WO1999017317A8 - Microelectronic component carrier and method of its manufacture - Google Patents

Microelectronic component carrier and method of its manufacture

Info

Publication number
WO1999017317A8
WO1999017317A8 PCT/US1998/020262 US9820262W WO9917317A8 WO 1999017317 A8 WO1999017317 A8 WO 1999017317A8 US 9820262 W US9820262 W US 9820262W WO 9917317 A8 WO9917317 A8 WO 9917317A8
Authority
WO
WIPO (PCT)
Prior art keywords
leads
leadframe
perforations
package
component carrier
Prior art date
Application number
PCT/US1998/020262
Other languages
French (fr)
Other versions
WO1999017317A1 (en
Inventor
James D Lint
Nanci Vogtli
Original Assignee
Pulse Eng Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pulse Eng Inc filed Critical Pulse Eng Inc
Priority to EP98949571A priority Critical patent/EP1019925A4/en
Priority to AU95868/98A priority patent/AU9586898A/en
Priority to CA002304537A priority patent/CA2304537A1/en
Publication of WO1999017317A1 publication Critical patent/WO1999017317A1/en
Publication of WO1999017317A8 publication Critical patent/WO1999017317A8/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/10—Connecting leads to windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H01F17/06—Fixed inductances of the signal type  with magnetic core with core substantially closed in itself, e.g. toroid
    • H01F17/062—Toroidal core with turns of coil around it
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/02—Casings
    • H01F27/027—Casings specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H01F5/04—Arrangements of electric connections to coils, e.g. leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A microelectronic component carrier package (100) and method of its manufacture. A nonconducting component carrier having vertical risers (110) and guide channels (108) permits the rapid and accurate routing of microelectronic component leads with respect to a leadframe (104). Specially shaped perforations (116) in the leadframe (104) adjacent to and aligned with the guide channels (108) receive the leads, strip away the necessary amount of insulation, and sever the leads (124) to the proper length in one manufacturing process step. The leads are joined to the leadframe (104) by an interference fit, convention bonding technique (such as solder or thermal compression bonding), or other technique. The perforations (116) further provide for stress relief of the leads in the assembled package, and permit the joints between the leadframe (104) and leads to reside outside of the package, thereby minimizing the overall volume of the package. The perforations (116) may also be used as masks for laser energy used to strip insulation from the leads in the vicinity of the perforations (116).
PCT/US1998/020262 1997-09-29 1998-09-28 Microelectronic component carrier and method of its manufacture WO1999017317A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP98949571A EP1019925A4 (en) 1997-09-29 1998-09-28 Microelectronic component carrier and method of its manufacture
AU95868/98A AU9586898A (en) 1997-09-29 1998-09-28 Microelectronic component carrier and method of its manufacture
CA002304537A CA2304537A1 (en) 1997-09-29 1998-09-28 Microelectronic component carrier and method of its manufacture

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US6038997P 1997-09-29 1997-09-29
US60/060,389 1997-09-29
US09/045,379 1998-03-19
US09/045,379 US5986894A (en) 1997-09-29 1998-03-19 Microelectronic component carrier and method of its manufacture

Publications (2)

Publication Number Publication Date
WO1999017317A1 WO1999017317A1 (en) 1999-04-08
WO1999017317A8 true WO1999017317A8 (en) 1999-07-15

Family

ID=26722704

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1998/020262 WO1999017317A1 (en) 1997-09-29 1998-09-28 Microelectronic component carrier and method of its manufacture

Country Status (6)

Country Link
US (1) US5986894A (en)
EP (1) EP1019925A4 (en)
CN (2) CN1196151C (en)
AU (1) AU9586898A (en)
CA (1) CA2304537A1 (en)
WO (1) WO1999017317A1 (en)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3800536B2 (en) * 2002-12-06 2006-07-26 Ｔｄｋ株式会社 Modular jack
JP4416432B2 (en) * 2003-05-12 2010-02-17 シチズン電子株式会社 Power circuit equipment
US7241181B2 (en) 2004-06-29 2007-07-10 Pulse Engineering, Inc. Universal connector assembly and method of manufacturing
DE102004037844A1 (en) * 2004-08-04 2006-02-23 Epcos Ag Holder for an electrical component
US7524206B2 (en) * 2005-03-23 2009-04-28 Pulse Engineering, Inc. Power-enabled connector assembly with heat dissipation apparatus and method of manufacturing
US8496499B2 (en) 2006-04-05 2013-07-30 Pulse Electronics, Inc. Modular electronic header assembly and methods of manufacture
CN101662110A (en) * 2006-11-10 2010-03-03 莫列斯公司 Modular jack with two-piece housing and insert
US7596864B2 (en) * 2007-03-15 2009-10-06 Hon Hai Precision Ind. Co., Ltd. Stacked module connector
US7845984B2 (en) * 2008-07-01 2010-12-07 Pulse Engineering, Inc. Power-enabled connector assembly and method of manufacturing
US8203853B2 (en) * 2009-08-26 2012-06-19 U.D. Electronic Corp. Chip filter and the related supplementary tool
CN102431108A (en) * 2011-08-09 2012-05-02 四川欧曼机械有限公司 Cooling system of forming machine for electronic component package carrier
CN102496453A (en) * 2011-12-22 2012-06-13 德宙佑电电子(深圳)有限公司 Method for processing transformer before tin soldering
WO2013183011A2 (en) * 2012-06-07 2013-12-12 Intal Tech Ltd. Electronic equipment building blocks for rack mounting
GB2508402B (en) * 2012-11-30 2015-05-27 Control Tech Ltd A mount for electrical equipment
US9601857B2 (en) 2013-05-23 2017-03-21 Pulse Electronics, Inc. Methods and apparatus for terminating wire wound electronic devices
US9716344B2 (en) 2013-07-02 2017-07-25 Pulse Electronics, Inc. Apparatus for terminating wire wound electronic components to an insert header assembly
US9401561B2 (en) 2013-07-02 2016-07-26 Pulse Electronics, Inc. Methods and apparatus for terminating wire wound electronic components to a header assembly
JP6156042B2 (en) * 2013-10-09 2017-07-05 富士通株式会社 Transformer device and method of manufacturing transformer device
CN104821230B (en) * 2015-04-24 2017-03-15 诸暨斯通机电设备制造有限公司 A kind of small multi-sectional coiling magnet ring wire stripper
JP2017188202A (en) * 2016-04-01 2017-10-12 株式会社村田製作所 Terminal block with built-in coil
US10707010B2 (en) * 2016-05-05 2020-07-07 Cyntec Co., Ltd. Methods to spray paint on a body of an inductor
CN105934095B (en) * 2016-06-28 2019-02-05 Oppo广东移动通信有限公司 Pcb board and mobile terminal with it
US20190283164A1 (en) * 2018-03-19 2019-09-19 Asia Vital Components Co., Ltd. Soldering jig
CN109473407B (en) * 2018-09-29 2020-10-30 江苏芯力特电子科技有限公司 Chip carrier
CN117637312A (en) * 2022-08-17 2024-03-01 绵阳普思电子有限公司 Lead frame structure and magnetic core structure combined with lead frame structure

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3287795A (en) * 1964-06-05 1966-11-29 Western Electric Co Methods of assembling electrical components with circuits
US3370203A (en) * 1965-07-19 1968-02-20 United Aircraft Corp Integrated circuit modules
US3469684A (en) * 1967-01-26 1969-09-30 Advalloy Inc Lead frame package for semiconductor devices and method for making same
US4166265A (en) * 1978-02-03 1979-08-28 Amp Incorporated Coil bobbins and termination of coil windings
JPS58169948A (en) * 1982-03-30 1983-10-06 Fujitsu Ltd Resin-sealed type semiconductor device
US4521828A (en) * 1982-12-23 1985-06-04 At&T Technologies, Inc. Component module for piggyback mounting on a circuit package having dual-in-line leads
JPS59135753A (en) * 1983-01-25 1984-08-04 Toshiba Corp Semiconductor device and manufacture thereof
DE3623419A1 (en) * 1986-07-11 1988-01-21 Junghans Uhren Gmbh METHOD FOR EQUIPPING A CABINET NETWORK FOR THE CIRCUIT HOLDER OF AN ELECTROMECHANICAL CLOCKWORK AND PARTLY ASSEMBLED CABINET NETWORK OF A CLOCKWORK CIRCUIT BRACKET
DE3636065C1 (en) * 1986-10-23 1988-04-28 Klaus Lorenzen Holder of electrical components on a circuit board
US4906802A (en) * 1988-02-18 1990-03-06 Neal Castleman Molded chip carrier
US5162894A (en) * 1988-05-24 1992-11-10 Kabushiki Kaisha Toshiba Semiconductor integrated circuit having a dummy lead and shaped inner leads
US5200364A (en) * 1990-01-26 1993-04-06 Texas Instruments Incorporated Packaged integrated circuit with encapsulated electronic devices
US5042146A (en) * 1990-02-06 1991-08-27 Watson Troy M Method and apparatus of making an electrical interconnection on a circuit board
US5015981A (en) * 1990-08-21 1991-05-14 Pulse Engineering, Inc. Electronic microminiature packaging and method
US5185653A (en) * 1990-11-08 1993-02-09 National Semiconductor Corporation O-ring package
US5270262A (en) * 1991-02-28 1993-12-14 National Semiconductor Corporation O-ring package
US5281849A (en) * 1991-05-07 1994-01-25 Singh Deo Narendra N Semiconductor package with segmented lead frame
US5402321A (en) * 1991-05-27 1995-03-28 Tdk Corporation Composite device having inductor and coupling member
DE9106978U1 (en) * 1991-06-07 1992-10-01 Robert Bosch Gmbh, 7000 Stuttgart, De
US5375320A (en) * 1991-08-13 1994-12-27 Micron Technology, Inc. Method of forming "J" leads on a semiconductor device
US5345670A (en) * 1992-12-11 1994-09-13 At&T Bell Laboratories Method of making a surface-mount power magnetic device
JPH06224054A (en) * 1993-01-27 1994-08-12 Tdk Corp Bobbin for transformer and manufacture thereof
US5451715A (en) * 1993-08-11 1995-09-19 Sgs-Thomson Microelectronics, Inc. Molded package integrated circuit with electrochemical cell
US5483024A (en) * 1993-10-08 1996-01-09 Texas Instruments Incorporated High density semiconductor package
US5455741A (en) * 1993-10-26 1995-10-03 Pulse Engineering, Inc. Wire-lead through hole interconnect device
FR2722033B1 (en) * 1994-07-04 1996-08-02 Entrelec Sa ELECTRICAL CONNECTION MODULE WITH CONNECTING PART OF THE TYPE WITH A WIRE RETAINING SLOT PROVIDED WITH AN INSULATING MOUTH
US5541451A (en) * 1994-10-24 1996-07-30 Kabushiki Kaisha Toshiba Packaged semiconductor device with external leads having anchor holes provided at polyamide/glass sealed regions

Also Published As

Publication number Publication date
CN1196151C (en) 2005-04-06
CN1280702A (en) 2001-01-17
EP1019925A1 (en) 2000-07-19
EP1019925A4 (en) 2005-12-21
CN1495814A (en) 2004-05-12
WO1999017317A1 (en) 1999-04-08
US5986894A (en) 1999-11-16
CA2304537A1 (en) 1999-04-08
CN1252753C (en) 2006-04-19
AU9586898A (en) 1999-04-23

Similar Documents

Publication Publication Date Title
WO1999017317A8 (en) Microelectronic component carrier and method of its manufacture
US20010023087A1 (en) Method for housing sensors in a package
MY123937A (en) Process for manufacturing semiconductor package and circuit board assembly
DE3581049D1 (en) A METHOD FOR PRODUCING A SEMICONDUCTOR ARRANGEMENT WITH LADDER PLUGS.
DE69532298D1 (en) MICROELECTRONIC BOND CONNECTION WITH LADDER MOVEMENT
WO2007067384A3 (en) Hermetically sealed glass package and method of manufacture
CA2237819A1 (en) A micromagnetic device for power processing applications and method of manufacture therefor
CA2340108A1 (en) Semiconductor package, semiconductor device, electronic device, and method for producing semiconductor package
MY120319A (en) Multi-layer solder seal band for semiconductor substrates and process thereof.
EP1150351A3 (en) Semiconductor package and semiconductor package fabrication method
EP0984051A4 (en) Heat-resistant adhesives and semiconductor devices produced therewith
TW349233B (en) Pre-bond cavity air bridge
EP1063699A4 (en) Base sheet for semiconductor module, method for manufacturing base sheet for semiconductor module, and semiconductor module
US5339518A (en) Method for making a quad leadframe for a semiconductor device
DE59505452D1 (en) METHOD FOR SOLDERING CONNECTING SURFACES AND METHOD FOR PRODUCING A SOLDER ALLOY
WO2000015429A8 (en) Composite wire with noble metal cladding
US5006143A (en) Method of producing a joined article through bonding with low melting point glass
KR20080089041A (en) Led package comprising lead frame being without outer lead and method for fabricating the same
JPH06104295A (en) Soldering of hybrid ic
EP0204102A3 (en) Direct connection of lead frame having flexible, tapered leads and mechanical die support
KR100259361B1 (en) Semiconductor chip size package and manufacturing method thereof
CN212365958U (en) Edge pressing integrated circuit lead frame for chip area
CA1238120A (en) Packaged integrated circuit chip
WO1999004414A3 (en) Heat dissipation in lead frames
US20040094827A1 (en) Leadframe for semiconductor device, method for manufacturing semiconductor device using the same, semiconductor device using the same, and electronic equipment

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 98811589.1

Country of ref document: CN

AK Designated states

Kind code of ref document: A1

Designated state(s): AL AM AT AU AZ BA BB BG BR BY CA CH CN CU CZ DE DK EE ES FI GB GE GH GM HR HU ID IL IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MD MG MK MN MW MX NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT UA UG UZ VN YU ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GH GM KE LS MW SD SZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
AK Designated states

Kind code of ref document: C1

Designated state(s): AL AM AT AU AZ BA BB BG BR BY CA CH CN CU CZ DE DK EE ES FI GB GE GH GM HR HU ID IL IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MD MG MK MN MW MX NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT UA UG UZ VN YU ZW

AL Designated countries for regional patents

Kind code of ref document: C1

Designated state(s): GH GM KE LS MW SD SZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG

CFP Corrected version of a pamphlet front page

Free format text: REVISED ABSTRACT RECEIVED BY THE INTERNATIONAL BUREAU AFTER COMPLETION OF THE TECHNICAL PREPARATIONS FOR INTERNATIONAL PUBLICATION

ENP Entry into the national phase

Ref document number: 2304537

Country of ref document: CA

Ref document number: 2304537

Country of ref document: CA

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: KR

WWE Wipo information: entry into national phase

Ref document number: 1998949571

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 1998949571

Country of ref document: EP

REG Reference to national code

Ref country code: DE

Ref legal event code: 8642