WO1999011431A1 - Device and method for treating polishing pads, especially polishing cloths - Google Patents

Device and method for treating polishing pads, especially polishing cloths Download PDF

Info

Publication number
WO1999011431A1
WO1999011431A1 PCT/DE1998/002486 DE9802486W WO9911431A1 WO 1999011431 A1 WO1999011431 A1 WO 1999011431A1 DE 9802486 W DE9802486 W DE 9802486W WO 9911431 A1 WO9911431 A1 WO 9911431A1
Authority
WO
WIPO (PCT)
Prior art keywords
polishing
processing
polishing pad
diamond pieces
base layer
Prior art date
Application number
PCT/DE1998/002486
Other languages
German (de)
French (fr)
Inventor
Olaf Kühn
André RICHTER
Sigurd Zehner
Original Assignee
Infineon Technologies Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag filed Critical Infineon Technologies Ag
Priority to EP98949938A priority Critical patent/EP1007278A1/en
Publication of WO1999011431A1 publication Critical patent/WO1999011431A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B45/00—Means for securing grinding wheels on rotary arbors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D9/00—Wheels or drums supporting in exchangeable arrangement a layer of flexible abrasive material, e.g. sandpaper
    • B24D9/08—Circular back-plates for carrying flexible material
    • B24D9/085—Devices for mounting sheets on a backing plate

Definitions

  • the present invention relates to a device and a method for processing polishing pads, in particular polishing cloths.
  • polishing pads are used, for example, for polishing wafers in corresponding polishing devices.
  • a well-known method for polishing wafers is, among others, chemical mechanical polishing (CMP).
  • Polishing pads are usually subject to wear during use, so that they have to be refurbished from time to time and replaced if necessary. Especially with the
  • Refurbishing of polishing pads can result in individual particles of the refurbishing agent being deposited in the polishing pad, as a result of which the wafer surface can be damaged in the subsequent polishing process. This leads to increased wafer reject rates.
  • polishing pads can be worked up unevenly, so that the wafers are polished with different quality.
  • the present invention has for its object to provide a device for processing polishing pads, in which the disadvantages mentioned in the prior art are avoided.
  • a device is to be provided with which polishing pads can be worked up in a simple and safe manner without the disadvantageous effects described above occurring in the subsequent polishing process.
  • a corresponding, suitable method is to be provided.
  • the object is achieved by a device for processing polishing pads, in particular polishing cloths, which is characterized in that a processing disk is arranged on a carrying device, that the processing disk is brought into contact with the polishing pad via the carrying device and that the processing disk is a Has base layer on which metal-framed diamond pieces are arranged.
  • the service life of the polishing pads can be considerably improved by the device according to the invention. This leads to a cost reduction.
  • the diamond pieces evenly roughen the surface of the polishing pads, whereby a uniform, uniform surface structure of the polishing pads is achieved. In the subsequent polishing process, this leads to a constant polishing quality over the entire wafer surface.
  • the metal setting of the diamond pieces has the further advantage that the number of breaks out or breaks off of individual diamonds can be greatly reduced during the machining process. This prevents individual pieces of diamond deposited in the polishing pad from causing damage to the wafers in the subsequent polishing process.
  • the diamond pieces can be arranged on the surface of the base layer.
  • the processing disk can have any shape. For example, round, oval or square panes are conceivable. The invention is therefore not restricted to a special disk configuration.
  • the device can be used in general form for the conditioning of polishing pads.
  • a preferred embodiment of such a polishing pad is, for example, a polishing cloth.
  • the invention can also be applied to any other configuration of polishing pads.
  • the processing disk is detachable, preferably arranged on the carrier device via an adhesive layer.
  • a self-adhesive layer is particularly advantageous here. Due to the detachable connection of the processing disc and the carrying device, the processing disc can be replaced quickly and without effort when worn. This leads to an enormous reduction in set-up time and saves time.
  • the machining disk can be circular and preferably have a diameter of 30 to 150 mm, advantageously a diameter of 50 to 100 mm.
  • Preferred embodiments of the processing disk have a diameter of 50 mm or 100 mm.
  • the diamond pieces can be in the size range from 30 to 300 ⁇ .
  • the diamond pieces are preferably arranged at different densities on the base layer.
  • the diamond pieces can be nickel-set.
  • the base layer can advantageously be formed from a synthetic resin.
  • a method for processing polishing pads, in particular polishing cloths, using a device according to the invention as described above the method being characterized by the following steps: a) attaching a processing disc with a base layer, on which metal-framed diamond pieces are arranged, on a carrying device; b) bringing the processing disc into contact with the polishing pad to be processed via the carrying device; and c) moving the polishing pad and the machining wheel relative to one another in such a way that the diamond pieces of the machining wheel are guided over the polishing pad.
  • the process according to the invention enables polishing pads, for example polishing cloths, to be worked up in a simple and safe manner without the disadvantages mentioned in relation to the prior art occurring in the subsequent polishing process.
  • the processing disk and the po lierpad moved relative to each other in such a way that the processing disc is guided over the polishing pad.
  • the present invention is not limited to individual forms of movement.
  • the processing disk and / or the polishing pad perform a rotational movement, so that the processing disk is guided in a circle over the polishing pad.
  • the processing disk and / or the polishing pad can be moved relative to one another in a linearly directed movement.
  • the machining wheel is guided in a straight line, for example in a scrubbing movement, over the polishing pad.
  • a polishing pad to be processed is arranged on a rotating plate arranged in a polishing device for polishing wafers.
  • a processing disc which consists of a base layer made of synthetic resin, on the surface of which nickel-coated diamond pieces with a size of 30 to 300 ⁇ m are arranged in different densities, is detachably attached to a carrier device via an adhesive layer.
  • the carrying device can be pivoted by means of a supporting arm and its height is variable. Furthermore, the Device rotated via a drive.
  • the rotating processing disk is now pivoted over the likewise rotating polishing pad and placed on it until the diamond pieces of the processing disk come into contact with the surface of the polishing pad.
  • the processing disk and the polishing pad execute circular movements relative to one another, the processing disk is guided in a circle over the polishing pad. As a result, the surface of the polishing pad is roughened uniformly and uniformly at all points, without individual diamond pieces breaking out of the processing disk and being able to adhere disadvantageously to the polishing pad.
  • the support arm with the processing disk is pivoted out of the polishing device, so that the polishing process for the wafers can be continued.

Abstract

The invention relates to a device and a method for treating a polishing pad, especially a polishing cloth for polishing wafers. The inventive device has a treatment disk which is mounted on a carrying device. Said treatment disk has a base layer on which diamond pieces set in metal are arranged, and is brought into contact with the polishing pad for treatment of the same by means of the carrying device. The invention also relates to a method for treating the polishing pads.

Description

Vorrichtung und Verfahren zum Bearbeiten von Polierpads, insbesondere PoliertüchernDevice and method for processing polishing pads, in particular polishing cloths
Die vorliegende Erfindung betrifft eine Vorrichtung sowie ein Verfahren zum Bearbeiten von Polierpads, insbesondere von Poliertüchern.The present invention relates to a device and a method for processing polishing pads, in particular polishing cloths.
Derartige Polierpads werden beispielsweise zum Polieren von Wafern in entsprechenden Polier-Vorrichtungen verwendet. Ein bekanntes Verfahren zum Polieren von Wafern ist unter anderem das chemisch mechanische Polieren (CMP) .Such polishing pads are used, for example, for polishing wafers in corresponding polishing devices. A well-known method for polishing wafers is, among others, chemical mechanical polishing (CMP).
Üblicherweise unterliegen Polierpads im Gebrauch einem Verschleiß, so daß sie von Zeit zu Zeit aufgearbeitet und gege- benfalls ausgetauscht werden müssen. Insbesondere bei derPolishing pads are usually subject to wear during use, so that they have to be refurbished from time to time and replaced if necessary. Especially with the
Aufarbeitung von Polierpads kann es passieren, daß sich einzelne Partikel des Aufarbeitungsmittels im Polierpad ablagern, wodurch die Waferoberflache im anschließenden Polierprozeß beschädigt werden kann. Dies führt zu erhöhten Wafer- Ausschußraten.Refurbishing of polishing pads can result in individual particles of the refurbishing agent being deposited in the polishing pad, as a result of which the wafer surface can be damaged in the subsequent polishing process. This leads to increased wafer reject rates.
Weiterhin kann die Aufarbeitung der Polierpads ungleichmäßig erfolgen, so daß die Wafer mit unterschiedlicher Qualität poliert werden.Furthermore, the polishing pads can be worked up unevenly, so that the wafers are polished with different quality.
Ausgehend hiervon liegt der vorliegenden Erfindung die Aufgabe zugrunde, eine Vorrichtung zum Bearbeiten von Polierpads zu schaffen, bei der die im Stand der Technik genannten Nachteile vermieden werden.Proceeding from this, the present invention has for its object to provide a device for processing polishing pads, in which the disadvantages mentioned in the prior art are avoided.
Insbesondere soll eine Vorrichtung bereitgestellt werden, mit der Polierpads auf einfache und sichere Weise aufgearbeitet werden können, ohne daß es im nachfolgenden Polierprozeß zu den oben beschriebenen nachteiligen Effekten kommt. Gemäß einem weiteren Aspekt der Erfindung soll ein entsprechendes geeignetes Verfahren bereitgestellt werden.In particular, a device is to be provided with which polishing pads can be worked up in a simple and safe manner without the disadvantageous effects described above occurring in the subsequent polishing process. According to a further aspect of the invention, a corresponding, suitable method is to be provided.
Erfindungsgemäß wird die Aufgabe durch eine Vorrichtung zum Bearbeiten von Polierpads, insbesondere Poliertüchern gelöst, die dadurch gekennzeichnet ist, daß eine Bearbeitungsscheibe an einer Tragvorrichtung angeordnet ist, daß die Bearbei- tungsscheibe über die Tragvorrichtung mit dem Polierpad in Kontakt gebracht wird und daß die Bearbeitungsscheibe eine Grundschicht aufweist, auf der metallgefaßte Diamantstücke angeordnet sind.According to the invention the object is achieved by a device for processing polishing pads, in particular polishing cloths, which is characterized in that a processing disk is arranged on a carrying device, that the processing disk is brought into contact with the polishing pad via the carrying device and that the processing disk is a Has base layer on which metal-framed diamond pieces are arranged.
Durch die erfindungsgemäße Vorrichtung kann die Lebensdauer der Polierpads erheblich verbessert werden. Dies führt zu ei- ner Kostenreduktion. Die Diamantstücke rauhen die Oberfläche der Polierpads gleichmäßig auf, wodurch eine uniforme, gleichmäßige Oberflächenstruktur der Polierpads erreicht wird. Dies führt im anschließenden Polierprozeß zu einer gleichbleibenden Polierqualität über der gesamten Waferober- fläche.The service life of the polishing pads can be considerably improved by the device according to the invention. This leads to a cost reduction. The diamond pieces evenly roughen the surface of the polishing pads, whereby a uniform, uniform surface structure of the polishing pads is achieved. In the subsequent polishing process, this leads to a constant polishing quality over the entire wafer surface.
Die Metallfassung der Diamantstücke hat weiterhin den Vorteil, daß die Anzahl der Aus- oder Abbruche von Einzeldiamanten während des Bearbeitungsprozesses stark reduziert werden kann. Auf diese Weise wird verhindert, daß einzelne, im Polierpad abgelagerte Diamantstücke im nachfolgenden Polierprozeß zu Beschädigungen bei den Wafern führen können.The metal setting of the diamond pieces has the further advantage that the number of breaks out or breaks off of individual diamonds can be greatly reduced during the machining process. This prevents individual pieces of diamond deposited in the polishing pad from causing damage to the wafers in the subsequent polishing process.
Erfindungsgemäß können die Diamantstücke auf der Oberfläche der Grundschicht angeordnet sein. Es ist jedoch auch möglich, die Diamantstücke in einer solchen Weise einzufassen, so daß nur Teile der Diamantstücke freiliegen. Dies führt zu einer weiteren Reduktion der Gefahr eines Aus- oder Abbrechens der Diamantstücke . Erfindungsgemäß kann die Bearbeitungsscheibe jede beliebige Form haben. So sind beispielsweise runde, ovale oder eckige Scheiben denkbar. Die Erfindung ist somit nicht auf eine spezielle Scheibenkonfiguration beschränkt.According to the invention, the diamond pieces can be arranged on the surface of the base layer. However, it is also possible to surround the diamond pieces in such a way that only parts of the diamond pieces are exposed. This leads to a further reduction in the risk of the diamond pieces breaking or breaking off. According to the invention, the processing disk can have any shape. For example, round, oval or square panes are conceivable. The invention is therefore not restricted to a special disk configuration.
Die Vorrichtung kann in allgemeiner Form für das Conditionie- ren von Polierpads verwendet werden. Eine bevorzugte Ausgestaltung eines solchen Polierpads ist beispielsweise ein Poliertuch. Jedoch ist die Erfindung auch auf jede andere Aus- gestaltung von Polierpads anwendbar.The device can be used in general form for the conditioning of polishing pads. A preferred embodiment of such a polishing pad is, for example, a polishing cloth. However, the invention can also be applied to any other configuration of polishing pads.
Weitere Ausgestaltungen der Erfindung ergeben sich aus den Unteransprüchen .Further embodiments of the invention result from the subclaims.
In vorteilhafter Ausgestaltung ist die Bearbeitungsscheibe lösbar, vorzugsweise über eine Klebeschicht an der Tragvorrichtung angeordnet. Hierbei ist insbesondere eine selbstklebende Klebeschicht von Vorteil. Durch die lösbare Verbindung der Bearbeitungsscheibe und der Tragvorrichtung kann die Be- arbeitungsscheibe bei Verschleiß schnell und ohne Aufwand ausgetauscht werde . Dies führt zu einer enormen Verringerung des Rüstaufwands und zu einer Zeitersparnis .In an advantageous embodiment, the processing disk is detachable, preferably arranged on the carrier device via an adhesive layer. A self-adhesive layer is particularly advantageous here. Due to the detachable connection of the processing disc and the carrying device, the processing disc can be replaced quickly and without effort when worn. This leads to an enormous reduction in set-up time and saves time.
Erfindungsgemäß kann die Bearbeitungsscheibe kreisförmig aus- gebildet sein und vorzugsweise einen Durchmesser von 30 bis 150 mm, vorteilhaft einen Durchmesser von 50 bis 100 mm aufweisen. Bevorzugte Ausführungsformen der Bearbeitungsscheibe weisen einen Durchmesser von 50 mm oder 100 mm auf.According to the invention, the machining disk can be circular and preferably have a diameter of 30 to 150 mm, advantageously a diameter of 50 to 100 mm. Preferred embodiments of the processing disk have a diameter of 50 mm or 100 mm.
In weiterer Ausgestaltung können die Diamantstücke im Größenbereich von 30 bis 300 μ liegen.In a further embodiment, the diamond pieces can be in the size range from 30 to 300 μ.
Bevorzugt sind die Diamantstücke unterschiedlich dicht auf der Grundschicht angeordnet . In weiterer Ausgestaltung können die Diamantstücke Nickel-gefaßt sein.The diamond pieces are preferably arranged at different densities on the base layer. In a further embodiment, the diamond pieces can be nickel-set.
Schließlich kann die Grundschicht vorteilhaft aus einem Kunstharz gebildet sein.Finally, the base layer can advantageously be formed from a synthetic resin.
Gemäß einem zweiten Aspekt der vorliegenden Erfindung wird ein Verfahren zum Bearbeiten von Polierpads, insbesondere von Poliertüchern unter Verwendung einer wie vorstehend beschrie- benen erfindungsgemäßen Vorrichtung bereitgestellt, wobei das Verfahren durch die folgenden Schritte gekennzeichnet ist: a) Anbringen einer Bearbeitungsscheibe, mit einer Grundschicht, auf der metallgefaßte Diamantstücke angeordnet sind, an einer Tragvorrichtung; b) In Kontakt bringen der Bearbeitungsscheibe mit dem zu bearbeitenden Polierpad über die Tragvorrichtung; und c) Bewegen des Polierpads und der Bearbeitungsscheibe relativ zu einander in einer Weise, daß die Diamantstücke der Bearbeitungsscheibe über das Polierpad geführt wer- den .According to a second aspect of the present invention, there is provided a method for processing polishing pads, in particular polishing cloths, using a device according to the invention as described above, the method being characterized by the following steps: a) attaching a processing disc with a base layer, on which metal-framed diamond pieces are arranged, on a carrying device; b) bringing the processing disc into contact with the polishing pad to be processed via the carrying device; and c) moving the polishing pad and the machining wheel relative to one another in such a way that the diamond pieces of the machining wheel are guided over the polishing pad.
Durch das erfindungsgemäße Verfahren können Polierpads, beispielsweise Poliertücher, auf einfache und sichere Weise aufgearbeitet werden, ohne daß es im nachfolgenden Polierprozeß zu den im Hinblick auf den Stand der Technik genannten Nachteilen kommt.The process according to the invention enables polishing pads, for example polishing cloths, to be worked up in a simple and safe manner without the disadvantages mentioned in relation to the prior art occurring in the subsequent polishing process.
Da erfindungsgemäß eine wie vorstehend beschriebene Vorrichtung verwendet wird, wird in bezug auf die Vorteile, Wirkun- gen, Effekte und Funktionen des erfindungsgemäßen Verfahrens ausdrücklich und vollinhaltlich auf die obigen Ausführungen zur Vorrichtung zum Bearbeiten von Polierpads Bezug genommen und verwiesen.Since a device as described above is used according to the invention, reference is made expressly and in full to the above explanations regarding the device for processing polishing pads with regard to the advantages, effects, effects and functions of the method according to the invention.
Erfindungsgemäß werden die Bearbeitungsscheibe und das Po- lierpad auf solch eine Weise relativ zueinander bewegt, daß die Bearbeitungsscheibe über das Polierpad geführt wird.According to the invention, the processing disk and the po lierpad moved relative to each other in such a way that the processing disc is guided over the polishing pad.
Dabei ist die vorliegende Erfindung nicht auf einzelne Bewe- gungsformen beschränkt. So ist es beispielsweise denkbar, daß die Bearbeitungsscheibe und/oder das Polierpad eine Rotationsbewegung ausführen, so daß die Bearbeitungsscheibe kreisförmig über das Polierpad geführt wird.The present invention is not limited to individual forms of movement. For example, it is conceivable that the processing disk and / or the polishing pad perform a rotational movement, so that the processing disk is guided in a circle over the polishing pad.
In einer anderen Variante können die Bearbeitungsscheibe und/oder das Polierpad in einer linear gerichteten Bewegung relativ zueinander bewegt werden. Dadurch wird die Bearbeitungsscheibe geradlinig, beispielsweise in einer Schrubbewe- gung über das Polierpad geführt.In another variant, the processing disk and / or the polishing pad can be moved relative to one another in a linearly directed movement. As a result, the machining wheel is guided in a straight line, for example in a scrubbing movement, over the polishing pad.
Natürlich sind auch Kombinationen aus beiden Bewegungsvarianten oder ganz andere Bewegungsmöglichkeiten für die Bearbeitungsscheibe und/oder das Polierpad denkbar. Wichtig ist nur, daß die Bearbeitungsscheibe derart über das Polierpad geführt wird, daß eine gleichmäßige Aufrauhung der Polierpad-Oberflache erfolgt, ohne daß es zum Ab- beziehungsweise Ausbrechen einzelner Diamantstücke kommt.Of course, combinations of both movement variants or completely different movement possibilities for the processing disk and / or the polishing pad are also conceivable. It is only important that the processing wheel is guided over the polishing pad in such a way that the surface of the polishing pad is roughened uniformly, without individual diamond pieces breaking off or breaking off.
Nachfolgend wird eine Ausführungsvariante des erfindungsge- mäßen Verfahrens beschrieben.An embodiment variant of the method according to the invention is described below.
Auf einer in einer Polier-Vorrichtung für das Polieren von Wafern angeordneten sich drehenden Platte ist ein zu bearbeitendes Polierpad angeordnet. Eine Bearbeitungsscheibe, die aus einer Grundschicht aus Kunstharz besteht, auf deren Oberfläche Nickel-gefaßte Diamantstücke mit einer Größe von 30 bis 300 μm in unterschiedlicher Dichte angeordnet sind, ist über eine Klebeschicht lösbar an einer Tragvorrichtung befestigt. Die Tragvorrichtung ist über einen Tragarm schwenkbar und in der Höhe variabel gelagert. Weiterhin wird die Trag- Vorrichtung über einen Antrieb in eine Rotationsbewegung versetzt .A polishing pad to be processed is arranged on a rotating plate arranged in a polishing device for polishing wafers. A processing disc, which consists of a base layer made of synthetic resin, on the surface of which nickel-coated diamond pieces with a size of 30 to 300 μm are arranged in different densities, is detachably attached to a carrier device via an adhesive layer. The carrying device can be pivoted by means of a supporting arm and its height is variable. Furthermore, the Device rotated via a drive.
Die rotierende Bearbeitungsscheibe wird nun über das eben- falls rotierende Polierpad geschwenkt auf dieses soweit abgesetzt, bis die Diamantstücke der Bearbeitungscheibe mit der Oberfläche des Polierpads in Kontakt kommen.The rotating processing disk is now pivoted over the likewise rotating polishing pad and placed on it until the diamond pieces of the processing disk come into contact with the surface of the polishing pad.
Da die Bearbeitungsscheibe und das Polierpad Kreisbewegungen relativ zueinander ausführen, wird die Bearbeitungsscheibe kreisförmig über das Polierpad geführt. Dadurch wird die Oberfläche des Polierpads an allen Stellen gleichmäßig und uniform aufgerauht, ohne daß einzelne Diamantstücke aus der Bearbeitungsscheibe ausbrechen und sich nachteilig im Polier- pad anlagern können. Nach Beendigung des Aufarbeitungsprozesses wird der Tragarm mit der Bearbeitungsscheibe aus der Polier-Vorrichtung herausgeschwenkt, so daß der Polierprozeß für die Wafer weitergeführt werden kann. Since the processing disk and the polishing pad execute circular movements relative to one another, the processing disk is guided in a circle over the polishing pad. As a result, the surface of the polishing pad is roughened uniformly and uniformly at all points, without individual diamond pieces breaking out of the processing disk and being able to adhere disadvantageously to the polishing pad. After the finishing process, the support arm with the processing disk is pivoted out of the polishing device, so that the polishing process for the wafers can be continued.

Claims

Patentansprücheclaims
1) Vorrichtung zum Bearbeiten eines Polierpads, insbesondere eines Poliertuchs, dadurch gekennzeichnet, daß eine Bearbeitungsscheibe an einer Tragvorrichtung angeordnet ist, daß die Bearbeitungsscheibe über die Tragvorrichtung mit dem Polierpad in Kontakt gebracht wird und daß die Bearbeitungsscheibe eine Grundschicht aufweist, auf der me- tallgefaßte Diamantstücke angeordnet sind.1) Device for processing a polishing pad, in particular a polishing cloth, characterized in that a processing disc is arranged on a carrier device, that the processing disc is brought into contact with the polishing pad via the carrier device and that the processing disc has a base layer on which metal Diamond pieces are arranged.
2) Vorrichtung nach Anspruch 1, dadurch gekennzeichnet, daß die Bearbeitungsscheibe lösbar, vorzugsweise über eine Klebeschicht an der Tragvorrichtung angeordnet ist.2) Device according to claim 1, characterized in that the processing disc is detachably, preferably arranged on the support device via an adhesive layer.
3 ) Vorrichtung nach Anspruch 1 oder 2 , dadurch gekennzeichnet, daß die Bearbeitungsscheibe kreisförmig ausgebildet ist und vorzugsweise einen Durchmesser von 30 bis 150 mm, vorteilhaft einen Durchmesser von 50 bis 100 mm aufweist.3) Device according to claim 1 or 2, characterized in that the processing disc is circular and preferably has a diameter of 30 to 150 mm, advantageously has a diameter of 50 to 100 mm.
4) Vorrichtung nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, daß die Diamantstücke im Größenbereich von 30 bis 300 μm liegen.4) Device according to one of claims 1 to 3, characterized in that the diamond pieces are in the size range of 30 to 300 microns.
5) Vorrichtung nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, daß die Diamantstücke unterschiedlich dicht auf der Grundschicht angeordnet sind.5) Device according to one of claims 1 to 4, characterized in that the diamond pieces are arranged different densities on the base layer.
6) Vorrichtung nach einem der Ansprüche 1 bis 5, dadurch ge- kennzeichnet, daß die Diamantstücke Nickel-gefaßt sind.6) Device according to one of claims 1 to 5, characterized in that the diamond pieces are nickel-set.
7) Vorrichtung nach einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, daß die Grundschicht aus Kunstharz gebildet ist. 8) Verfahren zum Bearbeiten von Polierpads, insbesondere von Poliertüchern, unter Verwendung einer Vorrichtung nach einem der Ansprüche 1 bis 7, gekennzeichnet durch folgende Schritte: a) Anbringen einer BearbeitungsScheibe, mit einer Grundschicht, auf der metallgefaßte Diamantstücke angeordnet sind, an einer Tragvorrichtung; b) in Kontakt bringen der Bearbeitungsscheibe mit dem zu bearbeitenden Polierpad über die Tragvorrichtung; und c) Bewegen des Polierpads und der BearbeitungsScheibe relativ zueinander in einer Weise, daß die Diamantstücke der Bearbeitungsscheibe über das Polierpad geführt werden. 7) Device according to one of claims 1 to 6, characterized in that the base layer is formed from synthetic resin. 8) Method for processing polishing pads, in particular polishing cloths, using a device according to one of claims 1 to 7, characterized by the following steps: a) attaching a processing disc, with a base layer, on which metal-framed diamond pieces are arranged, to a carrier device; b) bringing the processing disc into contact with the polishing pad to be processed via the carrying device; and c) moving the polishing pad and the machining wheel relative to one another in such a way that the diamond pieces of the machining wheel are guided over the polishing pad.
PCT/DE1998/002486 1997-08-29 1998-08-24 Device and method for treating polishing pads, especially polishing cloths WO1999011431A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP98949938A EP1007278A1 (en) 1997-08-29 1998-08-24 Device and method for treating polishing pads, especially polishing cloths

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19737873 1997-08-29
DE19737873.0 1997-08-29

Publications (1)

Publication Number Publication Date
WO1999011431A1 true WO1999011431A1 (en) 1999-03-11

Family

ID=7840668

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1998/002486 WO1999011431A1 (en) 1997-08-29 1998-08-24 Device and method for treating polishing pads, especially polishing cloths

Country Status (2)

Country Link
EP (1) EP1007278A1 (en)
WO (1) WO1999011431A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05154756A (en) * 1991-12-02 1993-06-22 Yokohama Rubber Co Ltd:The Polishing device
US5482496A (en) * 1992-04-13 1996-01-09 Minnesota Mining And Manufacturing Company Automated random orbital abrading system and method
EP0769350A1 (en) * 1995-10-19 1997-04-23 Ebara Corporation Method and apparatus for dressing polishing cloth
US5626509A (en) * 1994-03-16 1997-05-06 Nec Corporation Surface treatment of polishing cloth
US5655954A (en) * 1994-11-29 1997-08-12 Toshiba Kikai Kabushiki Kaisha Polishing apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05154756A (en) * 1991-12-02 1993-06-22 Yokohama Rubber Co Ltd:The Polishing device
US5482496A (en) * 1992-04-13 1996-01-09 Minnesota Mining And Manufacturing Company Automated random orbital abrading system and method
US5626509A (en) * 1994-03-16 1997-05-06 Nec Corporation Surface treatment of polishing cloth
US5655954A (en) * 1994-11-29 1997-08-12 Toshiba Kikai Kabushiki Kaisha Polishing apparatus
EP0769350A1 (en) * 1995-10-19 1997-04-23 Ebara Corporation Method and apparatus for dressing polishing cloth

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 017, no. 552 (M - 1491) 5 October 1993 (1993-10-05) *

Also Published As

Publication number Publication date
EP1007278A1 (en) 2000-06-14

Similar Documents

Publication Publication Date Title
DE19535616B4 (en) Wafer edge grinding device
EP1893384B1 (en) Method and device for grinding ceramic spheres
EP0264700B1 (en) Method of making a rotary groove at the border of a semiconductor wafer of a power semiconductor device
DE10195157B4 (en) Cleaning device for cleaning polishing cloths used for polishing semiconductor wafers
DE102018222296A1 (en) Workpiece processing method and processing device
WO1999011431A1 (en) Device and method for treating polishing pads, especially polishing cloths
DE10131668A1 (en) Process for the abrasive processing of surfaces, in particular semiconductor wafers
DE60110922T2 (en) TESTING DEVICE FOR POLISHING CUSHIONS AND METHOD FOR THE APPLICATION THEREOF
DE102005004041A1 (en) Ceramic balls grinding method, for use in ball grinding machine, involves grinding balls with grinding wheel having diamond abrasive grain in ceramic bond, where ceramic bond is burnt up to specific temperature, in oxygen-poor atmosphere
DE102004020723A1 (en) Method for clamping and subsequent machining of a workpiece and device for clamping a workpiece for carrying out the method
DE60129650T2 (en) Apparatus for dressing a polishing pad and method of making the polishing pad
EP2340149B1 (en) Adjustable belt sander
DE2855041A1 (en) Automatic dressing of resistance spot welding electrodes - where milling cutter reshapes electrodes, which are then re-polished via rotating polishing disk
DE10054166A1 (en) Method of machine polishing of semiconductor wafers, involves rotatably embedding the carriers for the wafers in recesses of a base plate with the carriers and base plate turning about own axes
DE102020202001A1 (en) Grinding device
DE102007022392A1 (en) Polishing machine for surface finishing of workpieces, has two polishing stations with rotary working disks which are arranged around central turning disk and two guiding and pressing stations are mounted for workpiece holder
EP0142636A2 (en) Brush with wire bristles for surface working
EP4149719A1 (en) Laboratory disk grinder, replacement grinding disk and use of a grinding disk
DE102023206090A1 (en) GRINDING PROCESS FOR WAFER DISCS
EP4292758A1 (en) Device for processing a disc blank by grinding
DE2857522A1 (en) Grinding and polishing arrangement - has parts mounted on spindle which makes planetary movement through polishing medium
DD213162A1 (en) DEVICE FOR PRODUCING HIGH-LEVEL SUBSTRATE DISCS
DD227073A1 (en) METHOD FOR PRODUCING BALL-ENVIRONMENTAL SURFACES ON COORDINATE GRINDING MACHINES
DE102004054567A1 (en) Process for simultaneous two sided removal of material from semiconductor wafers has wafer between rotary working discs and direction reversal at reduced force
DE10221859A1 (en) Rounding device for peripheral section of substrate such as thin semiconductor wafer, has rotating belt that extends over periphery of substrate and may be displaced relative to axis of rotation of wafer holder

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): JP KR US

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
WWE Wipo information: entry into national phase

Ref document number: 1998949938

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: KR

WWP Wipo information: published in national office

Ref document number: 1998949938

Country of ref document: EP

WWW Wipo information: withdrawn in national office

Ref document number: 1998949938

Country of ref document: EP