WO2000002243A1 - Dispositif a semi-conducteur, procede de fabrication associe, carte imprimee et dispositif electronique - Google Patents
Dispositif a semi-conducteur, procede de fabrication associe, carte imprimee et dispositif electronique Download PDFInfo
- Publication number
- WO2000002243A1 WO2000002243A1 PCT/JP1999/003417 JP9903417W WO0002243A1 WO 2000002243 A1 WO2000002243 A1 WO 2000002243A1 JP 9903417 W JP9903417 W JP 9903417W WO 0002243 A1 WO0002243 A1 WO 0002243A1
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- semiconductor device
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- semiconductor element
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- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000558549A JP3692935B2 (ja) | 1998-07-01 | 1999-06-25 | 半導体装置の製造方法 |
KR10-2000-7002052A KR100510387B1 (ko) | 1998-07-01 | 1999-06-25 | 반도체 장치 및 그 제조 방법, 회로 기판 및 전자 기기 |
HK01103293A HK1032672A1 (en) | 1998-07-01 | 2001-05-11 | Semiconductor device, method of manufacture, circuit board, and electronic device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10/201246 | 1998-07-01 | ||
JP20124698 | 1998-07-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000002243A1 true WO2000002243A1 (fr) | 2000-01-13 |
Family
ID=16437769
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP1999/003418 WO2000002244A1 (fr) | 1998-07-01 | 1999-06-25 | Dispositif a semi-conducteur, procede de fabrication associe, carte imprimee et dispositif electronique |
PCT/JP1999/003417 WO2000002243A1 (fr) | 1998-07-01 | 1999-06-25 | Dispositif a semi-conducteur, procede de fabrication associe, carte imprimee et dispositif electronique |
PCT/JP1999/003420 WO2000002245A1 (fr) | 1998-07-01 | 1999-06-25 | Dispositif a semi-conducteur, procede de fabrication associe, carte imprimee et dispositif electronique |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP1999/003418 WO2000002244A1 (fr) | 1998-07-01 | 1999-06-25 | Dispositif a semi-conducteur, procede de fabrication associe, carte imprimee et dispositif electronique |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP1999/003420 WO2000002245A1 (fr) | 1998-07-01 | 1999-06-25 | Dispositif a semi-conducteur, procede de fabrication associe, carte imprimee et dispositif electronique |
Country Status (8)
Country | Link |
---|---|
US (9) | US6462284B1 (ja) |
JP (3) | JP3702788B2 (ja) |
KR (3) | KR100509874B1 (ja) |
CN (3) | CN1143373C (ja) |
HK (3) | HK1032671A1 (ja) |
SG (1) | SG102032A1 (ja) |
TW (3) | TW452896B (ja) |
WO (3) | WO2000002244A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006286798A (ja) * | 2005-03-31 | 2006-10-19 | Toray Eng Co Ltd | 実装方法および装置 |
Families Citing this family (73)
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JP3815149B2 (ja) * | 1999-11-04 | 2006-08-30 | セイコーエプソン株式会社 | 部品実装方法および電気光学装置の製造方法 |
US6487078B2 (en) * | 2000-03-13 | 2002-11-26 | Legacy Electronics, Inc. | Electronic module having a three dimensional array of carrier-mounted integrated circuit packages |
US7102892B2 (en) * | 2000-03-13 | 2006-09-05 | Legacy Electronics, Inc. | Modular integrated circuit chip carrier |
US6713854B1 (en) | 2000-10-16 | 2004-03-30 | Legacy Electronics, Inc | Electronic circuit module with a carrier having a mounting pad array |
DE10019443A1 (de) * | 2000-04-19 | 2001-10-31 | Texas Instruments Deutschland | Vorrichtung zum Befestigen eines Halbleiter-Chips auf einem Chip-Träger |
US6395326B1 (en) * | 2000-05-31 | 2002-05-28 | Advanced Cardiovascular Systems, Inc. | Apparatus and method for depositing a coating onto a surface of a prosthesis |
DE10046296C2 (de) * | 2000-07-17 | 2002-10-10 | Infineon Technologies Ag | Elektronisches Chipbauteil mit einer integrierten Schaltung und Verfahren zu seiner Herstellung |
JP2002076589A (ja) * | 2000-08-31 | 2002-03-15 | Hitachi Ltd | 電子装置及びその製造方法 |
US7337522B2 (en) * | 2000-10-16 | 2008-03-04 | Legacy Electronics, Inc. | Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips |
JP3653460B2 (ja) * | 2000-10-26 | 2005-05-25 | 三洋電機株式会社 | 半導体モジュールおよびその製造方法 |
KR100897314B1 (ko) * | 2001-03-14 | 2009-05-14 | 레가시 일렉트로닉스, 인크. | 반도체 칩의 3차원 표면 실장 어레이를 갖는 회로 기판을 제조하기 위한 방법 및 장치 |
JP2004520722A (ja) * | 2001-05-17 | 2004-07-08 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 基体及び当該基体に付属するチップを有する製品 |
JP2002353369A (ja) * | 2001-05-28 | 2002-12-06 | Sharp Corp | 半導体パッケージおよびその製造方法 |
US20030059520A1 (en) | 2001-09-27 | 2003-03-27 | Yung-Ming Chen | Apparatus for regulating temperature of a composition and a method of coating implantable devices |
JP4137551B2 (ja) * | 2002-08-09 | 2008-08-20 | 日東電工株式会社 | 透明導電性基板用表面保護フィルム及び表面保護フィルム付き透明導電性基板 |
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-
2001
- 2001-05-07 HK HK01103203A patent/HK1032671A1/xx not_active IP Right Cessation
- 2001-05-11 HK HK01103293A patent/HK1032672A1/xx not_active IP Right Cessation
- 2001-05-28 HK HK01103675A patent/HK1033201A1/xx not_active IP Right Cessation
-
2002
- 2002-07-09 US US10/190,515 patent/US6972381B2/en not_active Expired - Fee Related
- 2002-07-09 US US10/190,580 patent/US6763994B2/en not_active Expired - Lifetime
-
2004
- 2004-07-20 US US10/893,993 patent/US20040256739A1/en not_active Abandoned
-
2005
- 2005-11-15 US US11/272,698 patent/US7198984B2/en not_active Expired - Fee Related
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2006
- 2006-03-29 US US11/391,559 patent/US7332371B2/en not_active Expired - Fee Related
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2007
- 2007-02-15 US US11/675,561 patent/US7560819B2/en not_active Expired - Fee Related
- 2007-12-21 US US12/003,367 patent/US7868466B2/en not_active Expired - Fee Related
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JPS62190342U (ja) * | 1986-05-26 | 1987-12-03 | ||
JPH01129431A (ja) * | 1987-11-16 | 1989-05-22 | Sharp Corp | 半導体チップ実装方式 |
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JP2006286798A (ja) * | 2005-03-31 | 2006-10-19 | Toray Eng Co Ltd | 実装方法および装置 |
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