WO1999044231A1 - Semiconductor wafer inspection apparatus - Google Patents
Semiconductor wafer inspection apparatus Download PDFInfo
- Publication number
- WO1999044231A1 WO1999044231A1 PCT/GB1999/000536 GB9900536W WO9944231A1 WO 1999044231 A1 WO1999044231 A1 WO 1999044231A1 GB 9900536 W GB9900536 W GB 9900536W WO 9944231 A1 WO9944231 A1 WO 9944231A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wafer
- inspection machine
- interface
- inspection
- accept
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Definitions
- the present invention relates to apparatus employed in the manufacture of wafers for use in the semiconductor industry, particularly, but not exclusively, silicon single crystal wafers. More particularly, the invention relates to improvements in apparatus for the inspection of wafers for quality control purposes during the manufacturing process .
- the inspection of wafers commonly involves the use of different apparatus for checking different properties of the wafers, such as flatness, thickness, resistivity and surface defects. It is known to use a first item of equipment to check flatness, thickness and resistivity. An example of such equipment is known as the ADE 9600. It is also known to use a second item of equipment to perform automatic surface inspection of the wafer. An example of such equipment is known as an ORP .
- the first item of equipment typically comprises: at least one station for receiving a batch of wafers which are to be inspected, the wafers being contained in cassettes or baskets, an alignment station at which individual wafers are aligned to a predetermined orientation (using the orientation flat or orientation notch which is formed in each wafer, as is well known in the art) ; at least one inspection station at which at least one inspection operation is carried out; at least one station for receiving wafers which are judged to be acceptable following inspection; at least one station for receiving wafers which are rejected following inspection; and robot handling means for transferring wafers between the various stations.
- the second item of equipment typically comprises a camera unit, which is used to generate an image of the wafer under inspection, and a processor unit, which processes the image generated by the camera and makes a judgement as to whether the wafer ought to be accepted or rejected.
- a wafer fails inspection by the visual inspection 3 machine, it can be rejected prior to further inspection by the first machine.
- a manual "reject" signal is input to the first machine via a keypad by the operator and the wafer is transferred from the alignment station to the reject station by the robot handling means. If the wafer passes visual inspection by the visual inspection machine, a manual "accept” command is input to the first machine in a similar manner. The wafer is then transferred from the alignment station to the inspection station (s) and inspection by the first machine proceeds in the normal manner.
- the first inspection machine and the visual inspection machine are quite separate items of equipment which are not designed to cooperate with one another and which are not directly connected to one another.
- the arrangement described above enables the alignment system of the first machine to be employed for the purposes of the visual inspection system.
- manual input is required to the first machine following visual inspection in order for the inspection process to proceed. This necessarily reduces the overall efficiency of the inspection process.
- a wafer inspection system comprising: a first inspection machine including a wafer alignment station, at least one wafer inspection station, wafer loading, accept and reject stations and means for transferring wafers between said stations; and a visual inspection machine including a camera unit arranged to generate images of wafers located at the alignment station of said first inspection machine A and a processor unit connected to said camera unit and adapted to process said images and to generate accept and reject signals according to the result of said processing; characterised in that: the system further includes interface means interconnecting said first inspection machine and said processor unit of said visual inspection machine, said interface means being adapted to receive said accept and reject signals generated by said processor unit, to convert said signals into a format capable of interpretation by said first inspection machine, and to transmit said converted signals to said first inspection machine.
- the system further includes sensor means associated with said alignment station and adapted to detect the presence of a wafer at said alignment station and to transmit a signal to said processor unit indicating the presence of a wafer at said alignment station.
- said sensor means is connected to said processor unit via said interface means, said interface means including timer means adapted to send a start signal to said processor means after a predetermined time period has elapsed following receipt of said signal from said sensor means, said time period being selected to be sufficient to allow the wafer to be properly aligned at the alignment station.
- said interface means is adapted to be connected to an existing I/O port of said processor unit and to an existing keypad connector port of said first inspection machine, and to convert said accept and reject signals received from said processor unit so as to mimic manually input keystrokes which would 5 normally be transmitted to said keypad connector port from a keypad.
- interface apparatus for use in a wafer inspection system in accordance with the first aspect of the invention, comprising an interface unit including a first input means for receiving a first signal from a wafer detection sensor means, timer means responsive to said first signal for outputting a start signal after a predetermined time period following receipt of said first signal, a first output means for outputting said start signal, second and third input means for receiving respective accept and reject signals, first and second signal conversion means for converting said accept and reject signals into a format mimicking keypad keystrokes, and second output means for outputting said converted signals.
- the interface apparatus further includes wafer detection sensor means adapted to be mounted on said alignment station of said first wafer inspection machine, said wafer detection sensor means being connected to said first input means of said interface unit.
- the interface apparatus further includes connector means for connecting said first output means and said second and third input means to an I/O port of said visual inspection machine and for connecting said second output means to a keypad connector port of said first inspection machine.
- Fig. 1 is a perspective view of wafer inspection apparatus incorporating an interface unit in accordance with the invention
- Fig. 2 is a circuit diagram of the interface unit of Fig. 1.
- a wafer inspection system includes a first wafer inspection machine, such as an ADE 9600, comprising a main wafer- handling and inspection unit 10 and a control console 12, and a visual inspection machine, such as an ORP, comprising a camera unit 14 and a processor unit 16.
- the inspection unit 10 includes an alignment station 18, inspection station (s) 20, stations for receiving wafer cassettes 22, 24, 26 for loading batches of wafers into the unit 10 and for receiving accepted and rejected wafers, and a robot handling arm 28.
- the visual inspection camera unit 14 is located over the alignment station 18 and is connected by a cable or the like (not shown) to the processor unit 16.
- a wafer located at the alignment station 18 would be imaged by the camera unit 14 and the image would be processed by the processor unit 16, which would display an accept or reject signal depending on the outcome of the visual inspection.
- An operator would then manually input a corresponding accept or reject signal to the first inspection machine 7 10, 12, by means of a keypad connected to a keypad port on the first machine.
- an interface unit 30 which connects the visual inspection processor 16 directly to the first inspection machine 10, 12 so as to provide a greater degree of automation in the use of the overall inspection system.
- the interface unit has a first input/output (I/O) port 32 connected by a first cable 34 to an existing I/O port (not shown) of the visual inspection processor unit, and a second I/O port 36 connected by a second cable 38 to an existing keypad connection port (not shown) of the first inspection machine 10,12.
- I/O input/output
- a sensor 40 which is mounted on or adjacent to the alignment station 18 of the first inspection machine 10 and which is adapted to detect the presence of a wafer at the alignment station.
- the sensor 40 may be of any suitable type, such as an optical sensor.
- the sensor 40 is also connected to the first I/O port of the interface unit 30, by a further cable indicated schematically by broken line 42.
- the system in accordance with the invention operates as follows.
- a batch of wafers is loaded into the first inspection machine 10.
- the robot arm 28 transfers a first wafer to the alignment station 18.
- the sensor 40 detects the presence of the wafer and transmits a signal to the interface unit 30 (input "OPTO" on I/O port 32, Fig. 2) .
- the signal starts a timer (IC1 and associated circuitry, Fig. 2) in the interface unit 30.
- the timer 8 provides a predetermined delay (suitably 20 seconds) while the wafer is aligned by the alignment station 18.
- the timer Once the delay period has elapsed, the timer generates an output signal which energises a first relay 44, which in turn transmits a "Start" signal to the visual inspection processor 16.
- Components IC4 serve to convert the transient output from the timer into a square wave suitable for controlling the relay 44.
- the processor unit processes the image of the pre-aligned wafer generated by the camera unit 14, and generates either an Accept signal or a Reject signal depending on the results of the inspection process. These signals are transmitted via the I/O port of the processor unit 16 to respective pins of the first I/O port of the interface unit 30.
- the Accept and Reject signals control the operation of respective pairs of ganged relays 46 and 48.
- the relays are in turn connected to the second I/O port 36 of the interface unit 30, and thence to the keyboard connector port of the first inspection machine 10. In each case, one of the relays is normally closed and the other is normally open.
- This arrangement enables the output signals from the interface unit 30 to the first inspection machine 10 to mimic the keystroke signals which the first inspection machine 10 would normally receive from a manually operated keypad; i.e. an Accept or Reject keystroke followed by an "Enter” or “Carriage Return” keystroke.
- the invention thus allows the first inspection machine 10,12 and the visual inspection machine 14,16 to operate together in a fully integrated manner, without the need for manual intervention by an operator and without any modification of either of the inspection 9 machines 10,12 and 14,16, other than the mounting of the sensor 40 on the alignment station 18 of the first machine 10,12.
- the function of the sensor 40 could be performed by a sensor forming an integral part of the first inspection machine. However, this would require a degree of internal modification of the first machine to enable such a sensor to communicate with the processor unit of the visual inspection machine.
- the interface unit could also be incorporated into either the first inspection machine or the visual inspection machine. Again, this would require a degree of modification to the relevant machine.
Abstract
An inspection system for semiconductor wafers comprises a first inspection machine (10) including a wafer alignment station (18), at least one wafer inspection station (20), wafer loading, accept and reject stations and means (28) for transferring wafers between said stations; and a visual inspection machine inlcuding a camera unit (14) arranged to generate images of wafers located at the alignment station of the first inspection machine and a processor unit (16) connected to the camera unit and adapted to process said images and to generate accept and reject signals according to the result of the processing. The system further includes interface means (30) interconnecting the first inspection machine and the processor unit of the visual inspection machine. The interface is adapted to receive the accept and reject signals generated by the processor unit, to convert said signals into a format capable of interpretation by the first inspection machine, and to transmit the converted signals to the first inspection machine. The invention also includes an interface unit for use in the system.
Description
"Semiconductor Wafer Inspection Apparatus"
Field of the Invention
The present invention relates to apparatus employed in the manufacture of wafers for use in the semiconductor industry, particularly, but not exclusively, silicon single crystal wafers. More particularly, the invention relates to improvements in apparatus for the inspection of wafers for quality control purposes during the manufacturing process .
Background to the Invention
The inspection of wafers commonly involves the use of different apparatus for checking different properties of the wafers, such as flatness, thickness, resistivity and surface defects. It is known to use a first item of equipment to check flatness, thickness and resistivity. An example of such equipment is known as the ADE 9600. It is also known to use a second item of equipment to perform automatic surface inspection of the wafer. An example of such equipment is known as an ORP .
2 The first item of equipment (referred to hereinafter as the "first inspection machine") typically comprises: at least one station for receiving a batch of wafers which are to be inspected, the wafers being contained in cassettes or baskets, an alignment station at which individual wafers are aligned to a predetermined orientation (using the orientation flat or orientation notch which is formed in each wafer, as is well known in the art) ; at least one inspection station at which at least one inspection operation is carried out; at least one station for receiving wafers which are judged to be acceptable following inspection; at least one station for receiving wafers which are rejected following inspection; and robot handling means for transferring wafers between the various stations.
The second item of equipment (referred to hereinafter as the "visual inspection machine") typically comprises a camera unit, which is used to generate an image of the wafer under inspection, and a processor unit, which processes the image generated by the camera and makes a judgement as to whether the wafer ought to be accepted or rejected.
It has been found to be convenient to set up the camera of the visual inspection machine adjacent the alignment station of the first inspection machine, such that the camera views the wafer when it is located on the alignment station. This allows the wafer to be aligned by the first machine and visual inspection to be carried out by the visual inspection machine prior to further inspection by the first machine.
If a wafer fails inspection by the visual inspection
3 machine, it can be rejected prior to further inspection by the first machine. A manual "reject" signal is input to the first machine via a keypad by the operator and the wafer is transferred from the alignment station to the reject station by the robot handling means. If the wafer passes visual inspection by the visual inspection machine, a manual "accept" command is input to the first machine in a similar manner. The wafer is then transferred from the alignment station to the inspection station (s) and inspection by the first machine proceeds in the normal manner.
The first inspection machine and the visual inspection machine are quite separate items of equipment which are not designed to cooperate with one another and which are not directly connected to one another. The arrangement described above enables the alignment system of the first machine to be employed for the purposes of the visual inspection system. However, manual input is required to the first machine following visual inspection in order for the inspection process to proceed. This necessarily reduces the overall efficiency of the inspection process.
Summary of the Invention
In accordance with a first aspect of the invention, there is provided a wafer inspection system comprising: a first inspection machine including a wafer alignment station, at least one wafer inspection station, wafer loading, accept and reject stations and means for transferring wafers between said stations; and a visual inspection machine including a camera unit arranged to generate images of wafers located at the alignment station of said first inspection machine
A and a processor unit connected to said camera unit and adapted to process said images and to generate accept and reject signals according to the result of said processing; characterised in that: the system further includes interface means interconnecting said first inspection machine and said processor unit of said visual inspection machine, said interface means being adapted to receive said accept and reject signals generated by said processor unit, to convert said signals into a format capable of interpretation by said first inspection machine, and to transmit said converted signals to said first inspection machine.
Preferably, the system further includes sensor means associated with said alignment station and adapted to detect the presence of a wafer at said alignment station and to transmit a signal to said processor unit indicating the presence of a wafer at said alignment station.
Preferably also, said sensor means is connected to said processor unit via said interface means, said interface means including timer means adapted to send a start signal to said processor means after a predetermined time period has elapsed following receipt of said signal from said sensor means, said time period being selected to be sufficient to allow the wafer to be properly aligned at the alignment station.
Preferably also, said interface means is adapted to be connected to an existing I/O port of said processor unit and to an existing keypad connector port of said first inspection machine, and to convert said accept and reject signals received from said processor unit so as to mimic manually input keystrokes which would
5 normally be transmitted to said keypad connector port from a keypad.
In accordance with a second aspect of the invention, there is provided interface apparatus for use in a wafer inspection system in accordance with the first aspect of the invention, comprising an interface unit including a first input means for receiving a first signal from a wafer detection sensor means, timer means responsive to said first signal for outputting a start signal after a predetermined time period following receipt of said first signal, a first output means for outputting said start signal, second and third input means for receiving respective accept and reject signals, first and second signal conversion means for converting said accept and reject signals into a format mimicking keypad keystrokes, and second output means for outputting said converted signals.
Preferably, the interface apparatus further includes wafer detection sensor means adapted to be mounted on said alignment station of said first wafer inspection machine, said wafer detection sensor means being connected to said first input means of said interface unit.
Preferably also, the interface apparatus, further includes connector means for connecting said first output means and said second and third input means to an I/O port of said visual inspection machine and for connecting said second output means to a keypad connector port of said first inspection machine.
Brief Description of the Drawings
An embodiment of the invention will now be described,
6 by way of example only, with reference to the accompanying drawings in which:
Fig. 1 is a perspective view of wafer inspection apparatus incorporating an interface unit in accordance with the invention; and Fig. 2 is a circuit diagram of the interface unit of Fig. 1.
Description of the Preferred Embodiment
Referring now to Fig. 1 of the drawings, a wafer inspection system includes a first wafer inspection machine, such as an ADE 9600, comprising a main wafer- handling and inspection unit 10 and a control console 12, and a visual inspection machine, such as an ORP, comprising a camera unit 14 and a processor unit 16.
As described above, the inspection unit 10 includes an alignment station 18, inspection station (s) 20, stations for receiving wafer cassettes 22, 24, 26 for loading batches of wafers into the unit 10 and for receiving accepted and rejected wafers, and a robot handling arm 28. The visual inspection camera unit 14 is located over the alignment station 18 and is connected by a cable or the like (not shown) to the processor unit 16.
The arrangement described thus far is conventional, as described above. A wafer located at the alignment station 18 would be imaged by the camera unit 14 and the image would be processed by the processor unit 16, which would display an accept or reject signal depending on the outcome of the visual inspection. An operator would then manually input a corresponding accept or reject signal to the first inspection machine
7 10, 12, by means of a keypad connected to a keypad port on the first machine.
In accordance with the present invention, there is provided an interface unit 30 which connects the visual inspection processor 16 directly to the first inspection machine 10, 12 so as to provide a greater degree of automation in the use of the overall inspection system. The interface unit has a first input/output (I/O) port 32 connected by a first cable 34 to an existing I/O port (not shown) of the visual inspection processor unit, and a second I/O port 36 connected by a second cable 38 to an existing keypad connection port (not shown) of the first inspection machine 10,12.
Further in accordance with the invention, there is provided a sensor 40 which is mounted on or adjacent to the alignment station 18 of the first inspection machine 10 and which is adapted to detect the presence of a wafer at the alignment station. The sensor 40 may be of any suitable type, such as an optical sensor. The sensor 40 is also connected to the first I/O port of the interface unit 30, by a further cable indicated schematically by broken line 42.
The system in accordance with the invention operates as follows.
A batch of wafers is loaded into the first inspection machine 10. The robot arm 28 transfers a first wafer to the alignment station 18. The sensor 40 detects the presence of the wafer and transmits a signal to the interface unit 30 (input "OPTO" on I/O port 32, Fig. 2) . The signal starts a timer (IC1 and associated circuitry, Fig. 2) in the interface unit 30. The timer
8 provides a predetermined delay (suitably 20 seconds) while the wafer is aligned by the alignment station 18.
Once the delay period has elapsed, the timer generates an output signal which energises a first relay 44, which in turn transmits a "Start" signal to the visual inspection processor 16. Components IC4 serve to convert the transient output from the timer into a square wave suitable for controlling the relay 44.
Once the Start signal is received, the processor unit processes the image of the pre-aligned wafer generated by the camera unit 14, and generates either an Accept signal or a Reject signal depending on the results of the inspection process. These signals are transmitted via the I/O port of the processor unit 16 to respective pins of the first I/O port of the interface unit 30. The Accept and Reject signals control the operation of respective pairs of ganged relays 46 and 48. The relays are in turn connected to the second I/O port 36 of the interface unit 30, and thence to the keyboard connector port of the first inspection machine 10. In each case, one of the relays is normally closed and the other is normally open. This arrangement enables the output signals from the interface unit 30 to the first inspection machine 10 to mimic the keystroke signals which the first inspection machine 10 would normally receive from a manually operated keypad; i.e. an Accept or Reject keystroke followed by an "Enter" or "Carriage Return" keystroke.
The invention thus allows the first inspection machine 10,12 and the visual inspection machine 14,16 to operate together in a fully integrated manner, without the need for manual intervention by an operator and without any modification of either of the inspection
9 machines 10,12 and 14,16, other than the mounting of the sensor 40 on the alignment station 18 of the first machine 10,12.
It is possible that the function of the sensor 40 could be performed by a sensor forming an integral part of the first inspection machine. However, this would require a degree of internal modification of the first machine to enable such a sensor to communicate with the processor unit of the visual inspection machine. The interface unit could also be incorporated into either the first inspection machine or the visual inspection machine. Again, this would require a degree of modification to the relevant machine.
Improvements and modifications may be incorporated without departing from the scope of the invention.
Claims
1. A wafer inspection system comprising: a first inspection machine including a wafer alignment station, at least one wafer inspection station, wafer loading, accept and reject stations and means for transferring wafers between said stations; and a visual inspection machine including a camera unit arranged to generate images of wafers located at the alignment station of said first inspection machine and a processor unit connected to said camera unit and adapted to process said images and to generate accept and reject signals according to the result of said processing; characterised in that: the system further includes interface means interconnecting said first inspection machine and said processor unit of said visual inspection machine, said interface means being adapted to receive said accept and reject signals generated by said processor unit, to convert said signals into a format capable of interpretation by said first inspection machine, and to transmit said converted signals to said first inspection machine.
2. A system as claimed in Claim 1, further including sensor means associated with said alignment station and adapted to detect the presence of a wafer at said alignment station and to transmit a signal to said processor unit indicating the presence of a wafer at said alignment station.
3. A system as claimed in Claim 2, wherein said sensor means is connected to said processor unit via said interface means, said interface means including timer means adapted to send a start signal to said 11 processor means after a predetermined time period has elapsed following receipt of said signal from said sensor means, said time period being sufficient to allow the wafer to be properly aligned at the alignment station.
4. A system as claimed in any preceding Claim, wherein said interface means is adapted to be connected to an existing I/O port of said processor unit and to an existing keypad connector port of said first inspection machine, and to convert said accept and reject signals received from said processor unit so as to mimic manually input keystrokes which would normally be transmitted to said keypad connector port from a keypad.
5. Interface apparatus for use in a wafer inspection system as claimed in any one of Claims 1 to 4 , comprising an interface unit including a first input means for receiving a first signal from a wafer detection sensor means, timer means responsive to said first signal for outputting a start signal after a predetermined time period following receipt of said first signal, a first output means for outputting said start signal, second and third input means for receiving respective accept and reject signals, first and second signal conversion means for converting said accept and reject signals into a format mimicking keypad keystrokes, and second output means for outputting said converted signals.
6. Interface apparatus as claimed in Claim 5, further including wafer detection sensor means adapted to be mounted on said alignment station of said first wafer inspection machine, said wafer detection sensor means being connected to said first input means of said 12 interface unit .
7. Interface apparatus as claimed in Claim 5 or Claim 6, further including connector means for connecting said first output means and said second and third input means to an I/O port of said visual inspection machine and for connecting said second output means to a keypad connector port of said first inspection machine.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB9803842.5 | 1998-02-25 | ||
| GBGB9803842.5A GB9803842D0 (en) | 1998-02-25 | 1998-02-25 | Semiconductor wafer inspection apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO1999044231A1 true WO1999044231A1 (en) | 1999-09-02 |
Family
ID=10827484
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/GB1999/000536 WO1999044231A1 (en) | 1998-02-25 | 1999-02-22 | Semiconductor wafer inspection apparatus |
Country Status (2)
| Country | Link |
|---|---|
| GB (1) | GB9803842D0 (en) |
| WO (1) | WO1999044231A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004008118A1 (en) * | 2002-07-12 | 2004-01-22 | Aoti Operating Company, Inc. | Detection method and apparatus |
| WO2004008119A1 (en) * | 2002-07-17 | 2004-01-22 | Aoti Operating Company, Inc. | Detection method and apparatus |
| WO2004010121A1 (en) * | 2002-07-19 | 2004-01-29 | Aoti Operating Company, Inc | Detection method and apparatus |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4644172A (en) * | 1984-02-22 | 1987-02-17 | Kla Instruments Corporation | Electronic control of an automatic wafer inspection system |
| GB2197948A (en) * | 1986-10-29 | 1988-06-02 | Electroplating Eng | Automatic inspection of ic lead frames |
| JPS63216354A (en) * | 1987-03-05 | 1988-09-08 | Mitsubishi Electric Corp | Visual inspection device for semiconductor device |
| JPH09167788A (en) * | 1995-12-14 | 1997-06-24 | Shin Etsu Handotai Co Ltd | Inspecting method and handling device of wafer |
| DE19610124A1 (en) * | 1996-03-14 | 1997-09-18 | Siemens Ag | Electrical component testing device, esp. for ICs. |
-
1998
- 1998-02-25 GB GBGB9803842.5A patent/GB9803842D0/en not_active Ceased
-
1999
- 1999-02-22 WO PCT/GB1999/000536 patent/WO1999044231A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4644172A (en) * | 1984-02-22 | 1987-02-17 | Kla Instruments Corporation | Electronic control of an automatic wafer inspection system |
| GB2197948A (en) * | 1986-10-29 | 1988-06-02 | Electroplating Eng | Automatic inspection of ic lead frames |
| JPS63216354A (en) * | 1987-03-05 | 1988-09-08 | Mitsubishi Electric Corp | Visual inspection device for semiconductor device |
| JPH09167788A (en) * | 1995-12-14 | 1997-06-24 | Shin Etsu Handotai Co Ltd | Inspecting method and handling device of wafer |
| DE19610124A1 (en) * | 1996-03-14 | 1997-09-18 | Siemens Ag | Electrical component testing device, esp. for ICs. |
Non-Patent Citations (2)
| Title |
|---|
| PATENT ABSTRACTS OF JAPAN vol. 013, no. 005 (E - 701) 9 January 1989 (1989-01-09) * |
| PATENT ABSTRACTS OF JAPAN vol. 097, no. 010 31 October 1997 (1997-10-31) * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004008118A1 (en) * | 2002-07-12 | 2004-01-22 | Aoti Operating Company, Inc. | Detection method and apparatus |
| WO2004008119A1 (en) * | 2002-07-17 | 2004-01-22 | Aoti Operating Company, Inc. | Detection method and apparatus |
| WO2004010121A1 (en) * | 2002-07-19 | 2004-01-29 | Aoti Operating Company, Inc | Detection method and apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| GB9803842D0 (en) | 1998-04-22 |
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