US20030164225A1
(en)
*
|
1998-04-20 |
2003-09-04 |
Tadashi Sawayama |
Processing apparatus, exhaust processing process and plasma processing
|
US6383300B1
(en)
*
|
1998-11-27 |
2002-05-07 |
Tokyo Electron Ltd. |
Heat treatment apparatus and cleaning method of the same
|
US6540838B2
(en)
*
|
2000-11-29 |
2003-04-01 |
Genus, Inc. |
Apparatus and concept for minimizing parasitic chemical vapor deposition during atomic layer deposition
|
JP2000256856A
(en)
*
|
1999-03-11 |
2000-09-19 |
Tokyo Electron Ltd |
Treating device, vacuum exhaust system for treating device, vacuum cvd device, vacuum exhaust system for vacuum cvd device and trapping device
|
GB9913970D0
(en)
*
|
1999-06-16 |
1999-08-18 |
Boc Group Plc |
Semiconductor processing exhaust abatement
|
FI110311B
(en)
|
1999-07-20 |
2002-12-31 |
Asm Microchemistry Oy |
Method and apparatus for eliminating substances from gases
|
US6500487B1
(en)
*
|
1999-10-18 |
2002-12-31 |
Advanced Technology Materials, Inc |
Abatement of effluent from chemical vapor deposition processes using ligand exchange resistant metal-organic precursor solutions
|
US6391385B1
(en)
|
1999-10-18 |
2002-05-21 |
Advanced Technology Materials, Inc. |
Method of abating of effluents from chemical vapor deposition processes using organometallic source reagents
|
US6773687B1
(en)
*
|
1999-11-24 |
2004-08-10 |
Tokyo Electron Limited |
Exhaust apparatus for process apparatus and method of removing impurity gas
|
TW496907B
(en)
*
|
2000-04-14 |
2002-08-01 |
Asm Microchemistry Oy |
Method and apparatus of growing a thin film onto a substrate
|
US7060132B2
(en)
*
|
2000-04-14 |
2006-06-13 |
Asm International N.V. |
Method and apparatus of growing a thin film
|
US6800254B1
(en)
*
|
2000-06-07 |
2004-10-05 |
Tegal Corporation |
Visual indicator cold trapping system
|
US6998097B1
(en)
*
|
2000-06-07 |
2006-02-14 |
Tegal Corporation |
High pressure chemical vapor trapping system
|
US6428609B1
(en)
*
|
2000-09-08 |
2002-08-06 |
Moore Epitaxial, Inc. |
Exhaust particulate controller and method
|
US6821489B1
(en)
*
|
2000-10-10 |
2004-11-23 |
International Business Machines Corporation |
System and method for abating the simultaneous flow of silane and arsine
|
US6770145B2
(en)
*
|
2000-12-11 |
2004-08-03 |
Tanaka Kikinzoku Kogyo K.K. |
Low-pressure CVD apparatus and method of manufacturing a thin film
|
US6866093B2
(en)
*
|
2001-02-13 |
2005-03-15 |
Honeywell International Inc. |
Isolation and flow direction/control plates for a heat exchanger
|
US7060234B2
(en)
*
|
2001-07-18 |
2006-06-13 |
Applied Materials |
Process and apparatus for abatement of by products generated from deposition processes and cleaning of deposition chambers
|
US6929637B2
(en)
*
|
2002-02-21 |
2005-08-16 |
Spiration, Inc. |
Device and method for intra-bronchial provision of a therapeutic agent
|
KR100484881B1
(en)
*
|
2002-06-17 |
2005-04-22 |
동부아남반도체 주식회사 |
Apparatus for monitoring temperature of cold trap for pvd chamber formed a vacuum
|
US6843893B2
(en)
*
|
2002-12-12 |
2005-01-18 |
International Business Machines Corporation |
Metal dry etch using electronic field
|
US6926775B2
(en)
*
|
2003-02-11 |
2005-08-09 |
Micron Technology, Inc. |
Reactors with isolated gas connectors and methods for depositing materials onto micro-device workpieces
|
US6843830B2
(en)
*
|
2003-04-15 |
2005-01-18 |
Advanced Technology Materials, Inc. |
Abatement system targeting a by-pass effluent stream of a semiconductor process tool
|
US7235138B2
(en)
*
|
2003-08-21 |
2007-06-26 |
Micron Technology, Inc. |
Microfeature workpiece processing apparatus and methods for batch deposition of materials on microfeature workpieces
|
US7422635B2
(en)
*
|
2003-08-28 |
2008-09-09 |
Micron Technology, Inc. |
Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpieces
|
US7647886B2
(en)
*
|
2003-10-15 |
2010-01-19 |
Micron Technology, Inc. |
Systems for depositing material onto workpieces in reaction chambers and methods for removing byproducts from reaction chambers
|
US7258892B2
(en)
|
2003-12-10 |
2007-08-21 |
Micron Technology, Inc. |
Methods and systems for controlling temperature during microfeature workpiece processing, e.g., CVD deposition
|
US8133554B2
(en)
|
2004-05-06 |
2012-03-13 |
Micron Technology, Inc. |
Methods for depositing material onto microfeature workpieces in reaction chambers and systems for depositing materials onto microfeature workpieces
|
US7699932B2
(en)
|
2004-06-02 |
2010-04-20 |
Micron Technology, Inc. |
Reactors, systems and methods for depositing thin films onto microfeature workpieces
|
DE602005016933D1
(en)
*
|
2004-06-28 |
2009-11-12 |
Cambridge Nanotech Inc |
ATOMIC SEPARATION SYSTEM AND METHOD
|
US8435351B2
(en)
*
|
2004-11-29 |
2013-05-07 |
Tokyo Electron Limited |
Method and system for measuring a flow rate in a solid precursor delivery system
|
JP2009530083A
(en)
*
|
2006-03-14 |
2009-08-27 |
プラクスエア・テクノロジー・インコーポレイテッド |
Selective separation process
|
JP2008082285A
(en)
*
|
2006-09-28 |
2008-04-10 |
Techno Takatsuki Co Ltd |
Dust collecting mechanism of air pump
|
US7601264B2
(en)
*
|
2006-10-04 |
2009-10-13 |
Applied Materials, Inc. |
Method for treatment of plating solutions
|
US20080083623A1
(en)
*
|
2006-10-04 |
2008-04-10 |
Golden Josh H |
Method and apparatus for treatment of plating solutions
|
ATE546570T1
(en)
*
|
2006-11-22 |
2012-03-15 |
Soitec Silicon On Insulator |
METHOD FOR EPITACTICAL DEPOSITION OF SINGLE CRYSTALLINE III-V SEMICONDUCTOR MATERIAL
|
KR100809852B1
(en)
*
|
2007-05-17 |
2008-03-04 |
(주)엘오티베큠 |
Intergrated apparatus for vacuum producing
|
WO2008150769A2
(en)
*
|
2007-05-31 |
2008-12-11 |
Thinsilicon Corporation |
Photovoltaic device and method of manufacturing photovoltaic devices
|
JP5133013B2
(en)
*
|
2007-09-10 |
2013-01-30 |
東京エレクトロン株式会社 |
Exhaust system structure of film forming apparatus, film forming apparatus, and exhaust gas treatment method
|
CN102165604A
(en)
*
|
2008-09-29 |
2011-08-24 |
薄膜硅公司 |
Monolithically-integrated solar module
|
US9394608B2
(en)
|
2009-04-06 |
2016-07-19 |
Asm America, Inc. |
Semiconductor processing reactor and components thereof
|
WO2010129163A2
(en)
*
|
2009-05-06 |
2010-11-11 |
Thinsilicon Corporation |
Photovoltaic cells and methods to enhance light trapping in semiconductor layer stacks
|
US20100313952A1
(en)
*
|
2009-06-10 |
2010-12-16 |
Thinsilicion Corporation |
Photovoltaic modules and methods of manufacturing photovoltaic modules having multiple semiconductor layer stacks
|
US8802201B2
(en)
|
2009-08-14 |
2014-08-12 |
Asm America, Inc. |
Systems and methods for thin-film deposition of metal oxides using excited nitrogen-oxygen species
|
JP5328726B2
(en)
*
|
2009-08-25 |
2013-10-30 |
三星ディスプレイ株式會社 |
Thin film deposition apparatus and organic light emitting display device manufacturing method using the same
|
JP5611718B2
(en)
*
|
2009-08-27 |
2014-10-22 |
三星ディスプレイ株式會社Samsung Display Co.,Ltd. |
Thin film deposition apparatus and organic light emitting display device manufacturing method using the same
|
JP5677785B2
(en)
*
|
2009-08-27 |
2015-02-25 |
三星ディスプレイ株式會社Samsung Display Co.,Ltd. |
Thin film deposition apparatus and organic light emitting display device manufacturing method using the same
|
US20110052795A1
(en)
*
|
2009-09-01 |
2011-03-03 |
Samsung Mobile Display Co., Ltd. |
Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
|
US8876975B2
(en)
|
2009-10-19 |
2014-11-04 |
Samsung Display Co., Ltd. |
Thin film deposition apparatus
|
KR101146982B1
(en)
*
|
2009-11-20 |
2012-05-22 |
삼성모바일디스플레이주식회사 |
Aapparatus for thin layer deposition and method of manufacturing organic light emitting display apparatus
|
KR101174874B1
(en)
*
|
2010-01-06 |
2012-08-17 |
삼성디스플레이 주식회사 |
Deposition source, apparatus for thin layer deposition and method of manufacturing organic light emitting display apparatus
|
KR101084184B1
(en)
|
2010-01-11 |
2011-11-17 |
삼성모바일디스플레이주식회사 |
Apparatus for thin layer deposition
|
KR101174875B1
(en)
*
|
2010-01-14 |
2012-08-17 |
삼성디스플레이 주식회사 |
Apparatus for thin layer deposition, method for manufacturing of organic light emitting display apparatus using the same, and organic light emitting display apparatus manufactured by the method
|
KR101193186B1
(en)
|
2010-02-01 |
2012-10-19 |
삼성디스플레이 주식회사 |
Apparatus for thin layer deposition, method for manufacturing of organic light emitting display apparatus using the same, and organic light emitting display apparatus manufactured by the method
|
KR101156441B1
(en)
|
2010-03-11 |
2012-06-18 |
삼성모바일디스플레이주식회사 |
Apparatus for thin layer deposition
|
KR101202348B1
(en)
|
2010-04-06 |
2012-11-16 |
삼성디스플레이 주식회사 |
Apparatus for thin layer deposition and method for manufacturing of organic light emitting display apparatus using the same
|
US8894458B2
(en)
|
2010-04-28 |
2014-11-25 |
Samsung Display Co., Ltd. |
Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
|
KR101223723B1
(en)
|
2010-07-07 |
2013-01-18 |
삼성디스플레이 주식회사 |
Apparatus for thin layer deposition, method for manufacturing of organic light emitting display apparatus using the same, and organic light emitting display apparatus manufactured by the method
|
KR101738531B1
(en)
|
2010-10-22 |
2017-05-23 |
삼성디스플레이 주식회사 |
Method for manufacturing of organic light emitting display apparatus, and organic light emitting display apparatus manufactured by the method
|
KR101723506B1
(en)
|
2010-10-22 |
2017-04-19 |
삼성디스플레이 주식회사 |
Apparatus for organic layer deposition and method for manufacturing of organic light emitting display apparatus using the same
|
KR20120045865A
(en)
|
2010-11-01 |
2012-05-09 |
삼성모바일디스플레이주식회사 |
Apparatus for organic layer deposition
|
KR20120065789A
(en)
|
2010-12-13 |
2012-06-21 |
삼성모바일디스플레이주식회사 |
Apparatus for organic layer deposition
|
KR101760897B1
(en)
|
2011-01-12 |
2017-07-25 |
삼성디스플레이 주식회사 |
Deposition source and apparatus for organic layer deposition having the same
|
US8404028B2
(en)
|
2011-01-18 |
2013-03-26 |
International Business Machines Corporation |
Vacuum trap labyrinth
|
JP5276679B2
(en)
*
|
2011-02-01 |
2013-08-28 |
東京エレクトロン株式会社 |
Deposition equipment
|
KR101840654B1
(en)
|
2011-05-25 |
2018-03-22 |
삼성디스플레이 주식회사 |
Apparatus for organic layer deposition and method for manufacturing of organic light emitting display apparatus using the same
|
KR101852517B1
(en)
|
2011-05-25 |
2018-04-27 |
삼성디스플레이 주식회사 |
Apparatus for organic layer deposition and method for manufacturing of organic light emitting display apparatus using the same
|
KR101857249B1
(en)
|
2011-05-27 |
2018-05-14 |
삼성디스플레이 주식회사 |
Patterning slit sheet assembly, apparatus for organic layer deposition, method for manufacturing organic light emitting display apparatus and organic light emitting display apparatus
|
KR101826068B1
(en)
|
2011-07-04 |
2018-02-07 |
삼성디스플레이 주식회사 |
Apparatus for thin layer deposition
|
US20130023129A1
(en)
|
2011-07-20 |
2013-01-24 |
Asm America, Inc. |
Pressure transmitter for a semiconductor processing environment
|
KR20130015144A
(en)
|
2011-08-02 |
2013-02-13 |
삼성디스플레이 주식회사 |
Deposition source, apparatus for organic layer deposition and method for manufacturing of organic light emitting display apparatus using the same
|
US9017481B1
(en)
|
2011-10-28 |
2015-04-28 |
Asm America, Inc. |
Process feed management for semiconductor substrate processing
|
JP5921168B2
(en)
*
|
2011-11-29 |
2016-05-24 |
株式会社日立国際電気 |
Substrate processing equipment
|
US9057388B2
(en)
*
|
2012-03-21 |
2015-06-16 |
International Business Machines Corporation |
Vacuum trap
|
US8728240B2
(en)
|
2012-05-02 |
2014-05-20 |
Msp Corporation |
Apparatus for vapor condensation and recovery
|
KR101994838B1
(en)
|
2012-09-24 |
2019-10-01 |
삼성디스플레이 주식회사 |
Apparatus for organic layer deposition, method for manufacturing of organic light emitting display apparatus using the same, and organic light emitting display apparatus manufactured by the method
|
US10714315B2
(en)
|
2012-10-12 |
2020-07-14 |
Asm Ip Holdings B.V. |
Semiconductor reaction chamber showerhead
|
US20140196664A1
(en)
*
|
2013-01-17 |
2014-07-17 |
Air Products And Chemicals, Inc. |
System and method for tungsten hexafluoride recovery and reuse
|
KR101682473B1
(en)
*
|
2013-10-18 |
2016-12-05 |
삼성전자주식회사 |
Fume purging chamber and manufacturing apparatus for semiconductor devices including the same
|
US11015245B2
(en)
|
2014-03-19 |
2021-05-25 |
Asm Ip Holding B.V. |
Gas-phase reactor and system having exhaust plenum and components thereof
|
US10858737B2
(en)
|
2014-07-28 |
2020-12-08 |
Asm Ip Holding B.V. |
Showerhead assembly and components thereof
|
US9890456B2
(en)
|
2014-08-21 |
2018-02-13 |
Asm Ip Holding B.V. |
Method and system for in situ formation of gas-phase compounds
|
US10941490B2
(en)
|
2014-10-07 |
2021-03-09 |
Asm Ip Holding B.V. |
Multiple temperature range susceptor, assembly, reactor and system including the susceptor, and methods of using the same
|
US10276355B2
(en)
|
2015-03-12 |
2019-04-30 |
Asm Ip Holding B.V. |
Multi-zone reactor, system including the reactor, and method of using the same
|
US10458018B2
(en)
|
2015-06-26 |
2019-10-29 |
Asm Ip Holding B.V. |
Structures including metal carbide material, devices including the structures, and methods of forming same
|
JP6391171B2
(en)
*
|
2015-09-07 |
2018-09-19 |
東芝メモリ株式会社 |
Semiconductor manufacturing system and operation method thereof
|
KR102477302B1
(en)
*
|
2015-10-05 |
2022-12-13 |
주성엔지니어링(주) |
Substrate treatment apparatus having exhaust gas cracker and exhaust gas treatment method of the same
|
US10211308B2
(en)
|
2015-10-21 |
2019-02-19 |
Asm Ip Holding B.V. |
NbMC layers
|
US11139308B2
(en)
|
2015-12-29 |
2021-10-05 |
Asm Ip Holding B.V. |
Atomic layer deposition of III-V compounds to form V-NAND devices
|
US10529554B2
(en)
|
2016-02-19 |
2020-01-07 |
Asm Ip Holding B.V. |
Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches
|
US10865475B2
(en)
|
2016-04-21 |
2020-12-15 |
Asm Ip Holding B.V. |
Deposition of metal borides and silicides
|
US10190213B2
(en)
|
2016-04-21 |
2019-01-29 |
Asm Ip Holding B.V. |
Deposition of metal borides
|
US10367080B2
(en)
|
2016-05-02 |
2019-07-30 |
Asm Ip Holding B.V. |
Method of forming a germanium oxynitride film
|
US11453943B2
(en)
|
2016-05-25 |
2022-09-27 |
Asm Ip Holding B.V. |
Method for forming carbon-containing silicon/metal oxide or nitride film by ALD using silicon precursor and hydrocarbon precursor
|
US9859151B1
(en)
|
2016-07-08 |
2018-01-02 |
Asm Ip Holding B.V. |
Selective film deposition method to form air gaps
|
US10612137B2
(en)
|
2016-07-08 |
2020-04-07 |
Asm Ip Holdings B.V. |
Organic reactants for atomic layer deposition
|
KR102532607B1
(en)
|
2016-07-28 |
2023-05-15 |
에이에스엠 아이피 홀딩 비.브이. |
Substrate processing apparatus and method of operating the same
|
US9812320B1
(en)
|
2016-07-28 |
2017-11-07 |
Asm Ip Holding B.V. |
Method and apparatus for filling a gap
|
US9887082B1
(en)
|
2016-07-28 |
2018-02-06 |
Asm Ip Holding B.V. |
Method and apparatus for filling a gap
|
US10643826B2
(en)
|
2016-10-26 |
2020-05-05 |
Asm Ip Holdings B.V. |
Methods for thermally calibrating reaction chambers
|
US11532757B2
(en)
|
2016-10-27 |
2022-12-20 |
Asm Ip Holding B.V. |
Deposition of charge trapping layers
|
US10714350B2
(en)
|
2016-11-01 |
2020-07-14 |
ASM IP Holdings, B.V. |
Methods for forming a transition metal niobium nitride film on a substrate by atomic layer deposition and related semiconductor device structures
|
US10229833B2
(en)
|
2016-11-01 |
2019-03-12 |
Asm Ip Holding B.V. |
Methods for forming a transition metal nitride film on a substrate by atomic layer deposition and related semiconductor device structures
|
KR102546317B1
(en)
|
2016-11-15 |
2023-06-21 |
에이에스엠 아이피 홀딩 비.브이. |
Gas supply unit and substrate processing apparatus including the same
|
KR20180068582A
(en)
|
2016-12-14 |
2018-06-22 |
에이에스엠 아이피 홀딩 비.브이. |
Substrate processing apparatus
|
US11581186B2
(en)
*
|
2016-12-15 |
2023-02-14 |
Asm Ip Holding B.V. |
Sequential infiltration synthesis apparatus
|
US11447861B2
(en)
*
|
2016-12-15 |
2022-09-20 |
Asm Ip Holding B.V. |
Sequential infiltration synthesis apparatus and a method of forming a patterned structure
|
KR20180070971A
(en)
|
2016-12-19 |
2018-06-27 |
에이에스엠 아이피 홀딩 비.브이. |
Substrate processing apparatus
|
US10269558B2
(en)
|
2016-12-22 |
2019-04-23 |
Asm Ip Holding B.V. |
Method of forming a structure on a substrate
|
US10867788B2
(en)
|
2016-12-28 |
2020-12-15 |
Asm Ip Holding B.V. |
Method of forming a structure on a substrate
|
US11390950B2
(en)
|
2017-01-10 |
2022-07-19 |
Asm Ip Holding B.V. |
Reactor system and method to reduce residue buildup during a film deposition process
|
US10468261B2
(en)
|
2017-02-15 |
2019-11-05 |
Asm Ip Holding B.V. |
Methods for forming a metallic film on a substrate by cyclical deposition and related semiconductor device structures
|
US10529563B2
(en)
|
2017-03-29 |
2020-01-07 |
Asm Ip Holdings B.V. |
Method for forming doped metal oxide films on a substrate by cyclical deposition and related semiconductor device structures
|
JP6479080B2
(en)
*
|
2017-03-30 |
2019-03-06 |
本田技研工業株式会社 |
Breather equipment
|
JP6980406B2
(en)
*
|
2017-04-25 |
2021-12-15 |
株式会社日立ハイテク |
Semiconductor manufacturing equipment and methods for manufacturing semiconductor equipment
|
KR102457289B1
(en)
|
2017-04-25 |
2022-10-21 |
에이에스엠 아이피 홀딩 비.브이. |
Method for depositing a thin film and manufacturing a semiconductor device
|
US10892156B2
(en)
|
2017-05-08 |
2021-01-12 |
Asm Ip Holding B.V. |
Methods for forming a silicon nitride film on a substrate and related semiconductor device structures
|
US10770286B2
(en)
|
2017-05-08 |
2020-09-08 |
Asm Ip Holdings B.V. |
Methods for selectively forming a silicon nitride film on a substrate and related semiconductor device structures
|
US10886123B2
(en)
|
2017-06-02 |
2021-01-05 |
Asm Ip Holding B.V. |
Methods for forming low temperature semiconductor layers and related semiconductor device structures
|
US11306395B2
(en)
|
2017-06-28 |
2022-04-19 |
Asm Ip Holding B.V. |
Methods for depositing a transition metal nitride film on a substrate by atomic layer deposition and related deposition apparatus
|
KR20190009245A
(en)
|
2017-07-18 |
2019-01-28 |
에이에스엠 아이피 홀딩 비.브이. |
Methods for forming a semiconductor device structure and related semiconductor device structures
|
US10541333B2
(en)
|
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2020-01-21 |
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Method for depositing a group IV semiconductor and related semiconductor device structures
|
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(en)
|
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2021-05-25 |
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|
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(en)
|
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2022-06-28 |
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Method for depositing a group IV semiconductor and related semiconductor device structures
|
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(en)
|
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2020-03-17 |
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|
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(en)
|
2017-08-08 |
2020-06-23 |
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Radiation shield
|
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(en)
|
2017-08-08 |
2020-09-08 |
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|
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(en)
|
2017-08-09 |
2021-10-05 |
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Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith
|
US11769682B2
(en)
|
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2023-09-26 |
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Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith
|
US11830730B2
(en)
|
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2023-11-28 |
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Layer forming method and apparatus
|
US11056344B2
(en)
|
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2021-07-06 |
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Layer forming method
|
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(en)
|
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2023-01-26 |
에이에스엠 아이피 홀딩 비.브이. |
Substrate processing apparatus
|
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(en)
|
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2022-04-05 |
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Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structures
|
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(en)
|
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2024-01-29 |
에이에스엠 아이피 홀딩 비.브이. |
Method of sequential infiltration synthesis treatment of infiltrateable material and structures and devices formed using same
|
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(en)
|
2017-09-22 |
2020-11-24 |
Asm Ip Holding B.V. |
Apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods
|
US10658205B2
(en)
|
2017-09-28 |
2020-05-19 |
Asm Ip Holdings B.V. |
Chemical dispensing apparatus and methods for dispensing a chemical to a reaction chamber
|
US10403504B2
(en)
|
2017-10-05 |
2019-09-03 |
Asm Ip Holding B.V. |
Method for selectively depositing a metallic film on a substrate
|
US10923344B2
(en)
|
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2021-02-16 |
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Methods for forming a semiconductor structure and related semiconductor structures
|
US10910262B2
(en)
|
2017-11-16 |
2021-02-02 |
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Method of selectively depositing a capping layer structure on a semiconductor device structure
|
US11022879B2
(en)
|
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2021-06-01 |
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Method of forming an enhanced unexposed photoresist layer
|
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(en)
|
2017-11-27 |
2023-12-22 |
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Storage device for storing wafer cassettes for use with batch ovens
|
US11639811B2
(en)
|
2017-11-27 |
2023-05-02 |
Asm Ip Holding B.V. |
Apparatus including a clean mini environment
|
WO2019120358A1
(en)
*
|
2017-12-21 |
2019-06-27 |
centrotherm international AG |
Method for operating a depositing system
|
US10872771B2
(en)
|
2018-01-16 |
2020-12-22 |
Asm Ip Holding B. V. |
Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures
|
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(en)
|
2018-01-19 |
2020-09-04 |
Asm Ip私人控股有限公司 |
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|
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(en)
|
2018-01-19 |
2023-07-01 |
荷蘭商Asm 智慧財產控股公司 |
Deposition method
|
US11018047B2
(en)
|
2018-01-25 |
2021-05-25 |
Asm Ip Holding B.V. |
Hybrid lift pin
|
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(en)
|
2018-02-01 |
2020-04-07 |
Asm Ip Holding B.V. |
Gas supply plate for semiconductor manufacturing apparatus
|
US11081345B2
(en)
|
2018-02-06 |
2021-08-03 |
Asm Ip Holding B.V. |
Method of post-deposition treatment for silicon oxide film
|
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(en)
|
2018-02-14 |
2023-09-12 |
Asm Ip私人控股有限公司 |
Method for depositing ruthenium-containing films on substrates by cyclical deposition processes
|
US10896820B2
(en)
|
2018-02-14 |
2021-01-19 |
Asm Ip Holding B.V. |
Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process
|
KR102636427B1
(en)
|
2018-02-20 |
2024-02-13 |
에이에스엠 아이피 홀딩 비.브이. |
Substrate processing method and apparatus
|
US10975470B2
(en)
|
2018-02-23 |
2021-04-13 |
Asm Ip Holding B.V. |
Apparatus for detecting or monitoring for a chemical precursor in a high temperature environment
|
US11473195B2
(en)
|
2018-03-01 |
2022-10-18 |
Asm Ip Holding B.V. |
Semiconductor processing apparatus and a method for processing a substrate
|
US11629406B2
(en)
|
2018-03-09 |
2023-04-18 |
Asm Ip Holding B.V. |
Semiconductor processing apparatus comprising one or more pyrometers for measuring a temperature of a substrate during transfer of the substrate
|
US11114283B2
(en)
|
2018-03-16 |
2021-09-07 |
Asm Ip Holding B.V. |
Reactor, system including the reactor, and methods of manufacturing and using same
|
KR102646467B1
(en)
|
2018-03-27 |
2024-03-11 |
에이에스엠 아이피 홀딩 비.브이. |
Method of forming an electrode on a substrate and a semiconductor device structure including an electrode
|
US11230766B2
(en)
|
2018-03-29 |
2022-01-25 |
Asm Ip Holding B.V. |
Substrate processing apparatus and method
|
US11088002B2
(en)
|
2018-03-29 |
2021-08-10 |
Asm Ip Holding B.V. |
Substrate rack and a substrate processing system and method
|
KR102501472B1
(en)
|
2018-03-30 |
2023-02-20 |
에이에스엠 아이피 홀딩 비.브이. |
Substrate processing method
|
TWI811348B
(en)
|
2018-05-08 |
2023-08-11 |
荷蘭商Asm 智慧財產控股公司 |
Methods for depositing an oxide film on a substrate by a cyclical deposition process and related device structures
|
TW202349473A
(en)
|
2018-05-11 |
2023-12-16 |
荷蘭商Asm Ip私人控股有限公司 |
Methods for forming a doped metal carbide film on a substrate and related semiconductor device structures
|
KR102596988B1
(en)
|
2018-05-28 |
2023-10-31 |
에이에스엠 아이피 홀딩 비.브이. |
Method of processing a substrate and a device manufactured by the same
|
US11718913B2
(en)
|
2018-06-04 |
2023-08-08 |
Asm Ip Holding B.V. |
Gas distribution system and reactor system including same
|
TW202013553A
(en)
|
2018-06-04 |
2020-04-01 |
荷蘭商Asm 智慧財產控股公司 |
Wafer handling chamber with moisture reduction
|
US11286562B2
(en)
|
2018-06-08 |
2022-03-29 |
Asm Ip Holding B.V. |
Gas-phase chemical reactor and method of using same
|
US10797133B2
(en)
|
2018-06-21 |
2020-10-06 |
Asm Ip Holding B.V. |
Method for depositing a phosphorus doped silicon arsenide film and related semiconductor device structures
|
KR102568797B1
(en)
|
2018-06-21 |
2023-08-21 |
에이에스엠 아이피 홀딩 비.브이. |
Substrate processing system
|
WO2020002995A1
(en)
|
2018-06-27 |
2020-01-02 |
Asm Ip Holding B.V. |
Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material
|
KR20210027265A
(en)
|
2018-06-27 |
2021-03-10 |
에이에스엠 아이피 홀딩 비.브이. |
Periodic deposition method for forming metal-containing material and film and structure comprising metal-containing material
|
KR20200002519A
(en)
|
2018-06-29 |
2020-01-08 |
에이에스엠 아이피 홀딩 비.브이. |
Method for depositing a thin film and manufacturing a semiconductor device
|
US10612136B2
(en)
|
2018-06-29 |
2020-04-07 |
ASM IP Holding, B.V. |
Temperature-controlled flange and reactor system including same
|
KR20210023647A
(en)
*
|
2018-06-29 |
2021-03-04 |
알타 디바이씨즈, 인크. |
Method and system for MOCVD wastewater reduction
|
US10755922B2
(en)
|
2018-07-03 |
2020-08-25 |
Asm Ip Holding B.V. |
Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
|
US10388513B1
(en)
|
2018-07-03 |
2019-08-20 |
Asm Ip Holding B.V. |
Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
|
US10767789B2
(en)
|
2018-07-16 |
2020-09-08 |
Asm Ip Holding B.V. |
Diaphragm valves, valve components, and methods for forming valve components
|
US11053591B2
(en)
|
2018-08-06 |
2021-07-06 |
Asm Ip Holding B.V. |
Multi-port gas injection system and reactor system including same
|
US10883175B2
(en)
|
2018-08-09 |
2021-01-05 |
Asm Ip Holding B.V. |
Vertical furnace for processing substrates and a liner for use therein
|
US10829852B2
(en)
|
2018-08-16 |
2020-11-10 |
Asm Ip Holding B.V. |
Gas distribution device for a wafer processing apparatus
|
US11430674B2
(en)
|
2018-08-22 |
2022-08-30 |
Asm Ip Holding B.V. |
Sensor array, apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods
|
US11024523B2
(en)
|
2018-09-11 |
2021-06-01 |
Asm Ip Holding B.V. |
Substrate processing apparatus and method
|
KR20200030162A
(en)
|
2018-09-11 |
2020-03-20 |
에이에스엠 아이피 홀딩 비.브이. |
Method for deposition of a thin film
|
US11049751B2
(en)
|
2018-09-14 |
2021-06-29 |
Asm Ip Holding B.V. |
Cassette supply system to store and handle cassettes and processing apparatus equipped therewith
|
CN110970344A
(en)
|
2018-10-01 |
2020-04-07 |
Asm Ip控股有限公司 |
Substrate holding apparatus, system including the same, and method of using the same
|
US11232963B2
(en)
|
2018-10-03 |
2022-01-25 |
Asm Ip Holding B.V. |
Substrate processing apparatus and method
|
KR102592699B1
(en)
|
2018-10-08 |
2023-10-23 |
에이에스엠 아이피 홀딩 비.브이. |
Substrate support unit and apparatuses for depositing thin film and processing the substrate including the same
|
KR102546322B1
(en)
|
2018-10-19 |
2023-06-21 |
에이에스엠 아이피 홀딩 비.브이. |
Substrate processing apparatus and substrate processing method
|
KR102605121B1
(en)
|
2018-10-19 |
2023-11-23 |
에이에스엠 아이피 홀딩 비.브이. |
Substrate processing apparatus and substrate processing method
|
USD948463S1
(en)
|
2018-10-24 |
2022-04-12 |
Asm Ip Holding B.V. |
Susceptor for semiconductor substrate supporting apparatus
|
US11087997B2
(en)
|
2018-10-31 |
2021-08-10 |
Asm Ip Holding B.V. |
Substrate processing apparatus for processing substrates
|
KR20200051105A
(en)
|
2018-11-02 |
2020-05-13 |
에이에스엠 아이피 홀딩 비.브이. |
Substrate support unit and substrate processing apparatus including the same
|
US11572620B2
(en)
|
2018-11-06 |
2023-02-07 |
Asm Ip Holding B.V. |
Methods for selectively depositing an amorphous silicon film on a substrate
|
US11031242B2
(en)
|
2018-11-07 |
2021-06-08 |
Asm Ip Holding B.V. |
Methods for depositing a boron doped silicon germanium film
|
US10847366B2
(en)
|
2018-11-16 |
2020-11-24 |
Asm Ip Holding B.V. |
Methods for depositing a transition metal chalcogenide film on a substrate by a cyclical deposition process
|
US10818758B2
(en)
|
2018-11-16 |
2020-10-27 |
Asm Ip Holding B.V. |
Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structures
|
US11217444B2
(en)
|
2018-11-30 |
2022-01-04 |
Asm Ip Holding B.V. |
Method for forming an ultraviolet radiation responsive metal oxide-containing film
|
KR102636428B1
(en)
|
2018-12-04 |
2024-02-13 |
에이에스엠 아이피 홀딩 비.브이. |
A method for cleaning a substrate processing apparatus
|
US11158513B2
(en)
|
2018-12-13 |
2021-10-26 |
Asm Ip Holding B.V. |
Methods for forming a rhenium-containing film on a substrate by a cyclical deposition process and related semiconductor device structures
|
TW202037745A
(en)
|
2018-12-14 |
2020-10-16 |
荷蘭商Asm Ip私人控股有限公司 |
Method of forming device structure, structure formed by the method and system for performing the method
|
TWI819180B
(en)
|
2019-01-17 |
2023-10-21 |
荷蘭商Asm 智慧財產控股公司 |
Methods of forming a transition metal containing film on a substrate by a cyclical deposition process
|
KR20200091543A
(en)
|
2019-01-22 |
2020-07-31 |
에이에스엠 아이피 홀딩 비.브이. |
Semiconductor processing device
|
CN111524788B
(en)
|
2019-02-01 |
2023-11-24 |
Asm Ip私人控股有限公司 |
Method for topologically selective film formation of silicon oxide
|
KR102342124B1
(en)
|
2019-02-14 |
2021-12-22 |
주식회사 히타치하이테크 |
semiconductor manufacturing equipment
|
TW202104632A
(en)
|
2019-02-20 |
2021-02-01 |
荷蘭商Asm Ip私人控股有限公司 |
Cyclical deposition method and apparatus for filling a recess formed within a substrate surface
|
KR102638425B1
(en)
|
2019-02-20 |
2024-02-21 |
에이에스엠 아이피 홀딩 비.브이. |
Method and apparatus for filling a recess formed within a substrate surface
|
KR102626263B1
(en)
|
2019-02-20 |
2024-01-16 |
에이에스엠 아이피 홀딩 비.브이. |
Cyclical deposition method including treatment step and apparatus for same
|
KR20200102357A
(en)
|
2019-02-20 |
2020-08-31 |
에이에스엠 아이피 홀딩 비.브이. |
Apparatus and methods for plug fill deposition in 3-d nand applications
|
TW202100794A
(en)
|
2019-02-22 |
2021-01-01 |
荷蘭商Asm Ip私人控股有限公司 |
Substrate processing apparatus and method for processing substrate
|
KR20200108243A
(en)
|
2019-03-08 |
2020-09-17 |
에이에스엠 아이피 홀딩 비.브이. |
Structure Including SiOC Layer and Method of Forming Same
|
KR20200108242A
(en)
|
2019-03-08 |
2020-09-17 |
에이에스엠 아이피 홀딩 비.브이. |
Method for Selective Deposition of Silicon Nitride Layer and Structure Including Selectively-Deposited Silicon Nitride Layer
|
US11742198B2
(en)
|
2019-03-08 |
2023-08-29 |
Asm Ip Holding B.V. |
Structure including SiOCN layer and method of forming same
|
KR20200116033A
(en)
|
2019-03-28 |
2020-10-08 |
에이에스엠 아이피 홀딩 비.브이. |
Door opener and substrate processing apparatus provided therewith
|
KR20200116855A
(en)
|
2019-04-01 |
2020-10-13 |
에이에스엠 아이피 홀딩 비.브이. |
Method of manufacturing semiconductor device
|
KR20200123380A
(en)
|
2019-04-19 |
2020-10-29 |
에이에스엠 아이피 홀딩 비.브이. |
Layer forming method and apparatus
|
KR20200125453A
(en)
|
2019-04-24 |
2020-11-04 |
에이에스엠 아이피 홀딩 비.브이. |
Gas-phase reactor system and method of using same
|
KR20200130121A
(en)
|
2019-05-07 |
2020-11-18 |
에이에스엠 아이피 홀딩 비.브이. |
Chemical source vessel with dip tube
|
KR20200130118A
(en)
|
2019-05-07 |
2020-11-18 |
에이에스엠 아이피 홀딩 비.브이. |
Method for Reforming Amorphous Carbon Polymer Film
|
KR20200130652A
(en)
|
2019-05-10 |
2020-11-19 |
에이에스엠 아이피 홀딩 비.브이. |
Method of depositing material onto a surface and structure formed according to the method
|
JP2020188255A
(en)
|
2019-05-16 |
2020-11-19 |
エーエスエム アイピー ホールディング ビー.ブイ. |
Wafer boat handling device, vertical batch furnace, and method
|
USD947913S1
(en)
|
2019-05-17 |
2022-04-05 |
Asm Ip Holding B.V. |
Susceptor shaft
|
USD975665S1
(en)
|
2019-05-17 |
2023-01-17 |
Asm Ip Holding B.V. |
Susceptor shaft
|
USD935572S1
(en)
|
2019-05-24 |
2021-11-09 |
Asm Ip Holding B.V. |
Gas channel plate
|
USD922229S1
(en)
|
2019-06-05 |
2021-06-15 |
Asm Ip Holding B.V. |
Device for controlling a temperature of a gas supply unit
|
KR20200141002A
(en)
|
2019-06-06 |
2020-12-17 |
에이에스엠 아이피 홀딩 비.브이. |
Method of using a gas-phase reactor system including analyzing exhausted gas
|
KR20200143254A
(en)
|
2019-06-11 |
2020-12-23 |
에이에스엠 아이피 홀딩 비.브이. |
Method of forming an electronic structure using an reforming gas, system for performing the method, and structure formed using the method
|
USD944946S1
(en)
|
2019-06-14 |
2022-03-01 |
Asm Ip Holding B.V. |
Shower plate
|
USD931978S1
(en)
|
2019-06-27 |
2021-09-28 |
Asm Ip Holding B.V. |
Showerhead vacuum transport
|
KR20210005515A
(en)
|
2019-07-03 |
2021-01-14 |
에이에스엠 아이피 홀딩 비.브이. |
Temperature control assembly for substrate processing apparatus and method of using same
|
JP2021015791A
(en)
|
2019-07-09 |
2021-02-12 |
エーエスエム アイピー ホールディング ビー.ブイ. |
Plasma device and substrate processing method using coaxial waveguide
|
CN112216646A
(en)
|
2019-07-10 |
2021-01-12 |
Asm Ip私人控股有限公司 |
Substrate supporting assembly and substrate processing device comprising same
|
KR20210010307A
(en)
|
2019-07-16 |
2021-01-27 |
에이에스엠 아이피 홀딩 비.브이. |
Substrate processing apparatus
|
KR20210010816A
(en)
|
2019-07-17 |
2021-01-28 |
에이에스엠 아이피 홀딩 비.브이. |
Radical assist ignition plasma system and method
|
KR20210010820A
(en)
|
2019-07-17 |
2021-01-28 |
에이에스엠 아이피 홀딩 비.브이. |
Methods of forming silicon germanium structures
|
US11643724B2
(en)
|
2019-07-18 |
2023-05-09 |
Asm Ip Holding B.V. |
Method of forming structures using a neutral beam
|
TW202121506A
(en)
|
2019-07-19 |
2021-06-01 |
荷蘭商Asm Ip私人控股有限公司 |
Method of forming topology-controlled amorphous carbon polymer film
|
CN112309843A
(en)
|
2019-07-29 |
2021-02-02 |
Asm Ip私人控股有限公司 |
Selective deposition method for achieving high dopant doping
|
CN112309899A
(en)
|
2019-07-30 |
2021-02-02 |
Asm Ip私人控股有限公司 |
Substrate processing apparatus
|
CN112309900A
(en)
|
2019-07-30 |
2021-02-02 |
Asm Ip私人控股有限公司 |
Substrate processing apparatus
|
US11227782B2
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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*
|
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