WO1998054942A1 - A shielding housing, methods of producing a shielding housing and use thereof - Google Patents

A shielding housing, methods of producing a shielding housing and use thereof Download PDF

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Publication number
WO1998054942A1
WO1998054942A1 PCT/SE1998/000986 SE9800986W WO9854942A1 WO 1998054942 A1 WO1998054942 A1 WO 1998054942A1 SE 9800986 W SE9800986 W SE 9800986W WO 9854942 A1 WO9854942 A1 WO 9854942A1
Authority
WO
WIPO (PCT)
Prior art keywords
shielding
housing
printed circuit
circuit board
gasket
Prior art date
Application number
PCT/SE1998/000986
Other languages
French (fr)
Inventor
Per Holmberg
Mats Larsson
Örjan FELDT
Original Assignee
Telefonaktiebolaget Lm Ericsson
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget Lm Ericsson filed Critical Telefonaktiebolaget Lm Ericsson
Priority to AU77937/98A priority Critical patent/AU7793798A/en
Priority to DE19882416T priority patent/DE19882416T1/en
Publication of WO1998054942A1 publication Critical patent/WO1998054942A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • H05K9/0028—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet with retainers or specific soldering features
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0031—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields combining different shielding materials

Definitions

  • the invention relates to a shielding housing for electrically shielding one or more components on a printed circuit board as well as to methods of producing such a shielding housing.
  • soldered shielding cans or housings are used to shield critical components on a printed circuit board.
  • the shielding cans are soldered to corresponding conductors on the printed circuit boards to cover and, thereby, shield the critical components.
  • Shielding cans which are soldered to printed to printed circuit boards, are difficult and expensive to remove and replace in connection with such tests and services.
  • the object of the invention is to bring about an improved shielding housing which is easy and inexpensive to mount and dismount.
  • the shielding housing in accordance with the invention comprises a shielding element which is provided with at least one serrated, elastic shielding gasket.
  • the shielding gasket is adapted to make contact with at least one corresponding conductor on a printed circuit board, surrounding a component or a set of components to be shielded, when the shielding housing is pressed against the printed circuit board.
  • the serrated shielding gasket is deposited on the shielding element by injection moulding.
  • the shielding housing according to the invention will be easy and inexpensive to mount and dismount in that it is not soldered to the printed circuit board but, instead, pressed to the printed circuit board. Thus, it will be cheaper to carry out a test or service operation on a component which is shielded by such a shielding housing than if the component was shielded by a soldered shielding housing.
  • the contact pressure which is necessary to obtain good electric contact between the shielding gasket and the corresponding conductor on the printed circuit board, will not have to be as high as if the gasket was non-serrated. Moreover, less material is needed for a serrated gasket in comparison with a non-serrated gasket.
  • Fig. 1 is a schematical cross-sectional view of a first embodiment of a shielding housing according to the invention
  • Fig. 2 is a schematical cross-sectional view of a second embodiment of the shielding housing according to the invention.
  • a first embodiment of a shielding housing 1 according to the invention is schematically illustrated in a cross-sectional view. To better illustrate the invention, the dimensions of the shielding housing 1 have been greatly exaggerated.
  • the shielding housing 1 shown in Fig. 1, comprises a shielding can 2.
  • the shielding can 2 may be made either of a conducting material, such as aluminum, or of a plastic material with a conducting filler, such as graphite, or of a non-conducting material, such as a plastic material, covered by a conducting material, such as a conductive paint, a metallization, or a metal foil.
  • the shielding can 2 has a single cavity 3 for receiving a component or components (not shown) to be shielded on a printed circuit board (not shown).
  • the shielding housing may have more than one cavity.
  • the shielding can 2 is provided with a serrated, elastic shielding gasket 4 which is adapted to cooperate with a corresponding conductor (not shown) surrounding the component (not shown) to be shielded on a printed circuit board (not shown).
  • shielding housing has more than one cavity
  • a shielding gasket would be provided for each cavity, if necessary.
  • the shielding gasket 4 is made of an electrically shielding material, e.g. a plastic material, such as silicone, silicone rubber, epoxy, polyurethane or a thermoplastic elastomer, having a conductive filler such as graphite or metal fibres, microspheres of silver or gold, or silver or gold plated microspheres.
  • a plastic material such as silicone, silicone rubber, epoxy, polyurethane or a thermoplastic elastomer, having a conductive filler such as graphite or metal fibres, microspheres of silver or gold, or silver or gold plated microspheres.
  • the shielding gasket 4 in the embodiment according to Fig. 1, is deposited on the rim of the shielding can 2, preferably by injection moulding, but it may also be deposited by gluing, dispensation or any other suitable process as long as good electric contact is obtained between the shielding can 2 and the shielding gasket 4.
  • the shielding can 2 as illustrated in Fig. 1, is supposed to be pressed with its shielding gasket 4 against a conductor (not shown) on a printed circuit board (not shown) to shield one or more components thereon.
  • the shielding can 2 may be pressed against a corresponding conductor on a printed circuit board by means of e.g. a covering lid on the mobile phone.
  • the shielding gasket 4 serrated in accordance with the invention By making the shielding gasket 4 serrated in accordance with the invention, less contact pressure will be needed to obtain good electric contact between the shielding gasket 4 and the corresponding conductor (not shown) surrounding the components to be shielded on the printed circuit board (not shown), than if the shielding gasket was non-serrated. Moreover, by making the shielding gasket 4 serrated, the requirements on the accuracy of the dimensions of the gasket will be low.
  • the shielding housing may be provided with a guiding element in order to locate the shielding housing on a printed circuit board.
  • the shielding can 2 is provided with a guiding pin 5 which is adapted to cooperate with a corresponding hole in a printed circuit board (not shown).
  • the shielding housing may of course be provided with more than one guiding element.
  • the guiding elements do not necessarily have to cooperate with elements on a printed circuit board but may instead cooperate with other elements in a device, e.g. a mobile phone, comprising a printed circuit board having components to be shielded.
  • Fig. 2 shows a cross-sectional view of a second embodiment of a shielding housing according to the invention, generally denoted 6. It should be noted that, also in Fig. 2, the dimensions of the shielding housing are greatly exaggerated.
  • the shielding housing 6 comprises a flat plate 7 which carries a serrated, elastic shielding gasket 8 of the same nature as the shielding gasket 4 in Fig. 1.
  • the shielding gasket 8 forms the rim of a cavity 9 for receiving a component or a set of components (not shown) to be shielded on a printed circuit board (not shown). It is to be understood that also in this case, more than one shielding gasket may be needed on the plate in order to define more than one cavity, if necessary.
  • the plate 7 is supposed to be made of a non- conducting material.
  • a shielding layer 10 of the same conducting material as the gasket 8 has been deposited, integral with the gasket 8, on the plate 7, preferably in the same injection moulding process as the gasket 8.
  • the plate 7 equally well may be of a conducting material. In such a case, just the shielding gasket 8 and not the conducting layer 10 would, of course, be deposited on the plate 7.
  • the shielding housing 6 is, in this embodiment, provided with a hole 11 through which a screw (not shown) may be screwed into a corresponding hole on the printed circuit board (not shown) to fix the housing to the printed circuit board.
  • the hole 11 may instead cooperate with a guiding pin (not shown) provided on a printed circuit board (not shown).
  • the shielding housmg may also be pressed to a printed circuit board by means of clips.
  • the shielding housing according to the invention will be easy and inexpensive to mount and dismount.
  • the serrated, elastic shielding gasket By means of the serrated, elastic shielding gasket, good electric contact will be obtained between the shielding housing and a corresponding conductor on a printed circuit board when the shielding housing is pressed with its gasket against a corresponding conductor on a printed circuit board.

Abstract

A shielding housing (1) cooperates with at least one conductor surrounding at least one component on a printed circuit board to electrically shield said at least one component. The shielding housing (1) comprises a shielding element (2) which carries a serrated, elastic shielding gasket (4), which is adapted to cooperate with said at least one conductor. The housing (1) is adapted to be pressed with its serrated gasket (4) against said conductor on the printed circuit board.

Description

A SHIELDING HOUSING, METHODS OF PRODUCING A SHIELDING HOUSING AND USE THEREOF
TECHNICAL FIELD The invention relates to a shielding housing for electrically shielding one or more components on a printed circuit board as well as to methods of producing such a shielding housing.
BACKGROUND OF THE INVENTION To prevent components in electronic equipment, e.g. mobile phones, from transmitting unwanted high-frequency signals that may interfere with other electronic equipment or vice versa, i.e. to prevent other electronic equipment from interfering with components in mobile phones, such components have to be electrically shielded. Moreover, such a shielding is necessary in order for the equipment to comply with electromagnetic compatibility (EMC) requirements.
Today, soldered shielding cans or housings are used to shield critical components on a printed circuit board. The shielding cans are soldered to corresponding conductors on the printed circuit boards to cover and, thereby, shield the critical components.
However, it is often necessary to test the components located under the shielding cans. Such tests have to be carried out both during production stages and at after- sales services.
Shielding cans which are soldered to printed to printed circuit boards, are difficult and expensive to remove and replace in connection with such tests and services.
SUMMARY OF THE INVENTION The object of the invention is to bring about an improved shielding housing which is easy and inexpensive to mount and dismount. This is attained in that the shielding housing in accordance with the invention, comprises a shielding element which is provided with at least one serrated, elastic shielding gasket. The shielding gasket is adapted to make contact with at least one corresponding conductor on a printed circuit board, surrounding a component or a set of components to be shielded, when the shielding housing is pressed against the printed circuit board.
Preferably, the serrated shielding gasket is deposited on the shielding element by injection moulding.
The shielding housing according to the invention will be easy and inexpensive to mount and dismount in that it is not soldered to the printed circuit board but, instead, pressed to the printed circuit board. Thus, it will be cheaper to carry out a test or service operation on a component which is shielded by such a shielding housing than if the component was shielded by a soldered shielding housing.
By making the shielding gasket serrated, the contact pressure which is necessary to obtain good electric contact between the shielding gasket and the corresponding conductor on the printed circuit board, will not have to be as high as if the gasket was non-serrated. Moreover, less material is needed for a serrated gasket in comparison with a non-serrated gasket.
BRIEF DESCRIPTION OF THE DRAWING The invention will be described more in detail below with reference to the appended drawing, on which Fig. 1 is a schematical cross-sectional view of a first embodiment of a shielding housing according to the invention, and Fig. 2 is a schematical cross-sectional view of a second embodiment of the shielding housing according to the invention. ***»
PREFERRED EMBODIMENTS
In Fig. 1, a first embodiment of a shielding housing 1 according to the invention, is schematically illustrated in a cross-sectional view. To better illustrate the invention, the dimensions of the shielding housing 1 have been greatly exaggerated.
The shielding housing 1 shown in Fig. 1, comprises a shielding can 2. The shielding can 2 may be made either of a conducting material, such as aluminum, or of a plastic material with a conducting filler, such as graphite, or of a non-conducting material, such as a plastic material, covered by a conducting material, such as a conductive paint, a metallization, or a metal foil.
In the embodiment according to Fig. 1, the shielding can 2 has a single cavity 3 for receiving a component or components (not shown) to be shielded on a printed circuit board (not shown). However, it is to be understood that the shielding housing 1, of course, may have more than one cavity.
In accordance with the invention, the shielding can 2 is provided with a serrated, elastic shielding gasket 4 which is adapted to cooperate with a corresponding conductor (not shown) surrounding the component (not shown) to be shielded on a printed circuit board (not shown).
In case the shielding housing has more than one cavity, a shielding gasket would be provided for each cavity, if necessary.
The shielding gasket 4 is made of an electrically shielding material, e.g. a plastic material, such as silicone, silicone rubber, epoxy, polyurethane or a thermoplastic elastomer, having a conductive filler such as graphite or metal fibres, microspheres of silver or gold, or silver or gold plated microspheres.
The shielding gasket 4 in the embodiment according to Fig. 1, is deposited on the rim of the shielding can 2, preferably by injection moulding, but it may also be deposited by gluing, dispensation or any other suitable process as long as good electric contact is obtained between the shielding can 2 and the shielding gasket 4.
In accordance with the invention, the shielding can 2, as illustrated in Fig. 1, is supposed to be pressed with its shielding gasket 4 against a conductor (not shown) on a printed circuit board (not shown) to shield one or more components thereon. In case of e.g. a mobile phone, the shielding can 2 may be pressed against a corresponding conductor on a printed circuit board by means of e.g. a covering lid on the mobile phone.
By making the shielding gasket 4 serrated in accordance with the invention, less contact pressure will be needed to obtain good electric contact between the shielding gasket 4 and the corresponding conductor (not shown) surrounding the components to be shielded on the printed circuit board (not shown), than if the shielding gasket was non-serrated. Moreover, by making the shielding gasket 4 serrated, the requirements on the accuracy of the dimensions of the gasket will be low.
In accordance with the invention, the shielding housing may be provided with a guiding element in order to locate the shielding housing on a printed circuit board.
In the embodiment in Fig. 1, the shielding can 2 is provided with a guiding pin 5 which is adapted to cooperate with a corresponding hole in a printed circuit board (not shown).
If necessary, the shielding housing may of course be provided with more than one guiding element. Also, it should be understood that the guiding elements do not necessarily have to cooperate with elements on a printed circuit board but may instead cooperate with other elements in a device, e.g. a mobile phone, comprising a printed circuit board having components to be shielded. Fig. 2 shows a cross-sectional view of a second embodiment of a shielding housing according to the invention, generally denoted 6. It should be noted that, also in Fig. 2, the dimensions of the shielding housing are greatly exaggerated.
In the embodiment in Fig. 2, the shielding housing 6 comprises a flat plate 7 which carries a serrated, elastic shielding gasket 8 of the same nature as the shielding gasket 4 in Fig. 1. Thus, the shielding gasket 8 as such will not be described in more detail in this connection. However, in this embodiment, the shielding gasket 8 forms the rim of a cavity 9 for receiving a component or a set of components (not shown) to be shielded on a printed circuit board (not shown). It is to be understood that also in this case, more than one shielding gasket may be needed on the plate in order to define more than one cavity, if necessary.
In the embodiment according to Fig. 2, the plate 7 is supposed to be made of a non- conducting material. To make the plate 7 shielding, a shielding layer 10 of the same conducting material as the gasket 8 has been deposited, integral with the gasket 8, on the plate 7, preferably in the same injection moulding process as the gasket 8.
It should, however, be understood that the plate 7 equally well may be of a conducting material. In such a case, just the shielding gasket 8 and not the conducting layer 10 would, of course, be deposited on the plate 7.
To locate the shielding housing 6 in Fig. 2 on a printed circuit board (not shown), the shielding housing 6 is, in this embodiment, provided with a hole 11 through which a screw (not shown) may be screwed into a corresponding hole on the printed circuit board (not shown) to fix the housing to the printed circuit board. As an alternative, the hole 11 may instead cooperate with a guiding pin (not shown) provided on a printed circuit board (not shown).
In accordance with the invention, the shielding housmg may also be pressed to a printed circuit board by means of clips. As should be apparent from the above, the shielding housing according to the invention will be easy and inexpensive to mount and dismount. By means of the serrated, elastic shielding gasket, good electric contact will be obtained between the shielding housing and a corresponding conductor on a printed circuit board when the shielding housing is pressed with its gasket against a corresponding conductor on a printed circuit board.

Claims

1. A shielding housing (1; 6) which is adapted to cooperate with at least one conductor surrounding at least one component on a printed circuit board to electrically shield said at least one component on the printed circuit board, characterized in that the housing (1; 6) comprises a shielding element (2; 7) which carries at least one serrated, elastic shielding gasket (4; 8), which is adapted to cooperate with said at least one conductor on the printed circuit board, the housing (1; 6) being adapted to be pressed with said at least one serrated gasket (4; 8) against said at least one conductor on the printed circuit board.
2. The housing as claimed in claim 1, characterized in that the shielding element (7) is a plate, and that said at least one serrated, elastic shielding gasket (8) forms the rim of at least one cavity (9) on the plate (7) for receiving said at least one component on the printed circuit board.
3. The housing as claimed in claim 2, characterized in that the plate (7) is of a non- shielding material, and that the plate (7) is provided with a layer (10) of a shielding material, integral with said at least one serrated, elastic shielding gasket (8).
4. The housing as claimed in claim 1, characterized in that the shielding element (2) exhibits at least one cavity (3), and that said at least one serrated, elastic shielding gasket (4) is provided on the rim of said at least one cavity (3) for receiving said at least one component on the printed circuit board.
5. The housing as claimed in any of claims 1 - 4, characterized in that it is provided with at least one guiding element (5; 11) for locating the housing (1; 6) on the printed circuit board.
6. The housing as claimed in claim 5, characterized in that the guiding element comprises at least one guiding pin (5) which is adapted to be inserted into a corresponding hole in the printed circuit board to locate the housing (1) thereon.
7. The housing as claimed in claims 5 or 6, characterized in that the guiding element comprises at least one hole (11) which is adapted to cooperate with a locating element for locating the housing (6) on the printed circuit board.
8. The housing as claimed in claim 7, characterized in that the locating element is a screw which is adapted to cooperated with a corresponding hole in the printed circuit board.
9. The housing as claimed in claim 7, characterized in that the locating element is a pin provided on the printed circuit board.
10. The housing as claimed in any of claims 1 - 9, characterized in that said at least one serrated, elastic shielding gasket (4; 8) has been deposited on the shielding element (1; 6) by injection moulding.
11. A method of producing a shielding housing for electrically shielding at least one component on a printed circuit board, said at least one component being surrounded by at least one conductor on the printed circuit board, characterized by depositing, on a shielding element (2; 7), at least one serrated, elastic shielding gasket (4; 8), the housing (1; 6) being adapted to be pressed with said at least one serrated gasket (4; 8) against said at least one conductor on the printed circuit board.
12. A method of producing a shielding housing for electrically shielding at least one component on a printed circuit board, said at least one component being surrounded by at least one conductor on the printed circuit board, characterized by depositing, on a non-shielding element (7), at least one serrated, elastic shielding gasket (8) of a shielding material, and, integral with the gasket, a shielding layer (10) of the same shielding material as the gasket (8), the housing (6) being adapted to be pressed with said at least one serrated gasket (8) against said conductor on the printed circuit board.
13. A mobile phone comprising, on a printed circuit board, at least one component electrically shielded by a shielding housing cooperating with at least one conductor surrounding said at least one component on the printed circuit board, characterized in that the housing comprises a shielding element which carries at least one serrated, elastic shielding gasket which is adapted to cooperate with said at least one conductor, the housing being pressed with said at least one serrated gasket against said at least one conductor on the printed circuit board.
PCT/SE1998/000986 1997-05-29 1998-05-26 A shielding housing, methods of producing a shielding housing and use thereof WO1998054942A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU77937/98A AU7793798A (en) 1997-05-29 1998-05-26 A shielding housing, methods of producing a shielding housing and use thereof
DE19882416T DE19882416T1 (en) 1997-05-29 1998-05-26 Shield housing, method of manufacturing a shield housing, and use thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9702027A SE511964C2 (en) 1997-05-29 1997-05-29 Shield casing and methods for making a casing
SE9702027-5 1997-05-29

Publications (1)

Publication Number Publication Date
WO1998054942A1 true WO1998054942A1 (en) 1998-12-03

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SE1998/000986 WO1998054942A1 (en) 1997-05-29 1998-05-26 A shielding housing, methods of producing a shielding housing and use thereof

Country Status (4)

Country Link
AU (1) AU7793798A (en)
DE (1) DE19882416T1 (en)
SE (1) SE511964C2 (en)
WO (1) WO1998054942A1 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6359214B1 (en) * 1999-10-28 2002-03-19 Dell Products, L.P. Serrated EMI gasket and computer system with improved EMI shielding
WO2002052915A1 (en) * 2000-12-27 2002-07-04 Telefonaktiebolaget L M Ericsson (Publ) Shield can
US6682674B2 (en) 2000-12-27 2004-01-27 Telefonaktiebolaget Lm Ericsson (Publ) Method of making a shield can
US7005573B2 (en) 2003-02-13 2006-02-28 Parker-Hannifin Corporation Composite EMI shield
WO2007098812A1 (en) * 2006-03-01 2007-09-07 Sony Ericsson Mobile Communications Ab Shielding device
US7326862B2 (en) 2003-02-13 2008-02-05 Parker-Hannifin Corporation Combination metal and plastic EMI shield
US7491899B2 (en) 2005-10-06 2009-02-17 Laird Technologies, Inc. EMI shields and related manufacturing methods
US7504592B1 (en) 2007-08-31 2009-03-17 Laird Technologies, Inc. Electromagnetic interference shields and related manufacturing methods

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE520785C2 (en) 2000-05-22 2003-08-26 Ericsson Telefon Ab L M Cover for an electronic device
JP4217520B2 (en) † 2003-04-16 2009-02-04 株式会社東海理化電機製作所 Switch device

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US2778868A (en) * 1953-04-07 1957-01-22 Walter E Stinger Integral radio frequency attenuation seal
US5008485A (en) * 1988-10-28 1991-04-16 Kitagawa Industries Co., Ltd. Conductive seal
US5039825A (en) * 1989-06-09 1991-08-13 Digital Equipment Corporation Corrugated strip gasket for an electronic enclosure joint to reduce both electromagnetic and radio frequency radiation
US5045635A (en) * 1989-06-16 1991-09-03 Schlegel Corporation Conductive gasket with flame and abrasion resistant conductive coating
US5150282A (en) * 1990-12-14 1992-09-22 Fujitsu Limited Electromagnetic shielding structure of high-frequency circuit arrangements
US5578790A (en) * 1995-09-06 1996-11-26 The Whitaker Corporation Shielding gasket

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US2778868A (en) * 1953-04-07 1957-01-22 Walter E Stinger Integral radio frequency attenuation seal
US5008485A (en) * 1988-10-28 1991-04-16 Kitagawa Industries Co., Ltd. Conductive seal
US5039825A (en) * 1989-06-09 1991-08-13 Digital Equipment Corporation Corrugated strip gasket for an electronic enclosure joint to reduce both electromagnetic and radio frequency radiation
US5045635A (en) * 1989-06-16 1991-09-03 Schlegel Corporation Conductive gasket with flame and abrasion resistant conductive coating
US5150282A (en) * 1990-12-14 1992-09-22 Fujitsu Limited Electromagnetic shielding structure of high-frequency circuit arrangements
US5578790A (en) * 1995-09-06 1996-11-26 The Whitaker Corporation Shielding gasket

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6359214B1 (en) * 1999-10-28 2002-03-19 Dell Products, L.P. Serrated EMI gasket and computer system with improved EMI shielding
WO2002052915A1 (en) * 2000-12-27 2002-07-04 Telefonaktiebolaget L M Ericsson (Publ) Shield can
US6682674B2 (en) 2000-12-27 2004-01-27 Telefonaktiebolaget Lm Ericsson (Publ) Method of making a shield can
US7005573B2 (en) 2003-02-13 2006-02-28 Parker-Hannifin Corporation Composite EMI shield
US7326862B2 (en) 2003-02-13 2008-02-05 Parker-Hannifin Corporation Combination metal and plastic EMI shield
US7491899B2 (en) 2005-10-06 2009-02-17 Laird Technologies, Inc. EMI shields and related manufacturing methods
US7926166B2 (en) 2005-10-06 2011-04-19 Laird Technologies, Inc. Method of making an electromagnetic interference shield
WO2007098812A1 (en) * 2006-03-01 2007-09-07 Sony Ericsson Mobile Communications Ab Shielding device
US7381906B2 (en) 2006-03-01 2008-06-03 Sony Ericsson Mobile Communications Ab Shielding device
US7955464B2 (en) 2006-03-01 2011-06-07 Sony Ericsson Mobile Communications Ab Method of making a shielding device
US7504592B1 (en) 2007-08-31 2009-03-17 Laird Technologies, Inc. Electromagnetic interference shields and related manufacturing methods

Also Published As

Publication number Publication date
DE19882416T1 (en) 2000-05-18
SE9702027D0 (en) 1997-05-29
AU7793798A (en) 1998-12-30
SE511964C2 (en) 1999-12-20
SE9702027L (en) 1998-11-30

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