638U1 (en) * | 1990-09-04 | 1990-11-08 | Siemens Ag, 8000 Muenchen, De | |
WO1990013990A2 (en) * | 1989-05-02 | 1990-11-15 | Hagner George R | Circuit boards with recessed traces |
JPH0349178A (en) * | 1989-07-18 | 1991-03-01 | Hitachi Ltd | Mounting structure for semiconductor device, mounting substrate and semiconductor device |
JPH04354174A (en) * | 1991-05-31 | 1992-12-08 | Fujitsu Ltd | Printed board and method of mounting thin electronic parts thereon |
JPH08255815A (en) * | 1995-03-16 | 1996-10-01 | Matsushita Electric Works Ltd | Mounting structure of electronic part |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1240789A (en) * | 1969-12-18 | 1971-07-28 | Standard Telephones Cables Ltd | Improvements in or relating to electrical equipment |
US4542439A (en) * | 1984-06-27 | 1985-09-17 | At&T Technologies, Inc. | Surface mount component |
US4631820A (en) * | 1984-08-23 | 1986-12-30 | Canon Kabushiki Kaisha | Mounting assembly and mounting method for an electronic component |
EP0361195B1 (en) * | 1988-09-30 | 1993-03-17 | Siemens Aktiengesellschaft | Printed circuit board with moulded substrate |
JPH02215068A (en) * | 1989-02-15 | 1990-08-28 | Nippon Kaiheiki Kogyo Kk | Control apparatus for printed board |
US5471151A (en) * | 1990-02-14 | 1995-11-28 | Particle Interconnect, Inc. | Electrical interconnect using particle enhanced joining of metal surfaces |
US5083697A (en) * | 1990-02-14 | 1992-01-28 | Difrancesco Louis | Particle-enhanced joining of metal surfaces |
US5384691A (en) * | 1993-01-08 | 1995-01-24 | General Electric Company | High density interconnect multi-chip modules including embedded distributed power supply elements |
US5579206A (en) * | 1993-07-16 | 1996-11-26 | Dallas Semiconductor Corporation | Enhanced low profile sockets and module systems |
JP2809115B2 (en) * | 1993-10-13 | 1998-10-08 | ヤマハ株式会社 | Semiconductor device and manufacturing method thereof |
US5745984A (en) * | 1995-07-10 | 1998-05-05 | Martin Marietta Corporation | Method for making an electronic module |
-
1997
- 1997-03-27 US US08/826,461 patent/US5994648A/en not_active Expired - Fee Related
- 1997-12-31 JP JP54126698A patent/JP2002515184A/en active Pending
- 1997-12-31 BR BR9714585-8A patent/BR9714585A/en not_active IP Right Cessation
- 1997-12-31 EP EP97950344A patent/EP0970594B1/en not_active Expired - Lifetime
- 1997-12-31 CA CA002284072A patent/CA2284072A1/en not_active Abandoned
- 1997-12-31 DE DE69709176T patent/DE69709176T2/en not_active Expired - Fee Related
- 1997-12-31 CN CN97182075A patent/CN1084585C/en not_active Expired - Fee Related
- 1997-12-31 WO PCT/GB1997/003558 patent/WO1998044769A1/en active IP Right Grant
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3326968A1 (en) * | 1982-06-12 | 1985-02-14 | IVO Irion & Vosseler, Zählerfabrik GmbH & Co, 7730 Villingen-Schwenningen | Support member made of thermoplastic material having metallic conductors applied by hot embossing |
JPS62262447A (en) * | 1986-05-09 | 1987-11-14 | Matsushita Electronics Corp | Semiconductor package and mounting thereof |
JPS6474794A (en) * | 1987-09-17 | 1989-03-20 | Matsushita Electronics Corp | Method of mounting substrate of semiconductor device |
JPH0273687A (en) * | 1988-09-08 | 1990-03-13 | Nec Corp | Mounting structure of surface mounted parts |
WO1990013990A2 (en) * | 1989-05-02 | 1990-11-15 | Hagner George R | Circuit boards with recessed traces |
JPH0349178A (en) * | 1989-07-18 | 1991-03-01 | Hitachi Ltd | Mounting structure for semiconductor device, mounting substrate and semiconductor device |
DE9012638U1 (en) * | 1990-09-04 | 1990-11-08 | Siemens Ag, 8000 Muenchen, De | |
JPH04354174A (en) * | 1991-05-31 | 1992-12-08 | Fujitsu Ltd | Printed board and method of mounting thin electronic parts thereon |
JPH08255815A (en) * | 1995-03-16 | 1996-10-01 | Matsushita Electric Works Ltd | Mounting structure of electronic part |
Non-Patent Citations (6)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 12, no. 146 (E - 605) 6 May 1988 (1988-05-06) * |
PATENT ABSTRACTS OF JAPAN vol. 13, no. 295 (E - 783) 7 July 1989 (1989-07-07) * |
PATENT ABSTRACTS OF JAPAN vol. 14, no. 252 (E - 0934) 30 May 1990 (1990-05-30) * |
PATENT ABSTRACTS OF JAPAN vol. 15, no. 187 (E - 1067) 14 May 1991 (1991-05-14) * |
PATENT ABSTRACTS OF JAPAN vol. 17, no. 219 (E - 1358) 30 April 1993 (1993-04-30) * |
PATENT ABSTRACTS OF JAPAN vol. 97, no. 2 28 February 1997 (1997-02-28) * |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1641328A2 (en) * | 2004-09-23 | 2006-03-29 | Walter Esser, Kunststoff-Spritzgiesserei GmbH & Co. KG | Part with electrically conductive paths |
EP1641328A3 (en) * | 2004-09-23 | 2007-04-25 | Walter Esser, Kunststoff-Spritzgiesserei GmbH & Co. KG | Part with electrically conductive paths |
US8049113B2 (en) * | 2007-05-18 | 2011-11-01 | Fukui Precision Component (Shenzhen) Co., Ltd. | Printed circuit boards |
WO2011113772A1 (en) * | 2010-03-16 | 2011-09-22 | Gemalto Sa | Electronic module having side contacts, device comprising same and method for manufacturing such a module |
EP2369904A1 (en) * | 2010-03-16 | 2011-09-28 | Gemalto SA | Electronic module with lateral contacts, device comprising same and method for manufacturing such a module |
WO2012120032A3 (en) * | 2011-03-09 | 2012-12-27 | Continental Automotive Gmbh | Assembly having a substrate, an smd component, and a lead frame part |
US9564789B2 (en) | 2011-03-09 | 2017-02-07 | Continental Automotive Gmbh | Assembly having a substrate, an SMD component, and a lead frame part |
FR2983029A1 (en) * | 2011-11-21 | 2013-05-24 | Bosch Gmbh Robert | CIRCUIT FOR ELECTRONIC AND / OR ELECTRICAL COMPONENTS |
WO2015121532A1 (en) * | 2014-02-14 | 2015-08-20 | Nokia Corporation | A circuit board and associated apparatus and methods |
EP3547357A4 (en) * | 2016-11-28 | 2020-07-01 | Kyocera Corporation | Wiring board, electronic device, and electronic module |
Also Published As
Publication number | Publication date |
---|---|
CA2284072A1 (en) | 1998-10-08 |
US5994648A (en) | 1999-11-30 |
CN1084585C (en) | 2002-05-08 |
EP0970594B1 (en) | 2001-12-12 |
EP0970594A1 (en) | 2000-01-12 |
CN1249122A (en) | 2000-03-29 |
DE69709176T2 (en) | 2002-07-18 |
JP2002515184A (en) | 2002-05-21 |
DE69709176D1 (en) | 2002-01-24 |
BR9714585A (en) | 2000-03-08 |
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